CN216354153U - Integrated circuit chip with dustproof function - Google Patents

Integrated circuit chip with dustproof function Download PDF

Info

Publication number
CN216354153U
CN216354153U CN202122913982.1U CN202122913982U CN216354153U CN 216354153 U CN216354153 U CN 216354153U CN 202122913982 U CN202122913982 U CN 202122913982U CN 216354153 U CN216354153 U CN 216354153U
Authority
CN
China
Prior art keywords
circuit chip
integrated circuit
miniature
square
uncovered
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202122913982.1U
Other languages
Chinese (zh)
Inventor
杨立峰
陈瑜
孙化
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen E Mantech Co ltd
Original Assignee
Shenzhen E Mantech Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen E Mantech Co ltd filed Critical Shenzhen E Mantech Co ltd
Priority to CN202122913982.1U priority Critical patent/CN216354153U/en
Application granted granted Critical
Publication of CN216354153U publication Critical patent/CN216354153U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Abstract

The utility model provides an integrated circuit chip with a dustproof function, which comprises a square step plastic frame, a uncovered step protective shell and an integrated circuit chip body, wherein the integrated circuit chip body is positioned at the lower end inside the uncovered step protective shell, a radiating silicone sheet is adhered to the upper end surface of the integrated circuit chip body, an aluminum heat-conducting plate is arranged on the upper end surface of the radiating silicone sheet, a first clamping groove is formed in the uppermost side of the inner side surface of the square step plastic frame, a high-temperature-resistant PC dustproof net is placed in the first clamping groove, a second clamping groove is formed in the upper side of the inner side surface of the square step plastic frame, a nylon fine sand net is clamped in the second clamping groove, a plurality of miniature compression springs are longitudinally fixed on the edge of the inner side surface of the uncovered step protective shell, the design solves the problems that the installation and disassembly steps of the original dustproof mechanism are troublesome and inconvenient, the structure is reasonable, the disassembly and the assembly are convenient, and the chip damage is not easy to cause in the process, and has high practicability.

