CN215547470U - Silicon wafer chamfering and grinding equipment for processing solar panel - Google Patents
Silicon wafer chamfering and grinding equipment for processing solar panel Download PDFInfo
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- CN215547470U CN215547470U CN202121912232.6U CN202121912232U CN215547470U CN 215547470 U CN215547470 U CN 215547470U CN 202121912232 U CN202121912232 U CN 202121912232U CN 215547470 U CN215547470 U CN 215547470U
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 134
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 134
- 239000010703 silicon Substances 0.000 title claims abstract description 134
- 238000000227 grinding Methods 0.000 title claims abstract description 73
- 230000017105 transposition Effects 0.000 claims abstract description 29
- 239000000463 material Substances 0.000 claims description 26
- 238000003860 storage Methods 0.000 claims description 26
- 230000007306 turnover Effects 0.000 claims description 24
- 238000001179 sorption measurement Methods 0.000 claims description 16
- 238000009434 installation Methods 0.000 claims description 14
- 230000005540 biological transmission Effects 0.000 claims description 9
- 230000002093 peripheral effect Effects 0.000 claims description 6
- 241000252254 Catostomidae Species 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 abstract description 159
- 238000000034 method Methods 0.000 abstract description 15
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 238000007688 edging Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004570 mortar (masonry) Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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Abstract
The utility model discloses silicon wafer chamfering and grinding equipment for processing a solar panel, which can meet the requirements of chamfering and grinding of silicon wafers at multiple angles, a limiting block presses the side edge of the chamfering, the silicon wafers in the chamfering process are effectively fixed, a plurality of silicon wafers can be stored, the silicon wafers are fed through two guide rollers when the silicon wafers are subjected to chamfering grinding, the silicon wafers at the bottom are conveniently separated from the silicon wafers above, the feeding is convenient and efficient, the silicon wafers after chamfering grinding can be transferred into a receiving bin through the arrangement of a transposition frame, the condition that the silicon wafers fall down in the receiving process is avoided through the design of a liftable receiving plate, the whole process does not need the participation of operators, and the automation degree is high.
Description
Technical Field
The utility model relates to the technical field of solar panel processing, in particular to silicon wafer chamfering and grinding equipment for solar panel processing.
Background
In the cutting process of the silicon wafer, due to steel wires, mortar, equipment, operation and other reasons, a local defect region which does not penetrate through the silicon wafer exists at the edge of the silicon wafer after the silicon wafer is cut, and the local defect region is generally called edge breakage. The product has great influence on the conversion efficiency in the subsequent manufacturing process of the solar cell panel, the overall aesthetic property of the product is influenced after series welding, the product does not meet the quality requirement, and simultaneously, the silicon wafer is chamfered and edged according to the actual use requirement in the production process.
Current chamfer edging equipment can't satisfy the multi-angle chamfer and the grinding of silicon chip according to the production demand, and the whole process of silicon chip needs operating personnel to participate in when the chamfer grinding, and degree of automation is not high, and the condition of breaking into pieces appears easily because the silicon chip is thinner at the in-process of material loading, unloading with current chamfer edging equipment.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide silicon wafer chamfering and grinding equipment for processing a solar panel, which solves the following technical problems: (1) the adjusting motor output shaft drives a first lead screw to rotate, the first lead screw drives a horizontal adjusting plate to move towards the direction of a supporting frame, a driving motor is started, the driving motor output shaft drives a chamfer grinding sheet to rotate through two belt pulleys III, a belt III drives the chamfer grinding sheet to rotate, an installation cylinder is started, a piston rod of the installation cylinder pushes a rotary joint to rotate, the rotary joint drives a rotary shaft lever to rotate, the rotary shaft lever drives the chamfer grinding sheet to rotate through a rotary seat, the rotary cylinder is started, the rotary cylinder drives a rotary supporting plate to rotate, the rotary supporting plate drives the chamfer grinding sheet to rotate through a shaft seat, the chamfer grinding sheet carries out chamfer grinding on the side edge of a silicon wafer, through the structure arrangement, the chamfer grinding can meet the requirements of multi-angle chamfering and grinding of the silicon wafer, a limiting block presses the side edge of the chamfer, and effectively fixes the silicon wafer in the chamfering process; (2) stacking a plurality of silicon wafers