CN216286656U

CN216286656U - Monitoring service device based on IIC extension mode

Info

Publication number: CN216286656U
Application number: CN202122607684.XU
Authority: CN
Inventors: 戚功才; 龚珊珊
Original assignee: Anhui Yunke Construction Technology Co ltd
Current assignee: Anhui Yunke Construction Technology Co ltd
Priority date: 2021-10-28
Filing date: 2021-10-28
Publication date: 2022-04-12
Anticipated expiration: 2031-10-28

Abstract

The utility model discloses a monitoring service device based on an IIC (inter-integrated circuit) expansion mode, relates to the technical field of servers, and aims to solve the problem that the normal operation of equipment is affected because the existing IIC is expanded by using a single chip microcomputer controller which does not have a heat dissipation structure and easily causes overhigh self temperature. The utility model has novel structure, can increase the heat radiation structure of the singlechip controller, realizes the self heat radiation function, improves the heat radiation effect, reduces the self temperature, ensures the normal work of equipment, can install and disassemble the singlechip, and is convenient to overhaul and maintain the singlechip.

Description

Monitoring service device based on IIC extension mode

Technical Field

The utility model relates to the technical field of servers, in particular to a monitoring service device based on an IIC (inter-integrated circuit) extension mode.

Background

The IIC, i.e., I2C, a bus structure, is a single chip or microcontroller that is made by integrating the peripheral circuits such as ROM, RAM, I/O port, a/D, D/a, etc. necessary for a CPU and a single operating system into a single chip with the development of large scale integrated circuit technology. The system comprises CPUs with various word lengths, ROMs and RAMs with various capacities, I/O interface circuits with different functions and the like, but the variety and the specification of the single chip microcomputer are still limited, so that only a certain single chip microcomputer can be selected for expansion. There are two methods of expansion: one is a parallel bus and the other is a serial bus. Because the serial bus has few connecting wires and simple structure, all the devices are often connected by wires without special motherboards and sockets. Therefore, the hardware design of the system can be greatly simplified by adopting the serial line.

The singlechip generally sets up in the inside of equipment, controls the product through circuit structure, and current singlechip controller self does not have heat radiation structure, and singlechip controller's heat dissipation is generally controlled by the heat radiation structure of product, can't realize self heat dissipation, and integrated circuit bus extension behind the singlechip, the operation degree is great, leads to singlechip controller self high temperature easily, influences equipment normal work. Therefore, in order to solve such problems, we propose a monitoring service device based on the IIC extension method.

SUMMERY OF THE UTILITY MODEL

The utility model provides a monitoring service device based on an IIC extension mode, which solves the problem that the normal work of equipment is influenced because the temperature of a single chip microcomputer controller is easily overhigh because the single chip microcomputer controller does not have a heat dissipation structure when the existing IIC is extended by using the single chip microcomputer controller.

In order to achieve the purpose, the utility model adopts the following technical scheme:

the utility model provides a control service device based on IIC extended mode, includes drain pan, top shell and singlechip main part, drain pan top movable mounting has the top shell, the inside singlechip main part that is equipped with of drain pan, singlechip main part top is equipped with the heat-conducting plate, heat-conducting plate top fixed mounting has the heating panel that is evenly distributed, heat-conducting plate top fixed mounting has condenser pipe and condensate pump, the condensate pump is connected with the condenser pipe both ends, singlechip main part tip fixed mounting has the circuit board, circuit board lateral wall fixed mounting has the wiring mouth, the thermovent has been seted up on top shell top, inside fixed mounting of thermovent has fan and dust guard, be equipped with buckle mechanism between drain pan and the top shell.

Preferably, the buckling mechanism comprises a clamping block and a clamping groove, sliding grooves which are symmetrically distributed are formed in two ends of the top shell, a sliding plate is arranged in each sliding groove in a sliding mode, return springs which are uniformly distributed are connected between the sliding plate and the top shell, supporting rods which are symmetrically distributed are fixedly mounted at the bottom end of the sliding plate, the bottom end of each supporting rod extends to the lower portion of the bottom end of the top shell, a sliding groove matched with the supporting rods is formed in the top shell, the clamping block is fixedly mounted at the bottom end of the supporting rod, and a clamping groove matched with the clamping block is formed in the top end of the bottom shell.

Preferably, the section of the clamping block is in a right triangle shape, the inclined plane of the clamping block is positioned on one side far away from the top shell, and the section of the clamping groove is in an L-shaped structure.

Preferably, the bottom shell is internally and fixedly provided with four guide seats with the same structure, the four guide seats are distributed in a rectangular array mode, the top shell is internally and fixedly provided with four guide rods with the same structure, the four guide rods are distributed in a rectangular array mode, and the guide rods are matched with the guide seats.

