CN215869362U - Monolithic rectifier diode with built-in heat conduction structure - Google Patents

Monolithic rectifier diode with built-in heat conduction structure Download PDF

Info

Publication number
CN215869362U
CN215869362U CN202122284643.1U CN202122284643U CN215869362U CN 215869362 U CN215869362 U CN 215869362U CN 202122284643 U CN202122284643 U CN 202122284643U CN 215869362 U CN215869362 U CN 215869362U
Authority
CN
China
Prior art keywords
heat
rectifier diode
heat conduction
diode body
sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202122284643.1U
Other languages
Chinese (zh)
Inventor
储煜
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Juxintong Electronics Co ltd
Original Assignee
Shenzhen Juxintong Electronics Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Juxintong Electronics Co ltd filed Critical Shenzhen Juxintong Electronics Co ltd
Priority to CN202122284643.1U priority Critical patent/CN215869362U/en
Application granted granted Critical
Publication of CN215869362U publication Critical patent/CN215869362U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Abstract

The utility model relates to the technical field of rectifier diodes, and discloses a monolithic rectifier diode with a built-in heat conduction structure, which comprises a rectifier diode body, wherein a heat dissipation assembly is arranged in the rectifier diode body, six groups of heat dissipation assemblies are arranged, the heat dissipation assembly comprises a U-shaped sheet arranged in the rectifier diode body and an outer sleeve ring arranged on the outer side of the upper end of the U-shaped sheet, the outer sleeve ring is arranged in the rectifier diode body, the heat generated in the rectifier diode body can be absorbed by a first heat conduction sheet and a second heat conduction sheet, the lower end of the U-shaped sheet is arranged in a heat conduction silica gel ring, the heat in the first heat conduction sheet can be guided into the U-shaped sheet by a fixing ring and the heat conduction silica gel ring, and finally the heat is dissipated by one side of the U-shaped sheet contacting with the outside, and the second heat conduction sheet can also be dissipated by the heat dissipation assembly because the first heat conduction sheet and the second heat conduction sheet are components made of the same structure, and a large amount of heat is prevented from being stored in the rectifier diode body.