Description

Integrated circuit chip with dustproof function
Technical Field
The utility model discloses an integrated circuit chip with a dustproof function, and belongs to the technical field of integrated circuit chip equipment.
Background
The integrated circuit chip is an electronic element comprising a silicon substrate, at least one circuit, a fixed seal ring, a grounding ring and at least one protective ring, and the structure is that the circuit is formed on the silicon substrate and is provided with at least one output/input pad. The fixed seal ring is formed on the silicon substrate and surrounds the circuit and the input/output pad. The grounding ring is formed between the silicon substrate and the input/output pad and is electrically connected with the fixed seal ring. The protective ring is arranged on the silicon substrate and surrounds the output/input pad for being electrically connected with the fixed seal ring.
The existing integrated circuit chip is easy to deposit dust when in use, and the long-time dust deposit easily causes the heat dissipation effect of the integrated circuit chip to be poor, so a dustproof mechanism is needed, but the installation and disassembly steps of the existing dustproof mechanism are troublesome and inconvenient, and the chip is easy to damage due to the misoperation of a user, so that the problem of the occurrence is solved by the integrated circuit chip with the dustproof function urgently needed.
SUMMERY OF THE UTILITY MODEL
The integrated circuit chip has a reasonable structure, is convenient to disassemble and assemble, is not easy to damage the chip in the process, and has high practicability.
In order to achieve the purpose, the utility model is realized by the following technical scheme: an integrated circuit chip with a dustproof function comprises a square step plastic frame, a uncovered step protective shell and an integrated circuit chip body, wherein the integrated circuit chip body is positioned at the lower end inside the uncovered step protective shell, a radiating silicone sheet is pasted on the upper end face of the integrated circuit chip body, an aluminum heat conducting plate is arranged on the upper end face of the radiating silicone sheet, a first clamping groove is formed in the uppermost side of the inner side face of the square step plastic frame, a high-temperature resistant PC dustproof net is placed in the first clamping groove, a second clamping groove is formed in the upper side of the inner side face of the square step plastic frame, a nylon fine sand net is clamped in the second clamping groove, a plurality of miniature compression springs are longitudinally fixed on the edge of the inner side face of the uncovered step protective shell, the square step plastic frame is clamped at the upper end of the uncovered step protective shell and is pasted and connected with the miniature compression springs, and a plurality of miniature circular through holes are uniformly formed in the left end face and the right end face of the uncovered step protective shell, the square step plastic frame is characterized in that a plurality of miniature circular grooves are formed in the left end face and the right end face of the square step plastic frame in an equal specification, the miniature circular through holes are communicated with the miniature circular grooves respectively, and annular clamping pieces are fixed on the inner side surface of the square step plastic frame.
Furthermore, it is a plurality of miniature hexagon socket head cap screw runs through the setting at square step plastic frame up end, and a plurality of miniature hexagon socket head cap screw all run through high temperature resistant PC dust screen top edge and the fine sand net edge of nylon.
Further, a miniature cylindrical pin penetrates through each miniature circular through hole and each miniature circular groove.
Furthermore, the micro radiating fins are arranged on the upper end face of the aluminum heat conducting plate in the same specification from left to right, and the upper ends of the micro radiating fins are attached to the annular clamping sheet.
Further, a plurality of the micro compression springs are all in a compressed state.
Furthermore, a plurality of specifications such as dust collecting circuit chip pins are arranged on the lower end face of the uncovered step protective shell, and the plurality of dust collecting circuit chip pins penetrate through the uncovered step protective shell to be connected with the integrated circuit chip body.
The utility model has the beneficial effects that: according to the integrated circuit chip with the dustproof function, the high-temperature-resistant PC dustproof net, the micro inner hexagon bolt, the nylon fine sand net and the square step plastic frame are added, so that the integrated circuit chip body can be dustproof, the high-temperature-resistant PC dustproof net and the nylon fine sand net can be conveniently detached for cleaning, the arranged micro cylindrical pin, the micro circular through hole, the micro circular groove and the micro compression spring can enable the uncovered step protective shell and the square step plastic frame to be clamped and fixed, the installation and the disassembly are convenient enough, the chip is not easily damaged in the process, and the arranged annular clamping piece, the heat dissipation silicone sheet, the aluminum heat conduction plate and the micro heat dissipation sheet can improve the heat dissipation effect of the integrated circuit chip body, so that workers can conveniently use the integrated circuit chip.
Drawings
Other features, objects and advantages of the utility model will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:
FIG. 1 is a schematic diagram of an IC chip with dust-proof function according to the present invention;
FIG. 2 is a cross-sectional view of an IC chip with dust-proof function according to the present invention;
FIG. 3 is a partially enlarged view of an IC chip with dust-proof function according to the present invention;
in the figure: 1-square step plastic frame, 11-high temperature resistant PC dust screen, 111-first card slot, 12-miniature inner hexagon bolt, 13-nylon fine sand screen, 131-second card slot, 14-miniature cylindrical pin, 141-miniature circular through hole, 142-miniature circular slot, 15-miniature compression spring, 16-annular card, 2-uncovered step protective shell, 3-integrated circuit chip body, 31-heat dissipation silicone grease piece, 32-aluminum heat conduction plate, 33-miniature heat sink, 34-integrated circuit chip pin.
Detailed Description
In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the utility model easy to understand, the utility model is further described with the specific embodiments.
Referring to fig. 1-3, the present invention provides a technical solution: an integrated circuit chip with a dustproof function comprises a square step plastic frame 1, a coverless step protective shell 2 and an integrated circuit chip body 3, wherein the integrated circuit chip body 3 is positioned at the lower end inside the coverless step protective shell 2, a radiating silicone sheet 31 is adhered to the upper end surface of the integrated circuit chip body 3, an aluminum heat-conducting plate 32 is arranged on the upper end surface of the radiating silicone sheet 31, a first clamping groove 111 is arranged at the uppermost side of the inner side surface of the square step plastic frame 1, a high-temperature resistant PC dustproof net 11 is placed in the first clamping groove 111, a second clamping groove 131 is arranged at the upper side of the inner side surface of the square step plastic frame 1, a nylon fine sand net 13 is clamped in the second clamping groove 131, a plurality of miniature compression springs 15 are longitudinally fixed at the edge of the inner side surface of the coverless step protective shell 2, the square step plastic frame 1 is clamped at the upper end of the coverless step protective shell 2 and is adhered and connected with the miniature compression springs 15, the equal specification of terminal surface has seted up a plurality of miniature circular through-holes 141 about uncovered step protecting crust 2, and the equal specification of terminal surface has seted up a plurality of miniature circular grooves 142 about square step plastic frame 1, and a plurality of miniature circular through-holes 141 communicate with each other respectively with a plurality of miniature circular grooves 142, and the inboard fixed surface of square step plastic frame 1 has annular card 16, and this design has solved that original dustproof machanism installation dismantlement step is comparatively troublesome, convenient problem inadequately.
A plurality of miniature hexagon socket head cap bolts 12 run through the setting at 1 up end of square step plastic frame, and a plurality of miniature hexagon socket head cap bolts 12 all run through 11 upper end edges of high temperature resistant PC dust screen and the thin husky net 13 edge of nylon, through a plurality of miniature hexagon socket head cap bolts 12 that set up, can install and dismantle high temperature resistant PC dust screen 11 and the thin husky net 13 of nylon through external hexagon socket head cap spanner, thereby be convenient for follow-up staff carries out cleaning process with the filterable dust of high temperature resistant PC dust screen 11 and the thin husky net 13 of nylon.
All run through between every miniature circular through-hole 141 and every miniature circular recess 142 and be provided with miniature cylindric lock 14, through a plurality of miniature circular through-holes 141 and a plurality of miniature circular recess 142 that set up, be convenient for carry out fixed connection between square step plastic frame 1 and uncovered step protecting crust 2.
The plurality of micro radiating fins 33 are arranged on the upper end surface of the aluminum heat conducting plate 32 in a specification equal to the specification from left to right, the upper ends of the plurality of micro radiating fins 33 are attached to the annular card 16, and the heat conducted by the aluminum heat conducting plate 32 can be dissipated through the plurality of micro radiating fins 33 arranged, so that the integrated circuit chip body 3 can work stably.
All be in compression state for a plurality of miniature compression spring 15, through a plurality of miniature compression spring 15 that set up, can make a plurality of miniature cylindric lock 14 block respectively and establish in a plurality of miniature circular through-holes 141 and a plurality of miniature circular recess 142 for a plurality of miniature cylindric lock 14 can not loosen by oneself, and also be convenient for the staff follow-up with the square step plastic frame 1 and do not install the dismantlement between the step protecting crust 2 of no lid.
The specification settings such as a plurality of collection dirt circuit chip pins 34 are terminal surface under uncovered step protecting crust 2, and a plurality of collection dirt circuit chip pins 34 all run through uncovered step protecting crust 2 and are connected with integrated circuit chip body 3, and through a plurality of collection dirt circuit chip pins 34 that set up, integrated circuit chip body 3 and external circuit board of being convenient for are connected.
As an embodiment of the present invention: when the device needs to be disassembled and cleaned for a long time, firstly, an external hexagon socket wrench is used for screwing off the micro hexagon socket bolts 12, then the high-temperature-resistant PC dustproof net 11 and the nylon fine sand net 13 can be taken out from the first clamping groove 111 and the second clamping groove 131 respectively, then, dust filtered by the high-temperature-resistant PC dustproof net 11 and the nylon fine sand net 13 can be cleaned, the square-step plastic frame 1 is pressed and kept still, then, the micro cylindrical pins 14 can be pulled out from the micro circular through holes 141 and the micro circular grooves 142 respectively, then, the square-step plastic frame 1 is loosened, the compression force can be released upwards by the micro compression springs 15 in a compression state, the square-step plastic frame 1 and the uncovered-step protective shell 2 can be easily disassembled, at the moment, the annular clamping sheet 16 can be separated from the micro radiating fins 33, and then, the micro radiating fins 33 and the nylon fine sand net 13 can be removed, The aluminum heat-conducting plate 32 and the heat-dissipating silicone sheet 31 can check and maintain the integrated circuit chip body 3; when the device needs to be combined, the steps are reversed, and the operation is simple and convenient.
While there have been shown and described what are at present considered the fundamental principles and essential features of the utility model and its advantages, it will be apparent to those skilled in the art that the utility model is not limited to the details of the foregoing exemplary embodiments, but is capable of other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims (6)

