CN215523170U

CN215523170U - COB packaging structure of light-emitting semiconductor

Info

Publication number: CN215523170U
Application number: CN202122217388.9U
Authority: CN
Inventors: 周朝彬
Original assignee: Shenzhen Shangzheng Lighting Co ltd
Current assignee: Shenzhen Shangzheng Lighting Co ltd
Priority date: 2021-09-14
Filing date: 2021-09-14
Publication date: 2022-01-14
Anticipated expiration: 2031-09-14

Abstract

The utility model discloses a COB packaging structure of a light-emitting semiconductor, which comprises a packaging box, wherein both sides of the inner bottom end of the packaging box are fixedly connected with refraction astigmatic lenses which are in an inclined shape, both sides of the outer part of the lower end of the packaging box are provided with a plurality of through holes at equal intervals, the inner parts of the through holes are fixedly connected with light distribution lenses, both sides of the outer part of the upper end of the packaging box are provided with a plurality of heat dissipation holes at equal intervals, the inner part of the packaging box is fixedly connected with a servo motor, and a half gear, the servo motor, a first rack, a second rack and a swing rod are arranged to be mutually matched, so that the purpose that the half gear drives a slide rail through a gear transmission rack and drives a driven gear corresponding to the second rack to drive the swing rod to swing back and forth through the gear transmission rack is realized, the effect of reciprocating swing of a light-emitting chip is realized, the effect of continuously changing a projection point is realized, and the mode of fixing a single irradiation angle of the traditional light-emitting chip is changed, the irradiation range and the ornamental value are enlarged.

Description

COB packaging structure of light-emitting semiconductor

Technical Field

The utility model relates to an LED packaging technology, in particular to a COB packaging structure of a light-emitting semiconductor.

Background

COB (chip On board) chip-On-board packaging technology is that the surface of a substrate is covered with a silicon chip mounting point by using heat-conducting epoxy resin (generally epoxy resin doped with silver particles), then a silicon chip is mounted On the surface of the substrate, the silicon chip is firmly fixed On the substrate through heat treatment, and then the electrical connection is indirectly established between the silicon chip and the substrate by using a wire bonding method.

At present, in order to reduce the production cost of LED high-power devices in the market, the scheme of integrating LED small chips is adopted. In various technical routes of small integrated chips, chip on board (COB for short) packaging technology is becoming a technical hotspot for development and application, and the technology is widely applied to indoor LED lighting fixtures at present.

Because the LED chip is packaged in the packaging box in a fixed form, the irradiation point is single, the irradiation range is limited, the ornamental value is poor, the interior of the packaging box is heated when being subjected to external factors and power consumption, heat cannot be dissipated, and the light-emitting chip is easy to damage by cooling water generated by self-cooling, so that the service life is short.

SUMMERY OF THE UTILITY MODEL

In order to overcome the defects of the prior art, an object of the present invention is to provide a COB package structure of a light emitting semiconductor.

One of the purposes of the utility model is realized by adopting the following technical scheme: light emitting semiconductor's COB packaging structure, including the packaging box, the equal fixedly connected with refraction astigmatic mirror in the inside bottom both sides of packaging box, and refraction astigmatic mirror are the slope form, a plurality of through-hole has been seted up to the equal equidistance in the outside both sides of lower extreme of packaging box, and the inside fixedly connected with light distribution mirror of through-hole, a plurality of louvre has been seted up to the equal equidistance in the outside both sides in upper end of packaging box, the inside fixedly connected with servo motor of packaging box.

Further, servo motor's output fixedly connected with semi-gear, the spout has been seted up to the top inner wall of encapsulation case, and the inside sliding connection of spout has slider two to the bottom fixedly connected with montant of slider two, the bottom fixedly connected with slide rail of montant, and the inner wall dislocation fixedly connected with rack one respectively about the slide rail to rack one is connected with the meshing of semi-gear.

Furthermore, the bottom end of the sliding rail is fixedly connected with a second rack in an external mode, a driven gear is meshed with the second rack in an external gear mode, a swing rod is fixedly connected to the front face of the driven gear, and a light emitting chip is fixedly connected to the bottom end of the swing rod.

