CN215771890U - Water cooling system for pumping module, pumping module and solid laser - Google Patents

Water cooling system for pumping module, pumping module and solid laser Download PDF

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Publication number
CN215771890U
CN215771890U CN202121497645.2U CN202121497645U CN215771890U CN 215771890 U CN215771890 U CN 215771890U CN 202121497645 U CN202121497645 U CN 202121497645U CN 215771890 U CN215771890 U CN 215771890U
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water
heat
channel
heat sink
pumping module
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曹剑
戴玮
朱青
徐晓明
张金玉
张新晨
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Research Institute of Physical and Chemical Engineering of Nuclear Industry
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Research Institute of Physical and Chemical Engineering of Nuclear Industry
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Abstract

The utility model provides a water cooling system for a pumping module, the pumping module and a solid laser, wherein the water cooling system comprises two water connectors, two water distributors, a heat sink group and a radiating pipe, wherein the heat sink group comprises N heat sinks which are uniformly distributed around the periphery of the radiating pipe; a bow-shaped water flow channel is arranged in each heat sink, the water inlet direction and the water outlet direction of each heat sink are perpendicular to the action surface of each heat sink, and the action surface is closely adjacent to the heat exchange channel with the whole length in each heat sink. The semiconductor laser side pumping module has long service life.

Description

Water cooling system for pumping module, pumping module and solid laser
Technical Field
The utility model relates to the technical field of lasers, in particular to a water cooling system for a pumping module, the pumping module and a solid laser.
Background
The semiconductor laser side pumping all-solid-state laser has the advantages of both a common solid-state laser and a semiconductor laser, is small in size, long in service life, good in beam quality and high in electro-optic conversion efficiency, and has important application value in the fields of laser communication, remote sensing, scientific research, industry and the like. The quasi-continuous green solid laser with high average power and high repetition frequency has important application value particularly in the military field.
Quasi-continuous green light generation mainly comprises 5 physical processes: semiconductor laser pumping, laser crystal stimulated radiation, laser resonance amplification, acousto-optic Q-switching and intracavity frequency doubling. The pumping module comprises a semiconductor laser and a laser crystal, is an energy source of the green solid laser, is also one of the key technologies for generating quasi-continuous green light, and has the technical characteristics of directly determining the maximum output power and the energy conversion efficiency of the green solid laser.
The quasi-continuous green light solid laser is not reported at home due to the influence of a plurality of technical factors, wherein the quasi-continuous green light solid laser reaching the level of 300 watts is an important restriction factor, namely the pumping module technology. In order to realize efficient acousto-optic Q-switching and intracavity frequency doubling to ensure the generation of high-power quasi-continuous green light, the semiconductor laser side pumping module not only needs to have higher power output capability in a limited space, but also needs to control the internal heat effect and ensure the quality of output light beams.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a water cooling system for a pump module, aiming at the technical defects in the prior art.
Another object of the present invention is to provide a pumping module based on the water cooling system.
Another object of the present invention is to provide a solid state laser based on said pump module.
The technical scheme adopted for realizing the purpose of the utility model is as follows:
a water cooling system for a pumping module comprises two water connectors, two water distributors, a heat sink group and a radiating pipe, wherein the heat sink group comprises N heat sinks which are uniformly distributed around the periphery of the radiating pipe; a bow-shaped water flow channel is arranged in each heat sink, the water inlet direction and the water outlet direction of each heat sink are perpendicular to the action surface of each heat sink, and the action surface is closely adjacent to the heat exchange channel with the whole length in each heat sink.
In the above technical solution, the two water connectors are a water inlet connector and a water outlet connector respectively, the two water distributors are a water inlet distributor and a water outlet distributor respectively, the water inlet connector is hermetically connected to the water inlet distributor, the water outlet connector is hermetically connected to the water outlet distributor, two ends of each heat sink are hermetically connected to corresponding heat sink connectors of the water outlet distributor and the water inlet distributor respectively, and two ends of the heat dissipation pipe are hermetically connected to corresponding heat dissipation pipe connectors of the water outlet distributor and the water inlet distributor respectively.
