CN215896356U

CN215896356U - Fixed component for bonding and bonding equipment

Info

Publication number: CN215896356U
Application number: CN202121465555.5U
Authority: CN
Inventors: 柯健; 付胜
Original assignee: Wuhan Yusheng Photoelectric Co ltd
Current assignee: Wuhan Yusheng Photoelectric Co ltd
Priority date: 2021-06-30
Filing date: 2021-06-30
Publication date: 2022-02-22
Anticipated expiration: 2031-06-30

Abstract

The utility model discloses a fixing component for bonding and bonding equipment, wherein the fixing component for bonding comprises a material plate and a heating block, a positioning groove is arranged on the material plate, and an adsorption through hole penetrating through the material plate is arranged at the bottom of the positioning groove; the heating block is provided with an adsorption unit corresponding to the positioning groove, the adsorption unit at least comprises a first adsorption groove and a second adsorption groove, the first adsorption groove is used for adsorbing a device to be bonded in the positioning groove through the adsorption through hole, and the second adsorption groove is used for adsorbing the flitch on the heating block; and a ventilation hole channel communicated with the adsorption unit is arranged in the heating block, and an outlet of the ventilation hole channel is externally connected with a vacuum suction device. The utility model omits a fixing device for fixing the flitch, simplifies the flow of adjusting and fixing the flitch in the lead bonding production process, saves time and labor and improves the bonding production efficiency.

Description

Fixed component for bonding and bonding equipment

Technical Field

The utility model relates to the field of chip packaging, in particular to a fixing assembly for bonding and bonding equipment.

Background

Wire bonding is an indispensable process flow in the package manufacturing process of many electric and optical devices, for example, wire bonding is used in semiconductor chips, DBC boards and some PCBA boards, and is mainly used for realizing electrical connection between different modules, and the process flow directly affects the packaged product yield.

During bonding, a fixing device is required to be used for fixing a device to be bonded, and along with the development of various electric devices and optical devices towards miniaturization, the mode of fixing the device to be bonded by using a pressing plate gradually appears to be low in efficiency and large in operation difficulty, so that some bonding fixing devices for adsorbing the device to be bonded through vacuum are provided.

Present vacuum adsorption bonding fixing device includes device supporting body, heating source, vacuum suction equipment and supporting body fixing device usually, wherein, is equipped with the constant head tank that is used for the location to treat the bonding device on the device supporting body, and the constant head tank bottom is equipped with the through-hole that is used for communicateing vacuum suction equipment, and supporting body fixing device can be guide rail, clamp plate, bolt etc.. When the device is used, the device bearing body is fixed by the bearing body fixing device, and then the device in the positioning groove is adsorbed by the vacuum suction equipment and the corresponding adsorption channel, so that the device to be bonded is fixed, and then the lead bonding process is implemented.

Disclosure of Invention

The inventor has found that the process is complicated by using the carrier fixing device to fix the device carrier, and for some bonding process lines, the carrier fixing device needs to be adjusted each time to complete the movement or replacement of the device carrier, which makes the packaging process more complicated. In order to at least partially solve the technical problems in the prior art, the inventor makes the present invention, and provides the following technical solutions through specific embodiments:

the utility model provides a fixing assembly for bonding, which comprises a material plate and a heating block, wherein:

the flitch is provided with a positioning groove, and the bottom of the positioning groove is provided with an adsorption through hole penetrating through the flitch;

the heating block is provided with an adsorption unit corresponding to the positioning groove, the adsorption unit at least comprises a first adsorption groove and a second adsorption groove, the first adsorption groove is used for adsorbing a device to be bonded in the positioning groove through the adsorption through hole, and the second adsorption groove is used for adsorbing the flitch on the heating block; a ventilation hole channel communicated with the adsorption unit is arranged in the heating block, and an outlet of the ventilation hole channel is externally connected with a vacuum suction device;

the assembly has at least a first state and a second state:

in a first state, the material plate and the heating block are arranged separately;

and in a second state, the material plate is adsorbed and fixed on the heating block by a second adsorption groove, and the first adsorption groove is communicated with the adsorption through hole.

Further, in the second state, a dimension of the notch of the first suction groove in at least one direction of the notch plane is larger than a dimension of the lower opening of the suction through hole in the direction.

Further, in the second state, a dimension of a lower opening of the suction through hole in at least one direction of a lower opening plane is larger than a dimension of a notch of the first suction groove in the one direction.

Furthermore, the material plate is provided with at least one row of positioning grooves, and the heating block is provided with at least one row of first adsorption grooves corresponding to the number of rows of the positioning grooves.