into a silicon wafer storage box, starting two guide motors, driving guide rollers to rotate by a belt through two belt pulleys I, conveying the bottom silicon wafers onto a peripheral turntable by the two guide rollers, starting a wafer pushing cylinder, pushing a wafer pushing block by a piston rod of the wafer pushing cylinder, pushing the silicon wafers out of a wafer pushing cavity by the wafer pushing block, then starting three limiting cylinders, pushing a limiting block by a piston rod of the limiting cylinder, rotating the limiting block along a fixing block and pressing the limiting block on the silicon wafers, and through the structure, the chamfering grinding equipment can store the silicon wafers, and when chamfering grinding is carried out on the silicon wafers, the silicon wafers are fed through the two guide rollers, so that the bottom silicon wafers are conveniently separated from the silicon wafers above, and the feeding is convenient and efficient; (3) the silicon wafer four-side edge chamfering grinding device is characterized in that a moving motor is started after chamfering grinding, a moving motor output shaft drives a second lead screw to rotate, the second lead screw drives a silicon wafer storage box to move to one side of a transposition frame, a wafer pushing block pushes out a silicon wafer, an adsorption disc adsorbs the pushed silicon wafer, the transposition motor is started, a transposition motor output shaft passes through two belt pulleys II, a belt II drives a hanging frame to move horizontally, the hanging frame moves the silicon wafer to the upper side of a receiving bin through the adsorption disc, the adsorption disc puts the silicon wafer into the receiving bin, the silicon wafer chamfering grinding device is arranged through the structure, the silicon wafer after chamfering grinding can be transferred into the receiving bin through the arrangement of the transposition frame, through the design of a liftable receiving plate, the condition that the silicon wafer falls in the receiving process is avoided, the whole process does not need the participation of operators, and the automation degree is high.
The purpose of the utility model can be realized by the following technical scheme:
a silicon wafer chamfering and grinding device for processing a solar panel comprises a rack, wherein a rotating supporting plate and a supporting frame are arranged on the rack, a mounting frame is arranged on the rotating supporting plate, a horizontal adjusting plate is arranged on the mounting frame, a shaft seat is arranged on the horizontal adjusting plate, a rotating shaft rod is arranged on the shaft seat, a rotating seat is arranged on the rotating shaft rod, and chamfering and grinding sheets are arranged on the rotating seat; the silicon wafer storage box is characterized in that a horizontal moving plate is arranged on the support frame, a support seat is arranged on the horizontal moving plate, a silicon wafer storage box is arranged on the support seat, guide rollers are arranged on the inner walls of two sides of the silicon wafer storage box in a rotating mode, a peripheral turntable is arranged in the inner cavity of the silicon wafer storage box in a rotating mode, a wafer pushing cylinder is arranged on the support seat, a wafer pushing block is arranged at the end portion of a piston rod of the wafer pushing cylinder, and a plurality of negative pressure suckers are arranged on the wafer pushing block; the material receiving device is characterized in that a shifting frame is arranged on one side of the support frame, a hanging frame is arranged on the shifting frame, a material receiving bin is arranged on one side of the shifting frame, a material receiving plate is arranged in the material receiving bin in a sliding mode, a material receiving cylinder is arranged in the rack, and the material receiving plate is connected with the end portion of a piston rod of the material receiving cylinder.
Further, a rotary cylinder is installed at the top of the rack, the output end of the rotary cylinder is connected with a rotary supporting plate, an arc-shaped guide rail is installed at the top of the rack, and the rotary supporting plate is connected with the arc-shaped guide rail in a sliding mode.
Further, install accommodate motor on the mounting bracket, accommodate motor output shaft end installs first lead screw, first lead screw threaded connection level adjusting plate, level adjusting plate passes through slider, slide rail sliding connection mounting bracket.
Furthermore, a driving motor is arranged on the rotating seat, and an output shaft of the driving motor is in transmission connection with the chamfer grinding sheet through the two third belt pulleys and the third belt.
Furthermore, a rotary joint is installed on the rotary shaft rod, a guide wheel is installed at one end of the rotary joint, a side plate is installed on one side of the shaft seat, a right-angle block is arranged on the side plate in a sliding mode, a waist-shaped hole is formed in the right-angle block, the guide wheel is movably installed in the waist-shaped hole, a supporting plate is arranged below the side plate, an installation cylinder is arranged on the supporting plate in a rotating mode, and one end, far away from the guide wheel, of the rotary joint is connected with the end portion of a piston rod of the installation cylinder in a rotating mode.