In the technical scheme, the radiating surface of the semiconductor laser is welded on the acting surface of the heat sink through the insulating heat conduction welding block, the distance from the inner wall of the heat exchange channel to the radiating surface is less than 1mm, and the diameter of the heat exchange channel is 3-5 mm.
In the above technical scheme, the heat sink comprises a heat dissipation block in an integrated structure and connection blocks located at two ends of the heat dissipation block, the two connection blocks are respectively provided with a connection port for communicating the heat sink connection ports, and the two connection ports are respectively the water inlet and the water outlet.
In the above technical solution, each connecting block is provided with a first channel and a second channel which are perpendicular to each other, the connecting port is located at an end of the first channel, the heat dissipation block is provided with the heat exchange channel and a third channel which is located at two sides of the heat exchange channel and is vertically communicated with the heat exchange channel, and the first channel and the second channel of the two connecting blocks and the third channel and the heat exchange channel of the heat dissipation block are communicated to form the arcuate water flow channel.
In the above technical scheme, the cooling tube is a glass tube, the end of the cooling tube is inserted into the cooling tube connecting port of the water separator and is sealed by the first sealing ring.
In the above technical scheme, N is 5, the heat sink group includes five heat sinks, the bottom of the water separator is provided with a water delivery port, the water delivery port is communicated with a distribution cavity formed in the water separator, a regular pentagonal prism structure is arranged on the side surface of the water separator, five side surfaces of the regular pentagonal prism structure are respectively provided with a heat sink connection port communicated with the distribution cavity, and the center of the regular pentagonal prism structure is formed at the heat radiation pipe connection port communicated with the distribution cavity.
In another aspect of the utility model, a semiconductor laser side pumping module comprises a semiconductor laser, a light-gathering cavity, a laser crystal, a diaphragm and the water cooling system.
In the above technical scheme, semiconductor laser becomes the linear array and is fixed in on the action face, laser crystal wear to overlap in the cooling tube, the cooling tube wear to overlap in the spotlight intracavity, be equipped with on the spotlight chamber with the window of semiconductor laser one-to-one so that the laser of semiconductor laser transmission gets into laser crystal, the both ends in spotlight chamber are fixed in respectively on two water knockout drums, wear out at laser crystal's both ends install one respectively behind the central through-hole of water knockout drum the diaphragm, laser crystal with it is sealed through the second sealing washer between the centre bore of diaphragm, the diaphragm assembles on the gland, the gland is fixed in on the corresponding water knockout drum, and the gland with it is sealed through the third sealing washer between the central through-hole.
In the above technical solution, the central through hole is communicated with the heat sink connection port through a 60 ° inclined channel, the central through hole and the heat dissipation tube connection port are coaxially arranged, and a channel connected with the water delivery port is perpendicular to the central through hole.
In the above technical solution, the material of the laser crystal is Nd: YAG, the laser crystal is a cylindrical structure, and the length-diameter ratio is more than 30.
In the above technical scheme, the material in spotlight chamber is the brass gilding, the center in spotlight chamber is equipped with the mounting hole that runs through, the cooling tube assemble in the mounting hole, N is 5, the side cut in spotlight chamber is pentagonal structure, and every side is corresponding a pumping direction, is equipped with a plurality of sectional types on every side the window, be equipped with a pentagonal socket on the water knockout drum, pentagonal socket with the axle center set up in the outer fringe of cooling tube connector.
In the technical scheme, the diameter of the diaphragm is 4.0-4.9 mm.
In the above technical solution, the pump module further includes three diaphragm adjusting blocks, the three diaphragm adjusting blocks are symmetrically arranged with the center of circle of the lining cover as a center, and each diaphragm adjusting block is provided with an inner screw.
In the technical scheme, the pumping module further comprises a base, the bottoms of the two water distributors are fixed to the top of the base through bolts, the water connector is fixed to the bottom of the base through bolts, and a shell is embedded outside the two water distributors.
In another aspect of the utility model, a solid-state laser includes the semiconductor laser side pumping module, a laser resonator mirror, an acousto-optic Q-switch, and a frequency doubling crystal.
