CN215988698U - Cleaning device for semiconductor wafer - Google Patents

Abstract

The utility model relates to the technical field of semiconductor wafers and discloses a cleaning device for semiconductor wafers, which comprises a cleaning box, wherein a closing mechanism is installed at the top of the cleaning box, a cleaning mechanism is installed at the top of the closing mechanism, a vibration mechanism is installed in the cleaning box, and a water storage mechanism is installed at the bottom of the inner wall of the cleaning box. This belt cleaning device for semiconductor wafer, through shock dynamo, the vibrations piece, the vibrations groove, flexible cover, the telescopic link, the thread pin axle, the setting of cardboard and water strainer, place the vibrations inslot portion with the wafer when using, to one side pulling telescopic link, the telescopic link drives the cardboard and extends to suitable position, the pulling cardboard, the thread pin axle drives the cardboard and rotates and pull open, fix the centre gripping to the not unidimensional wafer, install the water strainer again and fix vibrations tank bottom, the water after the washing of being convenient for is strained out, it shakes the piece and shakes the vibrations groove to start shock dynamo this moment to drive, carry out more quick washing to the wafer of inside.

Description

Cleaning device for semiconductor wafer

Technical Field

The utility model relates to the technical field of semiconductor wafers, in particular to a cleaning device for a semiconductor wafer.

Background

The semiconductor refers to a material with electric conductivity between a conductor and an insulator at normal temperature, which is often made into a wafer, the wafer refers to a silicon wafer used for manufacturing a silicon semiconductor circuit, the raw material of the wafer is silicon, high-purity polycrystalline silicon is dissolved and then doped into a silicon crystal seed crystal, and then is slowly pulled out to form cylindrical monocrystalline silicon, a silicon crystal bar is ground, polished and sliced to form a silicon wafer, namely the wafer, the main processing modes of the wafer are wafer processing and batch processing, namely one or more wafers are processed simultaneously, the processing and measuring equipment is more and more advanced along with the smaller and smaller characteristic size of the semiconductor, so that the wafer processing has new data characteristics, meanwhile, the characteristic size is reduced, the influence of the number of particles in the air on the quality and reliability of the processed wafer is increased along with the improvement of cleanness, and the number of the particles also has new data characteristics, after the wafer is manufactured, the wafer needs to be cleaned, and thus a cleaning apparatus for a semiconductor wafer needs to be used.

Traditional belt cleaning device for semiconductor wafer, most fixed effect is all not good when using, probably because rock or rivers are impulsive in the cleaning process, leads to the wafer to take place to damage inside the washing case, makes the wafer unable use, causes very big loss condition.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

The utility model provides a cleaning device for a semiconductor wafer, aiming at solving the problems that the traditional cleaning device for the semiconductor wafer in the background art is poor in fixing effect mostly when in use, and the wafer is damaged in a cleaning box and cannot be used due to shaking or water flow impact in the cleaning process, so that the great loss is caused.

(II) technical scheme

In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides a belt cleaning device for semiconductor wafer, is including wasing the case, the closing mechanism is installed at the top of wasing the case, the wiper mechanism is installed at the top of closing mechanism, the internally mounted who washs the case has vibrations mechanism, water storage mechanism is installed to the inner wall bottom of wasing the case.

Preferably, the closing mechanism includes electric lift loop bar, lid, sealing washer and fixing bolt, the electric lift loop bar is installed in wasing incasement wall both sides, the flexible end of electric lift loop bar is served and is installed the lid, the sealing washer is installed to the bottom of lid, the outer wall of sealing washer runs through there is fixing bolt, through the setting of electric lift loop bar and lid, starts the electric lift loop bar and drives the lid and carry out the jack-up and open when using, places the wafer after wasing incasement portion, starts the electric lift loop bar and drives the lid decline closure, is convenient for wash the wafer of inside.

Preferably, the sealing washer passes through fixing bolt and lid threaded connection, and fixing bolt is equidistant distribution setting at the sealing washer outer wall, through sealing washer and fixing bolt's setting, installs the sealing washer in the lid bottom when using, uses fixing bolt to fix it, is convenient for seal the gap between lid and the washing case, and water overflows when preventing to wash.

Preferably, wiper mechanism includes water tank, hinge, flip, water pump, connecting pipe and sprinkler bead, the water tank welding is at the lid top, the hinge is installed to the outer wall of water tank, the one end of hinge is connected with flip, outer wall one side of water tank is connected with the water pump, the one end intercommunication of water pump has the connecting pipe, the bottom intercommunication of connecting pipe has the sprinkler bead, through the setting of water tank, hinge, flip, water pump, connecting pipe and sprinkler bead, starts the water pump when using and drives the inside water of water tank, from the sprinkler bead department blowout of connecting pipe below, washs the wafer of inside.

Preferably, the vibration mechanism includes shock dynamo, vibrations piece and vibrations groove, shock dynamo installs in washing the outside one side of case, shock dynamo's output is connected with the vibrations piece, the one end welding of vibrations piece has the vibrations groove, through the setting in shock dynamo, vibrations piece and vibrations groove, starts shock dynamo and drives vibrations piece and vibrations groove and shake when using, carries out more quick washing to inside wafer.

Preferably, vibrations mechanism still includes telescopic sleeve, telescopic link, thread pin axle, cardboard and water strainer, telescopic sleeve welding is at vibrations inslot wall, the inside cover of telescopic sleeve is equipped with the telescopic link, thread pin axle is installed to the one end of telescopic link, thread pin axle's both sides all are connected with the cardboard, water strainer welding is in vibrations tank bottom portion, through the setting of telescopic sleeve, telescopic link, thread pin axle, cardboard and water strainer, places vibrations inslot portion with the wafer when using, to one side pulling telescopic link, the telescopic link drives the cardboard and extends to suitable position, the pulling cardboard, thread pin axle drives the cardboard and rotates and pull open, fixes the centre gripping to the wafer of unidimensional, installs the vibration tank bottom portion with the water strainer again and fixes, and the water after being convenient for washs filters out.

Preferably, water storage mechanism includes spout, slider and storage water tank, the spout is all seted up in wasing incasement wall both sides, the internally mounted of spout has assorted slider with it, the inboard welding of slider has the storage water tank, through the setting of spout, slider and storage water tank, washs the back that finishes, with the outside pulling of storage water tank, the storage water tank drives the slider and takes out on the spout, clears up out the inside water of storage water tank.

(III) advantageous effects

Compared with the prior art, the utility model provides a cleaning device for a semiconductor wafer, which has the following beneficial effects:

1. this belt cleaning device for semiconductor wafer, through shock dynamo, the vibrations piece, the vibrations groove, flexible cover, the telescopic link, the thread pin axle, the setting of cardboard and water strainer, place the vibrations inslot portion with the wafer when using, to one side pulling telescopic link, the telescopic link drives the cardboard and extends to suitable position, the pulling cardboard, the thread pin axle drives the cardboard and rotates and pull open, fix the centre gripping to the not unidimensional wafer, install the water strainer again and fix vibrations tank bottom, the water after the washing of being convenient for is strained out, it shakes the piece and shakes the vibrations groove to start shock dynamo this moment to drive, carry out more quick washing to the wafer of inside.

2. This belt cleaning device for semiconductor wafer, through the electric lift loop bar, the lid, sealing washer and fixing bolt's setting, install the lid bottom with the sealing washer, use fixing bolt to fix it, be convenient for seal the gap between lid and the washing case, water spills over when preventing to wash, it drives the lid and carries out the jack-up to open to start the electric lift loop bar this moment, place the wafer after wasing incasement portion, it drives the lid decline closure to start the electric lift loop bar, be convenient for wash the wafer of inside.

3. This belt cleaning device for semiconductor wafer through the setting of water tank, hinge, flip, water pump, connecting pipe and sprinkler bead, starts the water pump and drives the inside water of water tank when using, spouts from the sprinkler bead department of connecting pipe below, washs inside wafer.

Drawings

FIG. 1 is a schematic front sectional view of the present invention;

FIG. 2 is a schematic view of the front view of the present invention;

FIG. 3 is a schematic structural diagram of a vibration mechanism according to the present invention;

FIG. 4 is an enlarged view of the structure at A in FIG. 1 according to the present invention.

In the figure: 1. a cleaning tank; 2. a closing mechanism; 201. an electric lifting loop bar; 202. a cover; 203. a seal ring; 204. fixing the bolt; 3. a cleaning mechanism; 301. a water tank; 302. a hinge; 303. a cover is turned; 304. a water pump; 305. a connecting pipe; 306. a sprinkler head; 4. a vibration mechanism; 401. vibrating a motor; 402. a vibration block; 403. a vibration groove; 404. a telescopic sleeve; 405. a telescopic rod; 406. a threaded pin shaft; 407. clamping a plate; 408. a water filtering net; 5. a water storage mechanism; 501. a chute; 502. a slider; 503. a water storage tank.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-4, a cleaning apparatus for semiconductor wafers comprises a cleaning box 1, a closing mechanism 2 is installed on the top of the cleaning box 1, the closing mechanism 2 comprises an electric lifting loop bar 201, a cover 202, a sealing ring 203 and a fixing bolt 204, the electric lifting loop bar 201 is installed on two sides of the inner wall of the cleaning box 1, the cover 202 is installed on the telescopic end of the electric lifting loop bar 201, the sealing ring 203 is installed on the bottom of the cover 202, the fixing bolt 204 penetrates through the outer wall of the sealing ring 203, the electric lifting loop bar 201 is started to drive the cover 202 to jack up and open when in use through the arrangement of the electric lifting loop bar 201 and the cover 202, after a wafer is placed in the cleaning box 1, the electric lifting loop bar 201 is started to drive the cover 202 to descend and close, so as to clean the wafer inside, the sealing ring 203 is in threaded connection with the cover 202 through the fixing bolt 204, and the fixing bolts 204 are distributed at equal intervals on the outer wall of the sealing ring 203, through the arrangement of the sealing ring 203 and the fixing bolt 204, the sealing ring 203 is arranged at the bottom of the cover 202 when the washing machine is used, the washing machine is fixed by the fixing bolt 204, a gap between the cover 202 and the washing tank 1 is convenient to seal, water overflow during washing is prevented, the washing mechanism 3 is arranged at the top of the closing mechanism 2, the washing mechanism 3 comprises a water tank 301, a hinge 302, a flip cover 303, a water pump 304, a connecting pipe 305 and a water spraying head 306, the water tank 301 is welded at the top of the cover 202, the hinge 302 is arranged on the outer wall of the water tank 301, one end of the hinge 302 is connected with the flip cover 303, the water pump 304 is connected to one side of the outer wall of the water tank 301, one end of the water pump 304 is communicated with the connecting pipe 305, the bottom of the connecting pipe 305 is communicated with the water spraying head 306, and through the arrangement of the water tank 301, the hinge 302, the flip cover 303, the water pump 304, the connecting pipe 305 and the water spraying head 306, the water inside the water tank 301 is driven by the water pump 304 when the washing machine is used, the cleaning agent is sprayed out from a water spray head 306 below a connecting pipe 305 to clean an internal wafer, a vibration mechanism 4 is installed inside a cleaning box 1, the vibration mechanism 4 comprises a vibration motor 401, a vibration block 402 and a vibration groove 403, the vibration motor 401 is installed on one side outside the cleaning box 1, the output end of the vibration motor 401 is connected with the vibration block 402, the vibration groove 403 is welded at one end of the vibration block 402, through the arrangement of the vibration motor 401, the vibration block 402 and the vibration groove 403, the vibration motor 401 is started to drive the vibration block 402 to vibrate with the vibration groove 403 when in use, the internal wafer is cleaned more quickly, the vibration mechanism 4 further comprises a telescopic sleeve 404, a telescopic rod 405, a threaded pin 406, a clamping plate 407 and a water filter 408, the telescopic sleeve 404 is welded on the inner wall of the vibration groove 403, the telescopic rod 405 is sleeved inside the telescopic sleeve 404, and the threaded pin 406 is installed at one end of the telescopic rod 405, clamping plates 407 are connected to two sides of the threaded pin shaft 406, the water filtering net 408 is welded at the bottom of the vibration groove 403, through the arrangement of the telescopic sleeve 404, the telescopic rod 405, the threaded pin shaft 406, the clamping plates 407 and the water filtering net 408, when the wafer cleaning machine is used, a wafer is placed inside the vibration groove 403, the telescopic rod 405 is pulled to one side, the telescopic rod 405 drives the clamping plates 407 to extend to a proper position, the clamping plates 407 are pulled, the threaded pin shaft 406 drives the clamping plates 407 to rotate and pull apart, wafers of different sizes are fixedly clamped, then the water filtering net 408 is installed at the bottom of the vibration groove 403 to be fixed, so that water after cleaning can be filtered out conveniently, a water storage mechanism 5 is installed at the bottom of the inner wall of the cleaning box 1, the water storage mechanism 5 comprises sliding grooves 501, sliding blocks 502 and water storage tanks 503, the sliding grooves 501 are respectively arranged at two sides of the inner wall of the cleaning box 1, sliding blocks 502 matched with the sliding grooves 501 are installed inside, and the water storage tanks 503 are welded at the inner sides of the sliding blocks 502, through the arrangement of the sliding groove 501, the sliding block 502 and the water storage tank 503, after the washing is finished, the water storage tank 503 is pulled outwards, and the water storage tank 503 drives the sliding block 502 to slide and draw out on the sliding groove 501, so that the water in the water storage tank 503 is cleaned out.

The electrical components presented in the document are all electrically connected with an external master controller and 220V mains, and the master controller can be a conventional known device controlled by a computer or the like.

Before the device is used, an external power supply is switched on, the sealing ring 203 is installed at the bottom of the cover 202 and is fixed by the fixing bolt 204, a gap between the cover 202 and the cleaning box 1 is conveniently sealed, water is prevented from overflowing during cleaning, the electric lifting sleeve rod 201 is actuated again to drive the cover 202 to jack up and open, a wafer is placed in the cleaning box 1, the telescopic rod 405 is pulled towards one side, the telescopic rod 405 drives the clamping plate 407 to extend to a proper position, the clamping plate 407 is pulled, the threaded pin shaft 406 drives the clamping plate 407 to rotate and pull open, wafers of different sizes are fixedly clamped, the water filtering net 408 is installed at the bottom of the vibration groove 403 to be fixed, water after cleaning is conveniently filtered out, at the moment, the electric lifting sleeve rod 201 is actuated to drive the cover 202 to descend and close, the water pump 304 is actuated to drive water in the water tank 301 to be sprayed out from the water spraying head 306 below the connecting pipe 305, cleaning the inner wafer, then starting the vibration motor 401 to drive the vibration block 402 and the vibration groove 403 to vibrate, cleaning the inner wafer more quickly, finally pulling the water storage tank 503 outwards after cleaning is finished, the water storage tank 503 drives the sliding block 502 to slide and draw out on the sliding groove 501, and cleaning water in the water storage tank 503, wherein the electric lifting sleeve rod 201 is YS-NZ100-12A in model, the water pump 304 is PW-175EAH in model, and the vibration motor 401 is YZU-8-2 in model.

In summary, according to the semiconductor wafer cleaning device, through the arrangement of the vibration motor 401, the vibration block 402, the vibration groove 403, the telescopic sleeve 404, the telescopic rod 405, the threaded pin shaft 406, the clamping plate 407 and the water filter screen 408, when the semiconductor wafer cleaning device is used, a wafer is placed inside the vibration groove 403, the telescopic rod 405 is pulled to one side, the telescopic rod 405 drives the clamping plate 407 to extend to a proper position, the clamping plate 407 is pulled, the threaded pin shaft 406 drives the clamping plate 407 to rotate and pull open, wafers of different sizes are fixedly clamped, the water filter screen 408 is installed at the bottom of the vibration groove 403 to be fixed, so that water after cleaning is conveniently filtered out, at the moment, the vibration motor 401 is started to drive the vibration block 402 and the vibration groove 403 to vibrate, and the wafer inside is cleaned more quickly.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims (7)

1. A cleaning device for a semiconductor wafer, comprising a cleaning tank (1), characterized in that: close mechanism (2) are installed at the top of wasing case (1), wiper mechanism (3) are installed at the top of close mechanism (2), the internally mounted who washs case (1) has vibrations mechanism (4), water storage mechanism (5) are installed to the inner wall bottom of wasing case (1).

2. A cleaning apparatus for a semiconductor wafer as defined in claim 1, wherein: closing mechanism (2) are including electronic lift loop bar (201), lid (202), sealing washer (203) and fixing bolt (204), install in washing case (1) inner wall both sides electronic lift loop bar (201), install lid (202) on the flexible end of electronic lift loop bar (201), sealing washer (203) are installed to the bottom of lid (202), the outer wall of sealing washer (203) runs through there is fixing bolt (204).

3. A cleaning apparatus for a semiconductor wafer as defined in claim 2, wherein: the sealing ring (203) is in threaded connection with the cover (202) through the fixing bolts (204), and the fixing bolts (204) are distributed on the outer wall of the sealing ring (203) at equal intervals.

4. A cleaning apparatus for a semiconductor wafer as defined in claim 1, wherein: wiper mechanism (3) include water tank (301), hinge (302), flip (303), water pump (304), connecting pipe (305) and sprinkler bead (306), water tank (301) welding is at lid (202) top, hinge (302) are installed to the outer wall of water tank (301), the one end of hinge (302) is connected with flip (303), outer wall one side of water tank (301) is connected with water pump (304), the one end intercommunication of water pump (304) has connecting pipe (305), the bottom intercommunication of connecting pipe (305) has sprinkler bead (306).

5. A cleaning apparatus for a semiconductor wafer as defined in claim 1, wherein: the vibration mechanism (4) comprises a vibration motor (401), a vibration block (402) and a vibration groove (403), the vibration motor (401) is installed on one side of the outside of the cleaning box (1), the output end of the vibration motor (401) is connected with the vibration block (402), and the vibration groove (403) is welded at one end of the vibration block (402).

6. A cleaning apparatus for a semiconductor wafer as defined in claim 1, wherein: vibrations mechanism (4) still include flexible cover (404), telescopic link (405), threaded pin axle (406), cardboard (407) and water strainer (408), flexible cover (404) welding is at vibrations groove (403) inner wall, the inside cover of flexible cover (404) is equipped with telescopic link (405), threaded pin axle (406) is installed to the one end of telescopic link (405), the both sides of threaded pin axle (406) all are connected with cardboard (407), water strainer (408) welding is in vibrations groove (403) bottom.

7. A cleaning apparatus for a semiconductor wafer as defined in claim 1, wherein: the water storage mechanism (5) comprises sliding grooves (501), sliding blocks (502) and water storage tanks (503), wherein the sliding grooves (501) are arranged on two sides of the inner wall of the cleaning tank (1), the sliding blocks (502) matched with the sliding grooves (501) are arranged inside the sliding grooves (501), and the water storage tanks (503) are welded on the inner sides of the sliding blocks (502).

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