Further, a moving motor is arranged on the support frame, a second lead screw is installed at the end of an output shaft of the moving motor, the second lead screw is in threaded connection with a horizontal moving plate, and the horizontal moving plate is in sliding connection with the support frame through a sliding block and a sliding rail.
Further, two guide motors are symmetrically installed on the inner walls of the two sides of the silicon wafer storage box, the two guide motors correspond to the two guide rollers one to one, and output shafts of the guide motors are in transmission connection with the guide rollers through the first two belt pulleys and the belt.
Further, two jacking cylinders are installed to the supporting seat inner chamber, and two jacking cylinder piston rod end connection lifter plates are provided with the turnover motor between two jacking cylinders, turnover motor output shaft runs through the lifter plate and connects turnover dish bottom, the last radian of lifter plate is provided with a plurality of guide wheels, guide wheel and turnover dish lower surface contact.
Further, the bottom of the silicon wafer storage box is provided with a push piece cavity, the two sides of the push piece cavity are all penetrated through the silicon wafer storage box, the silicon wafer storage box is provided with three limiting cylinders and three fixed blocks on the outer wall of the same side, the end part of a piston rod of each limiting cylinder is rotated to be provided with a limiting block, the limiting blocks are in one-to-one correspondence with the three fixed blocks, the limiting blocks are rotated to be connected with the fixed blocks, a transposition motor is arranged on a transposition frame, the transposition frame is rotatably provided with two belt pulleys II, the two belt pulleys are connected through a belt II transmission, the hanging frame is connected with a belt II through a belt clamp, and an adsorption disc is arranged on the hanging frame.
The working process of the silicon wafer chamfering and grinding equipment for processing the solar panel is as follows:
the method comprises the following steps: stacking a plurality of silicon wafers into a silicon wafer storage box, starting two guide motors, driving guide rollers to rotate by the guide motors through two belt pulleys I and a belt, conveying the silicon wafers at the bottom onto a peripheral turntable by the two guide rollers, starting a wafer pushing cylinder, pushing a wafer pushing block by a piston rod of the wafer pushing cylinder, pushing the silicon wafers out of a wafer pushing cavity by the wafer pushing block, then starting three limiting cylinders, pushing a limiting block by a piston rod of the limiting cylinder, and enabling the limiting block to rotate along a fixing block and press the silicon wafers;
step two: starting an adjusting motor, an output shaft of the adjusting motor drives a first lead screw to rotate, the first lead screw drives a horizontal adjusting plate to move towards the direction of a support frame, a driving motor is started, an output shaft of the driving motor passes through a third belt pulley, a third belt pulley drives a chamfer grinding sheet to rotate, an installation cylinder is started, a piston rod of the installation cylinder pushes a rotary joint to rotate, the rotary joint drives a rotary shaft lever to rotate, the rotary shaft lever drives the chamfer grinding sheet to rotate through a rotary seat, the rotary cylinder drives a rotary supporting plate to rotate, the rotary supporting plate drives the chamfer grinding sheet to rotate through a shaft seat, the chamfer grinding sheet carries out chamfer grinding on the side edge of a silicon wafer, then three limiting cylinders are closed, a negative pressure sucker on a pushing sheet block adsorbs the silicon wafer and pulls the silicon wafer onto a turnover disc, the turnover motor is started, the output shaft of the turnover motor drives the turnover disc to rotate, the turnover disc drives the silicon wafer to rotate by 90 degrees, then the silicon wafer is pushed out continuously by the wafer pushing cylinder through the wafer pushing block, and the steps are repeated to finish chamfering grinding of four sides of the silicon wafer;
step three: the silicon wafer four-side chamfering grinding device is characterized in that a moving motor is started after the silicon wafer four-side chamfering grinding, an output shaft of the moving motor drives a second lead screw to rotate, the second lead screw drives a silicon wafer storage box to move to one side of a transposition frame, a wafer pushing block pushes the silicon wafer out, an adsorption disc adsorbs the pushed silicon wafer, the transposition motor is started, an output shaft of the transposition motor drives a hanging bracket to horizontally move through two belt pulleys II and a belt II, the hanging bracket moves the silicon wafer to the position above a material receiving bin through the adsorption disc, and the adsorption disc puts the silicon wafer into the material receiving bin.
The utility model has the beneficial effects that:
(1) the silicon wafer chamfering and grinding equipment for processing the solar panel is characterized in that an adjusting motor is started, an output shaft of the adjusting motor drives a first lead screw to rotate, the first lead screw drives a horizontal adjusting plate to move towards the direction of a supporting frame, a driving motor is started, an output shaft of the driving motor drives a chamfering and grinding sheet to rotate through two belt pulleys III and a belt III, an installation cylinder is started, a piston rod of the installation cylinder pushes a rotary joint to rotate, the rotary joint drives a rotary shaft lever to rotate, the rotary shaft lever drives the chamfering and grinding sheet to rotate through a rotary seat, the rotary cylinder is started, the rotary cylinder drives a rotary supporting plate to rotate, the rotary supporting plate drives the chamfering and grinding sheet to rotate through a shaft seat, the chamfering and grinding sheet performs chamfering and grinding on the side edge of a silicon wafer, the chamfering and grinding can meet the multi-angle chamfering and grinding of the silicon wafer through the structural arrangement, and a limiting block presses the side edge of the chamfering, effectively fixing the silicon wafer in the chamfering process;
(2) stacking a plurality of silicon wafers into a silicon wafer storage box, starting two guide motors, driving guide rollers to rotate by a belt through two belt pulleys I, conveying the bottom silicon wafers onto a peripheral turntable by the two guide rollers, starting a wafer pushing cylinder, pushing a wafer pushing block by a piston rod of the wafer pushing cylinder, pushing the silicon wafers out of a wafer pushing cavity by the wafer pushing block, then starting three limiting cylinders, pushing a limiting block by a piston rod of the limiting cylinder, rotating the limiting block along a fixing block and pressing the limiting block on the silicon wafers, and through the structure, the chamfering grinding equipment can store the silicon wafers, and when chamfering grinding is carried out on the silicon wafers, the silicon wafers are fed through the two guide rollers, so that the bottom silicon wafers are conveniently separated from the silicon wafers above, and the feeding is convenient and efficient;
(3) the silicon wafer four-side edge chamfering grinding device is characterized in that a moving motor is started after chamfering grinding, a moving motor output shaft drives a second lead screw to rotate, the second lead screw drives a silicon wafer storage box to move to one side of a transposition frame, a wafer pushing block pushes out a silicon wafer, an adsorption disc adsorbs the pushed silicon wafer, the transposition motor is started, a transposition motor output shaft passes through two belt pulleys II, a belt II drives a hanging frame to move horizontally, the hanging frame moves the silicon wafer to the upper side of a receiving bin through the adsorption disc, the adsorption disc puts the silicon wafer into the receiving bin, the silicon wafer chamfering grinding device is arranged through the structure, the silicon wafer after chamfering grinding can be transferred into the receiving bin through the arrangement of the transposition frame, through the design of a liftable receiving plate, the condition that the silicon wafer falls in the receiving process is avoided, the whole process does not need the participation of operators, and the automation degree is high.
Drawings
The utility model will be further described with reference to the accompanying drawings.
FIG. 1 is a schematic structural diagram of a silicon wafer chamfering and grinding apparatus for solar panel processing according to the present invention;
FIG. 2 is a schematic structural view of the support frame of the present invention;
FIG. 3 is an internal structural view of the silicon wafer storage box of the present invention;
FIG. 4 is a schematic view of the construction of the guide roll of the present invention;
FIG. 5 is a schematic structural view of the week rotary disk of the present invention;
FIG. 6 is a schematic view of the structure of the rotating blade of the present invention;
FIG. 7 is a schematic structural view of the support plate of the present invention;
FIG. 8 is a side view of the structure of FIG. 7;
FIG. 9 is a schematic structural view of a stop block of the present invention;
FIG. 10 is a schematic structural view of the transposing frame of the present invention;
fig. 11 is an internal structural view of the receiving bin of the present invention.
In the figure: 1. a rack; 2. rotating the supporting plate; 3. a support frame; 4. a rotating cylinder; 5. an arc-shaped guide rail; 6. a mounting frame; 7. a level adjustment plate; 8. adjusting the motor; 9. a shaft seat; 10. rotating the shaft lever; 11. a rotating base; 12. a drive motor; 13. a rotary joint; 14. a guide wheel; 15. a right-angle block; 16. a side plate; 17. a support plate; 18. mounting a cylinder; 19. horizontally moving the plate; 20. a moving motor; 21. a supporting seat; 22. a silicon wafer storage box; 23. a guide roller; 24. a steering motor; 25. a turnover disc; 26. jacking a cylinder; 27. a lifting plate; 28. a turnover motor; 29. a guide wheel; 30. a blade pushing cylinder; 31. a wafer pushing block; 32. a blade pushing cavity; 33. a limiting cylinder; 34. a limiting block; 35. a fixed block; 36. a transposition frame; 37. a transposition motor; 38. a hanger; 39. an adsorption tray; 40. a material receiving bin; 41. a material collecting plate; 42. receive the material cylinder.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The first embodiment is as follows:
referring to fig. 1-11, the utility model relates to silicon wafer chamfering and grinding equipment for processing a solar panel, which comprises a rack 1, wherein a rotating supporting plate 2 and a supporting frame 3 are arranged on the rack 1, an installation frame 6 is arranged on the rotating supporting plate 2, a horizontal adjusting plate 7 is arranged on the installation frame 6, a shaft seat 9 is arranged on the horizontal adjusting plate 7, a rotating shaft rod 10 is arranged on the shaft seat 9, a rotating seat 11 is arranged on the rotating shaft rod 10, and chamfering and grinding sheets are arranged on the rotating seat 11; a horizontal moving plate 19 is arranged on the support frame 3, a support seat 21 is arranged on the horizontal moving plate 19, a silicon wafer storage box 22 is arranged on the support seat 21, guide rollers 23 are arranged on the inner walls of two sides of the silicon wafer storage box 22 in a rotating mode, a turnover disc 25 is arranged in the inner cavity of the silicon wafer storage box 22 in a rotating mode, a wafer pushing cylinder 30 is arranged on the support seat 21, a wafer pushing block 31 is arranged at the end portion of a piston rod of the wafer pushing cylinder 30, and a plurality of negative pressure suction cups are arranged on the wafer pushing block 31; a shifting frame 36 is arranged on one side of the supporting frame 3, a hanging frame 38 is arranged on the shifting frame 36, a material receiving bin 40 is arranged on one side of the shifting frame 36, a material receiving plate 41 is arranged in the material receiving bin 40 in a sliding mode, a material receiving cylinder 42 is arranged in the rack 1, and the end portion of a piston rod of the material receiving cylinder 42 is connected with the material receiving plate 41.
The second embodiment is as follows:
the embodiment is further optimized on the basis of the first specific embodiment, which is specifically as follows:
as shown in fig. 6, a rotary cylinder 4 is installed at the top of the rack 1, the output end of the rotary cylinder 4 is connected with a rotary supporting plate 2, an arc-shaped guide rail 5 is installed at the top of the rack 1, and the rotary supporting plate 2 is slidably connected with the arc-shaped guide rail 5.
The third concrete embodiment:
the embodiment is further optimized on the basis of the first specific embodiment, which is specifically as follows:
as shown in fig. 6, the mounting frame 6 is provided with an adjusting motor 8, the end of the output shaft of the adjusting motor 8 is provided with a first lead screw, the first lead screw is in threaded connection with a level adjusting plate 7, and the level adjusting plate 7 is in sliding connection with the mounting frame 6 through a sliding block and a sliding rail.
The fourth concrete embodiment:
the embodiment is further optimized on the basis of the third specific embodiment, which is specifically as follows:
as shown in fig. 6-7, a driving motor 12 is arranged on the rotary base 11, and an output shaft of the driving motor 12 is in transmission connection with the chamfer grinding sheet through two belt pulleys iii and a belt iii.
The fifth concrete embodiment:
the embodiment is further optimized on the basis of the fourth specific embodiment, which is specifically as follows:
as shown in fig. 7-8, a rotary joint 13 is mounted on the rotary shaft 10, a guide wheel 14 is mounted at one end of the rotary joint 13, a side plate 16 is mounted at one side of the shaft seat 9, a right-angle block 15 is slidably disposed on the side plate 16, a kidney-shaped hole is disposed on the right-angle block 15, the guide wheel 14 is movably mounted in the kidney-shaped hole, a support plate 17 is disposed below the side plate 16, a mounting cylinder 18 is rotatably disposed on the support plate 17, and one end of the rotary joint 13, which is far away from the guide wheel 14, is rotatably connected with the end of a piston rod of the mounting cylinder 18.
The sixth specific embodiment:
the embodiment is further optimized on the basis of the fourth specific embodiment, which is specifically as follows:
as shown in fig. 2, a moving motor 20 is disposed on the supporting frame 3, a second lead screw is mounted at an end of an output shaft of the moving motor 20, the second lead screw is in threaded connection with the horizontal moving plate 19, and the horizontal moving plate 19 is slidably connected to the supporting frame 3 through a slider and a sliding rail.
The seventh specific embodiment:
the embodiment is further optimized on the basis of the sixth specific embodiment, which is specifically as follows:
as shown in fig. 3-4, two guiding motors 24 are symmetrically installed on the inner walls of the two sides of the silicon wafer storage box 22, the two guiding motors 24 correspond to the two guiding rollers 23 one by one, and the output shafts of the guiding motors 24 are in transmission connection with the guiding rollers 23 through two first belt pulleys and a belt.
The eighth embodiment:
the embodiment is further optimized on the basis of the seventh specific embodiment, which is specifically as follows:
as shown in fig. 3 and 5, two jacking cylinders 26 are installed in the inner cavity of the supporting seat 21, the end parts of the piston rods of the two jacking cylinders 26 are connected with a lifting plate 27, a turnover motor 28 is arranged between the two jacking cylinders 26, the output shaft of the turnover motor 28 penetrates through the lifting plate 27 and is connected with the bottom of a turnover disc 25, a plurality of guide wheels 29 are arranged on the lifting plate 27 at equal radian, and the guide wheels 29 are in contact with the lower surface of the turnover disc 25.
The specific embodiment is nine:
the embodiment is further optimized on the basis of the eighth specific embodiment, which is specifically as follows:
as shown in fig. 9-10, a wafer pushing cavity 32 is arranged at the bottom of the wafer storing box 22, two sides of the wafer pushing cavity 32 penetrate through the wafer storing box 22, three limiting cylinders 33 and three fixing blocks 35 are mounted on the outer wall of the same side of the wafer storing box 22, limiting blocks 34 are rotatably mounted at the end portions of piston rods of the limiting cylinders 33, the three limiting blocks 34 correspond to the three fixing blocks 35 one by one, the limiting blocks 34 are rotatably connected with the fixing blocks 35, a transposition motor 37 is mounted on a transposition frame 36, two belt pulleys two are rotatably mounted on the transposition frame 36 and are in transmission connection with each other through a belt pulley two, a hanging frame 38 is connected with the belt pulley two through a belt clamp, and an adsorption disc 39 is mounted on the hanging frame 38.
The working process of the silicon wafer chamfering and grinding equipment for processing the solar panel is as follows:
the method comprises the following steps: stacking a plurality of silicon wafers into a silicon wafer storage box 22, starting two guide motors 24, driving guide rollers 23 to rotate by the guide motors 24 through two belt pulleys I and a belt, conveying the silicon wafers at the bottom onto a turnover disc 25 by the two guide rollers 23, starting a wafer pushing cylinder 30, pushing a wafer pushing block 31 by a piston rod of the wafer pushing cylinder 30, pushing the silicon wafers out of a wafer pushing cavity 32 by the wafer pushing block 31, then starting three limiting cylinders 33, pushing a limiting block 34 by a piston rod of the limiting cylinder 33, and enabling the limiting block 34 to rotate along a fixing block 35 and press the silicon wafers;
step two: an adjusting motor 8 is started, an output shaft of the adjusting motor 8 drives a first lead screw to rotate, the first lead screw drives a horizontal adjusting plate 7 to move towards a support frame 3, a driving motor 12 is started, an output shaft of the driving motor 12 drives a chamfering grinding sheet to rotate through two belt pulleys III and a belt III, an installation cylinder 18 is started, a piston rod of the installation cylinder 18 pushes a rotary joint 13 to rotate, the rotary joint 13 drives a rotary shaft rod 10 to rotate, the rotary shaft rod 10 drives a chamfering grinding sheet to rotate through a rotary seat 11, the rotary cylinder 4 is started, the rotary cylinder 4 drives a rotary supporting plate 2 to rotate, the rotary supporting plate 2 drives the chamfering grinding sheet to rotate through a shaft seat 9, the chamfering grinding sheet performs chamfering grinding on the side edge of a silicon wafer, then three limiting cylinders 33 are closed, a negative pressure suction cup on a wafer pushing block 31 adsorbs the silicon wafer and pulls the silicon wafer onto a turnover disc 25, a turnover motor 28 is started, an output shaft of the motor 28 drives the turnover disc 25 to rotate, the peripheral turntable 25 drives the silicon wafer to rotate 90 degrees, then the wafer pushing cylinder 30 continues to push the silicon wafer out through the wafer pushing block 31, and the steps are repeated to complete chamfering grinding of four sides of the silicon wafer;
step three: after chamfering and grinding the four sides of the silicon wafer, the moving motor 20 is started, an output shaft of the moving motor 20 drives a second lead screw to rotate, the second lead screw drives the silicon wafer storage box 22 to move to one side of the transposition frame 36, the silicon wafer is pushed out by the pushing block 31, the adsorption disc 39 adsorbs the pushed silicon wafer, the transposition motor 37 is started, an output shaft of the transposition motor 37 drives the hanging bracket 38 to horizontally move through the two belt pulleys II and the belt II, the hanging bracket 38 moves the silicon wafer to the position above the material receiving bin 40 through the adsorption disc 39, and the adsorption disc 39 puts the silicon wafer into the material receiving bin 40.
The foregoing is merely exemplary and illustrative of the present invention, and various modifications, additions and substitutions of the specific embodiments described herein may be made by those skilled in the art without departing from the scope of the utility model as defined in the accompanying claims.
Claims (9)
1. The silicon wafer chamfering and grinding equipment for processing the solar panel is characterized by comprising a rack (1), wherein a rotating supporting plate (2) and a supporting frame (3) are arranged on the rack (1), a mounting frame (6) is arranged on the rotating supporting plate (2), a horizontal adjusting plate (7) is arranged on the mounting frame (6), a shaft seat (9) is mounted on the horizontal adjusting plate (7), a rotating shaft rod (10) is arranged on the shaft seat (9), a rotating seat (11) is mounted on the rotating shaft rod (10), and chamfering and grinding pieces are arranged on the rotating seat (11);
a horizontal moving plate (19) is arranged on the support frame (3), a support seat (21) is arranged on the horizontal moving plate (19), a silicon wafer storage box (22) is arranged on the support seat (21), guide rollers (23) are respectively and rotatably arranged on the inner walls of two sides of the silicon wafer storage box (22), a peripheral rotating disc (25) is rotatably arranged in the inner cavity of the silicon wafer storage box (22), a wafer pushing cylinder (30) is arranged on the support seat (21), a wafer pushing block (31) is arranged at the end part of a piston rod of the wafer pushing cylinder (30), and a plurality of negative pressure suckers are arranged on the wafer pushing block (31);
support frame (3) one side is provided with transposition frame (36), be provided with gallows (38) on transposition frame (36), transposition frame (36) one side is provided with receipts feed bin (40), it is provided with material receiving plate (41) to slide in material receiving bin (40), be provided with material receiving cylinder (42) in rack (1), material receiving cylinder (42) tailpiece of the piston rod portion receives material plate (41) even.
2. The silicon wafer chamfering and grinding equipment for processing the solar panel according to claim 1, wherein a rotating cylinder (4) is installed at the top of the rack (1), the output end of the rotating cylinder (4) is connected with a rotating support plate (2), an arc-shaped guide rail (5) is installed at the top of the rack (1), and the rotating support plate (2) is in sliding connection with the arc-shaped guide rail (5).
3. The silicon wafer chamfering and grinding equipment for processing the solar panel as claimed in claim 1 or 2, wherein the mounting frame (6) is provided with an adjusting motor (8), the end part of an output shaft of the adjusting motor (8) is provided with a first lead screw, the first lead screw is in threaded connection with a level adjusting plate (7), and the level adjusting plate (7) is in sliding connection with the mounting frame (6) through a sliding block and a sliding rail.
4. The silicon wafer chamfering and grinding equipment for processing the solar panel according to claim 3, wherein a driving motor (12) is arranged on the rotating base (11), and an output shaft of the driving motor (12) is in transmission connection with the chamfering and grinding sheet through two belt pulleys III and a belt III.
5. The silicon wafer chamfering and grinding equipment for processing the solar panel according to claim 2 or 4, characterized in that a rotary joint (13) is installed on the rotary shaft rod (10), a guide wheel (14) is installed at one end of the rotary joint (13), a side plate (16) is installed at one side of the shaft seat (9), a right-angle block (15) is arranged on the side plate (16) in a sliding mode, a waist-shaped hole is formed in the right-angle block (15), the guide wheel (14) is movably installed in the waist-shaped hole, a supporting plate (17) is arranged below the side plate (16), an installation cylinder (18) is arranged on the supporting plate (17) in a rotating mode, and one end, far away from the guide wheel (14), of the rotary joint (13) is rotatably connected with the end portion of a piston rod of the installation cylinder (18).
6. The silicon wafer chamfering and grinding device for processing the solar panel according to claim 5, wherein a moving motor (20) is arranged on the support frame (3), a second lead screw is mounted at the end of an output shaft of the moving motor (20), the second lead screw is in threaded connection with the horizontal moving plate (19), and the horizontal moving plate (19) is in sliding connection with the support frame (3) through a sliding block and a sliding rail.
7. The silicon wafer chamfering and grinding equipment for processing the solar panel according to claim 6, wherein two guiding motors (24) are symmetrically installed on the inner walls of two sides of the silicon wafer storage box (22), the two guiding motors (24) correspond to the two guiding rollers (23) one by one, and the output shafts of the guiding motors (24) are in transmission connection with the guiding rollers (23) through two belt pulleys I and a belt.
8. The silicon wafer chamfering and grinding equipment for processing the solar panel as claimed in claim 6 or 7, wherein two jacking cylinders (26) are installed in the inner cavity of the supporting seat (21), the end parts of piston rods of the two jacking cylinders (26) are connected with a lifting plate (27), a turnover motor (28) is arranged between the two jacking cylinders (26), an output shaft of the turnover motor (28) penetrates through the lifting plate (27) and is connected with the bottom of the turnover disc (25), a plurality of guide wheels (29) are arranged on the lifting plate (27) in an equal radian manner, and the guide wheels (29) are in contact with the lower surface of the turnover disc (25).
9. The silicon wafer chamfering and grinding device for processing the solar panel according to claim 8, wherein a wafer pushing cavity (32) is arranged at the bottom of the wafer storing box (22), two sides of the wafer pushing cavity (32) penetrate through the wafer storing box (22), three limiting cylinders (33) and three fixing blocks (35) are arranged on the outer wall of the same side of the wafer storing box (22), a limiting block (34) is rotatably arranged at the end part of a piston rod of each limiting cylinder (33), the three limiting blocks (34) correspond to the three fixing blocks (35) in a one-to-one manner, the limiting blocks (34) are rotatably connected with the fixing blocks (35), a transposition motor (37) is arranged on the transposition frame (36), two belt pulleys (II) are rotatably arranged on the transposition frame (36), the two belt pulleys are in transmission connection through the belt II, and the hanger (38) is connected with the belt II through a belt clamp, an adsorption disc (39) is mounted on the hanging bracket (38).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121912232.6U CN215547470U (en) | 2021-08-16 | 2021-08-16 | Silicon wafer chamfering and grinding equipment for processing solar panel |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121912232.6U CN215547470U (en) | 2021-08-16 | 2021-08-16 | Silicon wafer chamfering and grinding equipment for processing solar panel |
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| Publication Number | Publication Date |
|---|---|
| CN215547470U true CN215547470U (en) | 2022-01-18 |
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| CN202121912232.6U Expired - Fee Related CN215547470U (en) | 2021-08-16 | 2021-08-16 | Silicon wafer chamfering and grinding equipment for processing solar panel |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117226704A (en) * | 2023-11-14 | 2023-12-15 | 四川禾牧机械制造有限公司 | Monocrystalline silicon piece grinding chamfering device and method |
-
2021
- 2021-08-16 CN CN202121912232.6U patent/CN215547470U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117226704A (en) * | 2023-11-14 | 2023-12-15 | 四川禾牧机械制造有限公司 | Monocrystalline silicon piece grinding chamfering device and method |
| CN117226704B (en) * | 2023-11-14 | 2024-02-09 | 四川禾牧机械制造有限公司 | Monocrystalline silicon piece grinding chamfering device and method |
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