CN215912334U

CN215912334U - Singlechip for electronic engineering equipment

Info

Publication number: CN215912334U
Application number: CN202121867304.XU
Authority: CN
Inventors: 马海兰; 张燕军
Original assignee: Beijing Yanpuda Technology Co ltd
Current assignee: Beijing Yanpuda Technology Co ltd
Priority date: 2021-08-11
Filing date: 2021-08-11
Publication date: 2022-02-25
Anticipated expiration: 2031-08-11

Abstract

The utility model provides a singlechip for electronic engineering equipment, which comprises: the base, the supporting legs and the heat insulation plate; the lower part of the base is provided with supporting legs, and the base is connected with the supporting legs in a bolt fixing mode; the heat insulation plates are uniformly filled in the base; the bottom plate is arranged on the upper part of the base and is connected with the base in a welding mode; the threaded column is arranged at the upper part of the bottom plate and is connected with the bottom plate in a welding mode; the hood is arranged on the upper part of the bottom plate, and the hood is connected with the bottom plate in a bolt fixing mode; the ventilation hole is located the lower part position of aircraft bonnet both sides, and ventilation hole and aircraft bonnet formula structure as an organic whole. Through the improvement in structure, have stronger thermal-insulated function to and the heat dissipation cooling effect is showing, improves its practical value advantage such as greatly, thereby the effectual problem and the not enough that appear in having solved current device.

Description

Singlechip for electronic engineering equipment

Technical Field

The utility model relates to the technical field of single-chip microcomputers, in particular to a single-chip microcomputer for electronic engineering equipment.

Background

The single chip is a microcomputer control system device which is formed by packaging a small and perfect microcomputer by an enclosure and is widely applied to the field of electronic engineering control.

But present common singlechip still has certain weak point, for example the singlechip can place on the upper portion of switch board usually, because can produce higher heat when the switch board moves, and the singlechip lacks thermal-insulated function again, consequently appears the high temperature easily, leads to internal integrated circuit's operating stability relatively poor, and the radiating effect is relatively poor simultaneously, greatly reduced its life, cause the low scheduling problem of use value.

In view of this, research and improvement are made to solve the existing problems, and a single chip for electronic engineering equipment is provided, which aims to achieve the purposes of solving the problems and improving the practical value through the technology.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a single chip microcomputer for electronic engineering equipment, which aims to solve the problems and the defects in the background technology.

In order to achieve the purpose, the utility model provides a singlechip for electronic engineering equipment, which is achieved by the following specific technical means:

a singlechip for electronic engineering equipment comprises: the heat-radiating fan comprises a base, supporting legs, a heat-insulating plate, a bottom plate, threaded columns, a hood, a vent hole, a heat-radiating fan and a socket hole; the lower part of the base is provided with supporting legs, and the base is connected with the supporting legs in a bolt fixing mode; the heat insulation plates are uniformly filled in the base; the bottom plate is arranged on the upper part of the base and is connected with the base in a welding mode; the threaded column is arranged at the upper part of the bottom plate and is connected with the bottom plate in a welding mode; the hood is arranged on the upper part of the bottom plate, and the hood is connected with the bottom plate in a bolt fixing mode; the ventilation holes are positioned at the lower parts of the two sides of the hood, and the ventilation holes and the hood are of an integrated structure; the heat dissipation fans are arranged on two sides of the upper part of the hood and are connected with the hood in a bolt fixing mode; the socket hole is located the both sides at aircraft bonnet back, and socket hole and aircraft bonnet formula structure as an organic whole.

As a further optimization of the technical scheme, the base of the single chip microcomputer for the electronic engineering equipment is of a rectangular box-shaped structure, and the heat insulation plate made of glass wool heat insulation felt is filled in the base.

As a further optimization of the technical scheme, the supporting legs of the single chip microcomputer for the electronic engineering equipment are cylindrical and made of rubber materials, and the supporting legs are distributed at four positions on the lower portion of the base in a rectangular mode.

As a further optimization of the technical scheme, the single chip microcomputer for the electronic engineering equipment has a rectangular hood, the upper part of the hood is in a stepped arrangement with a high left part and a low right part, the left side of the hood is provided with a long strip-shaped digital display mounting opening, and the right side of the hood is provided with a rectangular keyboard mounting opening.

As a further optimization of the technical scheme, the thread columns of the single chip microcomputer for the electronic engineering equipment are arranged in a rectangular shape, and two groups of thread columns are arranged at four positions, and two groups of thread columns are arranged in a pairwise corresponding manner with the digital display mounting port and the keyboard mounting port on the hood.

Due to the application of the technical scheme, compared with the prior art, the utility model has the following advantages:

1. according to the single chip microcomputer for the electronic engineering equipment, the heat insulation plate is arranged in the base, so that the heat insulation effect between the integrated circuit and the control cabinet in the single chip microcomputer can be achieved, the phenomenon that the operation stability is influenced due to overhigh temperature is avoided, and the single chip microcomputer has high practicability.

2. According to the singlechip for the electronic engineering equipment, the heat in the hood can be extracted and exhausted by the heat dissipation fans through the heat dissipation fans arranged on the two sides of the upper part of the hood, and meanwhile, cold air enters through the ventilation holes arranged on the two sides of the lower part of the hood, so that the heat dissipation and cooling effects of the singlechip are more remarkable, the service life of an internal integrated circuit is greatly prolonged, and the singlechip has more practical value.

3. The utility model has the advantages of strong heat insulation function, obvious heat dissipation and cooling effects, great improvement of practical value and the like by improving the structure of the upper device, thereby effectively solving the problems and the defects of the existing device.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this application, illustrate embodiments of the utility model and, together with the description, serve to explain the utility model and not to limit the utility model. In the drawings:

FIG. 1 is a schematic front view of the present invention;

fig. 2 is a schematic view of the appearance structure of the present invention.

In the figure: the heat-insulation structure comprises a base 1, supporting legs 2, a heat-insulation plate 3, a bottom plate 4, a threaded column 5, a hood 6, a vent hole 7, a heat-dissipation fan 8 and an insertion hole 9.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.

It is to be noted that, in the description of the present invention, "a plurality" means two or more unless otherwise specified; the terms "upper", "lower", "left", "right", "inner", "outer", "front", "rear", "head", "tail", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are only for convenience in describing and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, should not be construed as limiting the utility model.

Furthermore, the terms "first," "second," "third," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

Meanwhile, in the description of the present invention, unless otherwise explicitly specified or limited, the terms "connected" and "connected" should be interpreted broadly, for example, as being fixedly connected, detachably connected, or integrally connected; the connection can be mechanical connection or electrical connection; may be directly connected or indirectly connected through an intermediate. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Referring to fig. 1 to 2, the present invention provides a specific technical embodiment of a single chip for electronic engineering equipment:

a singlechip for electronic engineering equipment comprises: the heat insulation structure comprises a base 1, supporting legs 2, a heat insulation plate 3, a bottom plate 4, a threaded column 5, a hood 6, a vent hole 7, a heat dissipation fan 8 and an insertion hole 9; the lower part of the base 1 is provided with supporting legs 2, and the base 1 is connected with the supporting legs 2 in a bolt fixing mode; the heat insulation plate 3 is uniformly filled in the base 1; the bottom plate 4 is arranged at the upper part of the base 1, and the bottom plate 4 is connected with the base 1 in a welding mode; the threaded column 5 is arranged at the upper part of the bottom plate 4, and the threaded column 5 is connected with the bottom plate 4 in a welding mode; the hood 6 is arranged at the upper part of the bottom plate 4, and the hood 6 is connected with the bottom plate 4 in a bolt fixing mode; the vent holes 7 are positioned at the lower parts of the two sides of the hood 6, and the vent holes 7 and the hood 6 are of an integrated structure; the heat dissipation fans 8 are arranged on two sides of the upper part of the hood 6, and the heat dissipation fans 8 are connected with the hood 6 in a bolt fixing mode; the jack holes 9 are located on both sides of the back of the hood 6, and the jack holes 9 and the hood 6 are of an integrated structure.

Specifically, the base 1 is a rectangular box-shaped structure, and the heat insulation board 3 made of glass wool heat insulation felt is filled in the base 1.

Specifically, the supporting legs 2 are cylindrical and made of rubber materials, and the supporting legs 2 are distributed in a rectangular manner at four positions on the lower portion of the base 1.

Specifically, the hood 6 is rectangular, the upper portion of the hood 6 is arranged in a step shape with the left high and the right low, the left side of the hood is provided with a long-strip-shaped digital display mounting opening, and the right side of the hood is provided with a rectangular keyboard mounting opening.

Specifically, the threaded columns 5 are arranged in a rectangular shape, and two groups of threaded columns are arranged at four positions of each rectangular column and are arranged in a group, and two groups of threaded columns 5 are arranged in a pairwise corresponding manner with the digital display mounting port and the keyboard mounting port on the hood 6.

The method comprises the following specific implementation steps:

when the device is used, the integrated circuit board of the singlechip is firstly installed on the threaded column 5, the digital display screen is installed on the digital display installation port on the left side of the hood 6 by using screws, the keyboard keys are installed on the keyboard installation port on the right side, the serial port socket is installed on the socket groove 9 on the back of the hood 6, finally, the heat dissipation fan 8 is powered on, and the assembly can be completed and is placed on the upper part of the control cabinet connected with the heat dissipation fan. Can block through heat insulating board 3 that the switch board causes the overheated influence of temperature to the singlechip, utilize heat dissipation fan 8 can in time dispel the heat to singlechip inside, make then it possess stronger practical value.

In summary, the following steps: according to the single chip microcomputer for the electronic engineering equipment, the heat insulation plate is arranged in the base, so that the heat insulation effect between an integrated circuit and a control cabinet in the single chip microcomputer can be achieved, the phenomenon that the operation stability is influenced due to overhigh temperature is avoided, and the single chip microcomputer has strong practical performance; through setting up the heat dissipation fan in aircraft bonnet upper portion both sides to can utilize aircraft bonnet lower part both sides to set up the ventilation hole simultaneously and get into cold air with the heat extraction of aircraft bonnet from the discharge, thereby make its heat dissipation cooling effect comparatively showing, improve internal integrated circuit's life greatly, make it possess practical value more, thereby the effectual problem and the not enough that appear in having solved the current device.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A singlechip for electronic engineering equipment comprises: the heat-insulation type wind power generator comprises a base (1), supporting legs (2), a heat-insulation plate (3), a bottom plate (4), a threaded column (5), a hood (6), a vent hole (7), a heat-dissipation fan (8) and an insertion hole (9); the method is characterized in that: the lower part of the base (1) is provided with supporting legs (2), and the base (1) is connected with the supporting legs (2) in a bolt fixing mode; the heat insulation plate (3) is uniformly filled in the base (1); the bottom plate (4) is arranged on the upper part of the base (1), and the bottom plate (4) is connected with the base (1) in a welding mode; the threaded column (5) is arranged at the upper part of the bottom plate (4), and the threaded column (5) is connected with the bottom plate (4) in a welding mode; the hood (6) is arranged at the upper part of the bottom plate (4), and the hood (6) is connected with the bottom plate (4) in a bolt fixing mode; the ventilation holes (7) are positioned at the lower parts of the two sides of the hood (6), and the ventilation holes (7) and the hood (6) are of an integrated structure; the heat dissipation fans (8) are arranged on two sides of the upper part of the hood (6), and the heat dissipation fans (8) are connected with the hood (6) in a bolt fixing mode; the socket holes (9) are located on two sides of the back of the hood (6), and the socket holes (9) and the hood (6) are of an integrated structure.

2. The single chip microcomputer for electronic engineering equipment according to claim 1, wherein: the base (1) is of a rectangular box-shaped structure, and a heat insulation plate (3) made of glass wool heat insulation felt is filled in the base (1).

3. The single chip microcomputer for electronic engineering equipment according to claim 1, wherein: the supporting legs (2) are cylindrical and made of rubber materials, and the supporting legs (2) are distributed on the lower portion of the base (1) in a rectangular mode.

4. The single chip microcomputer for electronic engineering equipment according to claim 1, wherein: the hood (6) is rectangular, the upper part of the hood (6) is arranged in a step shape with the left high and the right low, a long-strip-shaped digital display mounting opening is formed in the left side, and a rectangular keyboard mounting opening is formed in the right side.

5. The single chip microcomputer for electronic engineering equipment according to claim 1, wherein: the threaded columns (5) are arranged in a rectangular shape, every four positions are provided with two groups of threaded columns, and the two groups of threaded columns (5) are arranged in a pairwise corresponding mode with the digital display mounting port and the keyboard mounting port on the hood (6).