CN215393138U

CN215393138U - Laser lobe of a leaf device

Info

Publication number: CN215393138U
Application number: CN202121201730.XU
Authority: CN
Inventors: 徐韧; 李建平; 杨建林; 徐兆华; 叶凯云; 颜广文; 杨勇; 盛辉; 张凯
Original assignee: Shenzhen Tete Laser Technology Co Ltd
Current assignee: Shenzhen Tete Laser Technology Co Ltd
Priority date: 2021-05-31
Filing date: 2021-05-31
Publication date: 2022-01-04
Anticipated expiration: 2031-05-31

Abstract

The utility model discloses a laser lobe of a leaf device, including the board and tool assembly mounted to said board, the said tool assembly includes processing platform, locating part and pushing away the material assembly, the said processing platform is used for placing the product, the said processing platform has processing stations; the limiting piece is arranged on one side of the machining station; the pushing assembly is installed on the machine table or the processing table and comprises a pushing block and a driving piece, and the driving piece is connected with the pushing block to drive a product to abut against the limiting piece and be located at the processing station. The technical scheme of the utility model improves the automation degree of the laser splinter device.

Description

Laser lobe of a leaf device

Technical Field

The utility model relates to the technical field of laser, in particular to a laser splitting device.

Background

Among the correlation technique, the manipulator will wait to process the product and place the back on the tool, need the manual work to remove and wait to process the product to the processing position of tool on, lead to degree of automation low, has reduced the machining efficiency of laser filamentation device, is unfavorable for the mass production processing of product.

SUMMERY OF THE UTILITY MODEL

The utility model mainly aims to provide a laser splitting device, aiming at improving the automation degree of the laser splitting device.

In order to achieve the purpose, the laser splitting device provided by the utility model comprises a machine table and a jig assembly arranged on the machine table, wherein the jig assembly comprises a processing table, a limiting piece and a pushing assembly, the processing table is used for placing a product, and the processing table is provided with a processing station; the limiting piece is arranged on one side of the machining station; the pushing assembly is installed on the machine table or the processing table and comprises a pushing block and a driving piece, and the driving piece is connected with the pushing block to drive a product to abut against the limiting piece and be located at the processing station.

In an embodiment, the limiting member and the pushing block are disposed opposite to each other.

In one embodiment, the number of the limiting members is multiple, wherein two limiting members are located at two adjacent sides of the processing station to abut against two adjacent sides of the product; the push block is provided with a first side face and a second side face which are used for abutting against the other two sides of the product.

In one embodiment, the intersection of the first side surface and the second side surface is recessed to form a concave arc surface.

In an embodiment, a limit area is formed between two limit parts located at two adjacent sides of the processing station, and the push block moves towards and away from the limit area.

In one embodiment, the processing table is provided with a suction opening and/or a dust suction opening.

In an embodiment, the laser splitting device further comprises a splitting pressure block installed on the machine table, and the splitting pressure block is used for mechanically splitting a product; the splinter pressing block can move along the up-down direction and the front-back direction.

In an embodiment, the jig assembly further includes a mounting bracket, the mounting bracket is mounted on the machine table, and the processing table and the pushing assembly are both mounted on the mounting bracket.

In one embodiment, the mounting bracket comprises a side plate and a mounting plate mounted on the side plate, the mounting plate extends out of the side plate, and the processing table is mounted on the mounting plate; the laser splitting device further comprises a waste material box arranged on the machine table, and the waste material box is located below the processing table.

In an embodiment, the laser splitting device further comprises a material moving module arranged on the machine table, the material moving module comprises a moving module, and a grabbing component and a cleaning component which are arranged on the moving module, the grabbing component is used for grabbing a product, and the cleaning component is used for cleaning the processing station; the moving module is used for moving the grabbing component and the cleaning component so as to move the product and the cleaning component.

According to the technical scheme, the driving piece drives the push block to move, the product placed on the machining table is moved towards the limiting piece through the push block until the product abuts against the limiting piece, the limiting piece limits the product, the product is located on the machining station, and a laser generator of the laser splitting device heats the product to enable the product to be split. The jig assembly is used for completing the movement work of a product, and manual movement is not needed, so that the automation degree and the processing accuracy of the laser splitting device are improved, and the labor amount of workers is reduced; in addition, the products do not need to be moved one by one manually, so that the safety performance of the laser splitting device is improved, the processing efficiency of the laser splitting device is also improved, and the laser splitting device is beneficial to the mass production and processing work of the products.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.

FIG. 1 is a schematic structural diagram of a processing apparatus according to an embodiment of the present invention;

FIG. 2 is a schematic structural diagram of a laser cleaving apparatus according to an embodiment of the present invention;

FIG. 3 is a schematic structural diagram of a jig assembly, a laser generator and a CCD module according to an embodiment of the present invention;

FIG. 4 is a schematic structural diagram of a jig assembly according to an embodiment of the present invention;

FIG. 5 is another perspective view of the jig assembly of FIG. 4;

FIG. 6 is an enlarged view of a portion of FIG. 5 at A;

FIG. 7 is a schematic view of a fixture assembly (no product at the processing station) according to an embodiment of the present invention;

FIG. 8 is an enlarged view of a portion of FIG. 7 at B;

FIG. 9 is a schematic structural diagram of an embodiment of a material moving module according to the present invention;

FIG. 10 is an enlarged view of a portion of FIG. 9 at C;

FIG. 11 is a schematic structural diagram of an embodiment of a flip module according to the present invention;

fig. 12 is a schematic structural diagram of a material receiving module according to an embodiment of the utility model.

The reference numbers illustrate:

the implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It should be noted that, if directional indications (such as up, down, left, right, front, and back … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative positional relationship between the components, the movement situation, and the like in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indications are changed accordingly.

In addition, if there is a description of "first", "second", etc. in an embodiment of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, if appearing throughout the text, "and/or" is meant to include three juxtaposed aspects, taking "A and/or B" as an example, including either the A aspect, or the B aspect, or both A and B satisfied aspects. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.

The utility model provides a laser lobe of a leaf device.

In an embodiment of the present invention, referring to fig. 4 to 6, the laser splitting apparatus 20 includes a machine table 100 and a jig assembly 200 installed on the machine table 100, the jig assembly 200 includes a processing table 210, a limiting member 220 and a pushing assembly 230, the processing table 210 is used for placing a product 30, and the processing table 210 has a processing station; the limiting member 220 is arranged on one side of the processing station; the pushing assembly 230 is installed on the machine table 100 or the processing table 210, the pushing assembly 230 includes a pushing block 231 and a driving member 232, and the driving member 232 is connected to the pushing block 231 to drive the product 30 to abut against the limiting member 220 and is located at the processing station.

Specifically, referring to fig. 2 to 3, the laser splinter device 20 further includes a laser generator 610, wherein the laser generator 610 is used for splinting the product 30, and the product 30 is heated by the generated laser beam to crack the product 30. The laser generator 610 may be a type of laser generator 610 such as an ultraviolet laser, an infrared laser, a fiber laser, or a carbon dioxide laser, depending on the actual situation. With reference to fig. 2 to fig. 3, the laser splitting apparatus 20 may further include a CCD module 620, and the CCD module 620 may be installed at an emitting end of the laser generator 610 to photograph the product 30 at the processing station, so as to obtain image information of the product 30, and facilitate the laser generator 610 to accurately process the position of the product 30 to be processed.

It should be noted that, referring to fig. 1, the laser splitting device 20 may be used in cooperation with the laser filamentation device 10, after the product 30 is grooved or punched by the laser filamentation device 10, the laser splitting device 20 heats the grooved position of the product 30, and since the grooved position is thinner than other parts of the product 30, the product 30 is cracked after laser heating, thereby completing the cutting operation of the product 30. It should be noted that the product 30 may be a glass sheet.

Referring to fig. 2, the machine 100 is used for installing the jig assembly 200, the laser generator 610 and other components, an electrical board, a control box and the like may be installed in the machine 100 as required, and the control box is electrically connected to the laser generator 610 to control the operation of the laser generator 610. The machine table 100 can be provided with a machine cover for covering the laser generator 610 and the jig assembly 200, and the like, so that the situation that when the laser generator 610 performs splitting operation, the body of a worker carelessly puts in a laser processing station is avoided, the laser beam damages the body of the worker, and the safety of the laser splitting device 20 is improved.

Referring to fig. 3, the processing table 210 is installed on the machine 100, and the processing station of the processing table 210 is located below the emission end of the laser generator 610, so that the laser beam emitted from the emission end irradiates the product 30 at the processing station of the processing table 210 to perform a laser splitting operation on the product 30. Referring to fig. 5 to 6, the position limiting member 220 is disposed on the processing table 210 and at one side of the processing station to limit the position of the product 30, so as to prevent the product 30 from moving too far beyond the processing station and being unfavorable for positioning the product 30. Referring to fig. 6 and 8, the limiting member 220 may be a limiting post or a limiting member, in an embodiment, the limiting post is cylindrical, and a peripheral wall of the limiting post is used for abutting against an end of the product 30.

Referring to fig. 4 to 6, the pushing assembly 230 is used for pushing the product 30 to move toward the position-limiting member 220, the pushing assembly 230 includes a pushing block 231 and a driving member 232, and the driving member 232 is connected to the pushing block 231 and drives the pushing block 231 to move toward and away from the position-limiting member 220. The pushing block 231 is used to contact the product 30, and it is understood that the pushing block 231 can contact the end of the product 30 and push the product 30 to move, so that the product 30 abuts against the limiting member 220. That is, the product 30 is moved to the processing station by the limit of the limiting member 220 and the movement of the pushing block 231. It should be noted that the driving member 232 may be a pushing cylinder, and the pushing block 231 is mounted on the pushing cylinder.

According to the technical scheme of the utility model, the driving piece 232 drives the pushing block 231 to move, the product 30 placed on the processing table 210 is moved towards the limiting piece 220 through the pushing block 231 until the product 30 abuts against the limiting piece 220, the limiting piece 220 limits the product 30, so that the product 30 is positioned on a processing station, and the laser generator 610 of the laser splitting device 20 heats the product 30, so that the product 30 is split. The jig assembly 200 is used for completing the movement of the product 30 without manual movement, thereby improving the automation degree and the processing accuracy of the laser splinter device 20 and reducing the labor capacity of workers; in addition, because the products 30 do not need to be moved by people one by one, the safety performance of the laser splitting device 20 is improved, the processing efficiency of the laser splitting device 20 is also improved, and the mass production and processing work of the products 30 is facilitated.

In order to accurately move the product 30 to the processing station, referring to fig. 6 and 8, in an embodiment, the limiting member 220 is disposed opposite to the pushing block 231. Thus, the pushing block 231 can move in a direction close to the limiting part 220, so as to reduce the distance between the pushing block 231 and the limiting part 220, and push the product 30 to move in a direction close to the limiting part 220 until the product 30 abuts against the limiting part 220, so that the product 30 is located on the processing station, and the movement of the product 30 on the processing table 210 is completed.

Referring to fig. 6, in an embodiment, the number of the limiting members 220 is plural, wherein two of the limiting members 220 are located at two adjacent sides of the processing station to abut against two adjacent sides of the product 30; the push block 231 has a first side 231a and a second side 231b for abutting against the other two sides of the product 30.

Referring to fig. 6, the two adjacent sides of the processing station are provided with two or three limiting members 220, and the number of the limiting members 220 on one side of the processing station may be two or three. That is, the limiting members 220 limit the adjacent two sides of the product 30, so as to prevent the product 30 from deviating from the processing station. Referring to fig. 6, the other two sides of the processing station are limited by the push block 231, the push block 231 has a first side surface 231a and a second side surface 231b which abut against the other two sides of the product 30, and the first side surface 231a and the second side surface 231b are respectively contacted with the two sides of the product 30, so that the product 30 is pushed to move towards the direction close to the limit block, and the product 30 is pushed into the processing station.

Referring to fig. 5 to 6, the pushing block 231 may be disposed in a V shape, and a first side surface 231a and a second side surface 231b are formed at two opposite sides of the opening of the pushing block 231, and the first side surface 231a and the second side surface 231b are used for contacting with the end of the product 30 to cooperate with the limiting member 220, so as to push the product 30 into the processing station in one step, thereby improving the working efficiency of the jig assembly 200.

The product 30 may be square, and in order to prevent the pushing block 231 from damaging the end of the product 30, referring to fig. 6 and 8, in an embodiment, the intersection of the first side 231a and the second side 231b is recessed to form a concave arc surface 231 c. By arranging the concave arc 231c at the intersection of the first side 231a and the second side 231b, the concave arc 231c is over against the end of the product 30 in the process that the push block 231 approaches the product 30, so that the end of the product 30 just extends into the avoiding space formed by the concave arc 231c, and the product 30 is protected.

Referring to fig. 7 to 8, in order to enable the pushing block 231 to accurately move the product 30, in an embodiment, a limiting area 210a may be formed between two limiting members 220 located at two adjacent sides of the processing station, and the pushing block 231 moves towards and away from the limiting area 210 a.

In order to improve the precision of the laser processing, referring to fig. 7 to 8, in an embodiment, the table top of the processing table 210 is provided with a suction port 210 b. After the product 30 is pushed to the processing station by the pushing block 231, the suction port 210b can be vacuumized to suck the product 30, so as to prevent the product 30 from moving when being irradiated by the laser beam. The number of the adsorption ports 210b can be multiple, and the adsorption ports 210b can be round holes or square holes, and can be specifically set according to actual conditions.

In order to prevent dust generated during the processing of the product 30 by the laser beam, referring to fig. 8, in an embodiment, the processing table 210 is provided with a dust suction port 210 c. The dust suction port 210c can be arranged on the table top of the processing table 210, and can suck dust generated by laser processing of the product 30 and suck away the dust in time, so that the dust is prevented from flying and polluting air; on the other hand, the product 30 is favorably adsorbed by the adsorption port 210b, so that the adsorption force of the product 30 by the adsorption port 210b is prevented from being reduced by dust, and the product 30 can be stably adsorbed by the processing table 210.

Referring to fig. 4, in an embodiment, the laser splitting apparatus 20 further includes a splitting pressing block 310 installed on the machine 100, wherein the splitting pressing block 310 is used for mechanically splitting the product 30; the breaking piece pressing block 310 can move in the up-down direction and the front-back direction. The product 30 may not be split into two parts after the laser beam irradiation treatment, and in this regard, the product 30 is split into two parts by pressing the split compacts 310 against unnecessary parts of the product 30.

Referring to fig. 4 to 5, the laser splinting device 20 further includes a first cylinder 320 and a second cylinder 330, the second cylinder 330 is mounted on the first cylinder 320, and the splinting pressing block 310 is mounted on the second cylinder 330. The first cylinder 320 drives the second cylinder 330 and the split pressing block 310 to move in the up-and-down direction, and the second cylinder 330 drives the split pressing block 310 to move in the front-and-rear direction, so that the split moves forward and downward to press the product 30, and then the split pressing block 310 is raised and the split pressing block 310 is retreated backward.

The processing table 210 may be directly installed on the machine table 100, or may be installed on the machine table 100 through other components. Referring to fig. 3 to 4, in an embodiment, the jig assembly 200 further includes a mounting bracket 240, the mounting bracket 240 is mounted on the machine 100, and the processing table 210 and the pushing assembly 230 are both mounted on the mounting bracket 240. By mounting the bracket 240, the height of the processing station 210 is raised, and the distance between the processing station and the emission end of the laser generator 610 is shortened.

