CN216378475U - Device for removing copper plated on conductive roller - Google Patents
Device for removing copper plated on conductive roller Download PDFInfo
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- CN216378475U CN216378475U CN202122806091.6U CN202122806091U CN216378475U CN 216378475 U CN216378475 U CN 216378475U CN 202122806091 U CN202122806091 U CN 202122806091U CN 216378475 U CN216378475 U CN 216378475U
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- conductive roller
- copper
- control device
- copper plating
- removing groove
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Abstract
The utility model relates to a device for removing copper plating on a conductive roller, which is connected with the conductive roller and comprises a copper removing groove and a power supply control device, wherein the bottom of the copper removing groove is gradually closed to form a long seam, the long seam is opposite to the conductive roller, a first cathode plate is arranged in the copper removing groove, the negative electrode output end of the power supply control device is connected with the first cathode plate, and the positive electrode output end of the power supply control device is connected with the conductive roller. The utility model is matched with a power supply control device, and the first cathode plate in the copper removing groove is electrified to form an electroplating loop between the conductive roller and the first cathode plate, so that the electrolytic lamination of metal copper on the conductive roller onto the first cathode plate is realized, copper plating on the conductive roller is removed, and the strip seam at the bottom of the copper removing groove prevents the copper laminated on the first cathode plate from falling onto the conductive roller again to cause the scraping of the conductive roller.
Description
Technical Field
The utility model relates to the technical field of electroplating, in particular to a device for removing copper plated on a conductive roller.
Background
Electroplating is a process of plating a layer of metal on a product to be plated in an electrolyte, so that the product is attached with a layer of metal film.
In the whole electroplating process, because the film passes through the conductive roller, the plating solution is brought onto the conductive roller by the film, a metal layer is often plated on the conductive roller, so that sharp spines which are easy to scratch the film are formed, the production yield of film products is greatly reduced, and the quality of the film products is influenced.
The above problems are worth solving.
Disclosure of Invention
In order to overcome the defects of the prior art, the utility model provides a device for removing copper plated on a conductive roller.
The technical scheme of the utility model is as follows:
the utility model provides a get rid of copper-plated device on conductive roll, is connected with the conductive roll, its characterized in that, including going copper groove and power control device, it is equipped with first negative pole piece to go the copper inslot, power control device's negative pole output is connected first negative pole piece, power control device's anodal output is connected the conductive roll makes power control device first negative pole piece with the conductive roll forms the return circuit.
By adopting the technical scheme, the copper plating on the conductive roller is electrolyzed and laminated on the first cathode sheet, so that the copper plating on the conductive roller is removed.
The present invention according to the above aspect is characterized in that the power supply control device includes a constant current source for applying a constant current to the conductive roller, and a voltage measuring device for measuring a voltage value of the conductive roller.
The utility model according to the above aspect is characterized in that the bottom of the copper removing groove is in an inverted triangle shape.
The utility model according to the scheme is characterized in that the distance between the bottom of the copper removing groove and the surface of the conductive roller is 0.5-10 mm.
The utility model according to the scheme is characterized in that the copper removing groove is provided with an adjusting seat for adjusting the height of the copper removing groove.
The utility model according to the scheme is characterized in that transverse plates used for being hung on the notch of the copper removing groove are arranged at two ends of the first cathode piece.
The utility model according to the above scheme is characterized in that the first cathode sheet is provided with a connecting plate extending upwards, and a negative electrode output end of the power supply control device is connected to the connecting plate.
The utility model according to the scheme is characterized by further comprising a second cathode sheet, wherein the second cathode sheet is located at the bottom of the lower conductive roller, is used for removing the copper plating on the surface of the lower conductive roller and is connected with the negative electrode output end of the power supply control device.
The utility model according to the scheme is characterized in that liquid inlets capable of controlling liquid inlet amount are arranged on two sides of the top of the copper removing groove.
The utility model according to the scheme has the advantages that:
the utility model is matched with a power supply control device, and the first cathode plate in the copper removing groove is electrified to form an electroplating loop between the conductive roller and the first cathode plate, so that the electrolytic lamination of metal copper on the conductive roller onto the first cathode plate is realized, copper plating on the conductive roller is removed, and the strip seam at the bottom of the copper removing groove prevents the copper laminated on the first cathode plate from falling onto the conductive roller again to cause the scraping of the conductive roller.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is an exploded view of the present invention;
fig. 3 is a schematic structural diagram of a preferred embodiment of the present invention.
In the figure, 1, a copper removing groove; 11. long seams; 12. an adjusting seat; 13. a liquid inlet;
21. a conductive roller; 22. a lower conductive roller;
3. a first cathode sheet; 31. a transverse plate; 32. a connecting plate;
4. a power supply control device;
5. a second cathode sheet.
Detailed Description
For better understanding of the objects, technical solutions and effects of the present invention, the present invention will be further explained with reference to the accompanying drawings and examples. Meanwhile, the following described examples are only for explaining the present invention, and are not intended to limit the present invention.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.
The terms "upper", "lower", "front", "rear", "top", "bottom", "inner", "outer", and the like indicate orientations or positions based on the orientations or positions shown in the drawings, and are for convenience of description only and not to be construed as limiting the technical solution.
The terms "first", "second" and "first" are used merely for descriptive purposes and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features. The meaning of "a number" is two or more unless specifically defined otherwise.
Example one
As shown in figures 1 and 2, the device for removing copper plating on the conductive roller is connected with the conductive roller 2 and comprises a copper removing groove 1 and a power supply control device 4, wherein the bottom of the copper removing groove 1 is gradually closed to form a long seam 11, the long seam 11 is opposite to the conductive roller 2, a first cathode sheet 3 is arranged in the copper removing groove 1, the cathode output end of the power supply control device 4 is connected with the first cathode sheet 3, the anode output end of the power supply control device 4 is connected with the conductive roller 2, when the device is used, the first cathode sheet 3 in the copper removing groove 1 is electrified to be negative, an electroplating loop is formed between the conductive roller 2 and the first cathode sheet 3, metal copper on the conductive roller 2 is electrolyzed and then laminated on the first cathode sheet 3, and therefore copper plating on the conductive roller 2 is removed.
In this embodiment, the strip slit 11 at the bottom of the decoppering groove 1 can only allow the fine copper ions electrolyzed by the conductive roller 2 to pass through the copper particles on the first cathode sheet 3, so as to prevent the copper laminated on the first cathode sheet 3 from falling onto the conductive roller 2 again and causing the scraping of the conductive roller 2.
In order to know the copper plating removal condition of the conductive roller at any time, the power supply control device 4 comprises a constant current source for applying constant current to the conductive roller 2, and a voltage measurer for measuring the voltage value of the conductive roller 2 and judging whether the conductive roller is plated with copper or not by comparing the change of the voltage value.
In this embodiment, the bottom of copper removing groove 1 is the shape of falling triangle, does benefit to and collects the copper that drops on the first negative pole piece 3, avoids falling conductive roll 2 again on, scotch conductive roll 2.
In the embodiment, the distance between the bottom of the copper removing groove 1 and the surface of the conductive roller 2 is 0.5-10mm, and the distance can ensure the electroplating effect and prevent the copper removing groove 1 from contacting the conductive roller 2 and interfering the rotation of the conductive roller 2. In order to adjust the distance between the copper removing groove 1 and the conductive roller 2 conveniently, the copper removing groove 1 is provided with an adjusting seat 12, the height of the copper removing groove 1 is adjusted through the adjusting seat 12, the bottom of the copper removing groove is convenient to control, and therefore the plating solution is prevented from flowing in the direction of the film, and the plating solution flowing to the direction can be accumulated on the film surface because the roller interval in the direction is large, so that the film is pressed downwards, and the phenomenon that the tension of the film is unstable is caused.
In a preferred embodiment, adjusting seats 12 are arranged on both sides of the copper removing groove 1, so that the two sides of the copper removing groove 1 are at the same horizontal height after being adjusted, and the adjusting seats 12 are provided with scales convenient to check, so that an operator can conveniently adjust the height.
In an optional embodiment, first negative pole piece 3 both ends are equipped with and are used for hanging the diaphragm 31 of adorning at removing 1 notch in copper groove, during the use, only need erect the diaphragm 31 of both sides and remove 1 notch in copper groove and can fix first negative pole piece 3, and the dismouting is very convenient, does benefit to and looks over, changes first negative pole piece 3.
In an alternative embodiment, the first cathode plate 3 is provided with a connecting plate 32 extending upward, the negative output terminal of the power control device 4 is connected to the connecting plate 32, and the power contact point can be arranged at a high position through the connecting plate 32, so that the corrosion of the plating solution is prevented, and the electrical connection between the power control device 4 and the first cathode plate 3 is ensured.
In an optional embodiment, the liquid inlet of the copper removing groove 1 is separately connected with a conveying pipe and a pump, so that a small amount of plating solution enters the copper removing groove from the liquid inlet, liquid inlets 13 capable of controlling the liquid inlet amount are arranged on two sides of the top of the copper removing groove, and the liquid inlet amount can be adjusted by an operator conveniently according to actual requirements.