1. The utility model provides an integrated circuit chip with dustproof function, includes square step plastic frame (1), uncovered step protecting crust (2) and integrated circuit chip body (3), its characterized in that: the integrated circuit chip body (3) is positioned at the lower end inside the uncovered step protective shell (2), the upper end surface of the integrated circuit chip body (3) is pasted with a heat dissipation silicone sheet (31), the upper end surface of the heat dissipation silicone sheet (31) is provided with an aluminum heat conduction plate (32), the uppermost side of the inner side surface of the square step plastic frame (1) is provided with a first clamping groove (111), a high temperature resistant PC dust screen (11) is placed on the first clamping groove (111), the upper side of the inner side surface of the square step plastic frame (1) is provided with a second clamping groove (131), a nylon fine sand screen (13) is clamped in the second clamping groove (131), the edge of the inner side surface of the uncovered step protective shell (2) is longitudinally fixed with a plurality of miniature compression springs (15), the square step plastic frame (1) is clamped at the upper end of the uncovered step protective shell (2) and is pasted with the miniature compression springs (15), the uncovered step protective shell (2) is provided with a plurality of miniature circular through holes (141) in the same specification of the left end face and the right end face, the square step plastic frame (1) is provided with a plurality of miniature circular grooves (142) in the same specification of the left end face and the right end face, the miniature circular through holes (141) are respectively communicated with the miniature circular grooves (142), and the inner side surface of the square step plastic frame (1) is fixed with an annular clamping piece (16).
2. The integrated circuit chip with a dustproof function according to claim 1, wherein: the upper end face of the square step plastic frame (1) is provided with a plurality of miniature inner hexagonal bolts (12) in a penetrating mode, and the miniature inner hexagonal bolts (12) penetrate through the upper end edge of the high-temperature-resistant PC dust screen (11) and the edge of the nylon fine sand screen (13).
3. The integrated circuit chip with a dustproof function according to claim 1, wherein: and a micro cylindrical pin (14) penetrates through each micro circular through hole (141) and each micro circular groove (142).
4. The integrated circuit chip with a dustproof function according to claim 1, wherein: the upper end face of the aluminum heat conducting plate (32) is provided with a plurality of micro radiating fins (33) in an equal specification from left to right, and the upper ends of the micro radiating fins (33) are attached to the annular card (16).
5. The integrated circuit chip with a dustproof function according to claim 1, wherein: the plurality of miniature compression springs (15) are all in a compressed state.
6. The integrated circuit chip with a dustproof function according to claim 1, wherein: the lower end face of the uncovered step protective shell (2) is provided with a plurality of dust collecting circuit chip pins (34) in an equal specification, and the dust collecting circuit chip pins (34) penetrate through the uncovered step protective shell (2) and are connected with the integrated circuit chip body (3).
CN202122913982.1U 2021-11-25 2021-11-25 Integrated circuit chip with dustproof function Active CN216354153U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202122913982.1U CN216354153U (en) 2021-11-25 2021-11-25 Integrated circuit chip with dustproof function

