CN216271578U - Piece mechanism and upset receipts piece device fall - Google Patents
Piece mechanism and upset receipts piece device fall Download PDFInfo
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- CN216271578U CN216271578U CN202122363809.9U CN202122363809U CN216271578U CN 216271578 U CN216271578 U CN 216271578U CN 202122363809 U CN202122363809 U CN 202122363809U CN 216271578 U CN216271578 U CN 216271578U
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- 235000012431 wafers Nutrition 0.000 claims abstract description 92
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 91
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 91
- 239000010703 silicon Substances 0.000 claims abstract description 91
- 230000000875 corresponding Effects 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 11
- 210000001503 Joints Anatomy 0.000 claims description 3
- 230000003139 buffering Effects 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 238000001514 detection method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000000903 blocking Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000001808 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000003028 elevating Effects 0.000 description 1
- 230000001360 synchronised Effects 0.000 description 1
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The utility model provides a piece dropping mechanism and a piece overturning and receiving device, wherein the piece dropping mechanism comprises a first side conveying mechanism and a second side conveying mechanism, wherein: the first conveying mechanism comprises a first mounting bracket, a first conveying belt mounting plate driving mechanism, a first conveying belt mounting plate and a first conveying belt; the second conveying mechanism comprises a second mounting bracket, a second conveying belt mounting plate driving mechanism, a second conveying belt mounting plate and a second conveying belt. When the first conveying belt mounting plate and the second conveying belt mounting plate are close to the middle, the first conveying belt and the second conveying belt are matched to support the silicon wafer and convey the silicon wafer to a blanking position; when the first conveying belt mounting plate and the second conveying belt mounting plate are separated towards two sides, the silicon wafers fall down from the first conveying belt and the second conveying belt. The silicon wafer overturning and conveying device can receive the silicon wafer falling from the overturning and conveying mechanism, convey the silicon wafer to the preset blanking position and then fall, realize blanking buffering on the silicon wafer and prevent the silicon wafer from falling and being damaged.
Description
Technical Field
The utility model relates to the field of battery production, in particular to a piece dropping mechanism and a piece overturning and collecting device.
Background
After the detection and classification of the silicon wafers are completed, the silicon wafers qualified for detection need to be taken down from the conveying line so as to complete the collection of qualified silicon wafers. In order to realize the collection of qualified silicon wafers, the conventional method is to arrange a special collection mechanism at the side of a silicon wafer conveying line or manually pick up the silicon wafers from the conveying line to collect the silicon wafers, and the conventional silicon wafer collection mode has low wafer collection efficiency.
SUMMERY OF THE UTILITY MODEL
In order to solve the technical problem, the utility model provides a sheet dropping mechanism on one hand, which adopts the following technical scheme:
the utility model provides a piece mechanism that falls, includes relative first side conveying mechanism and the second side conveying mechanism that sets up, wherein:
first conveying mechanism includes first installing support, first conveyer belt mounting panel actuating mechanism, first conveyer belt mounting panel and first conveyer belt, wherein: the first conveying belt mounting plate driving mechanism is arranged on the first mounting bracket, the first conveying belt mounting plate is connected to the driving end of the first conveying belt mounting plate driving mechanism, and the first conveying belt is mounted on the first conveying belt mounting plate;
the second conveying mechanism comprises a second mounting bracket, a second conveying belt mounting plate driving mechanism, a second conveying belt mounting plate and a second conveying belt, wherein: the second conveying belt mounting plate driving mechanism is arranged on the second mounting bracket, the second conveying belt mounting plate is connected to the driving end of the second conveying belt mounting plate driving mechanism, and the second conveying belt is mounted on the second conveying belt mounting plate;
when the first conveying belt mounting plate driving mechanism and the second conveying belt mounting plate driving mechanism drive the first conveying belt mounting plate and the second conveying belt mounting plate to approach towards the middle, the first conveying belt and the second conveying belt are matched to support the silicon wafer and convey the silicon wafer to a preset blanking position;
when the first conveying belt mounting plate driving mechanism and the second conveying belt mounting plate driving mechanism push the first conveying belt mounting plate and the second conveying belt mounting plate to separate towards two sides, the silicon wafers conveyed to the blanking position fall down from the first conveying belt and the second conveying belt.
