CN215869449U - Arc-shaped LED packaging structure - Google Patents
Arc-shaped LED packaging structure Download PDFInfo
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- CN215869449U CN215869449U CN202122026258.7U CN202122026258U CN215869449U CN 215869449 U CN215869449 U CN 215869449U CN 202122026258 U CN202122026258 U CN 202122026258U CN 215869449 U CN215869449 U CN 215869449U
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- heat
- substrate
- fan
- screw
- arc
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 30
- 229910052802 copper Inorganic materials 0.000 claims abstract description 30
- 239000010949 copper Substances 0.000 claims abstract description 30
- 230000017525 heat dissipation Effects 0.000 claims abstract description 26
- 239000000758 substrate Substances 0.000 claims abstract description 17
- 229920003023 plastic Polymers 0.000 claims description 10
- 239000004033 plastic Substances 0.000 claims description 10
- 239000010410 layer Substances 0.000 claims description 8
- 239000012790 adhesive layer Substances 0.000 claims description 7
- 229920001296 polysiloxane Polymers 0.000 claims description 7
- WYTGDNHDOZPMIW-RCBQFDQVSA-N alstonine Natural products C1=CC2=C3C=CC=CC3=NC2=C2N1C[C@H]1[C@H](C)OC=C(C(=O)OC)[C@H]1C2 WYTGDNHDOZPMIW-RCBQFDQVSA-N 0.000 claims description 6
- 239000004519 grease Substances 0.000 claims description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 4
- 239000008393 encapsulating agent Substances 0.000 claims 2
- 229910052737 gold Inorganic materials 0.000 claims 2
- 239000010931 gold Substances 0.000 claims 2
- 238000000034 method Methods 0.000 abstract description 3
- 241000218202 Coptis Species 0.000 description 10
- 235000002991 Coptis groenlandica Nutrition 0.000 description 10
- 230000005855 radiation Effects 0.000 description 7
- 238000001816 cooling Methods 0.000 description 6
- 239000000084 colloidal system Substances 0.000 description 5
- 239000003292 glue Substances 0.000 description 5
- 239000000843 powder Substances 0.000 description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
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- Led Device Packages (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The utility model relates to the technical field of LED packaging, and discloses an arc-shaped LED packaging structure which comprises a substrate, wherein a heat-conducting copper column is arranged in the substrate, an LED chip is connected above the heat-conducting copper column, a snakelike copper pipe is connected below the heat-conducting copper column, a heat-radiating fin is connected below the snakelike copper pipe, screws are connected in the heat-radiating fin, and a fan inlet and a fan outlet are respectively connected to two sides of the heat-radiating fin below the substrate, wherein the heat generated in the working process of the LED chip is transferred to the inside of the heat-radiating fin through the heat-conducting copper column and the snakelike copper pipe by the heat-radiating fin, the fan inlet and the fan outlet are simultaneously opened, so that air circulation is formed among the fan inlet, the fan outlet and the heat-radiating fin, the heat dissipation in the heat-radiating fin is accelerated, the heat-radiating efficiency is improved, and the problem of poor heat dissipation is solved, the long-time use can shorten the service life of the light-emitting chip.
Description
Technical Field
The utility model relates to the technical field of LED packaging, in particular to an arc-shaped LED packaging structure.
Background
The package refers to that circuit pins on a silicon chip are connected to external joints by wires so as to facilitate connection of other devices, and the LED package refers to a package of a light emitting chip, because the chip must be isolated from the outside to prevent the electrical performance degradation caused by corrosion of the chip circuit by impurities in the air.
There are many kinds of LED package structures in the market at present, but these LED package structures generally exist, and the thermal diffusivity is relatively poor, and long-time use can shorten the life of emitting chip, therefore, the technical personnel in the art provide an arc LED package structure to solve the problem that proposes in the above-mentioned background art.
SUMMERY OF THE UTILITY MODEL
The present invention is directed to an arc LED package structure to solve the above problems.
In order to achieve the purpose, the utility model provides the following technical scheme:
the utility model provides an arc LED packaging structure, includes the base plate, the internally mounted of base plate has the heat conduction copper post, a set of screw has been seted up to the inside correspondence of base plate, the top of heat conduction copper post is connected with the LED chip, the below of heat conduction copper post is connected with snakelike copper pipe, the below of snakelike copper pipe is connected with a plurality of heat radiation fins, adjacent two heat radiation fins's inboard is connected with the silicone grease layer, a set of through-hole has been seted up to heat radiation fins's inside, and is a set of the internally connected with screw of through-hole, the screw is connected with the screw, the below of base plate is close to heat radiation fins's both sides and is connected with inlet fan and exhaust fan respectively.
As a still further scheme of the utility model: the LED lamp is characterized in that a plastic reflection cup is connected above the substrate, a fluorescent powder doped adhesive layer and a gold thread protection adhesive layer are sequentially connected to the inner side of the plastic reflection cup from top to bottom, a group of gold threads are connected to the inner side of the gold thread protection adhesive layer, and two ends of each gold thread are respectively connected with the LED chip and the substrate.
As a still further scheme of the utility model: the outer side of the plastic reflection cup is connected with a packaging colloid, and the packaging colloid is arc-shaped.
As a still further scheme of the utility model: and a group of circuit pins are connected to the lower part of the substrate.
As a still further scheme of the utility model: the positions of the air inlet fan and the exhaust fan correspond to the positions of the radiating fins.
As a still further scheme of the utility model: the air inlet fan and the air exhaust fan are electrically connected with an external controller through a circuit.
As a still further scheme of the utility model: the screws penetrate through the through holes and the screw holes, and the heat dissipation fins are fixedly connected with the base plate through the screws.
Compared with the prior art, the utility model has the beneficial effects that:
1. through cooling fin, air inlet fan and exhaust fan, in the LED chip course of operation, produced heat passes through the heat conduction copper post, inside snakelike copper pipe transmits cooling fin, under the linkage effect on silicone grease layer, with inside heat transmission to a plurality of cooling fin, open air inlet fan and exhaust fan simultaneously, air inlet fan, under the corresponding condition in cooling fin's position of exhaust fan position, make air inlet fan, form air cycle between exhaust fan and the cooling fin, be favorable to accelerateing giving off of the inside heat of cooling fin, the radiating efficiency is improved, it is relatively poor to have solved the thermal diffusivity, long-time use can shorten the life's of light-emitting chip problem.
2. Through screw and screw, insert the inside of through-hole and screw with the screw to screw up, realize fixing heat radiation fins, when needs are dismantled, take out the screw can, easy operation has improved the practicality.
Drawings
FIG. 1 is a schematic structural diagram of an arc-shaped LED package structure;
FIG. 2 is a cross-sectional view of an arcuate LED package structure;
fig. 3 is a plan view of a heat sink fin of an arc LED package structure.
In the figure: 1. packaging the colloid; 2. a substrate; 3. a circuit pin; 4. a fluorescent powder doped glue layer; 5. a plastic reflector cup; 6. a gold thread protection adhesive layer; 7. an LED chip; 8. gold thread; 9. a screw hole; 10. a fan inlet; 11. screws; 12. a thermally conductive copper pillar; 13. a serpentine copper tube; 14. a silicone layer; 15. heat dissipation fins; 16. a through hole; 17. an exhaust fan.
Detailed Description
Referring to fig. 1 to 3, in an embodiment of the present invention, an arc LED package structure includes a substrate 2, a heat conductive copper pillar 12 is installed inside the substrate 2, a set of screw holes 9 is correspondingly formed inside the substrate 2, an LED chip 7 is connected above the heat conductive copper pillar 12, a serpentine copper tube 13 is connected below the heat conductive copper pillar 12, a plurality of heat dissipation fins 15 are connected below the serpentine copper tube 13, silicone grease layers 14 are connected to inner sides of two adjacent heat dissipation fins 15, a set of through holes 16 are formed inside the heat dissipation fins 15, screws 11 are connected inside the set of through holes 16, the screws 11 are connected to the screw holes 9, and an air intake fan 10 and an exhaust fan 17 are respectively connected to two sides of the lower portion of the substrate 2 close to the heat dissipation fins 15.
In fig. 2: the top of base plate 2 is connected with plastics reflection cup 5, and the inboard of plastics reflection cup 5 has connected gradually from last down and has mixed phosphor powder glue film 4 and gold thread protection glue film 6, and the inboard of gold thread protection glue film 6 is connected with a set of gold thread 8, and the both ends of a set of gold thread 8 are connected with LED chip 7, base plate 2 respectively, under the effect of mixing phosphor powder glue film 4, are favorable to improving illumination intensity.
In fig. 1 and 2: the outer side of the plastic reflection cup 5 is connected with the packaging colloid 1, and the packaging colloid 1 is arc-shaped, so that light rays can be conveniently ejected.
In fig. 1 and 2: the lower part of the base plate 2 is connected with a group of circuit pins 3, and the circuit pins 3 are connected with an external printed circuit board to realize the connection of an internal chip and an external circuit.
In fig. 2: the positions of the air inlet fan 10 and the air outlet fan 17 correspond to the positions of the heat dissipation fins 15, in the working process of the LED chip 7, the generated heat is transmitted to the inside of the heat dissipation fins 15 through the heat conduction copper columns 12 and the serpentine copper tubes 13, the heat is transmitted to the inside of the heat dissipation fins 15 under the connecting action of the silicone grease layers 14, the air inlet fan 10 and the air outlet fan 17 are simultaneously started, under the condition that the positions of the air inlet fan 10 and the air outlet fan 17 correspond to the positions of the heat dissipation fins 15, air circulation is formed among the air inlet fan 10, the air outlet fan 17 and the heat dissipation fins 15, the acceleration of the heat dissipation in the heat dissipation fins 15 is facilitated, the heat dissipation efficiency is improved, the problem that the heat dissipation performance is poor and the service life of the light emitting chip can be shortened after long-time use is solved.
In fig. 2: the air inlet fan 10 and the air outlet fan 17 are electrically connected with an external controller through a circuit, and the opening or closing of the air inlet fan 10 and the air outlet fan 17 is controlled through the external controller.
In fig. 2: screw 11 runs through the inside of through-hole 16 and screw 9, and heat radiation fins 15 passes through screw 11 and base plate 2 fixed connection, inserts screw 11 the inside of through-hole 16 and screw 9 to screw up, realize fixing heat radiation fins 15, when needs are dismantled, take out screw 11 can, easy operation has improved the practicality.
The working principle of the utility model is as follows: in the working process of the LED chip 7, the generated heat is transmitted to the inside of the heat dissipation fins 15 through the heat conduction copper columns 12 and the serpentine copper pipes 13, the heat is transmitted to the inside of the heat dissipation fins 15 under the connection action of the silicone grease layers 14, the air inlet fan 10 and the exhaust fan 17 are simultaneously opened, under the condition that the positions of the air inlet fan 10 and the exhaust fan 17 correspond to the positions of the heat dissipation fins 15, air circulation is formed among the air inlet fan 10, the exhaust fan 17 and the heat dissipation fins 15, the acceleration of the dissipation of the heat inside the heat dissipation fins 15 is facilitated, the heat dissipation efficiency is improved, the heat dissipation fins 15 are fixedly connected with the substrate 2 through screws 11, the screws 11 are inserted into the through holes 16 and the screw holes 9 and screwed tightly, the heat dissipation fins 15 are fixed, and when the disassembly is needed, the screws 11 are taken out.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the scope of the present invention, and the technical solutions and the utility model concepts of the present invention are equivalent to or changed within the scope of the present invention.
Claims (7)
1. An arc-shaped LED packaging structure comprises a substrate (2) and is characterized in that, a heat-conducting copper column (12) is arranged inside the base plate (2), a group of screw holes (9) are correspondingly arranged inside the base plate (2), an LED chip (7) is connected above the heat-conducting copper column (12), a snake-shaped copper tube (13) is connected below the heat-conducting copper column (12), a plurality of radiating fins (15) are connected below the serpentine copper tube (13), the inner sides of two adjacent radiating fins (15) are connected with a silicone grease layer (14), a group of through holes (16) are arranged inside the radiating fins (15), screws (11) are connected inside the group of through holes (16), the screw (11) is connected with the screw hole (9), and the two sides of the lower part of the base plate (2) close to the radiating fins (15) are respectively connected with an air inlet fan (10) and an exhaust fan (17).
2. The arc-shaped LED packaging structure according to claim 1, wherein a plastic reflection cup (5) is connected above the substrate (2), a phosphor-doped adhesive layer (4) and a gold wire protection adhesive layer (6) are sequentially connected to the inner side of the plastic reflection cup (5) from top to bottom, a set of gold wires (8) are connected to the inner side of the gold wire protection adhesive layer (6), and two ends of the set of gold wires (8) are respectively connected to the LED chip (7) and the substrate (2).
3. The curved LED package structure according to claim 2, wherein an encapsulant (1) is attached to an outer side of the plastic reflector cup (5), and the encapsulant (1) is shaped as a curved shape.
4. The curved LED package structure according to claim 1, wherein a set of circuit pins (3) is connected under the substrate (2).
5. The curved LED package structure of claim 1, wherein the positions of the air inlet fan (10) and the air outlet fan (17) correspond to the positions of the heat dissipation fins (15).
6. The arc-shaped LED packaging structure according to claim 1, wherein the air inlet fan (10) and the air outlet fan (17) are electrically connected with an external controller through a circuit.
7. The curved LED package structure of claim 1, wherein the screw (11) penetrates through the through hole (16) and the screw hole (9), and the heat sink (15) is fixedly connected to the substrate (2) via the screw (11).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122026258.7U CN215869449U (en) | 2021-08-26 | 2021-08-26 | Arc-shaped LED packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122026258.7U CN215869449U (en) | 2021-08-26 | 2021-08-26 | Arc-shaped LED packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215869449U true CN215869449U (en) | 2022-02-18 |
Family
ID=80242821
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122026258.7U Active CN215869449U (en) | 2021-08-26 | 2021-08-26 | Arc-shaped LED packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215869449U (en) |
-
2021
- 2021-08-26 CN CN202122026258.7U patent/CN215869449U/en active Active
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