CN216218507U - A laboratory computer room management equipment with good ventilation and heat dissipation - Google Patents

A laboratory computer room management equipment with good ventilation and heat dissipation Download PDF

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CN216218507U
CN216218507U CN202122744992.7U CN202122744992U CN216218507U CN 216218507 U CN216218507 U CN 216218507U CN 202122744992 U CN202122744992 U CN 202122744992U CN 216218507 U CN216218507 U CN 216218507U
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heat dissipation
machine room
pipe
fan
computer lab
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丁天翔
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Changchun University
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Changchun University
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Abstract

The utility model discloses laboratory machine room management equipment with good ventilation and heat dissipation, which comprises a machine room body and an equipment body, wherein an installation pipe is embedded in the upper surface of the machine room body, a first fan is arranged in the installation pipe, external threads are formed in the outer surface of the installation pipe, the installation pipe is connected with a dustproof pipe through external threads and threads, an annular air pipe is embedded in the inner wall of the machine room body, a ventilation pipeline extending to the left side surface of the machine room body is formed in the inner bottom wall of the machine room body, and an installation groove is formed in the inner bottom wall of the ventilation pipeline. This laboratory computer lab management equipment that ventilation cooling is good through setting up first fan and ring shape trachea, the operation of first fan blows into the computer lab this internally with the outside air to blow into air pipe with steam in it in, refrigerate to steam under the effect of semiconductor refrigeration piece body, the cold air current after the refrigeration gets into in the ring shape trachea and discharges from the air outlet, thereby reaches the purpose of cooling down to the computer lab inside.

Description

一种通风散热良好的实验室机房管理设备A laboratory computer room management equipment with good ventilation and heat dissipation

技术领域technical field

本实用新型涉及机房管理技术领域,具体为一种通风散热良好的实验室机房管理设备。The utility model relates to the technical field of computer room management, in particular to a laboratory computer room management device with good ventilation and heat dissipation.

背景技术Background technique

在信息时代,机房大都是指在电信、网通、移动、双线、电力以及政府或者企业中存放服务器的,为用户以及员工提供IT服务的地方,小的几十平米,一般放置二三十个机柜,机房里面通常放置各种服务器和小型机,机房的温度和湿度以及防静电措施都有严格的要求,非专业项目人员一般不能进入,机房里的服务器运行着很多业务。In the information age, the computer room mostly refers to the place where servers are stored in telecommunications, Netcom, mobile, dual-line, power, and government or enterprises, and IT services are provided for users and employees. The small tens of square meters are generally placed twenty or thirty. Various servers and minicomputers are usually placed in the cabinet and the computer room. The temperature and humidity of the computer room and the anti-static measures have strict requirements. Non-professional project personnel are generally not allowed to enter. The servers in the computer room run many businesses.

但是一般的机房在设备运行的过程中会产生大量的热量,从而使机房内部的温度不断升高,当温度过高时会降低设备的运行速率,且一般的机房散热方式较为单一,故散热效率较低。However, the general computer room will generate a lot of heat during the operation of the equipment, so that the temperature inside the computer room will continue to rise. When the temperature is too high, the operating speed of the equipment will be reduced, and the heat dissipation method of the general computer room is relatively simple, so the heat dissipation efficiency lower.

因此我们提出一种通风散热良好的实验室机房管理设备。Therefore, we propose a laboratory equipment room management equipment with good ventilation and heat dissipation.

实用新型内容Utility model content

本实用新型的目的在于提供一种通风散热良好的实验室机房管理设备,以解决上述背景技术中提出的问题。The purpose of the present invention is to provide a laboratory equipment room management equipment with good ventilation and heat dissipation, so as to solve the problems raised in the above background technology.