Furthermore, the equal fixedly connected with branch in outside both sides of slide rail, and the terminal inner wall fixedly connected with slider one of branch, the equal activity in inner wall both sides of encapsulation case has cup jointed the connecting rod, and the terminal fixedly connected with cylinder piece of connecting rod to reciprocal rail groove has been seted up to the outside of cylinder piece, slider one passes through branch and reciprocal rail groove sliding connection, the outside fixedly connected with flabellum of connecting rod.

Furthermore, the slide rail forms a reciprocating translation structure with the packaging box through a half gear and a rack I, and the slide block II forms a reciprocating sliding structure with the sliding groove through the slide rail and a vertical rod.

Furthermore, a reciprocating gear transmission structure is formed between the rack two-way and the driven gear through the slide rail, and a swing structure is formed between the swing rod and the packaging box through the driven gear.

Furthermore, the first sliding block and the reciprocating rail groove form a reciprocating sliding structure through the sliding rail and the supporting rod, and the cylindrical block and the packaging box form a rotating structure through the reciprocating rail groove and the first sliding block.

Compared with the prior art, the utility model has the beneficial effects that:

1. through setting up half gear, servo motor, rack one, rack two and pendulum rod and mutually supporting, realize that half gear passes through the gear drive rack and drives slide rail and the corresponding gear drive driven gear of rack two and drive the reciprocal wobbling purpose of pendulum rod to reach the reciprocal wobbling effect of luminous chip, reach the effect of constantly changing the projection point, thereby change the fixed single mode of shining the angle of traditional luminous chip, enlarge irradiation range and sight.

2. Through setting up refraction astigmatic mirror, light distribution mirror and through-hole and mutually supporting, realize that the swing of light-emitting chip penetrates light spot to refraction astigmatic mirror and refracts, passes through the light distribution mirror again and demonstrates sheen to outside purpose through the through-hole to reach light-emitting chip and change and penetrate the effect of light dazzling and shine single point directly, avoid light-emitting chip to penetrate the problem emergence of shining dazzling sight difference directly, the practicality is higher.

3. Through setting up branch, slider one, cylinder piece, flabellum and connecting rod and mutually supporting for slider one is through at reciprocal rail groove reciprocating slide, thereby realizes that the cylinder piece drives connecting rod and flabellum synchronous revolution's purpose, thereby reaches the effect of carrying out the heat dissipation with the electric heat degree to the encapsulation incasement, plays the life of extension encapsulation case and luminescence chip, has the security.

The foregoing description is only an overview of the technical solutions of the present invention, and in order to make the technical means of the present invention more clearly understood, the present invention may be implemented in accordance with the content of the description, and in order to make the above and other objects, features, and advantages of the present invention more clearly understood, the following preferred embodiments are described in detail with reference to the accompanying drawings.

Drawings

FIG. 1 is a sectional view of the present embodiment;

FIG. 2 is an enlarged view of the embodiment at A;

fig. 3 is an enlarged view of the embodiment at B.

In the figure: 1. packaging the box; 2. a through hole; 3. a light distribution mirror; 4. a refractive astigmatic lens; 5. a light emitting chip; 6. heat dissipation holes; 7. a servo motor; 8. a half gear; 9. a first rack; 10. a slide rail; 11. a second rack; 12. a driven gear; 13. a swing rod; 14. a connecting rod; 15. a fan blade; 16. a cylindrical block; 17. a reciprocating rail groove; 18. a first sliding block; 19. a strut; 20. a chute; 21. a vertical rod; 22. and a second sliding block.

Detailed Description

The present invention will be further described with reference to the accompanying drawings and the detailed description, and it should be noted that any combination of the embodiments or technical features described below can be used to form a new embodiment without conflict.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When a component is referred to as being "connected" to another component, it can be directly connected to the other component or intervening components may also be present. When a component is referred to as being "disposed on" another component, it can be directly on the other component or intervening components may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the utility model herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Referring to fig. 1 to 3, the COB package structure of the light emitting semiconductor of this embodiment includes a package box 1, a refraction astigmatic lens 4 is fixedly connected to both sides of an inner bottom end of the package box 1, the refraction astigmatic lens 4 is inclined, a plurality of through holes 2 are equidistantly formed on both sides of an outer bottom end of the package box 1, a light distribution lens 3 is fixedly connected to an inner portion of the through holes 2, a plurality of heat dissipation holes 6 are equidistantly formed on both sides of an outer upper end of the package box 1, a servo motor 7 is fixedly connected to an inner portion of the package box 1, a half gear 8 is fixedly connected to an output end of the servo motor 7, a sliding groove 20 is formed on an inner wall of a top end of the package box 1, a sliding block two 22 is slidably connected to an inner portion of the sliding groove 20, a vertical rod 21 is fixedly connected to a bottom end of the sliding block two 22, a sliding rail 10 is fixedly connected to a bottom end of the vertical rod 21, and a rack one 9 is fixedly connected to an upper inner wall and a lower wall of the sliding rail 10 in a staggered manner, the rack I9 is in gear engagement connection with the half gear 8, the slide rail 10 forms a reciprocating translation structure with the packaging box 1 through the half gear 8 and the rack I9, the slide block II 22 forms a reciprocating sliding structure with the slide groove 20 through the slide rail 10 and the vertical rod 21, the rack II 11 is fixedly connected to the outer portion of the bottom end of the slide rail 10, the driven gear 12 is in gear engagement connection with the outer portion of the rack II 11, the swing rod 13 is fixedly connected to the front side of the driven gear 12, the reciprocating gear transmission structure is formed between the slide rail 10 and the driven gear 12 through the rack II 11, the swing rod 13 forms a swing structure with the packaging box 1 through the driven gear 12, the bottom end of the swing rod 13 is fixedly connected with the light emitting chip 5, the half gear 8 drives the slide rail 10 and the gear 12 corresponding to the rack II 11 through the gear transmission rack I9 to drive the swing rod 13 to reciprocate, so as to achieve the effect of reciprocating swing of the light emitting chip 5, the function of continuously changing the projection point is achieved, so that the mode of fixing a single illumination angle by the traditional light-emitting chip 5 is changed, and the illumination range and the ornamental value are enlarged.

The outer two sides of the sliding rail 10 are fixedly connected with supporting rods 19, the inner wall of the tail end of each supporting rod 19 is fixedly connected with a first sliding block 18, the first sliding blocks 18 form a reciprocating sliding structure through the sliding rail 10 and the supporting rods 19 and a reciprocating rail groove 17, a cylindrical block 16 forms a rotating structure through the reciprocating rail groove 17 and the first sliding blocks 18 and the packaging box 1, the two sides of the inner wall of the packaging box 1 are movably sleeved with connecting rods 14, the tail end of each connecting rod 14 is fixedly connected with a cylindrical block 16, the outer portion of the cylindrical block 16 is provided with the reciprocating rail groove 17, the first sliding blocks 18 are slidably connected with the reciprocating rail groove 17 through the supporting rods 19, the first sliding blocks 14 are fixedly connected with fan blades 15 through reciprocating sliding in the reciprocating rail grooves 17, the purpose that the cylindrical block 16 drives the connecting rods 14 and the fan blades 15 to synchronously rotate is achieved, the effect of dissipating heat of electric heat in the packaging box 1 is achieved, and the service lives of the packaging box 1 and the light-emitting chips 5 are prolonged, has the guarantee.

The working principle is as follows: when the device is used, the servo motor 7 is started, so that the servo motor 7 drives the half gear 8 to rotate, the half gear 8 drives the slide rail 10 and the rack II 11 to synchronously reciprocate through the corresponding reciprocating translation motion of the gear transmission rack I9, the rack I9 drives the slide block II 22 to horizontally limit and reciprocate in the chute 20 through the vertical rod 21, the slide rail 10 drives the slide block II 22 to horizontally limit and reciprocate in the chute 20, the driven gear 12 corresponding to the rack II 11 drives the swing rod 13 and the light-emitting chip 5 to reciprocate leftwards and rightwards, the swing of the light-emitting chip 5 refracts a single light spot through the refraction diffuser 4 to form more irradiation points, the irradiation points are refracted to the side wall of the packaging box 1 through different swinging angles of the light-emitting chip 5, the soft light is diffused through the through hole 2 after being diffused by the light-diffusing mirror 3, and the irradiation light source is radiated by movable soft light with multiple points and multiple angles, improve the ornamental value and enlarge the illumination range.

The above embodiments are only preferred embodiments of the present invention, and the protection scope of the present invention is not limited thereby, and any insubstantial changes and substitutions made by those skilled in the art based on the present invention are within the protection scope of the present invention.

Claims

1. Luminescent semiconductor's COB packaging structure, including encapsulation case (1), its characterized in that: the utility model discloses a packaging box, including packaging box (1), the equal fixedly connected with refraction astigmatic mirror (4) in inside bottom both sides of packaging box (1), and refraction astigmatic mirror (4) are the slope form, a plurality of through-hole (2) have been seted up to the equal equidistance in the outside both sides of lower extreme of packaging box (1), and the inside fixedly connected with light distribution mirror (3) of through-hole (2), a plurality of louvre (6) have been seted up to the equal equidistance in the outside both sides of upper end of packaging box (1), the inside fixedly connected with servo motor (7) of packaging box (1).

2. The COB package structure of light-emitting semiconductor of claim 1, wherein: output fixedly connected with semi-gear (8) of servo motor (7), spout (20) have been seted up to the top inner wall of encapsulation case (1), and the inside sliding connection of spout (20) has two (22) of slider to the bottom fixedly connected with montant (21) of two (22) of slider, the bottom fixedly connected with slide rail (10) of montant (21), and slide rail (10) upper and lower inner wall dislocation fixedly connected with rack (9) respectively to rack (9) are connected with semi-gear (8) gear engagement.

3. The COB package structure of light-emitting semiconductor of claim 2, wherein: the bottom end of the sliding rail (10) is fixedly connected with a second rack (11) in an external mode, a driven gear (12) is meshed with an external gear of the second rack (11), a swing rod (13) is fixedly connected to the front face of the driven gear (12), and a light-emitting chip (5) is fixedly connected to the bottom end of the swing rod (13).

4. The COB package structure of light-emitting semiconductor of claim 2, wherein: the utility model discloses a packaging box, including slide rail (10), the equal fixedly connected with branch (19) in outside both sides of slide rail (10), and the terminal inner wall fixedly connected with slider (18) of branch (19), connecting rod (14) have all been cup jointed in the equal activity of inner wall both sides of packaging box (1), and the terminal fixedly connected with cylinder piece (16) of connecting rod (14) to reciprocal rail groove (17) have been seted up to the outside of cylinder piece (16), slider (18) are through branch (19) and reciprocal rail groove (17) sliding connection, the outside fixedly connected with flabellum (15) of connecting rod (14).

5. The COB package structure of light-emitting semiconductor of claim 2, wherein: the sliding rail (10) forms a reciprocating translation structure with the packaging box (1) through a half gear (8) and a rack I (9), and the sliding block II (22) forms a reciprocating sliding structure with the sliding groove (20) through the sliding rail (10) and a vertical rod (21).

6. The COB package structure of a light emitting semiconductor of claim 3, wherein: the second rack (11) and the driven gear (12) form a reciprocating gear transmission structure through the sliding rail (10), and the swing rod (13) and the packaging box (1) form a swing structure through the driven gear (12).

7. The COB package structure of a light emitting semiconductor of claim 4, wherein: the first sliding block (18) and the reciprocating rail groove (17) form a reciprocating sliding structure through the sliding rail (10) and the support rod (19), and the cylindrical block (16) and the packaging box (1) form a rotating structure through the reciprocating rail groove (17) and the first sliding block (18).