Description

Monolithic rectifier diode with built-in heat conduction structure
Technical Field
The utility model relates to the technical field of rectifier diodes, in particular to a monolithic rectifier diode with a built-in heat conduction structure.
Background
A rectifier diode is a semiconductor device for converting ac power into dc power, and generally includes a PN junction having two terminals, an anode terminal and a cathode terminal, and the most important characteristic of the diode is one-way conductivity.
When the traditional rectifier diode is used, a large amount of heat can be generated inside the traditional rectifier diode, internal elements of the rectifier diode can be damaged due to the heat, the traditional rectifier diode is not convenient for rapidly guiding away the heat through the heat conduction structure, and the heat conduction structure is not convenient for being utilized to achieve the insulating effect of the heat dissipation structure.
In view of the above problems, a monolithic rectifier diode with a built-in heat conducting structure is proposed.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a single-chip rectifier diode with a built-in heat conduction structure, which comprises a rectifier diode body, wherein a heat dissipation assembly is arranged in the rectifier diode body, six groups of heat dissipation assemblies are arranged, the improved rectifier diode is convenient for rapidly conducting heat away through the heat conduction structure, and the heat conduction structure is convenient to utilize, and the insulation effect of the heat dissipation structure is achieved, so that the problems in the background art are solved.
In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides a built-in heat conduction structure's monolithic rectifier diode, includes the rectifier diode body, and the inside radiator unit that is provided with of rectifier diode body, and radiator unit sets up six groups, and radiator unit is including setting up the U type piece in the rectifier diode body inside and setting up the outer lantern ring in the U type piece upper end outside, and the outer lantern ring is in inside the rectifier diode body.
Preferably, the rectifier diode body comprises a first heat-conducting fin arranged at the upper end in the rectifier diode body and a second heat-conducting fin arranged at the lower end in the rectifier diode body, the heat dissipation assembly is arranged on the outer sides of the first heat-conducting fin and the second heat-conducting fin, and one side of the U-shaped fin and the outer side of the rectifier diode body are located on the same horizontal plane.
Preferably, the first heat-conducting fin and the second heat-conducting fin are members made of the same structure and are in an arc state, and the first heat-conducting fin and the second heat-conducting fin are made of insulating materials.
Preferably, the first heat-conducting fin comprises a fixing ring arranged on one side of the first heat-conducting fin and a heat-conducting silica gel ring arranged inside the fixing ring, and the lower end of the U-shaped fin is in contact with the outer side of the heat-conducting silica gel ring.
Preferably, one side of the heat-conducting silica gel ring is in close contact with the side face of the outer sleeve ring, and one side of the heat-conducting silica gel ring is also in close contact with the same side of the outer sleeve ring.
Preferably, the outer collar comprises an insulating coating covering the outer side of the U-shaped sheet and a heat insulation layer covering the outer side of the insulating coating, and the outer side of the heat insulation layer is covered with the insulating layer.
Preferably, the heat insulation layer is a member made of an asbestos material, and the insulation layer is a member made of a polyimide film material.
Compared with the prior art, the utility model has the following beneficial effects:
1. according to the monolithic rectifier diode with the built-in heat conduction structure, the first heat conduction sheet and the second heat conduction sheet are arc-shaped and are arranged at the upper end position and the lower end position inside the rectifier diode body, heat generated inside the rectifier diode body can be absorbed by the first heat conduction sheet and the second heat conduction sheet, the lower end of the U-shaped sheet is arranged inside the heat conduction silica gel ring, the heat inside the first heat conduction sheet can be guided into the U-shaped sheet through the fixing ring and the heat conduction silica gel ring, and finally heat is dissipated from one side, in contact with the outside, of the U-shaped sheet.
2. According to the monolithic rectifier diode with the built-in heat conduction structure, the first heat conduction sheet and the second heat conduction sheet are all members made of insulating materials, the fixing ring and the heat conduction silica gel ring are in close contact with the same side face of the outer sleeve ring, the outer sleeve ring is provided with the insulating coating and the insulating layer, the U-shaped sheet can be effectively prevented from being electrified, the side, in contact with the outer side, of the U-shaped sheet is prevented from being electrified, the outer sleeve ring is further provided with the heat insulation layer, heat absorbed by the U-shaped sheet is prevented from being dissipated at the position of the outer sleeve ring, and the heat is prevented from being still inside a rectifier diode body.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic side plan view of the rectifier diode body and the heat sink assembly of the present invention;
FIG. 3 is an enlarged schematic view of the structure at A in FIG. 2 according to the present invention;
FIG. 4 is a schematic top plan view of the rectifier diode body and heat sink assembly of the present invention;
fig. 5 is a schematic plan view of the outer grommet sheet of the present invention.
In the figure: 1. a rectifier diode body; 11. a first thermally conductive sheet; 111. a fixing ring; 112. a heat-conducting silica gel ring; 12. a second thermally conductive sheet; 2. a heat dissipating component; 21. a U-shaped sheet; 22. an outer collar; 221. insulating paint; 222. a thermal insulation layer; 223. an insulating layer.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In order to solve the technical problem that the conventional rectifier diode is inconvenient to rapidly conduct heat away through the heat conducting structure, as shown in fig. 1 to 4, the following preferred technical solutions are provided:
a monolithic rectifier diode with a built-in heat conduction structure comprises a rectifier diode body 1, wherein a heat dissipation assembly 2 is arranged in the rectifier diode body 1, six groups of heat dissipation assemblies 2 are arranged on the heat dissipation assembly 2, the heat dissipation assembly 2 comprises a U-shaped sheet 21 arranged in the rectifier diode body 1 and an outer sleeve 22 arranged on the outer side of the upper end of the U-shaped sheet 21, the outer sleeve 22 is positioned in the rectifier diode body 1, the rectifier diode body 1 comprises a first heat conduction sheet 11 arranged on the upper end of the inner part of the rectifier diode body 1 and a second heat conduction sheet 12 arranged on the lower end of the inner part of the rectifier diode body 1, the heat dissipation assembly 2 is arranged on the outer sides of the first heat conduction sheet 11 and the second heat conduction sheet 12, one side of the U-shaped sheet 21 and the outer side of the rectifier diode body 1 are positioned on the same horizontal plane, the first heat conduction sheet 11 and the second heat conduction sheet 12 are components made of the same structure and are both in an arc state, the first heat-conducting strip 11 and the second heat-conducting strip 12 are both made of an insulating material, the first heat-conducting strip 11 includes a fixing ring 111 disposed on one side of the first heat-conducting strip 11 and a heat-conducting silicone ring 112 disposed inside the fixing ring 111, the lower end of the U-shaped strip 21 contacts with the outer side of the heat-conducting silicone ring 112, one side of the heat-conducting silicone ring 112 contacts with the side of the outer collar 22 closely, and one side of the heat-conducting silicone ring 112 also contacts with the same side of the outer collar 22 closely.
Specifically, because of first conducting strip 11 and second conducting strip 12 are the arc, and set up the upper and lower extreme position in rectifier diode body 1 is inside, usable first conducting strip 11 and second conducting strip 12 absorb the inside heat that produces of rectifier diode body 1, because of U type piece 21 lower extreme sets up inside heat conduction silica gel ring 112, the inside heat of first conducting strip 11 can be led into inside U type piece 21 by solid fixed ring 111 and heat conduction silica gel ring 112, dispel the heat by U type piece 21 and one side of external contact at last, because of first conducting strip 11 and second conducting strip 12 are the component that the looks isostructure made, second conducting strip 12 also can dispel the heat via radiator unit 2.
In order to solve the technical problem of facilitating the utilization of the heat conducting structure and achieving the insulating effect of the heat dissipation structure at the same time, as shown in fig. 5, the following preferred technical solutions are provided:
the outer sleeve 22 comprises an insulating paint 221 covering the outer side of the U-shaped sheet 21 and a heat insulating layer 222 covering the outer side of the insulating paint 221, an insulating layer 223 is covered and arranged on the outer side of the heat insulating layer 222, the heat insulating layer 222 is a member made of asbestos material, and the insulating layer 223 is a member made of polyimide film material.
Specifically, because the first heat conducting strip 11 and the second heat conducting strip 12 are both members made of insulating materials, and the fixing ring 111 and the heat conducting silicone ring 112 are both in close contact with the same side surface of the outer sleeve 22, and the outer sleeve 22 is provided with the insulating coating 221 and the insulating layer 223, the U-shaped strip 21 can be effectively prevented from being electrified, the side of the U-shaped strip 21 contacting with the outside is prevented from being electrified, and the outer sleeve 22 is further provided with the heat insulating layer 222, so that the heat absorbed by the U-shaped strip 21 is prevented from being dissipated at the position of the outer sleeve 22.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims (7)

1. A monolithic rectifier diode with a built-in heat conducting structure, comprising a rectifier diode body (1), characterized in that: the rectifier diode body (1) is internally provided with a heat dissipation assembly (2), the heat dissipation assembly (2) is provided with six groups, the heat dissipation assembly (2) comprises a U-shaped sheet (21) arranged inside the rectifier diode body (1) and an outer sleeve ring (22) arranged on the outer side of the upper end of the U-shaped sheet (21), and the outer sleeve ring (22) is arranged inside the rectifier diode body (1).
2. The monolithic rectifier diode with built-in heat conducting structure as claimed in claim 1, wherein: the rectifier diode body (1) comprises a first heat-conducting fin (11) arranged at the upper end inside the rectifier diode body (1) and a second heat-conducting fin (12) arranged at the lower end inside the rectifier diode body (1), the heat dissipation assembly (2) is arranged on the outer sides of the first heat-conducting fin (11) and the second heat-conducting fin (12), and one side of the U-shaped fin (21) and the outer side of the rectifier diode body (1) are located on the same horizontal plane.
3. The monolithic rectifier diode with built-in heat conducting structure as claimed in claim 2, wherein: the first heat conducting fin (11) and the second heat conducting fin (12) are members made of the same structure and are in arc states, and the first heat conducting fin (11) and the second heat conducting fin (12) are made of insulating materials.
4. The monolithic rectifier diode with built-in heat conducting structure as claimed in claim 2, wherein: the first heat conducting sheet (11) comprises a fixing ring (111) arranged on one side of the first heat conducting sheet (11) and a heat conducting silica gel ring (112) arranged inside the fixing ring (111), and the lower end of the U-shaped sheet (21) is in contact with the outer side of the heat conducting silica gel ring (112).
5. The monolithic rectifier diode with built-in heat conducting structure as claimed in claim 4, wherein: one side of the heat-conducting silica gel ring (112) is in close contact with the side surface of the outer sleeve ring (22), and one side of the heat-conducting silica gel ring (112) is also in close contact with the same side of the outer sleeve ring (22).
6. The monolithic rectifier diode with built-in heat conducting structure as claimed in claim 1, wherein: the outer sleeve ring (22) comprises an insulating paint (221) covering the outer side of the U-shaped sheet (21) and a heat insulation layer (222) covering the outer side of the insulating paint (221), and an insulating layer (223) is covered on the outer side of the heat insulation layer (222).
7. The monolithic rectifier diode with built-in heat conducting structure as claimed in claim 6, wherein: the heat insulation layer (222) is a member made of asbestos materials, and the insulation layer (223) is a member made of polyimide film materials.
CN202122284643.1U 2021-09-22 2021-09-22 Monolithic rectifier diode with built-in heat conduction structure Active CN215869362U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202122284643.1U CN215869362U (en) 2021-09-22 2021-09-22 Monolithic rectifier diode with built-in heat conduction structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202122284643.1U CN215869362U (en) 2021-09-22 2021-09-22 Monolithic rectifier diode with built-in heat conduction structure