Compared with the prior art, the utility model has the beneficial effects that:
1. the output power of infrared 1064nm laser of the semiconductor laser side pumping module of the green solid laser can reach 500W, and the semiconductor laser side pumping module has good beam quality, low laser heat effect, stability and reliability and engineering application effects.
2. This semiconductor laser side pumping module utility model is applied to accurate continuous green glow solid laser, adopts the double-pumping module to carry out laser resonator series design, can obtain the accurate continuous green glow laser power output more than 350 watts, and this utility model has filled the technical blank of the special semiconductor laser side pumping module of the accurate continuous green glow solid laser of internal high power.
3. Through engineering examination and test, the semiconductor laser side pumping module is applied in a 250-watt quasi-continuous green light solid laser, and the measured service life of the semiconductor laser side pumping module is longer than 15000 hours.
Drawings
Fig. 1 is a side sectional view of a pump module.
Fig. 2 is a schematic structural view of the heat sink, in which (a) is a sectional view and (b) is a front view.
Fig. 3 is a schematic structural view of the water separator, wherein (a) is a top view, (b) is a side view, and (c) is a front view.
Fig. 4 is a partially enlarged view of fig. 1.
Fig. 5 is a perspective view of a collection chamber.
Fig. 6 is a side view of a pump module.
Fig. 7 is a front view of a pumping module.
Fig. 8 is a front cross-sectional view of a pump module.
In the figure: 1-semiconductor laser, 2-heat sink, 3-outer shell, 4-laser crystal, 5-diaphragm, 6-lining cover, 7-diaphragm adjusting block, 8-light gathering cavity, 9-radiating pipe, 10-base, 11-water joint, 12-radiating block, 13-radiating pipe connecting port, 14-water separator, 15-connecting block, 16-heat sink connecting port, 17-connecting port, 18-first channel, 19-second channel, 20-third channel, 21-heat exchanging channel, 22-water conveying port, 23-regular pentagonal prism structure, 24-heat sink screw hole, 25-connecting block screw hole, 26-first sealing ring, 27-second sealing ring, 28-third sealing ring, 29-lining cover fixing screw, 30-mounting hole, 31-window, 32-pentagonal socket, 33-central through hole, 34-action surface and 35-insulating heat-conducting welding block.
11 a-water inlet joint, 11 b-water outlet joint, 14 a-water inlet separator, 14 b-water outlet separator and m-water flow channel.
Detailed Description
The utility model is described in further detail below with reference to the figures and specific examples. It should be understood that the specific embodiments described herein are merely illustrative of the utility model and are not intended to limit the utility model.
Example 1
A water cooling system for a pumping module comprises two water connectors 11, two water distributors 14, a heat sink group and a radiating pipe 9, wherein,
the two water connectors 11 are respectively a water inlet connector 11a and a water outlet connector 11b, the two water distributors 14 are respectively a water inlet distributor 14a and a water outlet distributor 14b, the water distributors 14 reasonably distribute cooling water, one part of the cooling water enters the heat sink 2 to cool the semiconductor laser 1 welded on the action surface 34, the other part of the cooling water enters the radiating pipe 9 to cool the laser crystal 4 sleeved in the radiating pipe 9, the heat sink group comprises N heat sinks 2, and the N heat sinks 2 are uniformly distributed around the periphery of the radiating pipe 9; the heat sink 2 is a heat dissipation channel of the semiconductor laser 1, the structure of the heat dissipation channel directly influences the thermal resistance, the heat dissipation surface of the semiconductor laser 1 is welded on an action surface 34 of the heat sink 2 through an insulating heat conduction welding block 35, a bow-shaped water flow channel m is arranged in each heat sink 2, the bow-shaped water flow channel m can reduce the heat conduction distance as much as possible, the heat sink 2 adopts a bow-shaped design, so that the heat exchange channel 21 is close to the heat dissipation surface of the semiconductor laser 1 as much as possible, the water inlet direction and the water outlet direction of the heat sink 2 are both vertical to the action surface 34 of the heat sink 2, and the action surface 34 is closely adjacent to the heat exchange channel 21 which is through and long in the heat sink 2;
the water inlet joint 11a is connected to the water inlet distributor 14a in a sealing mode, the water outlet joint 11b is connected to the water outlet distributor 14b in a sealing mode, and the water passing joint 11 can be connected with an external water passing pipeline in a threaded locking mode. Two ends of each heat sink 2 are respectively and hermetically connected to the corresponding heat sink connecting ports 16 of the water outlet and water distributor 14b and the water inlet and water distributor 14a, and two ends of each radiating pipe 9 are respectively and hermetically connected to the corresponding radiating pipe connecting ports 13 of the water outlet and water distributor 14b and the water inlet and water distributor 14 a. The water separator 14 reasonably distributes the heat dissipation cooling water flow of the laser crystal 4 and the semiconductor laser 1, and the optimal heat dissipation effect of the pumping module is ensured.