The wafer falling mechanism provided by the utility model can receive the silicon wafers falling from the turnover conveying mechanism, convey the silicon wafers to the preset falling position and then fall, can realize falling buffering, prevent the silicon wafers from falling and being damaged, and improve the wafer collecting efficiency; in addition, it can also promote the degree of accuracy of blanking position, further improves and receives piece efficiency.
In some embodiments, the first mounting bracket, the second mounting bracket each include a mount and a first connecting plate, wherein: first connecting plate is connected on the mount pad, is provided with a plurality of guiding holes on the first connecting plate. First conveyer belt mounting panel actuating mechanism, second conveyer belt mounting panel actuating mechanism all include drive assembly, guide bar fixed plate and a plurality of guide bar, wherein: the drive assembly sets up on the mount pad, and the guide bar fixed plate is connected on drive assembly's drive end, and the first end of guide bar is connected on the guide bar fixed plate, and the second end of guide bar passes the guiding hole. The first conveyor belt mounting plate is connected to the second end of the guide rod of the first conveyor belt mounting plate driving mechanism, and the second conveyor belt mounting plate is connected to the second end of the guide rod of the second conveyor belt mounting plate driving mechanism.
Through setting up first installing support, second installing support and first conveyer belt mounting panel actuating mechanism, second conveyer belt mounting panel actuating mechanism, realized the stable drive to first conveyer belt mounting panel, second conveyer belt mounting panel to prevent that first conveyer belt mounting panel, second conveyer belt mounting panel from inclining when separately to both sides, causing the silicon chip slope.
In some embodiments, the drive assembly comprises a motor, an eccentric shaft, and a connecting rod, wherein: the motor is arranged on the mounting seat; the first end of the eccentric shaft is connected to the driving end of the motor; the first end of the connecting rod is connected to the second end of the eccentric shaft, and the second end of the connecting rod is rotatably connected to the guide rod fixing plate; the motor drives the connecting rod to swing through the eccentric shaft, so that the guide rod fixing plate is driven to translate.
The utility model provides a simple structure's drive assembly to the realization finally drives first conveyer belt mounting panel, the translation of second conveyer belt mounting panel to the drive of guide bar fixed plate.
In some embodiments, the first mounting bracket and the second mounting bracket each further comprise a second connecting plate, and the second connecting plate is connected to the first connecting plate or the mounting seat. A first limiting block is arranged on the second connecting plate of the first mounting bracket, and a second limiting block is arranged on the second connecting plate of the second mounting bracket. When the first conveying belt mounting plate driving mechanism and the second conveying belt mounting plate driving mechanism push the first conveying belt mounting plate and the second conveying belt mounting plate to be separated towards two sides, the first limiting block and the second limiting block respectively limit the side edges of silicon wafers borne on the first conveying belt and the second conveying belt.
Through set up the stopper on first installing support and second installing support, realized blockking spacing to the both sides edge of silicon chip, prevent that the silicon chip from leading to the offset because of dragging of first conveyer belt or second conveyer belt, finally influencing the blanking effect.
In some embodiments, the upper belt body of the first conveying belt is bent downwards at a position corresponding to the first limiting block, so that a first avoidance space corresponding to the first limiting block is formed; the upper side belt body of the second conveying belt is bent downwards at a position corresponding to the second limiting block to form a second avoidance space corresponding to the second limiting block; when the first conveying belt mounting plate driving mechanism and the second conveying belt mounting plate driving mechanism push the first conveying belt mounting plate and the second conveying belt mounting plate to be separated towards two sides, the lower end of the first limiting block enters a first avoidance space, and the lower end of the second limiting block enters a second avoidance space.
Through setting up first conveyer belt and second conveyer belt, thereby guarantee the blanking in-process, first stopper and second stopper can contact the both sides edge of silicon chip and implement the spacing that blocks of both sides edge to the silicon chip.