为实现上述目的,本实用新型提供如下技术方案:一种通风散热良好的实验室机房管理设备,包括机房本体和设备本体,所述机房本体的上表面嵌设有安装管,安装管的内部设置有第一风扇,安装管的外表面开设有外螺纹,安装管通过外螺纹螺纹连接有防尘管,机房本体的内壁嵌设有圆环形气管,机房本体的内底壁开设有延伸至机房本体左侧表面的通风管道,通风管道的内底壁开设有安装槽,安装槽的内底壁通过支撑杆固定安装有半导体制冷片本体,安装槽的内底壁开设有延伸至机房本体左侧表面的散热管道。In order to achieve the above purpose, the present utility model provides the following technical solutions: a laboratory computer room management equipment with good ventilation and heat dissipation, including a computer room body and a device body, an installation pipe is embedded on the upper surface of the computer room body, and the interior of the installation pipe is arranged. There is a first fan, the outer surface of the installation pipe is provided with an external thread, the installation pipe is connected with a dust-proof pipe through the external thread, the inner wall of the machine room body is embedded with a circular air pipe, and the inner bottom wall of the machine room body is provided with extending to the machine room. The ventilation duct on the left surface of the main body, the inner bottom wall of the ventilation duct is provided with a mounting groove, the inner bottom wall of the mounting groove is fixedly installed with the semiconductor refrigeration chip body through the support rod, and the inner bottom wall of the mounting groove is provided with extending to the left side of the machine room body. Surface cooling pipes.

优选的,所述防尘管的内壁设置有过滤芯。Preferably, the inner wall of the dust-proof pipe is provided with a filter element.

优选的,所述机房本体的左侧表面设置有与通风管道相对应的风管,风管的另一端延伸至圆环形气管的内部,圆环形气管的右侧表面设置有出风口。Preferably, the left side surface of the machine room body is provided with an air duct corresponding to the ventilation duct, the other end of the air duct extends to the inside of the annular air duct, and the right surface of the annular air duct is provided with an air outlet.

优选的,所述半导体制冷片本体的上表面为制冷端,半导体制冷片本体的下表面为散热端。Preferably, the upper surface of the semiconductor refrigerating sheet body is the cooling end, and the lower surface of the semiconductor refrigerating sheet body is the radiating end.

优选的,所述散热管道的内部设置有用于对半导体制冷片本体的散热端进行降温的第二风扇。Preferably, a second fan for cooling the heat dissipation end of the semiconductor refrigeration sheet body is provided inside the heat dissipation pipe.

优选的,所述机房本体的右侧表面设置有控制器,控制器分别与第一风扇、半导体制冷片本体和第二风扇信号连接。Preferably, a controller is provided on the right side surface of the machine room body, and the controller is signal-connected to the first fan, the semiconductor cooling chip body and the second fan respectively.

有益效果beneficial effect

本实用新型提供了一种通风散热良好的实验室机房管理设备,具备以下有益效果:The utility model provides a laboratory computer room management equipment with good ventilation and heat dissipation, which has the following beneficial effects:

1.该通风散热良好的实验室机房管理设备,通过设置第一风扇、通风管道、半导体制冷片本体和圆环形气管,第一风扇的运转将外部空气吹进机房本体内,并将其内的热气出吹进通风管道内,在半导体制冷片本体的作用下对热气进行制冷,制冷后的冷气流进入圆环形气管内并从出风口排出,冷气流在通过圆环形气管的过程中将机房本体内的热量带离,从而达到对机房内部进行降温、散热的目的,提高了设备的运行速率。1. The laboratory equipment room management equipment with good ventilation and heat dissipation, by setting the first fan, ventilation duct, semiconductor refrigeration chip body and annular air pipe, the operation of the first fan blows the outside air into the equipment room body, and blows the air inside the equipment room. The hot air is blown into the ventilation duct, and the hot air is refrigerated under the action of the semiconductor refrigerating sheet body. The cold air after cooling enters the annular air duct and is discharged from the air outlet. The heat in the machine room body is taken away, so as to achieve the purpose of cooling and dissipating heat inside the machine room, and improve the running speed of the equipment.