Referring to fig. 4 to 5, in an embodiment, the mounting bracket 240 includes a side plate 241 and a mounting plate 242 mounted on the side plate 241, the mounting plate 242 extends out of the side plate 241, and the processing table 210 is mounted on the mounting plate 242; the laser splinter device 20 further comprises a waste box 410 installed on the machine table 100, wherein the waste box 410 is located below the processing table 210.

Referring to fig. 3, the table 210 extends beyond the end of the mounting plate 242 and the waste bin 410 is positioned below the table 210 to receive the portion of the product 30 that is not desired after cleaving. In order to make the unwanted part of the product 30 fall into the waste bin 410 smoothly, please refer to fig. 3, a flaring member 420 can be disposed above the waste bin 410, the end of the flaring member 420 is communicated with the waste bin 410, and the opening of the flaring member 420 faces the processing station 210. Referring to fig. 5, the mounting bracket 240 may further include a connecting plate 243, the connecting plate 243 is mounted on one side of the mounting plate 242, and the pushing block 231 and the driving member 232 are mounted on the connecting plate 243.

The product 30 can be manually placed on the processing table 210 and then pushed to the processing station by the pushing assembly 230, or can be loaded by the material moving module 500. Referring to fig. 9, in an embodiment, the material moving module 500 includes a moving module 510 and a grabbing component 520 mounted on the moving module 510, the grabbing component 520 is used for grabbing the product 30, and the moving module 510 is used for moving the grabbing component 520 to grab and move the product 30 to a corresponding position, such as the processing station 210, so as to further improve the automation degree of the laser splitting apparatus 20 and free the hands of the worker.

Referring to fig. 9, the moving module 510 may include an X-axis linear module 511 and an X-axis driving motor 512, the grabbing element 520 is installed on the X-axis linear module 511, and the X-axis driving motor 512 is connected to the X-axis linear module 511, so that the grabbing element 520 moves on the X-axis linear module 511, thereby moving the product 30. The X-axis linear module 511 may extend from the laser filament forming device 10 to the jig assembly 200, or may extend along the length direction of the machine 100.

To achieve the multi-dimensional property of the moving direction of the moving module 510, please refer to fig. 9, the moving module 510 may include a Y-axis linear module 513 and a Y-axis driving motor 514, the Y-axis linear module 513 is installed on the X-axis linear module 511, the grabbing component 520 is disposed on the Y-axis linear module 513, so that the X-axis linear module 511 drives the Y-axis linear module 513 and the grabbing component 520 to move along the X-axis direction, and the Y-axis linear module 513 drives the grabbing component 520 to move along the Y-axis direction. The Y-axis linear module 513 may extend along the width direction of the tool 100.

Referring to fig. 9-10, the gripping assembly 520 may include a first suction cup 522 for absorbing the product 30. It will be appreciated that the gripper assembly 520 may also include jaws for gripping the product 30. Referring to fig. 10, the picking assembly 520 may further include a sliding table 521, the sliding table 521 is mounted on the Y-axis linear module 513, and the sliding table 521 is used for mounting the first suction pad 522. The gripping assembly 520 may further include a driving cylinder 523, the first suction cup 522 is mounted on the sliding table 521 through the driving cylinder 523, and the driving cylinder 523 is used for driving the first suction cup 522 to ascend or descend so as to suck the product 30 or to drop the product 30.

Referring to fig. 10, the picking assembly 520 may further include a second suction cup 524 mounted on the sliding table 521, and the second suction cup 524 may be used to suck the separated products 30 (unnecessary parts) and drop the separated products 30 into the waste bin 410 by moving the sliding table 521. The first suction cup 522 may be used to suck and receive a portion of the product 30 to be retained.

Referring to fig. 10, the material moving module 500 may further include a cleaning assembly 530 mounted on the sliding table 521, wherein the cleaning assembly 530 is used for cleaning the processing table 210 and sweeping away dust, debris, etc. on the top surface of the processing table 210. It should be noted that the cleaning assembly 530 may be a brush, the number of the driving cylinders 523 may be multiple, and the multiple driving cylinders 523 are respectively connected to the first suction cup 522, the second suction cup 524 and the brush, and are configured to drive the first suction cup 522, the second suction cup 524 and the brush to move up and down; it is also possible to have only one driving cylinder 523 for driving the first suction cup 522, the second suction cup 524 and the brush to move up and down at the same time.

Considering that the filament forming operation may be performed on both sides of the product 30, referring to fig. 2 and 11, the laser filament forming apparatus 10 may further include an overturning module 700 installed on the machine 100, wherein the overturning module 700 is used for overturning the product 30, and the overturning angle may be 180 degrees or other angles. Referring to fig. 1 to 3, the flipping module 700 includes a flipping frame 710, a flipping cylinder 720, a holding jaw cylinder 730, and a holding jaw block 740 mounted on the holding jaw cylinder 730, wherein the flipping cylinder 720 is mounted on the flipping frame 710, and the holding jaw block 740 and the holding jaw cylinder 730 are mounted on the flipping cylinder 720, so as to flip the holding jaw block 740.

Referring to fig. 10, the gripper block 740 is used to grip the product 30, and the gripper cylinder 730 is connected to the gripper block 740 to drive the gripper block 740 to grip and release the product 30. The structure of the clamping jaw blocks 740 can be varied, and referring to fig. 10, in one embodiment, the number of the clamping jaw blocks 740 is two, and a guide groove 740a is provided on a side of one clamping jaw block 740 facing the other clamping jaw block 740, and the guide groove 740a is used for accommodating the product 30.

When the splitting process of the product 30 is completed, the product 30 on the processing table 210 can be removed by the material moving module 500. Referring to fig. 2 and 12, in an embodiment, the laser filament forming apparatus 10 may further include a material receiving module 800 installed on the machine 100, the material receiving module 800 may include a tray 810, the material moving module 500 sucks a portion of the product 30 to be retained by the first suction cup 522 and transfers the part onto the tray 810, and a plurality of products 30 may be placed on the tray 810.

Referring to fig. 12, the material receiving module 800 may further include a material receiving box 820 and a tray pushing assembly 830, an opening of the material receiving box 820 is opposite to the tray 810, and when the tray 810 has the product 30 placed thereon, the tray pushing assembly 830 pushes the tray 810 to push the tray 810 into the material receiving box 820, thereby completing the blanking. Referring to fig. 12, the material receiving box 820 may be provided with a plurality of trays 810 at intervals in a vertical manner, the material receiving module 800 may further include a lifting module 840, the lifting module 840 drives the trays 810 to move up and down, so that the neutral position of the material receiving box 820 is opposite to the trays 810, and the tray pushing assembly 830 pushes the trays 810 into the neutral position of the material receiving box 820, so as to place the plurality of trays 810 in the material receiving box 820. It is understood that the tray pushing assembly 830 can push the tray 810 with the product 30 into the magazine 820, and can also push the tray 810 without the product 30 in the magazine 820 out of the magazine.

The working process of the laser splitting device 20 may be as follows: (1) the material feeding and moving module 500 grabs the product 30 from the material feeding box or the laser filamentation device 10 and moves the product to the processing table 210 of the jig assembly 200; (2) pushing, namely starting the pushing assembly 230, and pushing the product 30 to a processing station by the pushing block 231; (3) the CCD module 620 takes a picture of the product 30 (front side) for positioning; (4) the laser generator 610 generates a laser beam and irradiates the product 30 at the processing station; (5) the material moving module 500 moves the product 30 to the turnover module 700; (6) the clamping jaw block 740 clamps the product 30, and the overturning cylinder 720 drives the clamping jaw block 740 to rotate, so that the product 30 is overturned, and the other side (reverse side) of the product 30 faces upwards; (7) the material moving module 500 grabs the product 30 in the clamping jaw block 740, the clamping jaw block 740 releases the product 30, and the material moving module 500 moves the product 30 to the processing table 210 of the jig assembly 200; (8) the CCD module 620 takes a picture of the back side of the product 30 for positioning; (9) the laser generator 610 performs laser filamentation on the reverse side of the product 30; (10) the splinter compacts 310 are pressed against the part of the product 30 to be separated, so that the splinter compacts are separated from the part of the product 30 to be kept; (11) the material transferring module 500 adsorbs a part of the product 30 to be retained, and pushes the rest part of the product 30, dust and the like into the waste material box 410; (12) the material moving module 500 moves the product 30 of which the part needs to be reserved to the tray 810; (13) the tray pushing assembly 830 pushes the tray 810 into the magazine 820.

In this manner, the laser cleaving operation of the product 30. It is understood that the laser irradiation operation may be performed only on one side of the product 30, i.e., the steps (1) to (4) are performed, and the product 30 is moved into the receiving box 820 through the steps (11) to (13). The mechanical tabletting operation of the step (10) can be determined according to actual conditions.

Referring to fig. 1, the present invention further provides a processing apparatus, which includes a laser splitting device 20 and a laser filament forming device 10, and the specific structure of the laser splitting device 20 refers to the above embodiments, and since the processing apparatus adopts all technical solutions of all the above embodiments, the processing apparatus at least has all the beneficial effects brought by the technical solutions of the above embodiments, and details are not repeated herein.

The above description is only an alternative embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.

Claims

1. The utility model provides a laser lobe of a leaf device, its characterized in that, laser lobe of a leaf device include the board with install in the tool subassembly of board, the tool subassembly includes:

a processing table for placing a product, the processing table having a processing station;

the limiting piece is arranged on one side of the machining station;

the pushing assembly is installed on the machine table or the processing table and comprises a pushing block and a driving piece, and the driving piece is connected with the pushing block to drive a product to abut against the limiting piece and be located on the processing station.

2. The laser lobe splitting device of claim 1, wherein the limiting member is disposed opposite to the pushing block.

3. The laser splitting apparatus of claim 2, wherein the number of the position-limiting members is plural, and two of the position-limiting members are located at two adjacent sides of the processing station to abut two adjacent sides of the product; the push block is provided with a first side face and a second side face which are used for abutting against the other two sides of the product.

4. The laser splitting apparatus of claim 3, wherein the intersection of the first side surface and the second side surface is recessed to form a concave arc surface.

5. The laser splitting device of claim 3, wherein a limiting region is formed between two limiting members located at two adjacent sides of the processing station, and the pushing block moves towards and away from the limiting region.

6. The laser splinter device of any one of claims 1-5, wherein the processing station is provided with a suction port and/or a dust suction port.

7. The laser splitting apparatus as claimed in any one of claims 1 to 5, further comprising a splitting press block mounted on the machine platform, wherein the splitting press block is used for mechanically splitting the product; the splinter pressing block can move along the up-down direction and the front-back direction.

8. The laser splitting device of any one of claims 1 to 5, wherein the jig assembly further comprises a mounting bracket, the mounting bracket is mounted on the machine table, and the processing table and the pushing assembly are both mounted on the mounting bracket.

9. The laser splitting apparatus of claim 8, wherein the mounting bracket comprises a side plate and a mounting plate mounted to the side plate, the mounting plate extends out of the side plate, and the processing table is mounted to the mounting plate; the laser splitting device further comprises a waste material box arranged on the machine table, and the waste material box is located below the processing table.

10. The laser splitting apparatus of claim 9, further comprising a material moving module installed on the machine table, wherein the material moving module comprises a moving module, and a grabbing assembly and a cleaning assembly installed on the moving module, the grabbing assembly is used for grabbing a product, and the cleaning assembly is used for cleaning the processing station; the moving module is used for moving the grabbing component and the cleaning component so as to move the product and the cleaning component.