In some embodiments, the wafer dropping mechanism further comprises a magazine arranged below the first side conveying mechanism and the second side conveying mechanism, and the silicon wafers dropped from the first conveying belt and the second conveying belt drop into the magazine.
Through setting up the magazine, realized receiving material, storing to the silicon chip that falls.
In some embodiments, the first conveyor belt mounting plate and the second conveyor belt mounting plate are both provided with a stop plate which is inclined towards the magazine and is used for guiding the falling silicon wafers into the magazine.
Through setting up the backstop board, implement and block, the direction to the silicon chip that falls for the silicon chip can fall into to the magazine smoothly.
In some embodiments, the sheet dropping mechanism further comprises a magazine lifting mechanism, and the magazine is supported on the magazine lifting mechanism, and the magazine lifting mechanism is used for driving the magazine to lift.
Through setting up magazine elevating system, can be according to the silicon chip height control magazine lift in the magazine, guarantee that the silicon chip can fall into the magazine smoothly.
In some embodiments, the bottom plate of the magazine is inclined downwards along the conveying direction of the first conveying belt and the second conveying belt, and the conveying bearing surface of the first conveying belt and the conveying bearing surface of the second conveying belt are parallel to the bottom plate of the magazine.
The bottom plate of the material box, the first conveying belt and the second conveying belt are arranged to be inclined downwards, so that silicon wafers on the first conveying belt and the second conveying belt can fall into the material box stably.
The utility model also provides a turnover sheet receiving device, which comprises a first turnover conveying mechanism, a second turnover conveying mechanism and the sheet dropping mechanism, wherein the sheet dropping mechanism comprises: the second overturning conveying mechanism is arranged at the rear path of the first overturning conveying mechanism, and the piece dropping mechanism is positioned below the second overturning conveying mechanism. The first overturning conveying mechanism comprises a first overturning supporting plate and a third conveying belt installed on the first overturning supporting plate, the second overturning conveying mechanism comprises a second overturning supporting plate and a fourth conveying belt installed on the second overturning supporting plate, and the first overturning supporting plate and the second overturning supporting plate are both configured to be capable of being overturned and switched between a horizontal state and an inclined state. When the first overturning supporting plate and the second overturning supporting plate are both overturned to be in a horizontal state, the discharge end of the third conveying belt is in butt joint with the feed end of the fourth conveying belt, and the silicon wafers on the third conveying belt enter the fourth conveying belt through the feed end of the fourth conveying belt after being discharged through the discharge end of the third conveying belt and are conveyed backwards continuously. When the first overturning supporting plate and the second overturning supporting plate are both overturned to an inclined state, the discharge end of the third conveying belt is downwards inclined, and the silicon wafers on the third conveying belt are discharged from the discharge end of the third conveying belt and then are received by the wafer dropping mechanism. The wafer dropping mechanism performs the dropping of the received silicon wafer.
Through the matching of the first overturning conveying mechanism and the second overturning conveying mechanism, the overturning chip receiving device disclosed by the utility model realizes the automatic receiving of the silicon chips, and has higher efficiency compared with the traditional chip receiving mode; in addition, on the basis of the first overturning conveying mechanism and the second overturning conveying mechanism, the wafer dropping mechanism is additionally arranged, so that the silicon wafer dropping buffering is realized, the silicon wafer dropping loss is prevented, and the wafer receiving efficiency is further improved.