2.该通风散热良好的实验室机房管理设备,通过设置防尘管、过滤芯、散热管道和第二风扇,在过滤芯的作用下可以对外界空气中的灰尘进行过滤,当需要更换过滤芯时,将防尘管通过外螺纹从安装管上卸下即可,为过滤芯的更换工作提供了便捷,同时,第二风扇的运转通过散热管道对半导体制冷片本体的散热端进行吹风降温,避免半导体制冷片本体因过热而出现机体损坏的情况。2. This laboratory equipment room management equipment with good ventilation and heat dissipation can filter the dust in the outside air under the action of the filter element by setting the dustproof pipe, the filter element, the cooling pipe and the second fan. When the filter element needs to be replaced When the dust-proof pipe is removed from the installation pipe through the external thread, it provides convenience for the replacement of the filter element. Avoid the damage of the semiconductor refrigeration chip body due to overheating.

附图说明Description of drawings

图1为本实用新型立体结构示意图;1 is a schematic diagram of the three-dimensional structure of the present utility model;

图2为本实用新型正剖结构示意图;2 is a schematic diagram of the front section of the utility model;

图3为本实用新型图2中A处放大结构示意图。FIG. 3 is an enlarged schematic view of the structure at A in FIG. 2 of the present utility model.

图中:1机房本体、2设备本体、3第一风扇、4防尘管、5圆环形气管、6通风管道、7半导体制冷片本体、8散热管道、9过滤芯、10风管、11第二风扇、12控制器。In the figure: 1 machine room body, 2 equipment body, 3 first fan, 4 dust-proof pipe, 5 circular air pipe, 6 ventilation pipe, 7 semiconductor cooling chip body, 8 cooling pipe, 9 filter element, 10 air pipe, 11 The second fan, 12 controllers.

具体实施方式Detailed ways

下面将结合本实用新型实施例中的附图,对本实用新型实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本实用新型一部分实施例,而不是全部的实施例。基于本实用新型中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本实用新型保护的范围。The technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the implementations. example. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the protection scope of the present invention.

请参阅图1-3,本实用新型提供一种技术方案:一种通风散热良好的实验室机房管理设备,包括机房本体1和设备本体2,机房本体1的上表面嵌设有安装管,安装管的内部设置有第一风扇3,安装管的外表面开设有外螺纹,安装管通过外螺纹螺纹连接有防尘管4,防尘管4的内壁设置有过滤芯9,机房本体1的内壁嵌设有圆环形气管5,机房本体1的内底壁开设有延伸至机房本体1左侧表面的通风管道6,机房本体1的左侧表面设置有与通风管道6相对应的风管10,风管10的另一端延伸至圆环形气管5的内部,圆环形气管5的右侧表面设置有出风口,通风管道6的内底壁开设有安装槽,安装槽的内底壁通过支撑杆固定安装有半导体制冷片本体7,半导体制冷片本体7的上表面为制冷端,半导体制冷片本体7的下表面为散热端。1-3, the present utility model provides a technical solution: a laboratory computer room management equipment with good ventilation and heat dissipation, including a computer room body 1 and an equipment body 2, and an installation pipe is embedded on the upper surface of the computer room body 1 to install The inside of the pipe is provided with a first fan 3, the outer surface of the installation pipe is provided with an external thread, the installation pipe is connected with a dust-proof pipe 4 through the external thread thread, the inner wall of the dust-proof pipe 4 is provided with a filter element 9, and the inner wall of the machine room body 1 is provided. A circular air duct 5 is embedded, the inner bottom wall of the machine room body 1 is provided with a ventilation duct 6 extending to the left side surface of the machine room body 1, and the left side surface of the machine room body 1 is provided with an air duct 10 corresponding to the ventilation duct 6 , the other end of the air duct 10 extends to the inside of the annular air duct 5, the right side surface of the annular air duct 5 is provided with an air outlet, the inner bottom wall of the ventilation duct 6 is provided with an installation groove, and the inner bottom wall of the installation groove passes through The support rod is fixedly mounted with a semiconductor cooling chip body 7, the upper surface of the semiconductor cooling chip body 7 is the cooling end, and the lower surface of the semiconductor cooling chip body 7 is the heat dissipation end.

通过设置第一风扇3、通风管道6、半导体制冷片本体7和圆环形气管5,第一风扇3的运转将外部空气吹进机房本体1内,并将其内的热气出吹进通风管道6内,在半导体制冷片本体7的作用下对热气进行制冷,制冷后的冷气流进入圆环形气管5内并从出风口排出,冷气流在通过圆环形气管5的过程中将机房本体1内的热量带离,从而达到对机房内部进行降温、散热的目的,提高了设备的运行速率。By arranging the first fan 3 , the ventilation duct 6 , the semiconductor refrigeration chip body 7 and the annular air duct 5 , the operation of the first fan 3 blows the outside air into the machine room body 1 , and blows the hot air out into the ventilation duct. 6, under the action of the semiconductor refrigerating sheet body 7, the hot air is refrigerated, and the refrigerated cold air enters the annular air pipe 5 and is discharged from the air outlet, and the cold air flows through the annular air pipe 5. The heat in 1 is taken away, so as to achieve the purpose of cooling and dissipating heat inside the equipment room, and improve the running speed of the equipment.

安装槽的内底壁开设有延伸至机房本体1左侧表面的散热管道8,散热管道8的内部设置有用于对半导体制冷片本体7的散热端进行降温的第二风扇11,机房本体1的右侧表面设置有控制器12,控制器12分别与第一风扇3、半导体制冷片本体7和第二风扇11信号连接。The inner bottom wall of the installation groove is provided with a heat dissipation pipe 8 extending to the left side surface of the machine room body 1 . A controller 12 is provided on the right side surface, and the controller 12 is signally connected to the first fan 3 , the semiconductor refrigeration chip body 7 and the second fan 11 respectively.

通过设置防尘管4、过滤芯9、散热管道8和第二风扇11,在过滤芯9的作用下可以对外界空气中的灰尘进行过滤,当需要更换过滤芯9时,将防尘管4通过外螺纹从安装管上卸下即可,为过滤芯9的更换工作提供了便捷,同时,第二风扇11的运转通过散热管道8对半导体制冷片本体7的散热端进行吹风降温,避免半导体制冷片本体7因过热而出现机体损坏的情况。By arranging the dust-proof pipe 4, the filter element 9, the heat dissipation pipe 8 and the second fan 11, the dust in the outside air can be filtered under the action of the filter element 9. When the filter element 9 needs to be replaced, the dust-proof pipe 4 It can be removed from the installation pipe through the external thread, which provides convenience for the replacement of the filter element 9. At the same time, the operation of the second fan 11 blows and cools the heat dissipation end of the semiconductor refrigerating chip body 7 through the heat dissipation pipe 8, so as to avoid semiconductor cooling. The body 7 of the refrigerating sheet is damaged due to overheating.

工作原理:在使用该装置时,第一风扇3的运转将外部空气吹进机房本体1内,并将其内的热气出吹进通风管道6内,在半导体制冷片本体7的作用下对热气进行制冷,制冷后的冷气流进入圆环形气管5内并从出风口排出,冷气流在通过圆环形气管5的过程中将机房本体1内的热量带离,从而达到对机房内部进行降温、散热的目的,同时,在过滤芯9的作用下可以对外界空气中的灰尘进行过滤,当需要更换过滤芯9时,将防尘管4通过外螺纹从安装管上卸下即可,为过滤芯9的更换工作提供了便捷,同时,第二风扇11的运转通过散热管道8对半导体制冷片本体7的散热端进行吹风降温,避免半导体制冷片本体7因过热而出现机体损坏的情况。Working principle: When the device is used, the operation of the first fan 3 blows the outside air into the machine room body 1, and blows the hot air in it into the ventilation duct 6, and under the action of the semiconductor refrigerating sheet body 7, the hot air is blown out. Refrigeration is carried out, and the cooled air flow enters the annular air pipe 5 and is discharged from the air outlet, and the cold air takes away the heat in the main body 1 of the equipment room during the process of passing through the annular air pipe 5, so as to achieve the cooling of the inside of the equipment room. , the purpose of heat dissipation, and at the same time, the dust in the outside air can be filtered under the action of the filter element 9. When the filter element 9 needs to be replaced, the dust-proof pipe 4 can be removed from the installation pipe through the external thread. The replacement of the filter core 9 provides convenience. At the same time, the operation of the second fan 11 blows and cools the heat dissipation end of the semiconductor refrigeration chip body 7 through the heat dissipation pipe 8, so as to prevent the semiconductor refrigeration chip body 7 from being damaged due to overheating.

尽管已经示出和描述了本实用新型的实施例,对于本领域的普通技术人员而言,可以理解在不脱离本实用新型的原理和精神的情况下可以对这些实施例进行多种变化、修改、替换和变型,本实用新型的范围由所附权利要求及其等同物限定。Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes and modifications can be made to these embodiments without departing from the principles and spirit of the present invention , alternatives and modifications, the scope of the present invention is defined by the appended claims and their equivalents.

Claims (6)

1. The utility model provides a good laboratory computer lab management equipment of ventilation cooling, includes computer lab body (1) and equipment body (2), its characterized in that: the upper surface of computer lab body (1) inlays and is equipped with the installation pipe, the inside of installation pipe is provided with first fan (3), the external screw thread has been seted up to the surface of installation pipe, the installation pipe has dustproof pipe (4) through external screw thread threaded connection, the inner wall of computer lab body (1) inlays and is equipped with circle annular trachea (5), air pipe (6) that extend to computer lab body (1) left surface are seted up to the inner diapire of computer lab body (1), the mounting groove has been seted up to the inner diapire of air pipe (6), the inner diapire of mounting groove has semiconductor refrigeration piece body (7) through bracing piece fixed mounting, heat dissipation pipeline (8) that extend to computer lab body (1) left surface are seted up to the inner diapire of mounting groove.
2. The laboratory machine room management equipment with good ventilation and heat dissipation performance according to claim 1, wherein: the inner wall of the dustproof pipe (4) is provided with a filter element (9).
3. The laboratory machine room management equipment with good ventilation and heat dissipation performance according to claim 1, wherein: the air conditioner room is characterized in that an air pipe (10) corresponding to the ventilation pipeline (6) is arranged on the left side surface of the machine room body (1), the other end of the air pipe (10) extends to the inside of the circular air pipe (5), and an air outlet is formed in the right side surface of the circular air pipe (5).
4. The laboratory machine room management equipment with good ventilation and heat dissipation performance according to claim 1, wherein: the upper surface of the semiconductor refrigeration piece body (7) is a refrigeration end, and the lower surface of the semiconductor refrigeration piece body (7) is a heat dissipation end.
5. The laboratory machine room management device with good ventilation and heat dissipation functions according to claim 1 or 4, wherein: and a second fan (11) used for cooling the heat dissipation end of the semiconductor refrigeration piece body (7) is arranged in the heat dissipation pipeline (8).
6. The laboratory machine room management equipment with good ventilation and heat dissipation performance according to claim 1, wherein: the right side surface of the machine room body (1) is provided with a controller (12), and the controller (12) is in signal connection with the first fan (3), the semiconductor refrigeration sheet body (7) and the second fan (11) respectively.
CN202122744992.7U 2021-11-10 2021-11-10 A laboratory computer room management equipment with good ventilation and heat dissipation Active CN216218507U (en)

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Application Number Priority Date Filing Date Title
CN202122744992.7U CN216218507U (en) 2021-11-10 2021-11-10 A laboratory computer room management equipment with good ventilation and heat dissipation

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Application Number Priority Date Filing Date Title
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CN216218507U true CN216218507U (en) 2022-04-05

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