Preferably, the distance between the inner wall of the heat exchange channel 21 and the heat dissipation surface is less than 1mm, the diameter of the heat exchange channel 21 is 3-5mm, preferably 4mm, and the large-aperture and close-range heat dissipation heat sink pipeline design ensures that the semiconductor laser 1 has a good heat dissipation effect and avoids the light beam quality deterioration condition caused by the thermal deformation of the heat sink 2.
The cooling water enters into water knockout drum 14a through going into water swivel 11a, lets in each heat sink 2 and cooling tube 9 respectively through going into water knockout drum 14a, and the cooling water absorbs when heat sink 2 circulates and welds in the heat of semiconductor laser 1 on the active surface, the cooling water absorbs when circulating in cooling tube 9 and cup joints in the heat of the laser crystal 4 in cooling tube 9, and rivers after the heat absorption let in water knockout drum 14b, this water cooling system of rethread water swivel 11b discharge.
Preferably, the heat sink 2 comprises a heat dissipation block 12 and connection blocks 15, wherein the heat dissipation block 12 and the connection blocks 15 are integrally formed, the connection blocks 15 are fixed on the water separator 14 through bolts during assembly, and the connection ports 17 are in butt joint sealing with the heat sink connection ports 16 of the water separator 14 during fixing. The two connecting blocks 15 are respectively provided with a connecting port 17 for communicating with the heat sink connecting port 16, the two connecting ports 17 are respectively the water inlet and the water outlet, each connecting block 15 is internally provided with a first channel 18 and a second channel 19 which are perpendicular to each other, the connecting port 17 is positioned at the end part of the first channel 18, the heat radiating block 12 is internally provided with a heat exchanging channel 21 and a third channel 20 which is positioned at two sides of the heat exchanging channel 21 and is vertically communicated with the heat exchanging channel 21, and the first channel 18 and the second channel 19 of the two connecting blocks 15 and the third channel 20 and the heat exchanging channel 21 of the heat radiating block 12 are communicated to form the arched water flow channel m. The radiating pipe 9 is a glass pipe, the heat accumulation effect of the laser crystal 4 is serious under the condition of high-power operation, and the side surface of the laser crystal 4 is soaked in radiating cooling water in a mode of coating the glass pipe externally, so that a better radiating effect is obtained. The end of the radiating pipe 9 is inserted into the radiating pipe connection port 13 of the water separator 14 and is sealed by the first sealing ring 26.
Preferably, N is 5, the heat sink group includes five heat sinks, a water delivery port 22 is disposed at the bottom of the water separator 14, the water delivery port 22 is communicated with a distribution cavity formed in the water separator 14, a regular pentagonal prism structure 23 is disposed on a side surface of the water separator 14, the heat sink connection ports 16 communicated with the distribution cavity are formed on five side surfaces of the regular pentagonal prism structure 23, and the center of the regular pentagonal prism structure 23 is formed on the heat radiation pipe connection ports 13 communicated with the distribution cavity. Two sides of each heat sink connecting port 16 are provided with a heat sink screw hole 24 corresponding to a connecting block screw hole 25 correspondingly arranged on the connecting block 15, so as to fix the connecting blocks 15 of five heat sinks 2 on five side surfaces of the regular pentagonal prism structure 23 one by one.