Preferably, the singlechip main part is located four between the guide holder, the guide bar bottom and the laminating of singlechip main part, the air inlet that is evenly distributed is all seted up to the drain pan both sides, the wiring mouth extends to the drain pan lateral wall.

Preferably, the condenser pipe is of a serpentine structure, the condenser pipe is located between the two adjacent heating panels, and the condenser pipe is attached to the two adjacent heating panels.

The utility model has the beneficial effects that:

1. through setting up buckle mechanism, the process of drain pan and top shell lock, when the fixture block got into the draw-in groove, promote bracing piece and sliding plate and remove to the top shell direction to extrude reset spring, after the fixture block got into the draw-in groove, reset spring promoted the sliding plate and removed, drove the fixture block card and go into the draw-in groove, can fix drain pan and top shell, promoted the sliding plate at top shell both ends, the fixture block that drives buckle mechanism breaks away from the draw-in groove, can easily dismantle drain pan and top shell.

2. Through setting up condensate pump and condenser pipe, the condensate pump provides the coolant liquid and flows through the condenser pipe, and the condenser pipe can improve the heat transfer efficiency of heating panel with the laminating of heating panel lateral wall, further improves the radiating efficiency of heating panel.

In conclusion, the device can increase the heat dissipation structure of the single chip microcomputer controller, realize the self heat dissipation function, improve the heat dissipation effect, reduce the self temperature, ensure the normal work of equipment, and can be used for installing and disassembling the single chip microcomputer, thereby being convenient for overhauling and maintaining the single chip microcomputer.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a top view of the heat-conducting plate of the present invention;

FIG. 3 is an exploded view of the top shell of the present invention;

fig. 4 is a cross-sectional view of the snapping mechanism of the present invention.

Reference numbers in the figures: 1. a bottom case; 2. a top shell; 3. a singlechip main body; 4. a heat conducting plate; 5. a heat dissipation plate; 6. a condenser tube; 7. a condensate pump; 8. a circuit board; 9. a wiring port; 10. an air inlet; 11. a guide seat; 12. a guide bar; 13. a heat dissipation port; 14. a fan; 15. a dust-proof plate; 16. a chute; 17. a sliding plate; 18. a return spring; 19. a sliding groove; 20. a support bar; 21. a clamping block; 22. a clamping groove.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.

Referring to fig. 1 and 3, a monitoring service device based on IIC extension mode, including drain pan 1, top shell 2 and singlechip

main part

3, 1 top movable mounting of drain pan has top shell 2, the inside singlechip main part 3 that is equipped with of drain pan 1, air inlet 10 that is evenly distributed is all seted up to drain pan 1 both sides, the inside fixed mounting of drain pan 1 has four guide holders 11 that the structure is the same, four guide holders 11 are the rectangular array and distribute, singlechip main part 3 is located between four guide holders 11, the laminating of guide bar 12 bottom and singlechip main part 3, the inside fixed mounting of top shell 2 has four guide bars 12 that the structure is the same, four guide bars 12 are the rectangular array and distribute, guide bar 12 and guide holder 11 phase-matches.

Referring to fig. 2, a heat conducting plate 4 is arranged at the top end of a singlechip main body 3, heat radiating plates 5 which are uniformly distributed are fixedly arranged at the top end of the heat conducting plate 4, a condensing pipe 6 and a condensing pump 7 are fixedly arranged at the top end of the heat conducting plate 4, the condensing pipe 6 is in a serpentine structure, the condensing pipe 6 is positioned between two adjacent heat radiating plates 5, the condensing pipe 6 is attached to the two adjacent heat radiating plates 5, the condensing pump 7 is connected with the two ends of the condensing pipe 6, a circuit board 8 is fixedly arranged at the end part of the singlechip main body 3, a wiring port 9 is fixedly arranged on the side wall of the circuit board 8, the wiring port 9 extends to the side wall of a bottom shell 1, a heat radiating port 13 is arranged at the top end of a top shell 2, a fan 14 and a dust guard 15 are fixedly arranged in the heat radiating port 13,

referring to fig. 4, be equipped with buckle mechanism between drain pan 1 and the top shell 2, buckle mechanism includes fixture block 21 and draw-in groove 22, spout 16 that is the symmetric distribution is seted up at top shell 2 both ends, slidable mounting has sliding plate 17 in spout 16, be connected with reset spring 18 that is evenly distributed between sliding plate 17 and the top shell 2, sliding plate 17 bottom fixed mounting has the bracing piece 20 that is the symmetric distribution, bracing piece 20 bottom extends to top shell 2 bottom below, top shell 2 seted up with bracing piece 20 assorted sliding tray 19, fixture block 21 fixed mounting is in bracing piece 20 bottom, fixture block 21's cross-section is right angled triangle, fixture block 21's inclined plane is located the one side of keeping away from top shell 2, drain pan 1 top seted up with fixture block 21 assorted draw-in groove 22, the cross-section of draw-in groove 22 is L type structure.

When the device is installed, place singlechip main part 3 between four guide holder 11, make the guide bar 12 of top shell 2 aim at the guide holder 11 of drain pan 1, guide bar 12 can support tight singlechip main part 3, prevent that singlechip main part 3 is not hard up, the process of drain pan 1 and top shell 2 lock, when fixture block 21 gets into draw-in groove 22, promote bracing piece 20 and remove to top shell 2 direction, sliding plate 17 removes to top shell 2 direction along spout 16, and extrude reset spring 18, after fixture block 21 gets into draw-in groove 22, reset spring 18 promotes sliding plate 17 and removes, drive fixture block 21 card income draw-in groove 22, fix drain pan 1 and top shell 2.

When using the device, start condensate pump 7 and fan 14, the heat that 3 operation in-process of singlechip main part produced transmits to heating panel 5 through heat-conducting plate 4, fan 14 takes the air current to get into drain pan 1 and top shell 2 confined inside from air inlet 10, the air current drives the heat and discharges from thermovent 13, condensate pump 7 provides the coolant liquid and flows through condenser pipe 6,

condenser pipe

6 and 5 lateral wall laminating of heating panel, improve heating panel 5's heat transfer efficiency, further improve heating panel 5's radiating efficiency, promote both ends, when singlechip main part 3 need overhaul and maintain, promote the sliding plate 17 at 2 both ends of top shell, the fixture block 21 that drives buckle mechanism breaks away from draw-in groove 22, can conveniently dismantle drain pan 1 and top shell 2.

The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and equivalent alternatives or modifications according to the technical solution of the present invention and the inventive concept thereof should be covered by the scope of the present invention.

Claims

1. A monitoring service device based on an IIC extension mode comprises a bottom shell (1), a top shell (2) and a single chip microcomputer main body (3) and is characterized in that the top end of the bottom shell (1) is movably provided with the top shell (2), the single chip microcomputer main body (3) is arranged inside the bottom shell (1), the top end of the single chip microcomputer main body (3) is provided with a heat conducting plate (4), the top end of the heat conducting plate (4) is fixedly provided with heat dissipation plates (5) which are uniformly distributed, the top end of the heat conducting plate (4) is fixedly provided with a condensation pipe (6) and a condensation pump (7), the condensation pump (7) is connected with two ends of the condensation pipe (6), the end part of the single chip microcomputer main body (3) is fixedly provided with a circuit board (8), the side wall of the circuit board (8) is fixedly provided with a wiring port (9), the top end of the top shell (2) is provided with a heat dissipation port (13), and a fan (14) and a dustproof plate (15) are fixedly arranged inside the heat dissipation port (13), and a buckling mechanism is arranged between the bottom shell (1) and the top shell (2).

2. The IIC extension based monitoring service device as claimed in claim 1, it is characterized in that the buckling mechanism comprises a clamping block (21) and a clamping groove (22), sliding grooves (16) which are symmetrically distributed are formed at two ends of the top shell (2), a sliding plate (17) is arranged in the sliding groove (16) in a sliding way, return springs (18) which are uniformly distributed are connected between the sliding plate (17) and the top shell (2), the bottom end of the sliding plate (17) is fixedly provided with symmetrically distributed support rods (20), the bottom end of the supporting rod (20) extends to the lower part of the bottom end of the top shell (2), the top shell (2) is provided with a sliding groove (19) matched with the supporting rod (20), the clamping block (21) is fixedly arranged at the bottom end of the supporting rod (20), and a clamping groove (22) matched with the clamping block (21) is formed in the top end of the bottom shell (1).

3. The IIC expansion mode-based monitoring service device as claimed in claim 2, wherein the cross section of the fixture block (21) is in a right triangle shape, the inclined surface of the fixture block (21) is located on the side far away from the top shell (2), and the cross section of the clamping groove (22) is in an L-shaped structure.

4. The IIC extended mode based monitoring service device according to claim 1, wherein four guide seats (11) with the same structure are fixedly installed inside the bottom shell (1), the four guide seats (11) are distributed in a rectangular array, four guide rods (12) with the same structure are fixedly installed inside the top shell (2), the four guide rods (12) are distributed in a rectangular array, and the guide rods (12) are matched with the guide seats (11).

5. The IIC extended mode-based monitoring service device as claimed in claim 4, wherein the single chip microcomputer main body (3) is located among the four guide seats (11), the bottom end of each guide rod (12) is attached to the single chip microcomputer main body (3), air inlets (10) are uniformly distributed on two sides of the bottom shell (1), and the wiring ports (9) extend to the side wall of the bottom shell (1).

6. The IIC extended monitoring service device according to claim 1, wherein the condensation pipe (6) is of a serpentine structure, the condensation pipe (6) is located between two adjacent heat dissipation plates (5), and the condensation pipe (6) is attached to the two adjacent heat dissipation plates (5).