Drawings
FIG. 1 is a schematic structural diagram of a sheet dropping mechanism provided by the present invention at a first viewing angle;
FIG. 2 is a schematic structural diagram of a sheet dropping mechanism provided in the present invention at a second viewing angle;
FIG. 3 is a schematic diagram of the first conveyor belt and the first stopper;
FIG. 4 is a schematic structural diagram of a sheet dropping mechanism provided in the present invention at a third viewing angle;
FIG. 5 is a schematic structural view of a turnover sheet receiving device provided by the present invention;
fig. 1 to 5 include:
first side conveying mechanism 10: the device comprises a first mounting bracket 11, a first conveyor belt mounting plate driving mechanism 12, a first conveyor belt mounting plate 13, a first conveyor belt 14, a first limiting block 15 and a first stopping plate 16;
second-side conveying mechanism 20: the device comprises a second mounting bracket 21, a second conveyor belt mounting plate driving mechanism 22, a second conveyor belt mounting plate 23, a second conveyor belt 24, a second limiting block 25 and a second stopping plate 26;
a mounting seat 111, a first connecting plate 112 and a second connecting plate 113;
a driving assembly 121, a guide rod mounting plate 122, a guide rod 123 and a connecting rod 124;
a magazine 30;
a first inversion conveyance mechanism 40;
a second inversion conveyance mechanism 50.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in further detail below.
The utility model provides a turnover chip receiving device, which realizes automatic receiving of silicon chips through the matching of a first turnover conveying mechanism and a second turnover conveying mechanism, and has higher efficiency compared with the traditional chip receiving mode.
In order to further improve the wafer receiving efficiency, the utility model also provides a wafer dropping mechanism which can receive the silicon wafers dropped from the turnover conveying mechanism and convey the silicon wafers to a preset dropping position and then drop the silicon wafers, so that the dropping of the silicon wafers is buffered, and the silicon wafers are prevented from dropping and being damaged.
As shown in fig. 1 and fig. 2, the sheet dropping mechanism provided by the present invention includes a first side conveying mechanism 10 and a second side conveying mechanism 20 which are oppositely disposed, wherein:
first conveying mechanism 10 includes first installing support 11, first conveyer belt mounting panel actuating mechanism 12, first conveyer belt mounting panel 13 and first conveyer belt 14, wherein: first conveyer belt mounting panel actuating mechanism 12 sets up on first installing support 11, and first conveyer belt mounting panel 13 is connected on the drive end of first conveyer belt mounting panel actuating mechanism 12, and first conveyer belt 14 is installed on first conveyer belt mounting panel 13.
Second conveying mechanism 20 includes second installing support 21, second conveyer belt mounting panel actuating mechanism 22, second conveyer belt mounting panel 23 and second conveyer belt 24, wherein: second conveyer belt mounting panel actuating mechanism 22 sets up on second installing support 21, and second conveyer belt mounting panel 23 is connected on the drive end of second conveyer belt mounting panel actuating mechanism 22, and second conveyer belt 24 is installed on second conveyer belt mounting panel 23.
When the first conveying belt mounting plate driving mechanism 12 and the second conveying belt mounting plate driving mechanism 22 drive the first conveying belt mounting plate 13 and the second conveying belt mounting plate 23 to approach towards the middle, the first conveying belt 14 and the second conveying belt 24 are matched to support the silicon wafers and convey the silicon wafers to a preset blanking position.
When the first conveyor belt mounting plate driving mechanism 12 and the second conveyor belt mounting plate driving mechanism 22 push the first conveyor belt mounting plate 13 and the second conveyor belt mounting plate 23 to separate towards two sides, the silicon wafers conveyed to the blanking position fall from the first conveyor belt 14 and the second conveyor belt 24.
The working process of the sheet dropping mechanism of the utility model is as follows:
in an initial state, the first conveyor belt mounting plate driving mechanism 12 and the second conveyor belt mounting plate driving mechanism 22 drive the first conveyor belt mounting plate 13 and the second conveyor belt mounting plate 23 to move towards the middle, and at this time, the distance between the first conveyor belt 14 and the second conveyor belt 24 is smaller than the size of the silicon wafer.
The silicon wafer slipping down from the turnover mechanism falls onto the first conveyor belt 14 and the second conveyor belt 24, wherein one side edge of the silicon wafer is supported on the first conveyor belt 14, and the other side edge of the silicon wafer is supported on the second conveyor belt 24.