Example 2
The utility model provides a semiconductor laser side pumping module, includes semiconductor laser 1, spotlight chamber 8, laser crystal 4, diaphragm 5, as embodiment 1 the water cooling system, semiconductor laser 1 is fixed in into linear array on the action face, semiconductor laser 1 can be with the direct current conversion of input for 808nm laser, laser crystal 4 wears to overlap in cooling tube 9, laser crystal 4 absorbs behind the 808nm laser and can produce 1064nm stimulated radiation, cooling tube 9 wears to overlap in spotlight chamber 8, be equipped with on the spotlight chamber 8 with the window 31 of semiconductor laser 1 one-to-one so that the laser that semiconductor laser 1 emitted gets into laser crystal 4, the both ends of spotlight chamber 8 are fixed in respectively on two water knockout drums 14, wear out at the both ends of laser crystal 4 install one respectively behind the central through-hole 33 of water knockout drum 14 diaphragm 5, the two ends of the laser crystal 4 are provided with diaphragms 5, and the aperture of the diaphragm 5 can be selected according to the actual requirements of laser power, pulse width, beam quality and the like, so that the light spot control function is realized. The laser crystal 4 and the central hole of the diaphragm 5 are sealed through a second sealing ring 27, the diaphragm 5 is assembled on a lining cover 6, the lining cover 6 is fixed on the corresponding water separator 14, and the lining cover 6 and the central through hole 33 are sealed through a third sealing ring 28. The lining cover 6 mainly provides a supporting and fixing function for the diaphragm 5, and meanwhile, the lining cover 6 is fixed on the water segregator 14 through four lining cover fixing screws 29(M3 screws).
Preferably, the central through hole 33 is communicated with the heat sink connection port 16 through an inclined channel of 60 °, the central through hole 33 is coaxially disposed with the heat pipe connection port 13, and a channel connected to the water feed port 22 is perpendicular to the central through hole 33. The semiconductor laser 1 linear array is usually a minimum unit of 19 single tubes, which is called Bar. The Bar strip is installed on the water-cooling heat sink 2 linearly, and as the power is increased, a large amount of waste heat is gradually balanced after being deposited around, so that a high-temperature area is formed, and a temperature gradient is generated. In order to ensure the working life of each Bar, the working temperature of each Bar needs to be reduced as much as possible, and theoretically, the service life is improved by about one time when the working temperature is reduced by 10 ℃. Under the action of the heat sink 2 of the arched water flow channel m, the working life of the Bar strip can be effectively prolonged.
Preferably, the material of the laser crystal 4 is Nd: YAG, Nd: YAG can generate 1064nm stimulated radiation after absorbing 808nm laser, the fluorescence lifetime is about 230 microseconds, and the YAG is very suitable for laser pulse output under the repetition frequency of 10kHz level. Laser crystal 4 is cylindrical structure, and length to diameter ratio is greater than 30, and laser crystal 4 central zone radiating effect is poor, and outside and cooling water contact area radiating effect are good, lead to its inside temperature gradient distribution, form the thermal lens effect to destroy laser resonance condition, restrict the laser instrument maximum power output level. By increasing the length-diameter ratio of the laser crystal 4, the laser crystal has a smaller body surface ratio, the thermal lens effect in a working state is reduced, and meanwhile, the transverse mode of laser is limited, so that the pumping module has better beam quality under the lateral pumping condition.
Preferably, the material of the light-gathering cavity 8 is brass and gold plated, so that the light-gathering cavity has an excellent heat dissipation effect and high infrared 808nm semiconductor pump light reflectivity. The center of spotlight chamber 8 is equipped with the mounting hole 30 that runs through, cooling tube 9 assemble in the mounting hole 30, N is 5, the side cut of spotlight chamber 8 is pentagonal structure, and every side is corresponding a pumping direction, is equipped with a plurality of sectional types on every side window 31, be equipped with a pentagonal socket 32 on the water knockout drum 14, pentagonal socket 32 with the axle center set up in the outer fringe of cooling tube connector 13. The adoption of the pentagonal structure is more convenient when the light-gathering cavity 8 is fixed and positioned. The sectional frame structure enhances the mechanical strength of the light-gathering cavity 8 and reduces the amount of thermal deformation.