Example two
As shown in fig. 3, the structure of an apparatus for removing copper plating on a conductive roller is the same as that of the first embodiment, except that: the device further comprises a second cathode sheet 5, wherein the second cathode sheet 5 is positioned at the bottom of the lower conductive roller 22 and used for removing the copper plating on the surface of the lower conductive roller 22 and is connected with a negative electrode output end of the power supply control device 4. In this embodiment, two conductive rollers are arranged up and down, including the upper conductive roller and the lower conductive roller 22, the upper conductive roller adopts the structure of the copper removing groove 1 described in the first embodiment, the lower conductive roller 22 adopts the second cathode sheet 5, and since the second cathode sheet 5 is located below the lower conductive roller 22, it is not necessary to consider that the copper on the second cathode sheet 5 falls down to scratch the lower conductive roller 22.
According to the embodiment, the copper removing groove 1 is omitted, the copper removing groove 1 is only used at the upper conductive roller, the cost is reduced, the space is saved, and the use requirements of the upper and lower conductive roller structures are met.
In another aspect, the utility model also provides a use method of the device for removing copper plating on the conductive roller, which comprises the device for removing copper plating on the conductive roller using the scheme, and the method comprises the following steps:
s1, turning on the power control device 4;
s2, applying a constant current A to the conductive roller 2 to obtain a first voltage value V1;
specifically, a constant current a is applied to the conductive roller 2, and a voltage value V1 applied to the conductive roller 2 is displayed on the current control device; the first voltage value can be obtained before the film electroplating, and the first voltage value is used as a reference value.
S3, turning off the power supply control device and turning on the power supply control device after time T;
specifically, a time T for which the current is turned off is set on the power supply control device 4, and after the power supply control device is turned off for a certain time T, the power supply control device 4 applies the current again, and the process advances to step S4; the time T of disconnection is a fixed value, and 3S-20S can be generally adopted according to the requirements of actual conditions, such as the size of a power supply, the size of current in the coating process of the conductive roller and the like; the utility model sets a turn-off time to control the copper amount on the conductive roller and can also avoid the conductive roller body from being electrolyzed (the roller can be reduced) when the current is overlarge.
S4, reapplying the constant current A to the conductive roller 2 to obtain a second voltage value V2;
s5, determining the magnitude of the first voltage value V1 and the second voltage value V2;
specifically, the power control device 4 is internally provided with an MCU for automatically calculating V2-V1;
if V2-V1 is larger than or equal to 0, it is indicated that copper is not plated on the conductive roller 2, the conductive roller is made of stainless steel, the conductive performance of the stainless steel is inferior to that of copper, V2-V1 is larger than or equal to 0, it is indicated that no copper exists on the conductive roller, and under the condition that the current is constant, the resistance is larger if no copper exists, the voltage V2 is also larger, and the power supply control device 4 stops applying the current to the conductive roller 2;
if V2-V1 is less than 0, the copper content on the conductive roller 2 is large, and the conductive roller is made of stainless steel, so that the conductive performance of the stainless steel is lower than that of copper. V2-V1 is less than 0, which indicates that the conductive roller is copper, the copper resistance is small under the condition of constant current, the voltage V2 is also small, and the power supply control device 4 continuously applies current to the conductive roller 2;
s6, continuously judging until V2-V1 is more than or equal to 0, and stopping applying current to the conductive roller 2 by the power supply control device 4;
specifically, the power is supplied and the voltage value is recorded once every a period of time, and the judgment is carried out, so that the copper plating amount on the conductive roller is effectively controlled.
This embodiment adopts power control device 4, realizes that the copper-plating's on the conducting roller mode is got rid of to the intermittent type, controls the copper volume on the conducting roller, can also avoid when the electric current is too big, also electrolyzes the conducting roller body, and this mode can reduce the wasting of resources, accords with energy-concerving and environment-protective theory, is suitable for using widely.
The technical features of the above embodiments can be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the above embodiments are not described, but should be considered as the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above examples only show some embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the utility model. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (9)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122806091.6U CN216378475U (en) | 2021-11-16 | 2021-11-16 | Device for removing copper plated on conductive roller |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122806091.6U CN216378475U (en) | 2021-11-16 | 2021-11-16 | Device for removing copper plated on conductive roller |
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| CN216378475U true CN216378475U (en) | 2022-04-26 |
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| CN202122806091.6U Active CN216378475U (en) | 2021-11-16 | 2021-11-16 | Device for removing copper plated on conductive roller |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113897663A (en) * | 2021-11-16 | 2022-01-07 | 重庆金美新材料科技有限公司 | Method and device for removing copper plated on conductive roller |
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2021
- 2021-11-16 CN CN202122806091.6U patent/CN216378475U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113897663A (en) * | 2021-11-16 | 2022-01-07 | 重庆金美新材料科技有限公司 | Method and device for removing copper plated on conductive roller |
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Denomination of utility model: A device for removing copper plating from conductive rollers Granted publication date: 20220426 Pledgee: Chongqing Yunan Asset Management Co.,Ltd. Pledgor: Chongqing Jinmei New Material Technology Co.,Ltd. Registration number: Y2025980009666 |