The first conveyor belt 14 and the second conveyor belt 24 cooperate to convey the silicon wafers toward a predetermined blanking position. When the silicon wafers reach the blanking position, the first conveyor belt mounting plate driving mechanism 12 and the second conveyor belt mounting plate driving mechanism 22 drive the first conveyor belt mounting plate 13 and the second conveyor belt mounting plate 23 to separate towards two sides, and the silicon wafers lose support and then fall from the first conveyor belt 14 and the second conveyor belt 24.
Optionally, the first mounting bracket 11 and the second mounting bracket 21 have the same structure, and both include a mounting seat 111 and a first connecting plate 112, where: the first connecting plate 112 is connected to the mounting base 111, and a plurality of guide holes are formed in the first connecting plate 112.
First conveyer belt mounting panel actuating mechanism 12, second conveyer belt mounting panel actuating mechanism 22's structure is the same, all includes drive assembly 121, guide bar fixed plate 122 and a plurality of guide bar 123, wherein: a driving unit 121 is disposed on the mounting seat 111, and a guide bar fixing plate 122 is coupled to a driving end of the driving unit 121. The guide rods 123 are coupled at first ends thereof to the guide rod fixing plates 122, and second ends of the respective guide rods 123 pass through the guide holes of the first coupling plate 112.
The first belt mounting plate 13 is attached to the second end of the guide rod 123 of the first belt mounting plate drive mechanism 12. The second belt mounting plate 23 is attached to a second end of the guide rod 123 of the second belt mounting plate drive mechanism 22. That is, the second end of each guide rod 123 constitutes a driving end of the first and second conveyor mounting plate driving mechanisms 12 and 22.
Drive assembly 121 drives guide bar 123 translation through guide bar fixed plate 122 to drive first conveyer belt mounting panel 13 or the synchronous translation of second conveyer belt mounting panel 23 of connecting on guide bar 123, finally realize first conveyer belt mounting panel 13, second conveyer belt mounting panel 23 and draw close to the centre and separate to both sides.
Compared with the existing driving modes such as directly adopting a driving cylinder and the like, the driving mechanism for the first conveying belt mounting plate and the driving mechanism for the second conveying belt mounting plate provided by the utility model can greatly improve the driving stability of the first conveying belt mounting plate and the second conveying belt mounting plate.
Optionally, the driving assembly 121 includes a motor, an eccentric shaft and a connecting rod, wherein: the motor is installed on the mount pad. The first end of the eccentric shaft is connected to the driving end of the motor, the first end of the connecting rod is connected to the second end of the eccentric shaft, and the second end of the connecting rod is rotatably connected to the guide rod fixing plate. The motor drives the connecting rod to swing through the eccentric shaft, thereby driving the guide rod fixing plate 122 to translate.
The first conveyor belt mounting plate driving mechanism 12 and the second conveyor belt mounting plate driving mechanism 22 drive the first conveyor belt mounting plate 13 and the second conveyor belt mounting plate 23 to separate towards two sides, and when silicon wafer blanking is implemented, one side edge of the silicon wafer may be dragged by the first conveyor belt 14 or the second conveyor belt 24, so that the silicon wafer is subjected to position deviation and finally cannot accurately fall to a target position.
In order to solve this problem, as shown in fig. 1 and 2, the first mounting bracket 11 and the second mounting bracket 21 may further include a second connecting plate 113, respectively, wherein the second connecting plate 113 is connected to the first connecting plate 112 via a plurality of connecting rods 124. Of course, the second connecting plate 113 may also be directly connected to the mounting seat 111, and in this case, the second connecting plate 113 may be configured to have an "L" shape.
A plurality of first limiting blocks 15 are arranged on the second connecting plate 113 of the first mounting bracket 11, and a plurality of second limiting blocks 25 are arranged on the second connecting plate 113 of the second mounting bracket 21.
When the first conveyor belt mounting plate driving mechanism 12 and the second conveyor belt mounting plate driving mechanism 22 push the first conveyor belt mounting plate 13 and the second conveyor belt mounting plate 23 to separate towards two sides, the first limiting block 15 and the second limiting block 25 respectively block and limit the side edges of the silicon wafers borne on the first conveyor belt 14 and the second conveyor belt 24. Namely, the first stopper 15 and the second stopper 25 perform the blocking and limiting of the silicon wafer from both sides, and prevent one side edge of the silicon wafer from moving along with the first conveyor belt 14 or the second conveyor belt 24, thereby ensuring that the silicon wafer smoothly falls to the target position.
Alternatively, as shown in fig. 3, the upper belt body of the first conveyor belt 14 is bent downward at a position corresponding to the first stopper 15, and a first avoidance space a corresponding to the first stopper 15 is formed. Correspondingly, the upper belt body of the second conveyor belt 24 is bent downward at a position corresponding to the second limit block 25, and a second avoidance space corresponding to the second limit block 25 is formed.
When the first conveyor belt mounting plate driving mechanism 12 and the second conveyor belt mounting plate driving mechanism 22 push the first conveyor belt mounting plate 13 and the second conveyor belt mounting plate 23 to separate towards two sides, the lower end of the first limiting block 15 enters the first avoidance space a, and the lower end of the second limiting block 25 enters the second avoidance space. By the arrangement, in the blanking process, the first limiting block 15 and the second limiting block 25 can both contact with the two side edges of the silicon wafer to block and limit the two side edges of the silicon wafer.
Optionally, the wafer dropping mechanism of the present invention further includes a magazine 30 disposed below the first side conveying mechanism 10 and the second side conveying mechanism 20, and the silicon wafers dropped from the first conveying belt 14 and the second conveying belt 24 finally drop into the magazine 30.
Optionally, the magazine 30 is supported on a magazine lifting mechanism, and the magazine lifting mechanism is used for driving the magazine to lift. Through the arrangement of the material box lifting mechanism, the material box can be controlled to lift according to the height of the silicon wafer in the material box, so that the silicon wafer is ensured to fall into the material box by a preset fall.
Optionally, the first conveying belt mounting plate 13 and the second conveying belt mounting plate 23 are respectively provided with a first stop plate 16 and a second stop plate 26 which are inclined towards the magazine 30, and the first stop plate 16 and the second stop plate 26 cooperate to block the silicon wafer, so that the silicon wafer falling down can be further ensured to accurately fall into the magazine.
As shown in fig. 4, optionally, the bottom plate of the magazine 30 is inclined downward along the conveying direction (the direction indicated by the arrow in the figure) of the first and second conveyor belts 14 and 24, and the conveying bearing surface of the first and second conveyor belts 14 and 24 is parallel to the bottom plate of the magazine 30. So set up for the silicon chip that falls down on first conveyer belt, the second conveyer belt can fall into to magazine 30 more steadily.
As shown in fig. 5, the present invention further provides a sheet reversing and collecting device, which includes a first reversing and conveying mechanism 40, a second reversing and conveying mechanism 50, and a sheet dropping mechanism as described in any one of the above embodiments, wherein:
the second turnover conveying mechanism 50 is arranged at the rear of the first turnover conveying mechanism 40, and the sheet dropping mechanism is positioned below the second turnover conveying mechanism 50.
The first turnover conveying mechanism 40 includes a first turnover support plate and a third conveyor belt mounted on the first turnover support plate, and the second turnover conveying mechanism 50 includes a second turnover support plate and a fourth conveyor belt mounted on the second turnover support plate, both the first turnover support plate and the second turnover support plate being configured to be capable of being turned over and switched between a horizontal state and an inclined state.
When the first overturning supporting plate and the second overturning supporting plate are both overturned to be in a horizontal state, the discharge end of the third conveying belt is in butt joint with the feed end of the fourth conveying belt, and the silicon wafers on the third conveying belt enter the fourth conveying belt through the feed end of the fourth conveying belt after being discharged through the discharge end of the third conveying belt and are conveyed backwards continuously.
When the first overturning supporting plate and the second overturning supporting plate are both overturned to an inclined state, the discharge end of the third conveying belt is downwards inclined, and the silicon wafers on the third conveying belt are discharged from the discharge end of the third conveying belt and then are received by the wafer dropping mechanism.