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202122913982.1U CN216354153U (en) 2021-11-25 2021-11-25 Integrated circuit chip with dustproof function

Publications (1)

Publication Number Publication Date
CN216354153U true CN216354153U (en) 2022-04-19

Family

ID=81153365

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202122913982.1U Active CN216354153U (en) 2021-11-25 2021-11-25 Integrated circuit chip with dustproof function

Country Status (1)

Country Link
CN (1) CN216354153U (en)

Similar Documents

Publication Publication Date Title
CN216354153U (en) Integrated circuit chip with dustproof function
CN209728754U (en) A kind of wireless access mould group hardware
US9500417B2 (en) Thermal module connection structure
CN209593899U (en) A kind of board facilitating separation radiating subassembly
CN2924791Y (en) Radiating device
US20140313661A1 (en) Expansion card assembly and electronic device using the same
CN211349270U (en) Mounting and fixing device for computer CPU radiator
CN201957383U (en) Radiator and equipment with daughter card architecture
CN110191601A (en) A kind of computer network monitoring device
US20100236765A1 (en) Fan assembly and heat dissipation device having the same
CN216412080U (en) Insulating radiating fin for notebook computer
CN211928542U (en) Efficient heat dissipation mechanism for computer CPU
CN216748197U (en) Optical module structure with anti-interference function
CN210840199U (en) Heat balance type PCB
CN203118931U (en) Simple wafer radiator
CN213960176U (en) Multifunctional camera module device
CN210201542U (en) Fast charging power adapter with heat dissipation function
CN213991479U (en) Novel all-in-one heat dissipation device
CN214278851U (en) Mainboard fixing device for computer
CN214482000U (en) LCM display screen convenient to installation has heat dissipation mechanism
US20100220440A1 (en) Heat sink and motherboard assembly utilizing the heat sink
CN209149194U (en) A kind of anti-water dust type computer display
CN214958874U (en) Movable outdoor tower type UPS (uninterrupted Power supply)
CN215009592U (en) Surge protector based on internet of things technology
CN214151683U (en) Intelligent monitoring hard disk state and security device

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant