CN216161696U - Silicon chip degumming frame and silicon chip degumming machine - Google Patents
Silicon chip degumming frame and silicon chip degumming machine Download PDFInfo
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- CN216161696U CN216161696U CN202121906375.6U CN202121906375U CN216161696U CN 216161696 U CN216161696 U CN 216161696U CN 202121906375 U CN202121906375 U CN 202121906375U CN 216161696 U CN216161696 U CN 216161696U
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Abstract
本申请公开了一种硅片脱胶架以及硅片脱胶机，涉及硅片加工技术领域。硅片脱胶架具体可以包括：底板，以及相对设置的两个侧板和相对设置的两个端板；所述端板和所述侧板在所述底板的周向交替设置，且与所述底板围合成用于容纳硅片的容纳槽；所述容纳槽内设置有至少一个挡板，所述挡板平行于所述侧板且分别与两个所述端板可拆卸连接，所述挡板将所述容纳槽分隔成至少两个子容纳槽。本申请实施例中，硅片脱胶架可以按需承载不同尺寸的硅片，结构简单、兼容性好、重复利用率高，可以有效避免生产多种规格硅片脱胶架造成生产成本浪费的问题。
The application discloses a silicon wafer degumming frame and a silicon wafer degumming machine, which relate to the technical field of silicon wafer processing. The silicon wafer degumming rack may specifically include: a bottom plate, two opposite side plates and two opposite end plates; the end plates and the side plates are alternately arranged in the circumferential direction of the bottom plate, and are opposite to the The bottom plate is enclosed into an accommodating groove for accommodating silicon wafers; at least one baffle plate is arranged in the accommodating groove, the baffle plate is parallel to the side plate and is respectively detachably connected with the two end plates, the baffle plate is The plate divides the receiving groove into at least two sub-accommodating grooves. In the embodiment of the present application, the silicon wafer degumming rack can carry silicon wafers of different sizes on demand, has a simple structure, good compatibility, and high reusability, and can effectively avoid the problem of waste of production costs caused by producing various specifications of silicon wafer degumming racks.
Description
Technical Field
The application belongs to the technical field of silicon wafer processing, and particularly relates to a silicon wafer degumming frame and a silicon wafer degumming machine.
Background
With the development of photovoltaic technology, solar energy is widely popularized as a green, environment-friendly and renewable energy source. The solar photovoltaic half-chip technology is widely popularized due to the advantages of high photoelectric conversion efficiency, low cost and the like.
In the prior art, a silicon wafer sliced from a silicon rod is directly prepared into a whole photovoltaic cell, and then the whole photovoltaic cell is cut by laser, so that a half photovoltaic cell is obtained. However, the method of directly cutting the whole cell to prepare the small-sized cell is easy to form thermal damage and mechanical damage at the cut section, the damage can introduce defect states at the cut section of the cell, the defect states can cause minority carriers to be compounded, so that the conversion efficiency of the small-sized cell is reduced, and the problems of fragment breaking, hidden cracking and the like can be generated when the cell is cut and sliced at the cell end, so that the waste of the production cost is caused. In order to avoid the above problems, at present, half or 1/N small-sized silicon wafers are cut out first, and then the half or 1/N small-sized silicon wafers are prepared into corresponding half cells or 1/N small-sized cells, which gradually becomes the direction for preparing the half or 1/N small-sized cells.
However, most of the silicon wafer degumming frames on the existing silicon wafer degumming machines are designed according to the shape and the size of the whole silicon wafer, so that the existing silicon wafer degumming frames cannot bear half or 1/N small-size silicon wafers, and the silicon wafer degumming frames are processed again according to the size of the silicon wafer, which causes waste of production cost.
SUMMERY OF THE UTILITY MODEL
The embodiment of the application aims to provide a silicon wafer degumming frame and a silicon wafer degumming machine, and the problem that a traditional degumming frame cannot bear half or 1/N small-size silicon wafers simultaneously can be solved.
In a first aspect, an embodiment of the present application provides a silicon wafer degumming frame, including: the bottom plate, two side plates which are oppositely arranged and two end plates which are oppositely arranged;
the end plates and the side plates are alternately arranged in the circumferential direction of the bottom plate and form an accommodating groove for accommodating silicon wafers together with the bottom plate;
at least one baffle is arranged in the containing tank, the baffle is parallel to the side plates and is detachably connected with the two end plates respectively, and the baffle divides the containing tank into at least two sub-containing tanks.
Optionally, at least one baffle groove is formed in the end plate, the baffle groove extends in a first direction on the end plate, and the first direction is a direction from the notch of the accommodating groove to the bottom plate;
the baffle slots on the two end plates are in one-to-one correspondence, and two ends of the baffle are respectively embedded in the baffle slots.
Optionally, in a case where the number of the baffle slots is one, the baffle slots are disposed on a center line of the end plate in the second direction;
in the case where the number of the baffle slots is plural, the plural baffle slots are uniformly arranged in the second direction; the second direction is perpendicular to the first direction.
Optionally, the silicon wafer degumming frame further comprises: at least one baffle plate;
the separation blade set up in the sub-holding tank and with the end plate is relative, the one end of separation blade with the connection can be dismantled to the baffle, the other end with the baffle or the connection can be dismantled to the curb plate.
Optionally, a plurality of first baffle grooves are formed in the side plate;
the first baffle slots are parallel to the baffle slots and are arranged at intervals along the direction from one end plate to the other end plate;
under the condition that the other end of the blocking piece is connected to the side plate, the blocking piece is embedded in the first blocking piece groove.
Optionally, one side or both sides of the baffle plate are provided with a plurality of second baffle grooves, and the second baffle grooves correspond to the first baffle grooves one to one;
one end or two ends of the baffle sheet are embedded in the second baffle sheet groove.
Optionally, the separation blade set up in be close to in the sub-holding tank the position of bottom plate, and follow first direction, the size of separation blade is less than the size of separation blade.
Optionally, the baffle set up in be close to in the holding tank the position of bottom plate, just the baffle is concave to be located in the holding tank or with the notch parallel and level of holding tank.
Optionally, the curb plate is kept away from still be equipped with the installation department on the side of holding tank, the installation department orientation is kept away from the direction of holding tank is protruding.
In a second aspect, the embodiment of the application further provides a silicon wafer degumming machine, wherein the silicon wafer degumming machine comprises the silicon wafer degumming frame.
In this application embodiment, because be provided with at least one baffle in the holding tank, the baffle is on a parallel with the curb plate and can dismantle with two end plates respectively and be connected, the baffle separates into two at least sub-holding tanks with the holding tank, consequently, in practical application, can be through setting up one or more baffles in the holding tank to the sub-holding tank that makes the separation can have concurrently and bear half silicon chip or 1/N small-size silicon chip, perhaps, can also dismantle the back with the baffle is whole, makes the holding tank can bear whole silicon chip. In the embodiment of the application, the silicon wafer degumming frame can bear silicon wafers of different sizes as required for degumming by adjusting the position of the baffle, has simple structure, good compatibility and high repeated utilization rate, and can effectively avoid the problem that the production cost is wasted when the silicon wafer degumming frame with various specifications is produced.
Drawings
FIG. 1 is a schematic structural diagram of a silicon wafer degumming frame according to an embodiment of the present application;
FIG. 2 is a second schematic structural view of a silicon wafer degumming frame according to an embodiment of the present application;
FIG. 3 is a third schematic structural diagram of a silicon wafer degumming frame according to an embodiment of the present application;
fig. 4 is a fourth schematic structural diagram of a silicon wafer degumming frame according to an embodiment of the present application.
The reference numbers illustrate:
10: a base plate; 20: a side plate; 30: an end plate; 40: accommodating grooves; 50: a baffle plate; 60: a baffle plate; 70: an installation part; 41: a sub-accommodating groove; 31: a baffle slot; 21: a first catch groove; 51: a second blocking plate groove.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some, but not all, embodiments of the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The terms first, second and the like in the description and in the claims of the present application are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the application are capable of operation in sequences other than those illustrated or described herein. In addition, "and/or" in the specification and claims means at least one of connected objects, a character "/" generally means that a preceding and succeeding related objects are in an "or" relationship.
The silicon wafer degumming rack and the silicon wafer degumming machine provided by the embodiments of the present application are described in detail below with reference to the accompanying drawings by specific embodiments and application scenarios thereof.
Referring to fig. 1 to 4, schematic structural diagrams of a silicon wafer degumming frame according to an embodiment of the present application are shown.
In this embodiment, the silicon wafer degumming frame may specifically include: a bottom plate 10, two side plates 20 arranged oppositely and two end plates 30 arranged oppositely; the end plates 30 and the side plates 20 are alternately arranged in the circumferential direction of the bottom plate 10 and enclose with the bottom plate 10 to form a containing groove 40 for containing silicon wafers; at least one baffle plate 50 is arranged in the accommodating groove 40, the baffle plate 50 is parallel to the side plates 20 and is detachably connected with the two end plates 30 respectively, and the accommodating groove 40 is divided into at least two sub-accommodating grooves 41 by the baffle plate 50.
When a plurality of silicon wafers are set in the housing tank 40, the silicon wafers are stacked from one end plate 30 toward the other end plate 30.
In this embodiment, because be provided with at least one baffle 50 in the holding tank 40, baffle 50 is on a parallel with curb plate 20 and can dismantle with two end plates 30 respectively and be connected, baffle 50 separates holding tank 40 into two at least sub-holding tanks 41, consequently, in practical application, can be through setting up one or more baffle 50 in holding tank 40, thereby make the sub-holding tank 41 of separating carry half silicon chip or 1/N small-size silicon chip (1/2 silicon chips, 1/3 silicon chips, 1/4 silicon chips etc.), or, can also dismantle the back with baffle 50 is whole, make holding tank 40 can bear whole silicon chip. In the embodiment of the application, the silicon wafer degumming frame can bear silicon wafers of different sizes as required for degumming by adjusting the position of the baffle, has simple structure, good compatibility and high repeated utilization rate, and can effectively avoid the problem that the production cost is wasted when the silicon wafer degumming frame with various specifications is produced.
The silicon wafer degumming frame in the embodiment of the application is used for degumming the whole cut silicon wafer or 1/N silicon wafers; by arranging the baffle 50, N groups of cut small silicon wafers can be degummed at the same time, wherein N is more than or equal to 1. Under the condition that N is more than or equal to 2, compared with the condition that the existing silicon wafer degumming frame can only be used for degumming one group of silicon wafers, the silicon wafer degumming frame in the embodiment of the application can simultaneously degum two or more groups of 1/N small silicon wafers (1/2 silicon wafers, 1/3 silicon wafers, 1/4 silicon wafers and the like), so that the degumming efficiency of the 1/N small silicon wafers can be effectively improved.
In the embodiment of the present application, the baffle 50 is disposed at a position close to the bottom plate 10 in the accommodating groove 40, and the baffle 50 is concavely disposed in the accommodating groove 40 or flush with the notch of the accommodating groove 40. In practical application, the baffle 50 is concavely arranged in the accommodating groove 40, that is, the height of the baffle 50 is lower than the depth of the accommodating groove 40, or the height of the baffle 50 is lower than the height of the side plate 20, so that the accommodating groove 40 can be divided into two or more sub-accommodating grooves 41 by the baffle 50, the cost of the baffle 50 can be reduced, and the difficulty in degumming the silicon wafer can be reduced.
In the embodiment of the present application, in order to make the installation of the baffle 50 easier and more convenient, at least one baffle slot 31 may be provided on the end plate 30, and the baffle slot 31 extends in a first direction on the end plate 30, where the first direction is a direction from the notch of the accommodating groove 40 to the bottom plate 10; the baffle slots 31 on the two end plates 30 correspond one to one, and the two ends of the baffle 50 are respectively embedded in the baffle slots 31.
In practical applications, the number of baffle slots 31 can be set according to practical requirements. Specifically, in the case where the number of the baffle grooves 31 is one, the baffle grooves 31 are disposed at the center line of the end plate 30 in the second direction, so that the two sub-receiving grooves 41 partitioned by the baffle 50 have the same size, and half (1/2) silicon wafers can be carried in each sub-receiving groove 41; in the case that the number of the baffle grooves 31 is plural, the plural baffle grooves 31 are uniformly arranged along the second direction, and the second direction is perpendicular to the first direction, so that one or more baffles 50 can be arranged in the accommodating tank 40 as required, and thus the sub-accommodating tank 41 divided by the baffles 50 has a larger size, and can be compatible with 1/N small silicon wafers (1/2 silicon wafers, 1/3 silicon wafers, 1/4 silicon wafers, etc.) with different sizes. For example, in the case that the number of the baffle plate slots 31 is plural, two baffle plates 50 may be disposed in the accommodating groove 40, and the two baffle plates 50 are spaced in the accommodating groove 40, so that the accommodating groove 40 can be divided into 3 sub-accommodating grooves 41, and according to practical situations, the sizes of the 3 sub-accommodating grooves 41 may be the same, or the sizes of two of the sub-accommodating grooves 41 may be the same, or the sizes of any two of the sub-accommodating grooves 41 may be different.
It can be understood that the number of the sub-receiving grooves 41 is equal to the number of the baffles +1, and when the number of the baffles 50 is zero, the entire silicon wafer is carried in the receiving groove 40.
In the embodiment of the present application, the width of the baffle slot 31 is adapted to the thickness of the baffle 50, and the width of the baffle slot 31 may be equal to the thickness of the baffle 50, or the width of the baffle slot 31 is equal to the thickness of the baffle 50 within a certain error range, so that the baffle 50 can be stably embedded in the baffle slot 31 without shaking in the baffle slot 31.
In the case that the number of the baffle slots 31 is one, the baffle slots 31 may be disposed at 1/N of the first direction dimension of the end plate 30, so that the two sub-receiving grooves 41 with different sizes are separated to receive small silicon wafers (1/2 silicon wafers, 1/3 silicon wafers, 1/4 silicon wafers, etc.) with different sizes, and the small silicon wafers with different sizes are degummed.
In practical application, as the size of the silicon wafer is continuously increased, the thickness of the silicon wafer is continuously reduced, and therefore, in the degumming process of the silicon wafer, the silicon wafer is prevented from being damaged due to the fact that the silicon wafer is stacked too much in one direction. In this embodiment, the silicon wafer degumming frame may further include: at least one baffle 60; the blocking piece 60 is disposed in the sub-receiving groove 41 and opposite to the end plate 30, one end of the blocking piece 60 is detachably connected to the baffle 50, and the other end is detachably connected to the baffle 50 or the side plate 20.
In the embodiment of the present application, the dummy wafers 60 are used to separate a certain number of silicon wafers in the stacking direction of the silicon wafers in the sub-receiving groove 41. The specific position of the baffle 60 can be determined according to the natural state of the silicon wafers after cutting, for example, after the silicon rod is cut into the silicon wafers, because gaps are formed among the silicon wafers, part of the silicon wafers can incline towards the direction of the silicon wafer on one adjacent side, so that the gaps between the silicon wafers and the silicon wafer on the other side can be increased, and the baffle 60 is inserted into the gaps, so that the situation that the silicon wafers are stacked towards one side after degumming and are damaged due to the fact that the silicon wafers on one side are stressed greatly can be avoided. In the embodiment of the application, the breakage rate of the silicon wafer in the degumming process can be effectively reduced by arranging the baffle 60.
In the embodiment of the present application, one blocking plate 60 may be interposed between every N silicon wafers according to experience of a person skilled in the art, and the thickness of the silicon wafers and the area (or length and width dimensions) of the silicon wafers, and the specific value of N is set according to actual conditions, which is not limited herein.
It is understood that, in the embodiment of the present application, in order to facilitate the arrangement of the blocking piece 60 in the sub-receiving groove 41, or in order to facilitate the detachable connection between the blocking piece 60 and the side plate 20, a plurality of first blocking piece grooves 21 may be provided on the side plate 20; the plurality of first baffle slots 21 are parallel to the baffle slots 31, and the plurality of first baffle slots 21 are arranged at intervals along the direction from one end plate 30 to the other end plate 30; in a case where the other end of the shutter 60 is connected to the side plate 20, the shutter 60 is fitted into the first shutter groove 21.
In the embodiment of the present application, since the number of the first blocking grooves 21 is plural, and the plural first blocking grooves 21 are arranged on the side plate 20 at intervals along the direction from one end plate 30 to another end plate 30 (which may also be referred to as the length direction of the side plate 20), the positions and the numbers of the blocking pieces 60 in the sub-accommodating grooves 41 can be more flexible and changeable, so as to adapt to degumming of silicon wafers of different specifications. In the embodiment of the present application, one or more blocking pieces 60 may be disposed in the sub-receiving groove 41 along a direction from one end plate 30 to another end plate 30, so as to effectively avoid the problem that the silicon wafer is crushed and damaged due to the stacking of the silicon wafer to one side in the degumming process of the silicon wafer.
In the embodiment of the present application, since one end of the blocking plate 60 is detachably connected to the blocking plate 50, and the other end is detachably connected to the blocking plate 50 or the side plate 20, a plurality of second blocking plate grooves 51 may be formed in one side or both sides of the blocking plate 50, and the second blocking plate grooves 51 correspond to the first blocking plate grooves 21 one to one; one end or both ends of the blocking piece 60 are embedded in the second blocking piece groove 51. In the embodiment of the present application, when the blocking sheet 60 is detachably connected to the side plate 20 or the blocking sheet 50, that is, the two sides of the blocking sheet 60 are directly inserted into the grooves (the first blocking sheet groove 21 or the second blocking sheet groove 51) of the blocking sheet 60, so that the operation is simple and convenient.
It will be appreciated that the first tab slot 21 is the same size as the second tab slot 51 to provide a more stable and secure attachment of the tab 60.
In the embodiment of the present application, the size of the first shutter groove 21, the size of the second shutter groove 51, and the size of the shutter groove 31 may be the same.
In the embodiment of the present application, the blocking sheet 60 is disposed at a position close to the bottom plate 10 in the sub-accommodating groove 41, and along the first direction, the size of the blocking sheet 60 is smaller than that of the baffle 50, so that the silicon wafer degumming process can be avoided from falling into the sub-accommodating groove 41 to collide with the sub-accommodating groove, and the cost of the blocking sheet 60 can be reduced.
It can be understood that, when the silicon wafer degumming frame according to the embodiment of the present application is used for degumming a whole silicon wafer, the baffle 50 is directly detached, and the large-sized baffle 60 is replaced, and at this time, both ends of the baffle 60 are inserted into the first baffle groove 21 on the side plate 20, so that the operation is simple and convenient.
It should be noted that the silicon wafer degumming frame in the embodiment of the present application may be used alone, or may be arranged on an existing degumming frame to degum half silicon wafers, 1/3 silicon wafers, and 1/4 silicon wafers … …. In practical applications, the side of the side plate 20 away from the receiving groove 40 is further provided with a mounting portion 70, and the mounting portion 70 protrudes toward the direction away from the receiving groove 40.
In the embodiment of the application, the silicon wafer degumming frame can be fixed through the mounting part 70, so that the silicon wafer degumming frame is prevented from shaking in the degumming process. For example, the mounting parts 70 on the two side plates 20 can be respectively erected on the support rods of the existing silicon wafer degumming equipment to fix the silicon wafer degumming frame, so that the existing degumming equipment side does not need to be correspondingly changed, and the adaptability is high.
In this application embodiment, the quantity of installation department 70 can be two or more, and two or more installation departments 70 set up at the length direction interval of curb plate 20, and the length direction of curb plate 20 is the direction of an end plate 30 to another end plate 30 promptly, like this, can make the silicon chip come unstuck the frame and directly place on the bracing piece of current whole piece silicon chip frame that comes unstuck, and is more stable. Specifically, in the embodiment of the present application, the mounting portion 70 may be a mounting block, a mounting plate, or the like.
In summary, the silicon wafer degumming frame according to the embodiment of the present application at least includes the following advantages:
in this application embodiment, because be provided with at least one baffle in the holding tank, the baffle is on a parallel with the curb plate and can dismantle with two end plates respectively and be connected, the baffle separates into two at least sub-holding tanks with the holding tank, consequently, in practical application, can be through setting up one or more baffles in the holding tank to the sub-holding tank that makes the separation can have concurrently and bear half silicon chip or 1/N small-size silicon chip, perhaps, can also dismantle the back with the baffle is whole, makes the holding tank can bear whole silicon chip. In the embodiment of the application, the silicon wafer degumming frame can bear silicon wafers of different sizes as required for degumming by adjusting the position of the baffle, has simple structure, good compatibility and high repeated utilization rate, and can effectively avoid the problem that the production cost is wasted when the silicon wafer degumming frame with various specifications is produced.
The embodiment of the application also provides a silicon wafer degumming machine which comprises the silicon wafer degumming frame.
It should be noted that the structure and the working principle of the silicon wafer degumming frame in the embodiment of the present application are the same as those of the silicon wafer degumming frame in the previous embodiment, and are not described herein again.
In this application embodiment, because the holding tank that the silicon chip took off the gluey frame is provided with at least one baffle, the baffle is on a parallel with the curb plate and can dismantle with two end plates respectively and be connected, the baffle separates into two at least sub-holding tanks with the holding tank, consequently, in practical application, can be through setting up one or more baffles in the holding tank, thereby make the sub-holding tank of separating out can have concurrently and bear half silicon chip or 1/N small-size silicon chip, perhaps, can also dismantle the back with the baffle is whole, make the holding tank can bear whole silicon chip. In the embodiment of the application, the silicon wafer degumming frame can bear silicon wafers of different sizes as required for degumming by adjusting the position of the baffle, has simple structure, good compatibility and high repeated utilization rate, and can effectively avoid the problem that the production cost is wasted when the silicon wafer degumming frame with various specifications is produced.
While the present embodiments have been described with reference to the accompanying drawings, it is to be understood that the invention is not limited to the precise embodiments described above, which are meant to be illustrative and not restrictive, and that various changes may be made therein by those skilled in the art without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121906375.6U CN216161696U (en) | 2021-08-13 | 2021-08-13 | Silicon chip degumming frame and silicon chip degumming machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121906375.6U CN216161696U (en) | 2021-08-13 | 2021-08-13 | Silicon chip degumming frame and silicon chip degumming machine |
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| Publication Number | Publication Date |
|---|---|
| CN216161696U true CN216161696U (en) | 2022-04-01 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202121906375.6U Active CN216161696U (en) | 2021-08-13 | 2021-08-13 | Silicon chip degumming frame and silicon chip degumming machine |
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| CN (1) | CN216161696U (en) |
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