Furthermore, the flitch is provided with a transmission saw tooth parallel to the at least one row of the positioning grooves.

Further, in the second state, a dimension of the notch of the first adsorption groove in a direction perpendicular to the at least one row of the positioning grooves is larger than a dimension of the lower opening of the adsorption through-hole in the direction.

Further, in the second state, the size of the lower opening of the adsorption through hole in the direction parallel to the at least one row of the positioning grooves is larger than the size of the notch of the first adsorption groove in the direction.

In another aspect, the present invention also discloses a bonding apparatus comprising a controller, a wire bonding apparatus, a vacuum suction apparatus, and any one of the bonding fixture assemblies of the above aspects, wherein:

the controller is respectively in communication connection with the wire welding device and the vacuum suction device and is used for sending a start-stop instruction and receiving a feedback signal;

the wire welding device is in communication connection with the controller and is used for performing lead welding on the device to be bonded on the material plate when a wire welding starting instruction is received;

the vacuum suction device is connected with the ventilation hole of the heating block through a gas pipeline; the vacuum suction device is also in communication connection with the controller and is used for forming vacuum to adsorb a material plate positioned on the heating block and a device to be bonded positioned in a material plate positioning groove when receiving a suction starting command;

the heating block in the fixing component for bonding is fixed on the wire welding device, and the material plate is arranged on the heating block.

Further, the bonding equipment further comprises a feeding device, wherein the feeding device is in communication connection with the controller and is used for conveying the material plate to a position corresponding to the heating block when receiving a feeding instruction.

Furthermore, a through screw hole is formed in the heating block, and the heating block is fixed on the wire welding device through the screw hole and a bolt.

Based on the technical scheme, compared with the prior art, the utility model has the beneficial effects that:

according to the utility model, the positioning groove and the adsorption through hole communicated with the bottom of the positioning groove are arranged on the material plate, the first adsorption groove corresponding to the adsorption through hole and the second adsorption groove corresponding to the lower surface of the material plate are arranged on the heating block, and the first adsorption groove and the second adsorption groove are communicated with the suction equipment through the ventilation hole in the heating block, so that the material plate and a device to be bonded in the positioning groove can be simultaneously fixed in a vacuum adsorption manner. According to the utility model, the first adsorption groove on the heating block is used for adsorbing the to-be-bonded device in the positioning groove, and the second adsorption groove on the heating block is used for adsorbing the material plate, so that the material plate is fixed; in addition, the scheme does not need to use a supporting body fixing device, and the components of the fixing component for bonding are simplified.

Drawings

FIG. 1 is a schematic structural diagram of a fixing assembly for bonding in a separated state according to a first embodiment of the present invention;

FIG. 2 is a schematic structural view of the fixing component for bonding in FIG. 1 in a vacuum-absorbed state;

FIG. 3 is a schematic structural diagram of a heating block according to a first embodiment of the present invention;

fig. 4 is a schematic block diagram of a bonding apparatus according to a second embodiment of the present invention.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the utility model and are not intended to limit the utility model.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

Example one

Referring to fig. 1 and 2, a fixing assembly for bonding includes a material plate 1 and a heating block 2, wherein:

be equipped with constant head tank 11 on the flitch 1, constant head tank 11 bottom is equipped with the absorption through-hole 12 that runs through flitch 1.

The heating block 2 is provided with an adsorption unit 21 corresponding to the positioning groove 11, the adsorption unit 21 comprises a first adsorption groove 211 and a second adsorption groove 212, the first adsorption groove 211 is used for adsorbing a device to be bonded in the positioning groove 11 through the adsorption through hole 12, and the second adsorption groove 212 is used for adsorbing the material plate 1 on the heating block 2; a vent passage 22 communicated with the adsorption unit 21 is arranged in the heating block 2, and an outlet of the vent passage 22 is externally connected with a vacuum suction device.

As shown in fig. 1, the flitch 1 and the heating block 2 are separately provided before the fixing assembly for bonding is actually used to fix a device to be bonded.

As shown in fig. 2, when the fixing assembly for bonding is actually used to fix a device to be bonded, the material plate 1 is sucked and fixed on the heating block 2 by the second suction groove 212, at this time, the first suction groove 211 communicates with the suction through hole 12, and the device to be bonded in the positioning groove 11 is sucked and fixed in the positioning groove 11.

The work flow of the fixing assembly for bonding is as follows: flatly placing the flitch 1 on the heating block 2, aligning the positioning groove 11 on the flitch 1 with the adsorption unit 21 on the heating block 2, and then aligning the adsorption through hole 12 at the bottom of the positioning groove 11 with the first adsorption groove 211 of the adsorption unit 21; placing the device to be bonded into the positioning groove 11; starting a vacuum suction device to start a lead welding process; and after the lead welding is finished, closing the vacuum suction device and taking out the bonded optical module.

This embodiment is through set up the constant head tank on the flitch and with the adsorption through-hole of constant head tank bottom intercommunication, set up on the heating piece with the corresponding first adsorption tank of adsorption through-hole and with the corresponding second adsorption tank of flitch lower surface to through the inside venthole of heating piece messenger first adsorption tank and second adsorption tank and suction apparatus intercommunication, can realize treating the vacuum adsorption of bonding device fixed to the flitch with being located the constant head tank simultaneously. In the embodiment, the first adsorption groove on the heating block is used for adsorbing the to-be-bonded device in the positioning groove, and the second adsorption groove on the heating block is used for adsorbing the material plate, so that the material plate is fixed; in addition, the scheme does not need to use a material plate fixing device, and the components of the fixing assembly for bonding are simplified.

It can be understood that a plurality of suction through holes penetrating through the material plate 1 may be formed at the bottom of each positioning groove 11, and in this case, each suction unit 21 includes first suction grooves corresponding to the number of the suction through holes, so as to enhance the fixation of the devices to be bonded in the positioning grooves 11; similarly, a plurality of second adsorption grooves for adsorbing the flitch 1 may be included in each adsorption unit 21 to enhance the fixation of the flitch 1. This category of solutions belongs to the content of the present application.

When the fixing member for bonding is actually used to fix a device to be bonded, the first suction groove 211 communicates with the suction through-hole 12, and at this time, in some embodiments, the dimension of the notch of the first suction groove 211 in at least one direction of the notch plane is larger than the dimension of the lower opening of the suction through-hole 12 in that direction. It is understood that when the first suction grooves 211 are butted against the suction through holes 12, only the communication therebetween is required for suction. The scheme sets the first adsorption groove 211 to have a part exceeding the adsorption through hole 12 when being in butt joint with the adsorption through hole 12, and the exceeding part is used for crossing the adsorption through hole 12 and butting against the surface of the material plate 1 so as to generate adsorption force on the material plate 1 at the same time, so that the second adsorption groove 212 is assisted to adsorb and fix the material plate 1, and the fixing effect is enhanced.

When the fixing member for bonding is actually used to fix a device to be bonded, the first suction groove 211 communicates with the suction through-hole 12, and at this time, in some embodiments, the dimension of the lower opening of the suction through-hole 12 in at least one direction of the lower opening plane is larger than the dimension of the notch of the first suction groove 211 in that direction. It is understood that, when the first suction grooves 211 are butted against the suction through holes 12, they are only required to be communicated with each other for suction. In the present embodiment, the size of the suction through hole 12 is set to be longer in at least one direction when the suction through hole 12 is butted with the first suction groove 211, so as to increase the butting range between the suction through hole 12 and the first suction groove 211, and facilitate the suction through hole 12 and the first suction groove 211 to communicate with each other in the one direction when the suction through hole 12 is butted.

In some embodiments, at least one row of positioning grooves 11 is disposed on the material plate 1, and at least one column of adsorption units 21 corresponding to the number of rows of positioning grooves 11 is disposed on the heating block 2. Preferably, when the positioning grooves 11 are formed in a plurality of rows, the vent holes 22 communicating with the adsorption units 21 communicate with each other to the same outlet. It can be understood that a plurality of positioning grooves 11 may be disposed on the material plate 1 for batch bonding, and at this time, in order to reduce the power consumption of the heating block 2, it is not necessary to dispose a corresponding number of adsorption units 21, and as long as at least one row of adsorption units 21 is disposed, the adsorption fixation and wire bonding processes of the optical transceiver modules in the plurality of positioning grooves 11 may be gradually implemented by moving the material plate 1. In the scheme, the positioning grooves 11 on the material plate 1 are arranged into at least one row, and at least one row of adsorption units 21 corresponding to the row number of the positioning grooves 11 is arranged, when the scheme is actually applied, the row of adsorption units 21 corresponds to a lead bonding device, and batch lead bonding can be realized by moving the material plate 1; also, by providing fewer adsorption units 21, the volume of the heating block 2 is reduced, and heating power consumption is reduced.

Under the condition that the flitch 1 is provided with the in-line positioning grooves 11, the flitch 1 can be driven by a mechanical transmission structure in order to facilitate the stable translation of the flitch 1 on the heating block 2.

In some embodiments, the flitch 1 is provided with driving serrations 13 parallel to the at least one row of positioning slots 11. It can be understood that when the number of the positioning grooves 11 on the flitch 1 is large, the wire bonding of the optical transceiver modules in all the positioning grooves 11 can be realized by moving the flitch 1 on the heating block 2 step by step. This scheme is through setting up the transmission sawtooth 13 that is on a parallel with the constant head tank 11 array orientation on flitch 1 to utilize the accurate transmission flitch 1 of outside transmission system, realize the automatic transmission to flitch 1.

When the fixing member for bonding is actually used to fix a device to be bonded, the first suction groove 211 communicates with the suction through hole 12, and at this time, in some embodiments, the size of the notch of the first suction groove 211 in the direction perpendicular to the at least one row of positioning grooves 11 is larger than the size of the lower opening of the suction through hole 12 in that direction. It will be appreciated that in the case of a row of detents, the flitch 1 can be driven in the direction in which the detents are arranged. The size of the first adsorption groove 211 perpendicular to the arrangement direction of the positioning grooves when being in butt joint with the adsorption through holes 12 is set to be larger than that of the adsorption through holes 12, so that the first adsorption groove 211 vertically crosses the adsorption through holes 12 in the transmission direction of the flitch 1, and the adsorption force is better generated on the flitch 1.

When the fixing member for bonding is actually used to fix a device to be bonded, the first suction groove 211 communicates with the suction through hole 12, and at this time, in some embodiments, the size of the lower opening of the suction through hole 12 in the direction parallel to the at least one row of positioning grooves 11 is larger than the size of the notch of the first suction groove 211 in this direction. It will be appreciated that in the case of a row of detents, the flitch 1 can be driven in the direction in which the detents are arranged. The size of the adsorption through hole 12 parallel to the arrangement direction of the positioning grooves when being butted with the first adsorption groove 211 is set to be larger than that of the first adsorption groove 211, so that the first adsorption groove 211 is communicated with the adsorption through hole 12 in the transmission direction of the material plate 1.

In some embodiments, the heating block 2 is further provided with a through screw hole 23. It is understood that the number of the screw holes is at least one, and a plurality of screw holes can be provided. The heating block 2 can be fixed to a work platform, preferably a bonding apparatus or a bonding machine table, by means of a screw passing through the screw hole, so as to facilitate the bonding process.

Example two

As shown, a bonding apparatus includes a controller 200, a wire bonding apparatus 300, a vacuum suction apparatus 400, and any one of the bonding fixture assemblies 100 described in the first embodiment, wherein:

the controller 200 is in communication with the wire bonding apparatus 300 and the vacuum suction apparatus 400, respectively, for sending start/stop instructions and receiving feedback signals. Specifically, when the material plate 1 is located on the heating block 2 and the positioning groove 11 is aligned with the adsorption unit 21, the controller 200 receives a signal that the material plate is located, and the controller 200 sends a suction start command to the vacuum suction device 400 according to the signal and sends a wire bonding start command to the wire bonding device 300; after a set of wire bonding procedures has been completed, the wire bonding apparatus 300 stops and sends a completed signal to the controller 200, which causes the controller 200 to send a stop pump command to the vacuum pumping apparatus 400.

The wire bonding apparatus 300 is in communication with the controller 200, and is used for wire bonding the devices to be bonded on the material plate 1 when receiving a wire bonding start command. Specifically, the wire bonding apparatus 300 has a wire bonding program configured thereon, and when the wire bonding apparatus 300 receives a wire bonding start command, it starts to automatically execute a set of wire bonding program, and stops working after the wire bonding start command is completed, and feeds a wire bonding completion signal back to the controller 200.

The vacuum suction device 400 is connected with the vent hole 22 on the heating block 2 through a gas pipeline; the vacuum suction apparatus 400 is also in communication with the controller 200 for forming a vacuum to suck the material plate 1 on the heating block 2 and the to-be-bonded device in the positioning groove 11 upon receiving a suction start command. Specifically, when the vacuum suction device 400 receives a suction start command, suction is started, and after a period of suction, negative pressure is formed in the adsorption unit 21 of the heating block 2 to generate an adsorption effect; after the wire bonding is completed, the vacuum suction apparatus 400 stops suction according to the instruction of the controller 200 to facilitate the movement or removal of the flitch 1.

The heating block 2 of the bonding fixture 100 is fixed to the wire bonding apparatus 300, and the material plate 1 is disposed on the heating block 2. Specifically, the material plate 1 can be manually placed on the heating block 2 and moved to make the positioning grooves 11 on the material plate 1 align with the adsorption units 21 of the heating block 2, and after the wire bonding is completed on the device to be bonded in each positioning groove 11, a new device to be bonded is replaced or the material plate loaded with the device to be bonded is directly replaced; preferably, the flitch 1 is automatically picked and moved by a robot, and the alignment between the positioning groove 11 and the suction unit 21 is recognized by a machine recognition device.

In some embodiments, the bonding apparatus further includes a feeding device 500, and the feeding device 500 is in communication with the controller 200, and is configured to convey the flitch 1 loaded with the to-be-bonded device to a position corresponding to the heating block 2 upon receiving a feeding command. For example, the flitch 1 is transferred to above the heating block 2. Specifically, when the controller 200 receives a signal of wire bonding completion fed back by the wire bonding device 300, a feeding instruction is sent to the feeding device 500, and the feeding device 500 performs corresponding actions after receiving the instruction, so that the material plate 1 is conveyed to a position corresponding to the heating block 2, and then a signal of wire bonding completion is fed back to the controller 200. It can be understood that, in order to improve the working efficiency of the wire bonding apparatus, a plurality of material plates may be pre-loaded with the devices to be bonded, and the material plates may be conveyed to the heating block 2 by the feeding apparatus 500 for easy access.

In some embodiments, the heating block 2 is provided with a through screw hole 23, and the heating block 2 is bolted to the wire bonding apparatus 300 through the screw hole 23. It is understood that the number of the screw holes 23 is at least one, and may be plural. This scheme is fixed the heating block 2 on the bonding wire device 300 through the bolt, and is fixed effectual, and the installation or the dismantlement of the heating block 2 of being convenient for.

In the foregoing detailed description, various features are grouped together in a single embodiment for the purpose of streamlining the disclosure. This method of disclosure is not to be interpreted as reflecting an intention that the claimed embodiments of the subject matter require more features than are expressly recited in each claim. Rather, as the following claims reflect, invention lies in less than all features of a single disclosed embodiment. Thus, the following claims are hereby expressly incorporated into the detailed description, with each claim standing on its own as a separate preferred embodiment of the utility model.

What has been described above includes examples of one or more embodiments. It is, of course, not possible to describe every conceivable combination of components or methodologies for purposes of describing the aforementioned embodiments, but one of ordinary skill in the art may recognize that many further combinations and permutations of various embodiments are possible. Accordingly, the embodiments described herein are intended to embrace all such alterations, modifications and variations that fall within the scope of the appended claims. Furthermore, to the extent that the term "includes" is used in either the detailed description or the claims, such term is intended to be inclusive in a manner similar to the term "comprising" as "comprising" is interpreted when employed as a transitional word in a claim. Furthermore, any use of the term "or" in the specification of the claims is intended to mean a "non-exclusive or".

Claims

1. A fixed subassembly is used in bonding, its characterized in that includes flitch and heating block, wherein:

the assembly has at least a first state and a second state:

2. The bonding fixture assembly of claim 1, wherein in the second state, a dimension of the notch of the first suction groove in at least one direction of a plane of the notch is larger than a dimension of the lower opening of the suction through hole in the direction.

3. The bonding fixture according to claim 1, wherein in the second state, a dimension of a lower opening of the suction through hole in at least one direction of a plane of the lower opening is larger than a dimension of the notch of the first suction groove in the one direction.

4. The bonding fixture assembly of claim 1, wherein the material plate has at least one row of the positioning grooves, and the heating block has at least one row of first adsorption grooves corresponding to the row of the positioning grooves.

5. The bonding fixture assembly of claim 4, wherein the flitch is provided with drive serrations parallel to the at least one row of the detents.

6. The bonding fixture according to claim 4, wherein in the second state, a dimension of the notch of the first suction groove in a direction perpendicular to the at least one row of the positioning grooves is larger than a dimension of the lower opening of the suction through hole in the direction.

7. The bonding fixture according to claim 4, wherein in the second state, a dimension of a lower opening of the suction through hole in a direction parallel to the at least one row of the positioning grooves is larger than a dimension of a notch of the first suction groove in the direction.

8. A bonding apparatus comprising a controller, a wire bonding device, a vacuum suction device, and the fixing assembly for bonding of any one of claims 1 to 7, wherein:

9. The bonding apparatus of claim 8, further comprising a feeding device communicatively coupled to the controller for delivering the flitch to a location corresponding to the heating block upon receiving a feed command.

10. The bonding apparatus of claim 8, wherein the heating block has a threaded hole therethrough, and the heating block is bolted to the wire bonding device through the threaded hole.