CN215472908U - An injection molding machine cooling device - Google Patents
An injection molding machine cooling device Download PDFInfo
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- CN215472908U CN215472908U CN202121795602.2U CN202121795602U CN215472908U CN 215472908 U CN215472908 U CN 215472908U CN 202121795602 U CN202121795602 U CN 202121795602U CN 215472908 U CN215472908 U CN 215472908U
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- injection molding
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Abstract
The utility model discloses a cooling device of an injection molding machine, which comprises a bottom plate and a cooling plate, wherein a refrigerator is fixed on the upper surface of the bottom plate, a cooling channel is formed in the refrigerator, and the top end and the bottom end of the cooling channel are respectively a liquid inlet and a liquid outlet. The cooling plate is arranged at the injection port, the cooling plate and the interior of the refrigerator are jointly circulated with cooling liquid, the cooling liquid cools a plastic product when passing through the cooling plate, the cooling liquid is heated and then returns to the interior of the refrigerator to be cooled again, and the heated cooling liquid can be rapidly refrigerated under the action of the semiconductor refrigerating sheet and the cooling fan. In addition, the filter box and the filter screen are arranged, so that dirt in the cooling liquid can be filtered, and the cooling effect of the cooling device is prevented from being reduced.
Description
Technical Field
The utility model relates to the technical field of injection molding machines, in particular to a cooling device of an injection molding machine.
Background
An injection moulding machine, also known as an injection moulding machine or an injection machine, is a main moulding device for making thermoplastic plastics or thermosetting plastics into plastic products with various shapes by using a plastic moulding mould, and is divided into a vertical type, a horizontal type and an all-electric type, wherein the injection moulding machine can heat the plastics and apply high pressure to the molten plastics to ensure that the molten plastics are injected to fill a mould cavity, the injection moulding machine needs to be matched with a cooling device for production in the process of producing the plastic products, and the cooling device can cool the plastics at the mould so as to be convenient for fast demoulding of the plastic products.
Most of the existing cooling devices cool the grinding tool by using circulating water or cooling liquid, which requires that the cooling device is large enough to completely cool the circulating water and the cooling liquid and then send the cooled circulating water and the cooling liquid to the mold to cool the plastic product, while the existing cooling devices can not completely cool the heat-exchanged water or cooling liquid and then send the cooled circulating water and cooling liquid to the mold again to cool the plastic product, and after the existing cooling devices are used for a long time, the cooling effect is reduced. In addition, after water or cooling liquid in the existing cooling device circulates for a long time, water scale can appear in the cooling device, and the cooling effect can be affected, so that the utility model provides the cooling device for the injection molding machine.
Disclosure of Invention
The utility model aims to solve the defects in the prior art and provides a cooling device of an injection molding machine.
In order to achieve the purpose, the utility model adopts the following technical scheme: a cooling device of an injection molding machine comprises a bottom plate and a cooling plate, wherein a refrigerator is fixed on the upper surface of the bottom plate, a cooling channel is arranged in the refrigerator, the top end and the bottom end of the cooling channel are respectively provided with a liquid inlet and a liquid outlet, the cooling plate is internally provided with a heat exchange channel, the top end and the bottom end of the heat exchange channel are respectively provided with a liquid outlet and a liquid inlet, the top end of the side wall of the refrigerator is provided with a filter box, one side of the upper surface of the bottom plate is fixed with a pump body, the liquid inlet end and the liquid outlet end of the pump body are respectively connected with a liquid suction pipe and a second connecting pipe, the cooling plate middle part has been seted up the hole of moulding plastics, the refrigerator lateral wall is equipped with a plurality of semiconductor refrigeration pieces, and is a plurality of one side that the refrigerator was kept away from to the semiconductor refrigeration piece all is connected with a plurality of heat dissipation grid tray, and is a plurality of one side that the semiconductor refrigeration piece was kept away from to the heat dissipation grid tray is connected with the connecting plate jointly, one side that the heat dissipation grid tray was kept away from to the connecting plate is equipped with radiator fan.
Furthermore, the cooling channel and the heat exchange channel are both in S-shaped design, and cooling liquid is arranged inside the cooling channel and the heat exchange channel together.
Furthermore, the filter box is communicated with a liquid inlet of the cooling channel, one side, away from the refrigerator, of the filter box is connected with a first connecting pipe, one end, away from the filter box, of the first connecting pipe is communicated with a liquid outlet of the heat exchange channel, the liquid inlet of the heat exchange channel is communicated with a second connecting pipe, and one end, away from the pump body, of the liquid pumping pipe is communicated with the liquid outlet of the cooling channel.
Furthermore, a filter screen is arranged in the filter box.
Furthermore, it is a plurality of the system cold side of semiconductor refrigeration piece is laminated with the refrigerator lateral wall, and is a plurality of the heat dissipation grid tray all with the heat dissipation side fixed connection of semiconductor refrigeration piece.
Further, the inside connecting rod, motor and the flabellum of including of radiator fan, a plurality of ventilation holes have been seted up on the connecting plate surface.
The utility model has the beneficial effects that:
when the cooling device is used, the cooling plate is arranged at the injection port by arranging the cooling plate, the refrigerator, the cooling channel, the semiconductor refrigeration sheet, the heat dissipation grid plate, the connecting plate and the heat dissipation fan, cooling liquid is circulated in the cooling plate and the refrigerator together, the plastic product is cooled by the cooling liquid when the cooling liquid passes through the cooling plate, the cooling liquid is heated and then returns to the interior of the refrigerator to be cooled again, and the heated cooling liquid can be rapidly refrigerated under the action of the semiconductor refrigeration sheet and the heat dissipation fan. In addition, the filter box and the filter screen are arranged, so that dirt in the cooling liquid can be filtered, and the cooling effect of the cooling device is prevented from being reduced.
Drawings
FIG. 1 is a perspective view of the refrigerator of the present invention;
FIG. 2 is a main sectional view of the present invention;
FIG. 3 is a top view of the present invention;
fig. 4 is a perspective view of a connection plate of the present invention.
Illustration of the drawings:
1. a base plate; 2. a cooling plate; 3. a refrigerator; 4. a cooling channel; 5. a heat exchange channel; 6. a filter cartridge; 7. a first connecting pipe; 8. a second connecting pipe; 9. a pump body; 10. a liquid pumping pipe; 11. injection molding holes; 12. a filter screen; 13. a semiconductor refrigeration sheet; 14. a heat dissipation grid plate; 15. a connecting plate; 16. a heat radiation fan; 17. a connecting rod; 18. a motor; 19. a fan blade; 20. a vent hole.
Detailed Description
As shown in fig. 1 to 4, a cooling device of an injection molding machine is provided, which comprises a bottom plate 1 and a cooling plate 2, a refrigerator 3 is fixed on the upper surface of the bottom plate 1, a cooling channel 4 is arranged inside the refrigerator 3, the top end and the bottom end of the cooling channel 4 are respectively a liquid inlet and a liquid outlet, a heat exchange channel 5 is arranged inside the cooling plate 2, the top end and the bottom end of the heat exchange channel 5 are respectively a liquid outlet and a liquid inlet, a filter box 6 is arranged on the top end of the side wall of the refrigerator 3, a pump body 9 is fixed on one side of the upper surface of the bottom plate 1, the liquid inlet end and the liquid outlet end of the pump body 9 are respectively connected with a liquid pumping pipe 10 and a second connecting pipe 8, an injection molding hole 11 is arranged in the middle of the cooling plate 2, a plurality of semiconductor cooling plates 13 are arranged on the outer side wall of the refrigerator 3, a plurality of semiconductor cooling plates 13 are all connected with a plurality of cooling plate 14, one side of the plurality of cooling plate 14 away from the semiconductor cooling plate 13 is commonly connected with a connecting plate 15, the side of the connecting plate 15 away from the heat dissipation grid 14 is provided with a heat dissipation fan 16.
When using injection molding machine cooling device, install cooling plate 2 at the mouth of moulding at the play of injection molding machine, the coolant liquid in heat transfer passageway 5 can carry out the heat transfer to cooling plate 2 for 2 temperature reductions of cooling plate will be cooled off when liquid plastics pass the injection molding hole 11 at 2 middle parts of cooling plate, and the plastic products after the moulding of being convenient for can cool off the drawing of patterns fast. And under the drive of pump body 9, the coolant liquid after the heat transfer can get into in the cooling channel 4 of refrigerator 3 through first connecting pipe 7 and filter cartridge 6 in proper order, and when the coolant liquid flowed in cooling channel 4, the temperature of refrigerator 3 lateral wall can be reduced to the refrigeration side of semiconductor refrigeration piece 13 to reduce the temperature of coolant liquid, the coolant liquid after being cooled down again is under the drive of pump body 9, in heat transfer channel 5 of cooling plate 2 is returned through liquid suction pipe 10 and second connecting pipe 8 for cooling plastic products. In the process, the heat dissipation side of the semiconductor refrigeration piece 13 can transfer the heat to the heat dissipation grid plate 14, and then the heat can be blown away rapidly by matching with the heat dissipation fan 16, so that the refrigeration effect of the semiconductor refrigeration piece 13 is improved, and the heat on the surface of the refrigerator 3 is taken away, so that the cooling liquid in the cooling channel 4 can be refrigerated rapidly.
In a further scheme, the cooling channel 4 and the heat exchange channel 5 are both in an S-shaped design, and the cooling channel 4 and the heat exchange channel 5 are internally and jointly provided with cooling liquid, so that the distance through which the cooling liquid can flow is longer, the cooling plate 2 can be fully cooled, and the cooling liquid can be fully cooled in the cooling channel 4.
In the further scheme, the filter box 6 is communicated with a liquid inlet of the cooling channel 4, one side, away from the refrigerator 3, of the filter box 6 is connected with a first connecting pipe 7, one end, away from the filter box 6, of the first connecting pipe 7 is communicated with a liquid outlet of the heat exchange channel 5, a liquid inlet of the heat exchange channel 5 is communicated with a second connecting pipe 8, one end, away from the pump body 9, of the liquid pumping pipe 10 is communicated with a liquid outlet of the cooling channel 4, and through the work of the pump body 9, the cooling liquid forms a circulation loop between the cooling plate 2 and the refrigerator 3.
In a further scheme, a filter screen 12 is arranged in the filter box 6, so that impurities in the cooling liquid can be absorbed and filtered conveniently.
In a further scheme, the refrigerating sides of the semiconductor refrigerating sheets 13 are attached to the outer side wall of the refrigerator 3, and the plurality of radiating grid plates 14 are fixedly connected with the radiating sides of the semiconductor refrigerating sheets 13, so that the semiconductor refrigerating sheets 13 can refrigerate the cooling liquid in the cooling channel 4.
In a further scheme, the heat radiation fan 16 comprises a connecting rod 17, a motor 18 and fan blades 19, the surface of the connecting plate 15 is provided with a plurality of air vents 20, heat radiation on the heat radiation side of the semiconductor refrigeration sheet 13 can be accelerated through the heat radiation fan 16, the heat radiation effect of the semiconductor refrigeration sheet 13 is improved, and meanwhile, heat radiation can be performed on the surface of the refrigerator 3.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the utility model, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.
Claims (6)
1. The utility model provides an injection molding machine cooling device, includes bottom plate (1) and cooling plate (2), its characterized in that: the refrigerator is characterized in that a refrigerator (3) is fixed on the upper surface of the bottom plate (1), a cooling channel (4) is arranged in the refrigerator (3), the top end and the bottom end of the cooling channel (4) are respectively a liquid inlet and a liquid outlet, a heat exchange channel (5) is arranged in the cooling plate (2), the top end and the bottom end of the heat exchange channel (5) are respectively a liquid outlet and a liquid inlet, a filter box (6) is arranged at the top end of the side wall of the refrigerator (3), a pump body (9) is fixed on one side of the upper surface of the bottom plate (1), the liquid inlet end and the liquid outlet end of the pump body (9) are respectively connected with a liquid pumping pipe (10) and a second connecting pipe (8), an injection molding hole (11) is formed in the middle part of the cooling plate (2), a plurality of semiconductor refrigerating sheets (13) are arranged on the outer side wall of the refrigerator (3), and a plurality of heat dissipation grid plates (14) are connected to one side, far away from the refrigerator (3), of the semiconductor refrigerating sheets (13), and one side of the plurality of heat dissipation grid plates (14) far away from the semiconductor refrigeration sheet (13) is commonly connected with a connecting plate (15), and one side of the connecting plate (15) far away from the heat dissipation grid plates (14) is provided with a heat dissipation fan (16).
2. The cooling apparatus of an injection molding machine according to claim 1, wherein: the cooling channel (4) and the heat exchange channel (5) are both in S-shaped design, and cooling liquid is arranged inside the cooling channel (4) and the heat exchange channel (5) together.
3. The cooling apparatus of an injection molding machine according to claim 1, wherein: the utility model discloses a refrigerator, including filter box (6), liquid suction pipe (10), liquid suction pipe (6) and cooling channel (4), one side that filter box (6) kept away from refrigerator (3) is connected with first connecting pipe (7), the one end that filter box (6) were kept away from in first connecting pipe (7) communicates with the liquid outlet of heat transfer passageway (5), the inlet and the second connecting pipe (8) of heat transfer passageway (5) are linked together, the one end that the pump body (9) was kept away from in liquid suction pipe (10) communicates with the liquid outlet of cooling channel (4).
4. The cooling apparatus of an injection molding machine according to claim 1, wherein: a filter screen (12) is arranged in the filter box (6).
5. The cooling apparatus of an injection molding machine according to claim 1, wherein: the refrigeration side of a plurality of semiconductor refrigeration pieces (13) is attached to the outer side wall of the refrigerator (3), and the heat dissipation grid plates (14) are fixedly connected with the heat dissipation side of the semiconductor refrigeration pieces (13).
6. The cooling apparatus of an injection molding machine according to claim 1, wherein: the heat radiation fan (16) is internally provided with a connecting rod (17), a motor (18) and fan blades (19), and the surface of the connecting plate (15) is provided with a plurality of ventilation holes (20).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121795602.2U CN215472908U (en) | 2021-08-03 | 2021-08-03 | An injection molding machine cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121795602.2U CN215472908U (en) | 2021-08-03 | 2021-08-03 | An injection molding machine cooling device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215472908U true CN215472908U (en) | 2022-01-11 |
Family
ID=79755058
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121795602.2U Expired - Fee Related CN215472908U (en) | 2021-08-03 | 2021-08-03 | An injection molding machine cooling device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215472908U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115042400A (en) * | 2022-08-01 | 2022-09-13 | 江苏食品药品职业技术学院 | An injection mold internal cooling device |
| CN115195063A (en) * | 2022-07-08 | 2022-10-18 | 广东文穗智能装备股份有限公司 | Refrigeration system for injection molding auxiliary integrated system |
-
2021
- 2021-08-03 CN CN202121795602.2U patent/CN215472908U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115195063A (en) * | 2022-07-08 | 2022-10-18 | 广东文穗智能装备股份有限公司 | Refrigeration system for injection molding auxiliary integrated system |
| CN115042400A (en) * | 2022-08-01 | 2022-09-13 | 江苏食品药品职业技术学院 | An injection mold internal cooling device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20231204 Address after: 355300 Lanwei, Zhayang Village, Zhayang Township, Zherong County, Ningde City, Fujian Province (formerly known as Zherong County Alum Factory) Patentee after: Zherong County South China Ink Co.,Ltd. Address before: 415000 No. 108, Qianming Road, Changde economic and Technological Development Zone, Hunan Province (floor 1, building 3, former liyunte Industrial Park) Patentee before: Hunan deshengkang Technology Co.,Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20220111 |