CN216359683U - A solar monocrystalline silicon wafer cutting device - Google Patents

Abstract

The utility model discloses a solar monocrystalline silicon wafer cutting device, comprising a device main body, a protective fence is arranged on the upper end of the device main body, a protective cover is arranged on the inner side of the protective fence, and a space between the protective cover and the protective fence is arranged connected by a hinge. In the utility model, by connecting the protective cover with a rotating shaft inside the protective fence, and the protective cover is made of transparent glass, it can not only play a protective role in the cutting process of the silicon wafer, but also prevent the silicon powder generated in the cutting process from wafting into the air. It can also easily observe the cutting process of the silicon wafer; by setting the No. 1 fixing frame and the No. 2 fixing frame on the inside of the guardrail, the No. 1 fixing frame and the No. 2 fixing frame can be adjusted along the chute according to the cutting size of the silicon wafer. The position of the frame can be adjusted along the No. 1 fixing frame and the No. 2 fixing frame with the T-slot, threaded column, rotating seat and pressure plate, so that silicon wafers of different sizes can be fixed and easy to cut.

Description

A solar monocrystalline silicon wafer cutting device

technical field

The utility model relates to the technical field of cutting devices, in particular to a solar monocrystalline silicon wafer cutting device.

Background technique

With the aggravation of environmental pollution and energy crisis, people pay more and more attention to the research and development of new energy, among which solar cell modules that use sunlight to generate electricity will inevitably become the focus of people's attention. As a key component in a solar cell module, the cell is responsible for converting solar energy into electrical energy. The material of the cell is crystalline silicon. During the production process, the crystalline silicon needs to be cut into a predetermined shape, but a large amount of silicon powder will be generated during the cutting process, which is easy to float into the air and cause dust pollution. A solar monocrystalline silicon wafer cutting device.

Utility model content

The main purpose of the present invention is to provide a solar monocrystalline silicon wafer cutting device, which can effectively solve the problems in the background technology.

To achieve the above purpose, the technical scheme adopted by the present utility model is:

A solar monocrystalline silicon wafer cutting device comprises a device main body, the upper end of the device main body is provided with a guardrail, and the inner side of the guardrail near the upper end of the device main body is respectively provided with a No. The inner surface of the guardrail is provided with a chute near the connection between the rear end of the No. 1 fixing frame and the No. 2 fixing frame, the inner side of the sliding groove is provided with a sliding rod, and the No. 1 fixing frame and the No. 2 fixing frame are respectively embedded in the slide. On the inner side of the slot, and the inner side of the No. 1 fixing frame and the No. 2 fixing frame is provided with a sliding hole at the connection of the corresponding sliding rod. The upper ends of the No. 1 fixing frame and the No. 2 fixing frame are provided with T-shaped grooves, the inner side of the T-shaped grooves is connected with a threaded column, and the surface of the threaded column is connected with a nut and a rotating seat respectively, so A pressing plate is connected to the surface of the rotating seat, and the pressing plate rotates along the surface of the rotating seat.

Preferably, the guardrail and the device main body are fixed by welding, and supports are installed at the lower corners of the device main body, and the number of the supports is four groups and arranged in an array along the surface of the device main body.

Preferably, a protective cover is provided on the inner side of the protective fence, a rotating shaft is provided at the connection between the protective cover and the protective fence, and the rotating shaft penetrates through the protective cover, the protective cover and the protective fence are connected by a rotating shaft, and the protection The cover rotates along the rotating shaft, and a handle is arranged on the surface of the protective cover.

Preferably, the No. 1 fixing frame and the No. 2 fixing frame have the same structure, and one end of the T-shaped groove runs through the No. 1 fixing frame and the No. 2 fixing frame, and the end of the threaded column is embedded in the inner side of the T-shaped groove. , and slide along the inner side of the T-shaped groove, the nut rotates along the surface of the threaded column through the thread, and the nut is attached to the surface of the No. 1 fixing frame, the rotating seat moves up and down along the surface of the threaded column through the thread, the The lower surface of the pressing plate is provided with a protective pad.

Preferably, the upper ends of the No. 1 fixing frame and the No. 2 fixing frame are provided with a limit block at a position close to the chute, and the limit block and the No. 1 fixing frame and the No. 2 fixing frame are fixed by welding.

Preferably, a cross beam is provided on the inner side of the guard rail near the No. 1 fixing frame and the upper end of the No. 2 fixing frame, and both ends of the cross beam are fixed to the guard rail by welding, and the surface of the cross beam is provided with a longitudinal beam, so The longitudinal beam slides along the surface of the cross beam.

Preferably, a sliding seat is connected to the surface of the longitudinal beam, the sliding seat slides along the surface of the longitudinal beam, a hydraulic column is installed on the lower end of the sliding seat, and a cutting head is connected to the lower end of the hydraulic column.

Compared with the prior art, the utility model has the following beneficial effects:

(1) In this utility model, by connecting the protective cover with a rotating shaft inside the protective fence, and the protective cover is made of transparent glass, it can not only play a protective role during the cutting process of the silicon wafer, but also prevent the silicon powder generated during the cutting process. It is scattered into the air to cause dust pollution, and it is also convenient to observe the cutting process of the silicon wafer.

(2) In this utility model, by setting the No. 1 fixing frame and the No. 2 fixing frame on the inside of the guardrail, the positions of the No. 1 fixing frame and the No. 2 fixing frame can be adjusted along the chute according to the cutting size of the silicon wafer, so as to match the T-shaped fixing frame. The groove, the threaded column, the rotating seat and the pressure plate can adjust the position of the pressure plate along the No. 1 fixing frame and the No. 2 fixing frame, so that the silicon wafers of different sizes can be fixed, which is convenient for cutting.

Description of drawings

1 is a schematic diagram of the overall structure of a solar monocrystalline silicon wafer cutting device of the present invention;

2 is a schematic structural diagram of a protective cover in an open state of a solar monocrystalline silicon wafer cutting device of the present invention;

3 is a schematic diagram of a partial structure of a solar monocrystalline silicon wafer cutting device of the present invention;

4 is an exploded view of the connection between the No. 1 fixing frame and the threaded column in a solar monocrystalline silicon wafer cutting device of the present invention;

FIG. 5 is a schematic diagram of the connection between the beam and the longitudinal beam in a solar monocrystalline silicon wafer cutting device of the present invention.

In the figure: 1. Main body of the device; 2. Fence; 3. Protective cover; 4. No. 1 fixing frame; 5. No. 2 fixing frame; 6. T-slot; 7. Threaded post; 8. Nut; 9. Rotation seat; 10, pressure plate; 11, limit block; 12, chute; 13, sliding rod; 14, sliding hole; 15, beam; 16, longitudinal beam; 17, sliding seat; 18, hydraulic column; 19, cutting head ; 20. Support.

Detailed ways

In order to make the technical means, creation features, achievement goals and effects of the present invention easy to understand and understand, the present invention will be further described below with reference to the specific embodiments.

In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "two ends", "one end", "the other end" The orientation or positional relationship indicated by "" etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the indicated device or element must have a specific orientation, so as to The specific orientation configuration and operation is therefore not to be construed as a limitation of the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed to indicate or imply relative importance.

In the description of the present utility model, it should be noted that, unless otherwise expressly specified and limited, the terms "installed", "provided with", "connected", etc., should be understood in a broad sense, for example, "connected" may be a fixed The connection can also be a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, and it can be internal communication between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood in specific situations.

As shown in Figures 1-5, a solar monocrystalline silicon wafer cutting device includes a device main body 1, and a guard rail 2 is arranged on the upper end of the device main body 1. The guard rail 2 and the device main body 1 are fixed by welding, which can improve the The connection strength between the guardrail 2 and the main body 1 of the device, a support 20 is installed at the lower end corner of the main body 1, and the stability of the cutting device can be ensured by the support 20, and the number of the support 20 is four groups, and along the The surface of the main body 1 of the device is arranged in an array, the inner side of the protective fence 2 is provided with a protective cover 3, the connection between the protective cover 3 and the protective fence 2 is provided with a rotating shaft, and the rotating shaft runs through the protective cover 3, the protective cover 3 and the protective fence 2 They are connected by a rotating shaft, and the protective cover 3 rotates along the rotating shaft, and a handle is provided on the surface of the protective cover 3, and the protective cover 3 is conveniently opened along the rotating shaft through the handle.

A No. 1 fixing frame 4 and a No. 2 fixing frame 5 are respectively provided on the inner side of the guardrail 2 near the upper end of the device main body 1, which can support the silicon wafer. The inner surface of the fence 2 is provided with a chute 12 near the rear end connection of the No. 1 fixing frame 4 and the No. 2 fixing frame 5, so that the No. 1 fixing frame 4 and the No. 2 fixing frame 5 can slide along the inner side of the guardrail 2, and the sliding groove 12 A sliding rod 13 is provided on the inner side of the guardrail, through which the No. 1 fixing frame 4 and No. 2 fixing frame 5 can be restricted to prevent No. The frame 4 and the No. 2 fixing frame 5 are respectively embedded in the inner side of the chute 12, and the inner side of the No. 1 fixing frame 4 and the No. 2 fixing frame 5 is provided with a sliding hole 14 corresponding to the connection of the sliding rod 13. The second fixing frame 5 slides along the surface of the sliding rod 13 through the sliding hole 14 on the inner side of the sliding groove 12 .

The upper ends of the No. 1 fixing frame 4 and the No. 2 fixing frame 5 are provided with T-shaped grooves 6, through which the threaded post 7 can be inserted into the T-shaped groove 6, and at the same time, it is also convenient for the threaded post 7 to slide along the T-shaped groove 6, so as to adjust the thread The position of the column 7, and one end of the T-shaped slot 6 runs through the No. 1 fixing frame 4 and the No. 2 fixing frame 5, the inner side of the T-shaped groove 6 is connected with a threaded column 7, and the end of the threaded column 7 is embedded in the T-shaped groove 6. The inner side of the threaded column 7 slides along the inner side of the T-shaped groove 6. The surface of the threaded column 7 is connected with a nut 8 and a rotating seat 9 respectively. 4, the threaded column 7 can be fixed by the nut 8, which can prevent the threaded column 7 from moving along the inner side of the T-shaped groove 6, and the rotating seat 9 moves up and down along the surface of the threaded column 7 through the thread, which is conducive to driving the pressure plate 10 to the silicon wafer. For fixing, a pressure plate 10 is connected to the surface of the rotating base 9, and the pressure plate 10 rotates along the surface of the rotating base 9, and the angle of the pressure plate 10 can be adjusted. The upper ends of the No. 1 fixing frame 4 and the No. 2 fixing frame 5 are provided with a limit block 11 near the chute 12 .

The inner side of the guardrail 2 is provided with a beam 15 near the upper ends of the No. 1 fixing frame 4 and the No. 2 fixing frame 5, and both ends of the beam 15 are fixed with the guardrail 2 by welding, and the surface of the beam 15 is provided with a longitudinal beam 16, The longitudinal beam 16 slides along the surface of the cross beam 15, the surface of the longitudinal beam 16 is connected with a sliding seat 17, the sliding seat 17 slides along the surface of the longitudinal beam 16, the lower end of the sliding seat 17 is installed with a hydraulic column 18, and the lower end of the hydraulic column 18 is connected with a For the cutting head 19, the position of the cutting head 19 can be adjusted through the cross beam 15 and the longitudinal beam 16, so as to facilitate the cutting of the silicon wafer.

It should be noted that the present utility model is a solar monocrystalline silicon wafer cutting device. When it needs to be used, use the handle to open the protective cover 3, and then adjust the No. The position of frame 4 and No. 2 fixing frame 5, then place the silicon wafer on the surface of No. 1 fixing frame 4 and No. 2 fixing frame 5, and let the silicon chip touch the limit block 11, and then use the T-slot 6 to move threaded post 7, and then rotate the rotating base 9, so that the rotating base 9 drives the pressure plate 10 to move down, and presses the pressure plate 10 on the surface of the silicon wafer to fix the silicon wafer, and then the protective cover 3 is closed, and the beam 15 is connected with the The stringer 16 automatically adjusts the position of the cutting head 19 to cut the silicon wafer.

The basic principles and main features of the present invention and the advantages of the present invention are shown and described above. It should be understood by those skilled in the art that the present invention is not limited by the above-mentioned embodiments. The above-mentioned embodiments and descriptions only illustrate the principle of the present invention. Without departing from the spirit and scope of the present invention, the present invention There will also be various changes and improvements in the new model, which all fall within the scope of the claimed invention. The claimed scope of the present invention is defined by the appended claims and their equivalents.

Claims (7)

1. A solar monocrystalline silicon wafer cutting device, comprising a device main body (1), characterized in that: a guard rail (2) is provided on the upper end of the device main body (1), and the inner side of the guard rail (2) is close to the The upper end of the device main body (1) is respectively provided with a No. 1 fixing frame (4) and a No. 2 fixing frame (5), and the inner surface of the guard rail (2) is close to the No. 1 fixing frame (4) and the No. 2 fixing frame (5). ) is provided with a chute (12) at the rear end of the junction, a sliding rod (13) is provided on the inner side of the chute (12), and the No. 1 fixing frame (4) and the No. 2 fixing frame (5) are respectively embedded in The inner side of the chute (12) is provided with a sliding hole (14) at the connection of the inner side of the No. 1 fixing frame (4) and the inner side of the No. 2 fixing frame (5) corresponding to the sliding rod (13). (4) The No. 2 fixing frame (5) slides along the surface of the sliding rod (13) through the sliding hole (14) on the inner side of the chute (12). The No. 1 fixing frame (4) and the No. 2 fixing frame ( The upper end of 5) is provided with a T-shaped groove (6), the inner side of the T-shaped groove (6) is connected with a threaded column (7), and the surface of the threaded column (7) is respectively connected with a nut (8) and a rotating seat (9), a pressing plate (10) is connected to the surface of the rotating seat (9), and the pressing plate (10) rotates along the surface of the rotating seat (9). 2 . The solar monocrystalline silicon wafer cutting device according to claim 1 , wherein the guardrail ( 2 ) and the device main body ( 1 ) are fixed by welding, and the device main body ( 1 ) A support (20) is installed at the corner of the lower end of the device, and the number of the support (20) is four groups, which are arranged in an array along the surface of the device main body (1). 3 . The solar monocrystalline silicon wafer cutting device according to claim 1 , wherein a protective cover ( 3 ) is provided on the inner side of the protective fence ( 2 ), and the protective cover ( 3 ) is connected to the protective fence. 4 . The connection of (2) is provided with a rotating shaft, and the rotating shaft penetrates through the protective cover (3), the protective cover (3) and the guardrail (2) are connected by a rotating shaft, and the protective cover (3) rotates along the rotating shaft, and A handle is provided on the surface of the protective cover (3). 4. The solar monocrystalline silicon wafer cutting device according to claim 1, characterized in that: the No. 1 fixing frame (4) and the No. 2 fixing frame (5) have the same structure, and the T-slot (6) ) runs through the No. 1 fixing frame (4) and the No. 2 fixing frame (5), and the end of the threaded post (7) is inserted into the inner side of the T-slot (6), and runs along the T-slot (6). The inner side slides, the nut (8) rotates along the surface of the threaded column (7) through the thread, and the nut (8) fits the surface of the No. 1 fixing frame (4) and the No. 2 fixing frame (5), the said The rotating seat (9) moves up and down along the surface of the threaded column (7) through threads, and a protective pad is provided on the lower surface of the pressing plate (10). 5 . The solar monocrystalline silicon wafer cutting device according to claim 1 , wherein the upper ends of the No. 1 fixing frame ( 4 ) and the No. 2 fixing frame ( 5 ) are close to the position of the chute ( 12 ). 6 . A limit block (11) is provided, and the limit block (11) is fixed by welding with the No. 1 fixing frame (4) and the No. 2 fixing frame (5). 6 . The solar monocrystalline silicon wafer cutting device according to claim 1 , wherein the inner side of the guardrail ( 2 ) is close to the upper ends of the No. 1 fixing frame ( 4 ) and the No. 2 fixing frame ( 5 ). 7 . A beam (15) is provided, and both ends of the beam (15) are fixed to the guardrail (2) by welding, the surface of the beam (15) is provided with a longitudinal beam (16), and the longitudinal beam (16) Slide along the surface of the beam (15). 7 . The solar monocrystalline silicon wafer cutting device according to claim 6 , wherein a sliding seat ( 17 ) is connected to the surface of the longitudinal beam ( 16 ), and the sliding seat ( 17 ) runs along the longitudinal beam. 8 . The surface of (16) slides, a hydraulic column (18) is installed on the lower end of the sliding seat (17), and a cutting head (19) is connected to the lower end of the hydraulic column (18).

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