Publications (1)

Publication Number Publication Date
CN215869362U true CN215869362U (en) 2022-02-18

Family

ID=80255178

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202122284643.1U Active CN215869362U (en) 2021-09-22 2021-09-22 Monolithic rectifier diode with built-in heat conduction structure

Country Status (1)

Country Link
CN (1) CN215869362U (en)

Similar Documents

Publication Publication Date Title
CN211880257U (en) Heat dissipation mechanism for electric automobile motor
CN215869362U (en) Monolithic rectifier diode with built-in heat conduction structure
CN209183534U (en) A kind of heat radiating type diode package structure being easily assembled to
CN201521928U (en) Radiating structure of LED module
CN212012484U (en) Rectifying frame for fixing conversion chip
CN204991686U (en) Power device heat abstractor of well high -voltage electrical equipment
CN209544313U (en) A kind of diode based on graphene encapsulation
CN210576020U (en) Green's thermoelectric separation base plate
CN214800492U (en) Switching power supply substrate for new energy charging pile
CN214099227U (en) Electric wire with anticorrosion structure and convenient storage
CN215819171U (en) Circuit board heat radiation structure
CN216565628U (en) Far infrared electric heating film
CN210073619U (en) Capacitor case that heat dispersion is good
CN203136189U (en) PTC heat pipe heater
CN213340360U (en) Heat radiation structure of power semiconductor device
CN215010069U (en) Bridge type rectifier bridge structure
CN215580924U (en) Novel energy-saving transformer rectifier
CN211606913U (en) Easy radiating circuit board
CN213403983U (en) Heat radiation body structure
CN206670116U (en) A kind of efficient energy-saving semi-conductor refrigerator
CN209068478U (en) A kind of LED light red copper radiator
CN209785751U (en) Capacitor
CN212625554U (en) High-hardness copper-sealed diode
CN213936171U (en) Dustproof rectifier diode
CN214176015U (en) Schottky diode

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant