CN215470345U - Polishing device for semiconductor material substrate - Google Patents

Polishing device for semiconductor material substrate Download PDF

Info

Publication number
CN215470345U
CN215470345U CN202022834909.0U CN202022834909U CN215470345U CN 215470345 U CN215470345 U CN 215470345U CN 202022834909 U CN202022834909 U CN 202022834909U CN 215470345 U CN215470345 U CN 215470345U
Authority
CN
China
Prior art keywords
polishing
assembled
semiconductor
substrate
air cylinder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202022834909.0U
Other languages
Chinese (zh)
Inventor
不公告发明人
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzhou Shuoxin Electronic Technology Co ltd
Original Assignee
Suzhou Shuoxin Electronic Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suzhou Shuoxin Electronic Technology Co ltd filed Critical Suzhou Shuoxin Electronic Technology Co ltd
Priority to CN202022834909.0U priority Critical patent/CN215470345U/en
Application granted granted Critical
Publication of CN215470345U publication Critical patent/CN215470345U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Abstract

The utility model discloses a polishing device for a semiconductor material substrate, which comprises a polishing table, wherein the upper end of the polishing table is slidably provided with a sliding mechanism, the upper end of the sliding mechanism is fixedly provided with a portal frame, the upper end of the portal frame is fixedly provided with a polishing device, the left end and the right end of the polishing table are fixedly provided with clamping devices, the polishing table is internally provided with a chute, the lower end of the chute is communicated with a chip outlet, the lower end of the chip outlet is provided with a chip storage box, and the lower end of the polishing table is fixedly provided with support legs; clamping device in the scheme sets up inside the polishing platform, lets the piece that produces in the polishing process can not be in disorder spatter, directly falls on the chute, rolls from a bits mouth and falls in the storage bits case, and slide mechanism can let burnishing device horizontal slip, conveniently aims at the base plate, makes the polishing operation have more maneuverability.

Description

Polishing device for semiconductor material substrate
Technical Field
The utility model relates to the technical field of semiconductor material substrate production devices, in particular to a polishing device for a semiconductor material substrate.
Background
The semiconductor is a material with electric conductivity between a conductor and an insulator at normal temperature, the semiconductor material is more and more applied in the industry, the structure is stable, the semiconductor has excellent electrical characteristics and low cost, and can be used for manufacturing modern electronic equipment, the semiconductor has wide application in radio, television and temperature measurement, for example, a diode is a device manufactured by the semiconductor, the importance of the semiconductor is very huge from the viewpoint of technology or economic development, most electronic products, such as a core unit in a computer, a mobile phone or a digital recorder, have very close relation with the semiconductor, the semiconductor needs to be subjected to slicing, lapping, polishing, cleaning, epitaxy, oxidation, photoetching, diffusion, testing, pressure welding, packaging and finished product testing processes in the production process, and when the semiconductor is polished, the chips of the surface polishing can be remained on the workbench, and the tiny chips bring inconvenience to later operation and cleaning of a user.
SUMMERY OF THE UTILITY MODEL
An object of the present invention is to provide a polishing apparatus for a semiconductor material substrate, which solves the problems set forth in the background art described above.
In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides a burnishing device for semiconductor material base plate, the polishing bench upper end slides and is equipped with slide mechanism, the fixed portal frame that is equipped with in slide mechanism upper end, the fixed burnishing device that is equipped with in portal frame upper end, both ends are fixed to be equipped with clamping device about the polishing bench, the inside chute that has seted up of polishing bench, chute lower extreme intercommunication has a bits mouth, bits mouth lower extreme has been placed and has been stored up the bits case, the fixed stabilizer blade that is equipped with of polishing bench lower extreme.
Preferably, the polishing device comprises a first air cylinder, the lower end of the first air cylinder is fixedly assembled in the middle of the upper end of the portal frame, a first telescopic rod is assembled at the lower end of the first air cylinder in an inserting mode, a fixing plate A is fixedly assembled at the lower end of the first telescopic rod, a motor is fixedly assembled at the upper end of the fixing plate A, and a polishing disc is fixedly assembled at the lower end of the motor.
Preferably, clamping device includes the second cylinder, the fixed assembly of second cylinder is in the polishing platform side, the inside grafting of second cylinder is equipped with the second telescopic link, fixed assembly has fixed plate B in the second telescopic link, fixed assembly has splint in fixed plate B the inner.
Preferably, the sliding mechanism comprises a T-shaped boss, the lower end of the T-shaped boss is assembled at the upper end of the polishing table in a sliding mode, the upper end of the T-shaped boss is fixed at the lower end of the portal frame, a third telescopic rod is fixedly assembled on the side face of the T-shaped boss, a third air cylinder is assembled at the right end of the third telescopic rod in a sleeved mode, and the third air cylinder is fixedly assembled at the right end of the polishing table.
Compared with the prior art, the polishing device for the semiconductor material substrate has the following beneficial effects that:
(1) this device is provided with chute, play bits mouth and storage bits case, and the piece in the polishing process can drop on the chute, rolls from a bits mouth along with the action of gravity and falls storage bits case, lets the piece can not waft everywhere and spill, influences follow-up work.
(2) The portal frame of the device can move left and right on the polishing table, and after the polishing device is aligned with the substrate, the polishing disc is lowered by the polishing device, so that the device is convenient to operate and beneficial to processing.
Drawings
FIG. 1 is a schematic sectional view of the front view structure of the present invention;
FIG. 2 is a schematic cross-sectional side view of the present invention.
In the figure: the polishing machine comprises a polishing table 1, a portal frame 2, a polishing device 3, a first cylinder 31, a first telescopic rod 32, a motor 33, a fixed plate A34, a polishing disk 35, a sliding mechanism 4, a third telescopic rod 41, a boss 42T-shaped, a third cylinder 43, a clamping device 5, a second cylinder 51, a second telescopic rod 52, a fixed plate B53, a clamping plate 54, a chute 6, a scrap outlet 7, a scrap storage box 8 and a supporting leg 9.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1 and fig. 2, the present invention provides a technical solution: the utility model provides a burnishing device for semiconductor material base plate, including polishing platform 1, 1 upper end of polishing platform slides and is equipped with slide mechanism 4, slide mechanism 4 upper end fixed be equipped with portal frame 2, 2 upper ends fixed be equipped with burnishing device 3 of portal frame, both ends fixed be equipped with clamping device 5 about polishing platform 1, 1 inside chute 6 of having seted up of polishing platform, 6 lower extreme intercommunications of chute have a bits mouth 7, the lower extreme of a bits mouth 7 has been placed and has been stored up bits case 8, 1 lower extreme fixed be equipped with stabilizer blade 9 of polishing platform.
Polishing work is carried out in polishing platform 1 is inside, and the piece that drops directly falls on chute 6, rolls from a bits mouth 7 and falls to storing up bits case 8, and the person of facilitating the use has reduced cleaning device's time, has increased work efficiency to polishing device's continuous use.
The polishing device 3 comprises a first air cylinder 31, the lower end of the first air cylinder 31 is fixedly assembled in the middle of the upper end of the portal frame 2, the lower end of the first air cylinder 31 is assembled with a first telescopic rod 32 in a splicing mode, the lower end of the first telescopic rod 32 is fixedly assembled with a fixing plate A34, the upper end of the fixing plate A34 is fixedly assembled with a motor 33, and the lower end of the motor 33 is fixedly assembled with a polishing disc 35.
The polishing disk 35 in the polishing device 3 can move up and down, and polishing work of the substrate is facilitated.
The clamping device 5 comprises a second air cylinder 51, the second air cylinder 51 is fixedly assembled on the side surface of the polishing table 1, a second expansion link 52 is assembled in the second air cylinder 51 in an inserting manner, a fixing plate B53 is fixedly assembled at the inner end of the second expansion link 52, and a clamping plate 54 is fixedly assembled at the inner end of the fixing plate B53.
The clamping device 5 can clamp the substrate tightly, so that polishing work is convenient to carry out, and the substrate is prevented from deviating during polishing.
The clamping device 5 is arranged inside the polishing table 1, so that scraps generated during polishing can directly fall on the chute 6 and cannot be splashed around.
Slide mechanism 4 includes T-shaped boss 42, and the assembly that slides of T-shaped boss 42 lower extreme is in polishing platform 1 upper end, and the lower extreme at portal frame 2 is fixed to T-shaped boss 42 upper end, and T-shaped boss 42 side fixed assembly has third telescopic link 41, and the right-hand member of third telescopic link 41 cup joints and is equipped with third cylinder 43, and third cylinder 43 fixed assembly is at polishing platform 1 right-hand member.
The sliding mechanism 4 can drive the gantry to slide left and right on the polishing table 1, so that the polishing disk 35 is conveniently aligned to the substrate, and the operation is convenient.
It will be evident to those skilled in the art that the utility model is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims (4)

1. A polishing apparatus for a substrate of semiconductor material, characterized in that: including polishing platform (1), polishing platform (1) upper end slides and is equipped with slide mechanism (4), slide mechanism (4) upper end fixed mounting has portal frame (2), portal frame (2) upper end fixed mounting has burnishing device (3), both ends fixed mounting has clamping device (5) about polishing platform (1), chute (6) have been seted up to polishing platform (1) inside, chute (6) lower extreme intercommunication has chip outlet (7), chip outlet (7) lower extreme has been placed and has been stored up bits case (8), polishing platform (1) lower extreme fixed mounting has stabilizer blade (9).
2. A polishing apparatus for a substrate of semiconductor material as recited in claim 1, wherein: the polishing device (3) comprises a first air cylinder (31), the lower end of the first air cylinder (31) is fixedly assembled in the middle of the upper end of a portal frame (2), a first telescopic rod (32) is assembled at the lower end of the first air cylinder (31) in an inserted mode, a fixing plate A (34) is fixedly assembled at the lower end of the first telescopic rod (32), a motor (33) is fixedly assembled at the upper end of the fixing plate A (34), and a polishing disc (35) is fixedly assembled at the lower end of the motor (33).
3. A polishing apparatus for a substrate of semiconductor material as recited in claim 1, wherein: the clamping device (5) comprises a second air cylinder (51), the second air cylinder (51) is fixedly assembled on the side face of the polishing table (1), a second telescopic rod (52) is assembled in the second air cylinder (51) in an inserted mode, a fixing plate B (53) is fixedly assembled at the inner end of the second telescopic rod (52), and a clamping plate (54) is fixedly assembled at the inner end of the fixing plate B (53).
4. A polishing apparatus for a substrate of semiconductor material as recited in claim 1, wherein: slide mechanism (4) include T word boss (42), the assembly that slides of T word boss (42) lower extreme is in polishing platform (1) upper end, portal frame (2) lower extreme is fixed to T word boss (42) upper end, T word boss (42) side fixed be equipped with third telescopic link (41), third telescopic link (41) right-hand member cup joints and is equipped with third cylinder (43), third cylinder (43) fixed assembly is at polishing platform (1) right-hand member.
CN202022834909.0U 2020-12-01 2020-12-01 Polishing device for semiconductor material substrate Active CN215470345U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202022834909.0U CN215470345U (en) 2020-12-01 2020-12-01 Polishing device for semiconductor material substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202022834909.0U CN215470345U (en) 2020-12-01 2020-12-01 Polishing device for semiconductor material substrate

Publications (1)

Publication Number Publication Date
CN215470345U true CN215470345U (en) 2022-01-11

Family

ID=79717060

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202022834909.0U Active CN215470345U (en) 2020-12-01 2020-12-01 Polishing device for semiconductor material substrate

Country Status (1)

Country Link
CN (1) CN215470345U (en)

Similar Documents

Publication Publication Date Title
CN215470345U (en) Polishing device for semiconductor material substrate
CN112238252A (en) Cutting equipment of metal steel pipe and protective structure thereof
CN209434577U (en) A kind of socket production sleeve punch forming device
CN211991339U (en) Processing platform is used in processing of circuit board soldering tin
CN207403465U (en) A kind of formula engraving machine easy to carry
CN208062470U (en) A kind of tooling of Wiring harness terminal automatic crimping machine
CN208680638U (en) It is a kind of for producing the rapid cutting device of LED lead frame
CN210553005U (en) Pneumatic tool of pad pasting
CN212682737U (en) Tin dispensing device for semiconductor element production
CN209737766U (en) Rubber strip drilling jig
CN212552790U (en) Drilling positioning platform of rocker arm drilling machine
CN214625707U (en) Tin pick-up processing device for preparing electronic wire harness
CN211103838U (en) Assembling table for machining connecting shaft of notebook computer
CN208117366U (en) A kind of industrial electrical automation device
CN210305993U (en) Automatic cutting device for hardware pipe machining
CN208033931U (en) A kind of shock resistance is strong and the full-automatic carving machine of comprehensive operation
CN212823636U (en) Special-shaped circuit board welding tool
CN216413019U (en) Processing device of lead for semiconductor packaging
CN213617672U (en) Chip processing multi-scale cutting equipment capable of avoiding burr generation
CN210677099U (en) Processing equipment for welded pipe production
CN215879450U (en) Accurate-positioning automatic punching station of all-in-one machine
CN211507242U (en) Feeding device of cable stripping machine
CN107322542A (en) Cloth cutting workbench
CN207909837U (en) The bending mechanism of semiconductor test braid all-in-one machine
CN210548703U (en) Multi-purpose tin wire fixing frame

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant