CN215499707U - Multilayer circuit board with water-cooling function - Google Patents
Multilayer circuit board with water-cooling function Download PDFInfo
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- CN215499707U CN215499707U CN202120521542.9U CN202120521542U CN215499707U CN 215499707 U CN215499707 U CN 215499707U CN 202120521542 U CN202120521542 U CN 202120521542U CN 215499707 U CN215499707 U CN 215499707U
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- Prior art keywords
- water
- heat dissipation
- circuit board
- multilayer circuit
- claw
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- 238000001816 cooling Methods 0.000 title claims abstract description 26
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 68
- 230000017525 heat dissipation Effects 0.000 claims abstract description 33
- 239000000758 substrate Substances 0.000 claims abstract description 28
- 210000000078 claw Anatomy 0.000 claims abstract description 22
- 238000005086 pumping Methods 0.000 claims description 7
- 239000000428 dust Substances 0.000 claims description 2
- 238000010276 construction Methods 0.000 claims 1
- 239000000498 cooling water Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 230000036760 body temperature Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Images
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a multilayer circuit board with a water cooling function, which comprises substrates, wherein each substrate is provided with a main control chip and is provided with a plurality of through holes; the fastener is of an integrated structure and comprises a first column part and a claw part. The first column part is used for being sleeved with the through hole, and the wall surface of the first column part is provided with a circle of buckling grooves; the claw part is connected with the first column part and provided with a step at the joint, the claw part can be sleeved outside the first column part and is buckled and fixed, and the claw opening of the claw part is abutted against the substrate; two pipe connectors are also arranged on the substrate, and both the two pipe connectors penetrate through two surfaces of the substrate; the multilayer circuit board further comprises a water-cooling heat dissipation system. The multilayer circuit board adopts a water-cooling heat dissipation system to dissipate heat, and the water-cooling heat dissipation system is formed into a water loop structure by a water tank, a water pump, a heat dissipation pipeline, a plurality of water guide pipes, a plurality of pipe connectors and a plurality of spiral pipes, so that a high-efficiency heat dissipation effect is achieved.
Description
Technical Field
The utility model relates to a circuit board, in particular to a multilayer circuit board with a water cooling function.
Background
The name of the circuit board is: ceramic circuit board, alumina ceramic circuit board, aluminum nitride ceramic circuit board, multilayer circuit board body, PCB board, aluminium base board, high frequency board, thick copper board, impedance board, PCB, ultra-thin multilayer circuit board body, ultra-thin circuit board, printed (copper etching technology) circuit board etc..
The circuit board makes the circuit miniaturized, direct-viewing, play an important role to fixed circuit's batch production and optimize electrical apparatus overall arrangement, and the circuit board can be called printed multilayer circuit board main part or printed wiring board.
When the multilayer circuit board main part is in use, because the main control chip in the multilayer circuit board main part can produce a large amount of heat at the during operation, lead to multilayer circuit board main part body temperature to rise, and multilayer circuit board main part body temperature rises, can lead to the partial damage of multilayer circuit board main part internals, improves cost of maintenance.
Therefore, it is necessary to add a heat sink to the multilayer wiring board.
SUMMERY OF THE UTILITY MODEL
Aiming at the defects in the prior art, the technical problem to be solved by the utility model is to provide the multilayer circuit board with the water cooling function, the multilayer circuit board is designed to improve the service life of a main control chip by radiating the main control chip, and the substrates are connected through a fastener, so that the installation efficiency is high.
In order to solve the technical problem, the utility model is realized by the following scheme: the multilayer circuit board with the water cooling function comprises substrates, wherein each substrate is provided with a main control chip and is provided with a plurality of through holes, and the multilayer circuit board further comprises a fastener for connecting two substrates which are adjacent up and down;
the eye-splice formula structure as an organic whole includes:
the first column part is used for being sleeved with the through hole, and the wall surface of the first column part is provided with a circle of buckling grooves;
the claw part is connected with the first column part and provided with a step at the joint, the claw part can be sleeved outside the first column part and is fastened and fixed, and a claw opening of the claw part is abutted against the substrate;
the base plate is also provided with two pipe connectors, and the two pipe connectors penetrate through two surfaces of the base plate;
the multilayer circuit board further comprises a water-cooling heat dissipation system, and the water-cooling heat dissipation system comprises:
each main control chip is provided with a cover piece, the cover piece is arranged on the substrate and covers the main control chip, the cover piece is provided with a second column part, a column cavity with an upper opening is arranged in the second column part, and a spiral groove is arranged in the column cavity;
each cover part is provided with a spiral pipe, the spiral pipes are screwed in the spiral grooves, and the spiral pipes form a pipeline connected in series through a water guide pipe and a pipe connector;
the air cooling device is provided with a fan mounting frame and a fan, wherein the fan is mounted in the fan mounting frame, a water pumping device is mounted on the side part of the fan mounting frame, a heat dissipation pipeline is mounted at an air outlet of the fan mounting frame, a water pump is arranged in the water pumping device, the water inlet end of the water pump is connected with a water tank, the water outlet end of the water pump is connected to the heat dissipation pipeline, and the water tank, the water pump, the heat dissipation pipeline, a plurality of water guide pipes, a plurality of pipe connectors and a plurality of spiral pipes form a water loop structure.
Furthermore, the claw part is a cylinder with a one-way opening and is provided with a plurality of strip-shaped notches in the radial direction of the cylinder.
Furthermore, a boss is arranged on the inner side of the claw part and can be buckled into the buckling groove.
Furthermore, the air outlet end cover of the fan mounting rack is provided with a dustproof mesh enclosure.
Compared with the prior art, the utility model has the beneficial effects that: the multilayer circuit board adopts a water-cooling heat dissipation system to dissipate heat, the water-cooling heat dissipation system is in a water loop structure formed by a water tank, a water pump, a heat dissipation pipeline, a plurality of water guide pipes, a plurality of pipe connectors and a plurality of spiral pipes, the water pump pumps water to circulate water in the whole loop, the water in the spiral pipes absorbs heat of a main control chip, hot water is pumped into the heat dissipation pipeline through the water pump, the heat dissipation pipeline is cooled by a fan, and then the hot water in the heat dissipation pipeline is cooled and returns to the spiral pipes.
The eye-splice spare can splice each layer base plate fast, improves the installation effectiveness.
Drawings
FIG. 1 is a schematic view of a mounting structure of a multilayer wiring board of the present invention.
Fig. 2 is a schematic structural view of the water-cooling heat dissipation system of the present invention.
FIG. 3 is a schematic view showing the connection between the water pump and the heat dissipation pipeline and the water tank.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, and thus the protection scope of the present invention is more clearly and clearly defined. It should be apparent that the described embodiments of the present invention are only some embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; the two elements may be directly connected or indirectly connected through an intermediate medium, or may be communicated with each other inside the two elements, or may be wirelessly connected or wired connected. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In addition, the technical features involved in the different embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.
Example 1, the specific structure of the present invention is as follows:
referring to fig. 1-3, the multilayer circuit board with water cooling function of the present invention comprises substrates 1, each substrate 1 is provided with a main control chip 12, each substrate 1 is provided with a plurality of via holes, and the multilayer circuit board further comprises a fastener 2 for connecting two substrates 1 adjacent to each other up and down;
the eye-splice 2 formula structure as an organic whole includes:
the first column part 21 is used for being sleeved with a through hole, and the wall surface of the first column part is provided with a ring of buckle grooves 22;
a claw portion 23 connected to the first column portion 21 and having a step at a connection position, wherein the claw portion 23 can be fitted to the outside of the first column portion 21 and fastened and fixed, and a claw opening thereof abuts against the substrate 1;
the base plate 1 is also provided with two pipe connectors 11, and the two pipe connectors 11 penetrate through two surfaces of the base plate 1;
the multilayer circuit board further comprises a water-cooling heat dissipation system, and the water-cooling heat dissipation system comprises:
a plurality of cover members 49, each main control chip 12 is provided with a cover member 49, the cover member 49 is arranged on the substrate 1 and covers the main control chip 12, the cover member 49 is provided with a second column part 411, a column cavity with an upper opening is arranged in the second column part 411, and a spiral groove is arranged in the column cavity;
a plurality of spiral pipes 41, each cover 49 is provided with a spiral pipe 41, the spiral pipes 41 are screwed in the spiral grooves, and each spiral pipe 41 forms a pipeline in series through a water guide pipe 56 and a pipe connector 11;
the air cooling device is provided with a fan mounting frame 58 and a fan, wherein the fan is mounted on the fan mounting frame 58, a water pumping device 57 is mounted on the side portion of the fan mounting frame 58, a heat dissipation pipeline 55 is mounted at an air outlet of the water pumping device, a water pump 53 is arranged in the water pumping device 57, the water inlet end of the water pump 53 is connected with a water tank 52, the water outlet end of the water pump is connected to the heat dissipation pipeline 55, and the water tank 52, the water pump 53, the heat dissipation pipeline 55, a plurality of water guide pipes 56, a plurality of pipe connectors 11 and a plurality of spiral pipes 41 form a water loop structure.
A preferred technical solution of this embodiment: the claw part 23 is a cylindrical strip-shaped notch with a unidirectional opening and a plurality of cylindrical radial directions.
A preferred technical solution of this embodiment: a boss 24 is provided inside the claw portion 23, and the boss 24 can be engaged with the engaging groove 22.
A preferred technical solution of this embodiment: the air outlet end of the fan mounting frame 58 is covered with a dust screen 59.
Example 2:
as shown in fig. 1 to 3, when the main control chip 12 on each substrate 1 operates, a large amount of heat is emitted. The cover member 49 is made of aluminum, which has good heat conductivity. A large amount of heat is conducted to the cover member 49, the cover member 49 conducts the heat to the coil 41, the water in the coil 41 is heated by the cooling water, the water pump 53 is operated, and the heated water is introduced into the water tank 52 through the water pipe and then is introduced into the heat radiating pipe 55 by the water pump 53.
The fan works, and the fan blows to the heat dissipation pipeline 55 to cool the heat dissipation pipeline 55, and after the heat dissipation pipeline 55 is cooled, the hot water in the heat dissipation pipeline is cooled to form cooling water, and the cooling water flows back to the spiral pipe 41 to achieve the purpose of high-efficiency heat dissipation.
Example 3:
through holes are formed in four corners of a substrate 1, 4 fasteners 2 penetrate through the through holes from lower openings of the through holes, a first column portion 21 is exposed on the upper side of the through holes, and then the 4 fasteners 2 on the first substrate 1 are fastened into the 4 fasteners 2.
The second substrate 2 is directly placed on the upper fastener 2, and 4 fasteners are fastened on the second group of fasteners 2. And a third substrate 2 is placed.
The above operation cycles can continuously increase the base plate and the inserting fastener. A plurality of substrates 1 are formed into a multilayer wiring board.
The above description is only a preferred embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes, which are made by using the contents of the present specification and the accompanying drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (4)
1. A multilayer circuit board with a water cooling function comprises substrates (1), wherein each substrate (1) is provided with a main control chip (12) and each substrate (1) is provided with a plurality of through holes, and the multilayer circuit board is characterized by further comprising a fastener (2) for connecting two substrates (1) which are adjacent up and down;
eye-splice spare (2) formula structure as an organic whole includes:
the first column part (21) is used for being sleeved with the through hole, and the wall surface of the first column part is provided with a ring of buckle grooves (22);
the claw part (23) is connected with the first column part (21) and is provided with a step at the connection part, the claw part (23) can be sleeved outside the first column part (21) and is buckled and fixed, and the claw opening of the claw part is abutted against the base plate (1);
the base plate (1) is also provided with two pipe connectors (11), and the two pipe connectors (11) penetrate through two surfaces of the base plate (1);
the multilayer circuit board further comprises a water-cooling heat dissipation system, and the water-cooling heat dissipation system comprises:
the main control chip comprises a plurality of cover pieces (49), each main control chip (12) is provided with one cover piece (49), the cover pieces (49) are arranged on the substrate (1) and cover the main control chip (12), each cover piece (49) is provided with a second column part (411), a column cavity with an upper opening is arranged in each second column part (411), and a spiral groove is arranged in each column cavity;
a plurality of spiral pipes (41), wherein each cover piece (49) is provided with one spiral pipe (41), the spiral pipes (41) are screwed in the spiral grooves, and the spiral pipes (41) form a pipeline in series through a water guide pipe (56) and a pipe connector (11);
air cooling device has fan mounting bracket (58), fan, the fan install in fan mounting bracket (58), pumping device (57) are installed to fan mounting bracket (58) lateral part, and heat dissipation pipeline (55) are installed to its air outlet, pumping device (57) embeds there is water pump (53), the end of intaking of water pump (53) is connected with water tank (52), and its play water end is connected to heat dissipation pipeline (55), water tank (52), water pump (53), heat dissipation pipeline (55), many aqueducts (56), a plurality of pipe connector (11) and a plurality of spiral pipe (41) form water loop construction.
2. The multilayer wiring board with water cooling function according to claim 1, wherein the claw portion (23) is a cylindrical notch having a unidirectional opening and a plurality of cylindrical radial strip-shaped notches.
3. The multilayer wiring board with a water cooling function according to claim 2, wherein a boss (24) is provided inside the claw portion (23), and the boss (24) can be fitted into the catch groove (22).
4. The multilayer circuit board with the water cooling function as claimed in claim 1, wherein the air outlet end of the fan mounting bracket (58) is covered with a dust screen (59).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120521542.9U CN215499707U (en) | 2021-03-12 | 2021-03-12 | Multilayer circuit board with water-cooling function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120521542.9U CN215499707U (en) | 2021-03-12 | 2021-03-12 | Multilayer circuit board with water-cooling function |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215499707U true CN215499707U (en) | 2022-01-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120521542.9U Active CN215499707U (en) | 2021-03-12 | 2021-03-12 | Multilayer circuit board with water-cooling function |
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| Country | Link |
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| CN (1) | CN215499707U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114466507A (en) * | 2022-01-13 | 2022-05-10 | 龙宇电子(梅州)有限公司 | A heat dissipation function device for a multilayer circuit board |
-
2021
- 2021-03-12 CN CN202120521542.9U patent/CN215499707U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114466507A (en) * | 2022-01-13 | 2022-05-10 | 龙宇电子(梅州)有限公司 | A heat dissipation function device for a multilayer circuit board |
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