The drop mechanism effects a drop of the received silicon wafer so that the silicon wafer drops into the magazine 30.
Through the matching of the first overturning conveying mechanism and the second overturning conveying mechanism, the overturning chip receiving device disclosed by the utility model realizes the automatic receiving of the silicon chips, and has higher efficiency compared with the traditional chip receiving mode; in addition, on the basis of the first overturning conveying mechanism and the second overturning conveying mechanism, the wafer dropping mechanism is additionally arranged, so that the silicon wafer dropping buffering is realized, the silicon wafer dropping loss is prevented, and the wafer receiving efficiency is further improved.
The utility model has been described above with a certain degree of particularity. It will be understood by those of ordinary skill in the art that the description of the embodiments is merely exemplary and that all changes that come within the true spirit and scope of the utility model are desired to be protected. The scope of the utility model is defined by the appended claims rather than by the foregoing description of the embodiments.
Claims (10)
1. The utility model provides a mechanism that falls, its characterized in that, the mechanism that falls is including relative first side conveying mechanism and the second side conveying mechanism who sets up, wherein:
first conveying mechanism includes first installing support, first conveyer belt mounting panel actuating mechanism, first conveyer belt mounting panel and first conveyer belt, wherein: the first conveying belt mounting plate driving mechanism is arranged on the first mounting bracket, the first conveying belt mounting plate is connected to the driving end of the first conveying belt mounting plate driving mechanism, and the first conveying belt is mounted on the first conveying belt mounting plate;
second conveying mechanism includes second installing support, second conveyer belt mounting panel actuating mechanism, second conveyer belt mounting panel and second conveyer belt, wherein: the second conveyer belt mounting plate driving mechanism is arranged on the second mounting bracket, the second conveyer belt mounting plate is connected to the driving end of the second conveyer belt mounting plate driving mechanism, and the second conveyer belt is mounted on the second conveyer belt mounting plate;
when the first conveying belt mounting plate driving mechanism and the second conveying belt mounting plate driving mechanism drive the first conveying belt mounting plate and the second conveying belt mounting plate to approach towards the middle, the first conveying belt and the second conveying belt are matched to support the silicon wafer and convey the silicon wafer to a preset blanking position;
the first conveying belt mounting plate driving mechanism and the second conveying belt mounting plate driving mechanism push the first conveying belt mounting plate and the second conveying belt mounting plate to separate towards two sides, and silicon wafers conveyed to the blanking position fall down from the first conveying belt and the second conveying belt.
2. The drop mechanism of claim 1, wherein:
first installing support the second installing support all includes mount pad and first connecting plate, wherein: the first connecting plate is connected to the mounting seat, and a plurality of guide holes are formed in the first connecting plate;
first conveyer belt mounting panel actuating mechanism second conveyer belt mounting panel actuating mechanism all includes drive assembly, guide bar fixed plate and a plurality of guide bar, wherein: the driving assembly is arranged on the mounting seat, the guide rod fixing plate is connected to the driving end of the driving assembly, the first end of the guide rod is connected to the guide rod fixing plate, and the second end of the guide rod penetrates through the guide hole;
the first conveying belt mounting plate is connected to the second end of a guide rod of the first conveying belt mounting plate driving mechanism;
the second conveyor belt mounting plate is connected to the second end of the guide rod of the second conveyor belt mounting plate driving mechanism.
3. The drop mechanism of claim 2, wherein: the drive assembly comprises a motor, an eccentric shaft and a connecting rod, wherein:
the motor is arranged on the mounting seat;
the first end of the eccentric shaft is connected to the driving end of the motor;
the first end of the connecting rod is connected to the second end of the eccentric shaft, and the second end of the connecting rod is rotatably connected to the guide rod fixing plate;
the motor drives the connecting rod to swing through the eccentric shaft, so that the guide rod fixing plate is driven to translate.