Preferably, under the condition of high power output, the diameter of the diaphragm 5 is 4.0-4.9mm, preferably 4.8mm, so that the quality of a laser beam is controlled, the effective output of laser in a central area is ensured, the edge part with poor surface quality of the laser crystal 4 is limited, and the phenomenon of sparking caused by contact of edge stray light and a defect part of the laser crystal 4 is avoided.
Example 3
Preferably, the pumping module further comprises three diaphragm adjusting blocks 7, the three diaphragm adjusting blocks 7 are symmetrically arranged with the center of circle of the lining cover 6 as the center, and each diaphragm adjusting block 7 is provided with an internal screw. The diaphragm adjusting block 7 is an adjusting device for the positions of the diaphragm 5 and the lining cover 6, and the lining cover 6 is pushed by screwing the screw in the diaphragm adjusting block 7, so that the fine adjustment function of the position of the diaphragm 5 is realized.
Preferably, the pumping module further comprises a base 10, the bottoms of the two water distributors 14 are fixed on the top of the base 10 through bolts, the water connector 11 is fixed on the bottom of the base 10 through bolts, and the two water distributors 14 are externally embedded with a shell 3 to protect the heat sink 2, the heat dissipation pipe 9, the laser crystal 4 and the like inside the shell.
Example 4
A solid state laser comprising the pumping module, the laser resonator mirror, the acousto-optic Q-switch, and the frequency doubling crystal of embodiment 2 or 3. The pump module of embodiment 2 or embodiment 3 can effectively improve the maximum output power and the energy conversion efficiency of the solid-state laser. Preferably, the solid-state laser is a green solid-state laser.
Spatially relative terms, such as "upper," "lower," "left," "right," and the like, may be used in the embodiments for ease of description to describe one element or feature's relationship to another element or feature as illustrated in the figures. It will be understood that the spatial terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "below" other elements or features would then be oriented "above" the other elements or features. Thus, the exemplary term "lower" can encompass both an upper and a lower orientation. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
Moreover, relational terms such as "first" and "second," and the like, may be used solely to distinguish one element from another element having the same name, without necessarily requiring or implying any actual such relationship or order between such elements.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, several modifications can be made without departing from the principle of the present invention, and these modifications should also be construed as the protection scope of the present invention.

Claims (16)

1. A water cooling system for a pumping module is characterized by comprising two water connectors, two water distributors, a heat sink group and a radiating pipe, wherein the water distributors are respectively communicated with the heat sink and the radiating pipe; a bow-shaped water flow channel is arranged in each heat sink, and the action surface of each heat sink is closely adjacent to the through long heat exchange channel in each heat sink.
2. The water cooling system of claim 1, wherein the two water connectors are a water inlet connector and a water outlet connector, the two water separators are a water inlet water separator and a water outlet water separator, the water inlet connector is hermetically connected to the water inlet water separator, the water outlet connector is hermetically connected to the water outlet water separator, two ends of each heat sink are hermetically connected to corresponding heat sink connection ports of the water outlet water separator and the water inlet water separator, and two ends of the heat pipe are hermetically connected to corresponding heat pipe connection ports of the water outlet water separator and the water inlet water separator.
3. The water cooling system for a pump module according to claim 1, wherein the heat dissipating surface of the semiconductor laser is welded to the active surface by an insulating heat conducting welding block, the distance between the inner wall of the heat exchanging channel and the heat dissipating surface is less than 1mm, and the diameter of the heat exchanging channel is 3-5 mm.
4. The water cooling system for a pump module according to claim 1, wherein the heat sink includes a heat dissipation block and connection blocks at two ends of the heat dissipation block, the two connection blocks are respectively provided with a connection port for communicating with the connection port of the heat sink, and the two connection ports are respectively a water inlet and a water outlet.
5. The water cooling system for pump module as claimed in claim 4, wherein each connecting block has a first channel and a second channel perpendicular to each other, the connecting port is located at an end of the first channel, the heat dissipating block has the heat exchanging channel and a third channel located at two sides of the heat exchanging channel and perpendicular to the heat exchanging channel, and the first channel and the second channel of two connecting blocks and the third channel and the heat exchanging channel of the heat dissipating block are connected to form the arcuate water flow channel.
6. The water cooling system for pump module as claimed in claim 1, wherein the heat pipe is a glass pipe, and an end of the heat pipe is inserted into the heat pipe connection port of the water separator and sealed by a first sealing ring.
7. The water cooling system of claim 1, wherein N is 5, the heat sink set includes five heat sinks, a water delivery port is formed at the bottom of the water separator, the water delivery port communicates with a distribution cavity formed in the water separator, a regular pentagonal prism structure is formed on a side surface of the water separator, a heat sink connection port communicating with the distribution cavity is formed on each of five side surfaces of the regular pentagonal prism structure, and a center of the regular pentagonal prism structure is formed at the heat radiation pipe connection port communicating with the distribution cavity.
8. A semiconductor laser side pumping module comprising a semiconductor laser, a collection cavity, a laser crystal, an aperture, a water cooling system as claimed in any one of claims 1 to 7.
9. The semiconductor laser side pumping module of claim 8, wherein the semiconductor lasers are mounted in a linear array on the active surface, the laser crystal is sleeved in the radiating pipe, the radiating pipe is sleeved in the light-gathering cavity, the light-gathering cavity is provided with windows which are in one-to-one correspondence with the semiconductor lasers so that the laser emitted by the semiconductor lasers enters the laser crystal, two ends of the light-gathering cavity are respectively fixed on the two water distributors, two ends of the laser crystal are respectively provided with the diaphragm after penetrating through the central through hole of the water distributors, the laser crystal and the central hole of the diaphragm are sealed by a second sealing ring, the diaphragm is assembled on the lining cover, the lining cover is fixed on the corresponding water separator, and the lining cover and the central through hole are sealed through a third sealing ring.
10. The semiconductor laser side pumping module of claim 9, wherein the central through hole communicates with the heat sink connection port through an inclined channel of 60 °, the central through hole is coaxially disposed with the heat radiation pipe connection port, and a channel connected with a water delivery port is perpendicular to the central through hole.
11. The semiconductor laser side pumping module of claim 8, wherein the laser crystal is made of Nd: YAG, the laser crystal is a cylindrical structure, and the length-diameter ratio is more than 30.
12. The semiconductor laser side pumping module of claim 9, wherein the light-gathering cavity is made of gold-plated brass, a mounting hole is formed in the center of the light-gathering cavity, the heat dissipation tube is mounted in the mounting hole, N-5, the side cross-section of the light-gathering cavity is a pentagonal structure, each side surface corresponds to one pumping direction, a plurality of segmented windows are formed in each side surface, a pentagonal socket is formed in the water distributor, and the pentagonal sockets are coaxially disposed at the outer edges of the connection ports of the heat dissipation tube.
13. The semiconductor laser side pumping module of claim 8, wherein the stop has a diameter of 4.0-4.9 mm.
14. The semiconductor laser side pumping module of claim 9, wherein the pumping module further comprises three diaphragm adjusting blocks, the three diaphragm adjusting blocks are symmetrically arranged around the center of the lining cover, and each diaphragm adjusting block is provided with an internal screw.
15. The semiconductor laser side pumping module of claim 8, wherein the pumping module further comprises a base, the bottoms of the two water separators are fixed to the top of the base through bolts, the water connector is fixed to the bottom of the base through bolts, and a shell is embedded outside the two water separators.
16. A solid state laser comprising the semiconductor laser side pumping module of claim 8, a laser resonator mirror, an acousto-optic Q-switch, and a frequency doubling crystal.
CN202121497645.2U 2021-07-02 2021-07-02 Water cooling system for pumping module, pumping module and solid laser Active CN215771890U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202121497645.2U CN215771890U (en) 2021-07-02 2021-07-02 Water cooling system for pumping module, pumping module and solid laser

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202121497645.2U CN215771890U (en) 2021-07-02 2021-07-02 Water cooling system for pumping module, pumping module and solid laser

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Publication Number Publication Date
CN215771890U true CN215771890U (en) 2022-02-08

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