CN216159463U

CN216159463U - Cooling device for multilayer high-density PCB after manufacturing

Info

Publication number: CN216159463U
Application number: CN202122290095.3U
Authority: CN
Inventors: 黄小龙
Original assignee: Shenzhen Jiuxiang Electronics Co ltd
Current assignee: Shenzhen Jiuxiang Electronics Co ltd
Priority date: 2021-09-22
Filing date: 2021-09-22
Publication date: 2022-04-01
Anticipated expiration: 2031-09-22

Abstract

The utility model discloses a cooling device for a multilayer high-density PCB (printed circuit board) after manufacturing, which comprises a shell, wherein a top plate is arranged on the shell, a cavity is arranged in the top plate, a cold air assembly is arranged in the cavity, a rotating shaft is arranged on the bottom side wall of the top plate, and rotating fan blades are arranged on the rotating shaft; the mounting ring that is circular setting is installed to the symmetry in the casing, sliding connection has the cooling plate in the mounting ring, be equipped with the sliding tray of a plurality of limiters circuit board on the cooling plate. According to the utility model, through the interaction of the structures such as the top plate, the mounting box, the rotating shaft, the mounting ring, the connecting column, the cooling plate, the sliding groove, the cooling pipe, the vent hole and the like, when one end of the circuit board sliding groove slides to the other end, the circuit board is fully cooled through the convection and cooling of cold air, and the yield of the circuit board is improved.

Description

Cooling device for multilayer high-density PCB after manufacturing

Technical Field

The utility model relates to the technical field of multilayer high-density circuit boards, in particular to a cooling device for a multilayer high-density PCB after manufacturing.

Background

The utility model discloses a multilayer high density PCB circuit board makes back cooling device is disclosed for CN207692165U to the bulletin number, including the main casing body of device, main casing body top middle part of device is connected with the pipeline of taking a breath, and takes a breath the pipeline top and install the air extractor, both ends all are connected with left side elevating rod around the main casing body bottom left side of device, and just left side elevating rod lower extreme inside both ends all are provided with the screw thread through-hole, both ends all are connected with right side elevating rod around the main casing body bottom right side of device, and the inside both sides of right side elevating rod lower extreme all are provided with the screw thread and lead to.

The device in the above-mentioned patent can't fully realize the heat dissipation, leads to the cooling effect poor, and then has reduced the yield of circuit board.

SUMMERY OF THE UTILITY MODEL

The utility model aims to solve the following defects in the prior art, and provides a cooling device after manufacturing of a multilayer high-density PCB (printed circuit board), which cannot fully realize heat dissipation, causes poor cooling effect and further reduces the yield of the PCB.

In order to achieve the purpose, the utility model adopts the following technical scheme:

a cooling device for a multilayer high-density PCB after manufacturing comprises a shell, wherein a top plate is arranged on the shell, a cavity is arranged in the top plate, a cold air assembly is arranged in the cavity, a rotating shaft is arranged on the bottom side wall of the top plate, and rotating fan blades are arranged on the rotating shaft;

the mounting ring that is circular setting is installed to the symmetry in the casing, sliding connection has the cooling plate in the mounting ring, be equipped with the sliding tray of a plurality of limiters circuit board on the cooling plate.

Preferably, the outer side wall of the shell is provided with two supporting plates, the bottom ends of the supporting plates are provided with rubber pads, and the two supporting plates are different in length.

Preferably, the air conditioning assembly comprises a mounting box slidably connected in the cavity, and a cooling pipe is mounted in the mounting box.

Preferably, the cooling pipe is arranged in the top plate in an S shape, and an inlet and an outlet are respectively arranged at two ends of the cooling pipe.

Preferably, one end of the sliding groove close to the inner side wall of the shell is provided with a plurality of vent holes at equal intervals.

Preferably, one end of the cooling plate is further connected with a connecting column in a threaded manner.

Compared with the prior art, the utility model has the beneficial effects that:

through the mutual effect of roof, mounting box, axis of rotation, collar, spliced pole, cooling plate, sliding tray, cooling tube, ventilation hole isotructure, through the convection current and the cooling of cold air when the one end of circuit board sliding tray slides to the other end to realize abundant cooling to the circuit board, improved the yield of circuit board.

Drawings

Fig. 1 is a schematic front structural view of a cooling device after a multi-layer high-density PCB circuit board is manufactured according to the present invention;

FIG. 2 is an enlarged view of a portion of the mounting box;

fig. 3 is a partially enlarged view of a in fig. 1.

In the figure: the device comprises a shell 1, a top plate 2, a mounting box 3, a rotating shaft 4, a mounting ring 5, a connecting column 6, a cooling plate 7, a sliding groove 8, a cooling pipe 9 and a ventilation hole 10.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.

The terms "upper", "lower", "left", "right", "middle" and "one" used in the present invention are for clarity of description, and are not used to limit the scope of the present invention, and the relative relationship between the terms and the modifications may be regarded as the scope of the present invention without substantial technical change.

Referring to fig. 1-3, a cooling device after manufacturing of a multilayer high-density PCB comprises a housing 1, a support plate is arranged on the outer side wall of the housing 1, a rubber pad is arranged at the bottom end of the support plate, the support plate can play a role of supporting equipment and enhancing the stability of the working state of the equipment, the two support plates have different lengths, so that the whole equipment is in an inclined state, the rubber pad can play a role of skid resistance, a top plate 2 is arranged on the housing 1, a cavity is arranged in the top plate 2, an air conditioning assembly is arranged in the cavity, a rotating shaft 4 is arranged on the bottom side wall of the top plate 2, a rotating fan blade is arranged on the rotating shaft 4, the air conditioning assembly comprises a mounting box 3 which is slidably connected in the cavity, the mounting box 3 is conveniently drawn out of the top plate 2, so as to be convenient for maintaining and replacing a cooling pipe 9, the cooling pipe 9 is arranged in the mounting box 3, the cooling pipe 9 is arranged in the top plate 2 in an S shape, the both ends of cooling tube 9 are provided with import and export respectively, and the coolant liquid gets into from the import, comes out from the export, and the cooling tube 9 that is the S-shaped setting can let the more rapid cooling efficiency that accelerates that coolant liquid air conditioning spreads.

The utility model discloses a casing, including casing 1, the symmetry install the collar 5 that is circular setting in the casing, 5 sliding connection in the collar have cooling plate 7, be equipped with a plurality of sliding tray 8 that can restrict the circuit board on the cooling plate 7, the one end equidistance that sliding tray 8 is close to 1 inside wall of casing is equipped with a plurality of ventilation holes 10, threaded connection still has spliced pole 6 in the one end of cooling plate 7, threaded connection conveniently dismantles spliced pole 6, wherein spliced pole 6 is controlled by servo motor.

Put into sliding tray 8 with the circuit board, because cooling plate 7 is the slope setting, can let the circuit board slide to the other end from sliding tray 8's one end, 4 rotatory flabellums of drive of axis of rotation are rotatory, thereby carry out the vortex with the cold air and carry, cool off the circuit board, the rotation of spliced pole 6 drives cooling plate 7 rotatory in addition, the cold air comes in and goes out from ventilation hole 10, through the convection current and the cooling of cold air when the one end of circuit board sliding tray 8 slides to the other end, thereby realize abundant cooling to the circuit board, the yield of circuit board has been improved.

In the present invention, the terms "mounted," "connected," "secured," and the like are to be construed broadly unless otherwise specifically indicated and limited.

The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and equivalent alternatives or modifications according to the technical solution of the present invention and the inventive concept thereof should be covered by the scope of the present invention.

Claims

1. A cooling device for a multi-layer high-density PCB after manufacture comprises a shell (1) and is characterized in that a top plate (2) is mounted on the shell (1), a cavity is arranged in the top plate (2), a cold air assembly is arranged in the cavity, a rotating shaft (4) is mounted on the bottom side wall of the top plate (2), and rotating fan blades are arranged on the rotating shaft (4);

the circuit board limiting device is characterized in that a mounting ring (5) which is circularly arranged is symmetrically mounted in the shell (1), a cooling plate (7) is connected in the mounting ring (5) in a sliding mode, and a plurality of sliding grooves (8) capable of limiting circuit boards are formed in the cooling plate (7).

2. The cooling device for the multi-layer high-density PCB after manufacturing as claimed in claim 1, wherein two support plates are arranged on the outer side wall of the housing (1), the bottom ends of the support plates are provided with rubber pads, and the two support plates have different lengths.

3. A multi-layered high density PCB circuit board post-manufacturing cooling device according to claim 1, wherein the cooling air assembly comprises a mounting box (3) slidably connected in the cavity, the mounting box (3) having a cooling tube (9) mounted therein.

4. The cooling device for the multi-layer high-density PCB after manufacturing as recited in claim 3, wherein the cooling pipe (9) is disposed in the top plate (2) in an S shape, and both ends of the cooling pipe (9) are respectively provided with an inlet and an outlet.

5. A multi-layered high density PCB circuit board post-manufacturing cooling device as claimed in claim 1, wherein the sliding groove (8) has a plurality of ventilation holes (10) formed at an end thereof adjacent to the inner side wall of the housing (1) at equal intervals.

6. The cooling device after manufacturing of the multi-layered high density PCB circuit board as claimed in claim 1, wherein a connection post (6) is further screw-connected to one end of the cooling plate (7).