4. The drop mechanism of claim 2, wherein:
the first mounting bracket and the second mounting bracket respectively comprise a second connecting plate, and the second connecting plate is connected to the first connecting plate or the mounting seat;
a first limiting block is arranged on the second connecting plate of the first mounting bracket, a second limiting block is arranged on the second connecting plate of the second mounting bracket,
first conveyer belt mounting panel actuating mechanism second conveyer belt mounting panel actuating mechanism promotes first conveyer belt mounting panel when the second conveyer belt mounting panel separates to both sides, first stopper with the second stopper is respectively to bearing in first conveyer belt with silicon chip side reason on the second conveyer belt blocks spacingly.
5. The drop mechanism of claim 4, wherein:
the upper side belt body of the first conveying belt is bent downwards at a position corresponding to the first limiting block to form a first avoidance space corresponding to the first limiting block;
the upper side belt body of the second conveying belt is bent downwards at a position corresponding to the second limiting block to form a second avoidance space corresponding to the second limiting block;
first conveyer belt mounting panel actuating mechanism second conveyer belt mounting panel actuating mechanism promotes first conveyer belt mounting panel when the second conveyer belt mounting panel separates to both sides, the lower extreme of first stopper gets into in the first space of dodging, the lower extreme of second stopper gets into in the second dodges the space.
6. The drop mechanism of claim 1, wherein: the silicon wafer falling mechanism further comprises a material box arranged below the position between the first side conveying mechanism and the second side conveying mechanism, and the silicon wafers falling from the first conveying belt and the second conveying belt fall into the material box.
7. The drop mechanism of claim 6, wherein: the silicon wafer conveying device comprises a first conveying belt mounting plate, a second conveying belt mounting plate and a stopping plate, wherein the second conveying belt mounting plate is provided with a stopping plate facing the material box, and the stopping plate is used for guiding falling silicon wafers into the material box.
8. The mechanism of claim 6, further comprising a magazine lifting mechanism, wherein the magazine is supported by the magazine lifting mechanism, and the magazine lifting mechanism is configured to drive the magazine to lift.
9. The mechanism of claim 6, wherein the bottom plate of the magazine is inclined downward along the direction of the first and second conveyors, and the carrying surfaces of the first and second conveyors are parallel to the bottom plate of the magazine.
10. An overturning and collecting device, wherein the overturning and conveying mechanism comprises a first overturning and conveying mechanism, a second overturning and conveying mechanism and a piece dropping mechanism according to any one of claims 1 to 9, wherein:
the second overturning and conveying mechanism is arranged at the rear of the first overturning and conveying mechanism, and the sheet dropping mechanism is positioned below the second overturning and conveying mechanism;
the first overturning and conveying mechanism comprises a first overturning support plate and a third conveying belt arranged on the first overturning support plate, the second overturning and conveying mechanism comprises a second overturning support plate and a fourth conveying belt arranged on the second overturning support plate, and the first overturning support plate and the second overturning support plate are both configured to be capable of being overturned and switched between a horizontal state and an inclined state;
when the first overturning supporting plate and the second overturning supporting plate are both overturned to be in a horizontal state, the discharge end of the third conveying belt is in butt joint with the feed end of the fourth conveying belt, and the silicon wafers on the third conveying belt enter the fourth conveying belt through the feed end of the fourth conveying belt after being discharged through the discharge end of the third conveying belt and are continuously conveyed backwards;
when the first overturning supporting plate and the second overturning supporting plate are overturned to be in an inclined state, the discharge end of the third conveying belt is inclined downwards, and the silicon wafers on the third conveying belt are discharged from the discharge end of the third conveying belt and then received by the wafer dropping mechanism;
the wafer dropping mechanism performs the dropping of the received silicon wafer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122363809.9U CN216271578U (en) | 2021-09-28 | 2021-09-28 | Piece mechanism and upset receipts piece device fall |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122363809.9U CN216271578U (en) | 2021-09-28 | 2021-09-28 | Piece mechanism and upset receipts piece device fall |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216271578U true CN216271578U (en) | 2022-04-12 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202122363809.9U Active CN216271578U (en) | 2021-09-28 | 2021-09-28 | Piece mechanism and upset receipts piece device fall |
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