CN215181409U

CN215181409U - Alignment device for LDI automatic connection

Info

Publication number: CN215181409U
Application number: CN202121078946.1U
Authority: CN
Inventors: 吴越; 童巨特; 陈新宏
Original assignee: Hangzhou Xinnuo Microelectronics Co ltd
Current assignee: Hangzhou Xinnuo Microelectronics Co ltd
Priority date: 2021-05-19
Filing date: 2021-05-19
Publication date: 2021-12-14
Anticipated expiration: 2031-05-19

Abstract

The utility model provides a counterpoint device of LDI automatic line, including conveying platform, exposure platform and manipulator to and be used for carrying out the positioning system who fixes a position to the PCB board on the conveying platform, positioning system connect and be used for sending the location result for control module in control module, control module connect in exposure platform so that the exposure platform moves to the relevant position who is adapted to PCB board position. The scheme breaks through the traditional clapper positioning thinking, replaces mechanical motion with wireless electric pulse signal transmission and data processing, breaks through the speed limit of the mechanical motion, can greatly shorten the time required by clapper alignment, omits the process of impacting clappers, can improve the equipment stability, and ensures the yield of PCB boards to the maximum extent.

Description

Alignment device for LDI automatic connection

Technical Field

The utility model belongs to the technical field of the exposure line, especially, relate to an aligning device of LDI automatic line.

Background

Automation is a trend in production plants, for example, automatic inline loading and unloading is currently adopted for LDI exposure. The automation has the advantages that on one hand, the labor is saved, and on the other hand, the productivity is greatly improved.

However, automation is not a perpetual task and needs to be improved over and over again to continuously improve the performance, work efficiency, productivity and the like of the automation equipment. For the LDI automatic wiring equipment, the stability and the productivity of the equipment directly determine the benefit of a board factory, the higher the stability is, the higher the productivity is, the higher the board yield of the equipment of the automatic equipment is, and the better the yield is.

At present, the automatic LDI connecting equipment comprises a conveying platform, an exposure platform and a mechanical arm, wherein the mechanical arm grabs a board conveyed by the conveying platform to the exposure platform, the exposure platform moves to a fixed position in advance to wait for the board, and the exposure platform receives the board and then drives the board to move to an exposure chamber for exposure. As shown in fig. 1 and 2, the conveying platform is provided with a Y-direction limiting plate 7 and an X-direction clapping plate structure 8, the plate is conveyed to one end close to the exposure platform through a roller on the conveying platform and is limited by the Y-direction limiting plate 7, then the X-direction clapping plate structure 8 carries out clapping plate alignment in the X-axis direction on the plate to adapt to the position of the exposure platform, and after the alignment is finished, the plate is grabbed onto the exposure platform by a manipulator. In the automatic working process in the prior art, two steps of processes are required, namely, the PCB is firstly conveyed to the position of the Y-direction limiting plate 7, the Y-direction limiting plate 7 is used for limiting, then the X-direction clapping structure 8 is used for clapping, one clapping plate stop lever 81 of the X-direction clapping structure needs to be moved in the clapping process of the X-direction clapping structure 8, the PCB 4 is pushed by the clapping plate stop lever 81 to be moved to be clapped by the other fixed clapping plate stop lever 81, and the alignment is completed. In this process, since it takes a certain time for the flap lever 81 to move, it takes a long time for alignment, and one side of the board may contact the Y-direction stopper plate 7, causing a certain friction to the board in the process of moving the board, which lowers the board yield. In addition, because the two clapper blocking rods 81 of the X-direction clapper structure 8 directly impact the edge of the clapper during the clapper process, the PCB is damaged, and the problem of chip falling is easily caused, which causes defects.

At present, when many manufacturers start to solve the problems of efficiency and speed caused by the clappers, starting from the structural movement stroke, the shorter the time from the beginning of movement of a moving clapper baffle rod to the completion of alignment, the shorter the time consumed by the clappers, and the main mode of improving the efficiency to a certain extent and shortening the duration by compressing the duration is to accelerate the movement speed; but the boost is quite limited. On the one hand, this mechanical stroke is still present, no matter how fast the speed is, and it is impossible to shorten this duration to a great extent if the mechanical stroke is present; secondly, the shorter the duration, the greater the speed of the clapper lever, the greater the stability and the risk of collision, and the greater the damage to the board. That is, in the prior art, when solving the speed and efficiency problems caused by the flap, the stability of the device needs to be sacrificed, and because the stability problem of the device needs to be considered, the speed of the flap lever cannot be greatly increased, so the efficiency improvement is very limited.

SUMMERY OF THE UTILITY MODEL

The utility model aims at the above-mentioned problem, provide an aligning device of LDI automatic line.

In order to achieve the above purpose, the utility model adopts the following technical proposal:

the utility model provides a counterpoint device of LDI automatic line, includes conveying platform, exposure platform and manipulator, the system, positioning system connect and be used for sending the control module with the location result in control module, control module connect in exposure platform so that the exposure platform moves to the corresponding position that is adapted to PCB board position.

In the above LDI automatic connection alignment apparatus, the positioning system is a visual positioning system.

In the above LDI automatic connection alignment apparatus, the visual positioning system includes a visual information acquisition module and a visual information processing module connected to the visual information acquisition module, and the visual information processing module is connected to the control module.

In the above LDI automatic connection alignment device, the visual information acquisition module includes an alignment camera, and the alignment camera is configured to acquire CCD image data and send the CCD image data to the visual information processing module.

In the above LDI automatic wiring alignment device, the alignment camera is mounted above/below/side/rear/front/oblique rear/oblique above/oblique below/oblique front of the conveying platform.

In the above mentioned LDI automatic wiring alignment apparatus, the control module is embedded into the automatic controller of the corresponding LDI automatic wiring device.

In the above-mentioned LDI automatic wiring alignment apparatus, the visual information processing module and the control module are simultaneously embedded into the automatic controller of the corresponding LDI automatic wiring device.

In the above LDI automatic connection alignment device, the conveying platform is provided with a Y-direction position limiting plate.

In the above LDI automatic wiring alignment apparatus, the control module is connected to the manipulator so that the manipulator can adjust to a target position adapted to a PCB position before grasping the PCB.

In the alignment device for LDI automatic connection, the manipulator is provided with a plurality of groups of suckers, the control module is connected to the manipulator and controls the corresponding sucker to effectively grab the PCB according to the positioning result.

The utility model has the advantages that: the scheme breaks the traditional thought of alignment of clapping boards, adopts a visual positioning mode to acquire the position of the PCB, then adapts to the position of the PCB by the exposure machine, does not need to use X to a clapper structure, breaks through the speed limit of mechanical movement, can greatly shorten the time required by clapper alignment, omits the process of impacting clapper, can improve the stability of equipment, and ensures the yield of the PCB to the maximum extent.

Drawings

FIG. 1 is a schematic diagram of an LDI automatic connection alignment device according to the prior art;

FIG. 2 is a schematic structural diagram of an LDI automatic connection alignment device on a PCB conveying platform in the prior art;

fig. 3 is a schematic top view of an LDI automatic wiring device according to an embodiment of the present invention;

fig. 4 is a block diagram of a control structure of an alignment apparatus for LDI automatic connection according to an embodiment of the present invention;

fig. 5 is a block diagram of an embodiment of the present invention, in which a control module and a visual information processing module are embedded in an automatic controller in an alignment apparatus for LDI automatic connection;

fig. 6 is a working process of the positioning system of the alignment device for LDI automatic connection according to the embodiment of the present invention;

fig. 7 is a flowchart illustrating the operation of the alignment apparatus for LDI automatic connection according to an embodiment of the present invention;

fig. 8 is a flowchart illustrating the operation of the alignment apparatus for LDI automatic connection according to the second embodiment of the present invention;

fig. 9 is a block diagram of a control structure of an alignment apparatus for LDI automatic connection according to a second embodiment of the present invention;

fig. 10 is a flowchart of the alignment apparatus for LDI automatic connection according to the third embodiment of the present invention.

Description of the drawings: a conveying platform 1; a roller 11; an exposure stage 2; a manipulator 3; a PCB board 4; a positioning system 5; a visual information acquisition module 51; a visual information processing module 52; a control module 6; an alignment camera 53; a Y-direction limiting plate 7; an X-direction clapper structure 8; a paddle catch lever 81; and an automatic controller 9.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings and specific embodiments.

Currently, the capacity limit in LDI automatic wiring equipment is 10.1 sec/plane, and the capacity per minute is 5.9 sheets/minute. This scheme is through providing a neotype aligning device, will originally be improved by the mode that the PCB board removed the adaptation exposure platform for removing the position that adapts to the PCB board by the exposure platform, breaks traditional clapping board counterpoint thinking, can improve equipment stability, shortens the time consumption of clapping the board process when improving the PCB board yield, improves the productivity of automation equipment greatly, makes automation equipment have qualitative leap on the productivity. The present solution is described in detail below with reference to the accompanying drawings.

Example one

As shown in fig. 3 and 4, the present embodiment provides an alignment apparatus for LDI automatic connection, the apparatus includes a conveying platform 1, an exposure platform 2, a manipulator 3, and a positioning system 5 for positioning a PCB 4 on the conveying platform 1, the conveying platform 1 is provided with a Y-direction limiting plate 7, the positioning system 5 is connected to a control module 6 for sending a positioning result to the control module 6, the control module 6 is connected to the exposure platform 2 so that the exposure platform 2 moves to a corresponding position according to the positioning result to adapt to a current position of the PCB 4, and the PCB 4 does not need to be photographed in an X direction. The positioning system 5 is a visual positioning system, and the visual positioning system includes a visual information obtaining module 51 and a visual information processing module 52 connected to the visual information obtaining module 51, and the visual information processing module 52 is connected to the control module 6. The visual information acquisition module 51 includes an alignment camera 53 installed above/below/side/rear/front/oblique rear/oblique above/oblique below/oblique front of the conveying platform 1, and the alignment camera 53 is configured to collect CCD image data and send the CCD image data to the visual information processing module 52. The installation position of the alignment camera 53 is not absolutely limited, and the DDC image data acquired by the alignment camera only needs to be satisfied, so that the vision positioning system can analyze and determine the position of the PCB.

As shown in fig. 5, the control module 6 according to this embodiment may be embedded in the automatic controller 9 of the LDI automatic device itself, and the visual information processing module 52 may also be embedded in the automatic controller 9 of the LDI automatic connection device itself, so that when the conventional LDI automatic connection device is improved to this embodiment, only the alignment camera 53 needs to be installed at a suitable position, then the alignment camera 53 is connected to the automatic controller 9, and the program of the LDI automatic connection device is updated to embed the visual information processing module 52 and the control module 6 into the automatic controller 9, which is very easy and convenient to upgrade. At this time, as shown in fig. 6, when the exposure apparatus is put into use, the CCD image data is acquired by the alignment camera 53 and sent to the automatic controller 9, and the control module 6 controls the exposure stage 2 based on the position information output from the visual information processing module 52 in the automatic controller 9 after a series of analysis processes are performed on the CCD image data.

Of course, if necessary, a person skilled in the art may also install the visual information processing module 52 or the control module 6 outside the automatic controller 9 of the LDI automatic wiring apparatus, and then connect the visual information processing module 52 or the control module 6 to the automatic controller 9 to join the control system of the LDI automatic wiring apparatus.

As shown in fig. 7, taking the example that the control module 6 is embedded in the automatic controller 9 of the LDI automatic device itself, the implementation method of the positioning device for LDI automatic connection is as follows:

s1, an automatic controller 9 controls a conveying platform 1 to convey a PCB 4 to one end close to an exposure platform 2, and the PCB is limited by a Y-direction limiting plate 7; the time taken and the implementation of this part are the same as in conventional devices. After the step, the traditional equipment carries out plate-clapping alignment on the PCB 4 through the X-direction plate-clapping structure 8, and the scheme carries out alignment through the subsequent steps;

s2, CCD image data containing the PCB 4 are collected by the alignment camera 53 and sent to the visual information processing module 52;

s3, the visual information processing module 52 analyzes and processes the CCD image data to obtain the position information of the PCB 4 and sends the position information to the control module 6, namely the automatic controller 9;

s4, the automatic controller 9 controls the mechanical arm 4 to grab the PCB 4, and meanwhile, an exposure platform control command is generated according to the position information and sent to the exposure platform 2 to enable the exposure platform to move to a corresponding position;

and S5, the automatic controller 9 controls the mechanical arm 3 to convey the grabbed PCB 4 to the exposure platform 2 which is located at the corresponding position.

Traditional LDI automatic wiring equipment moves exposure platform 2 to fixed position, then realize counterpoint both through the position of clapping the board mode adjustment PCB board 4, and this scheme realizes counterpoint both through the mode that makes exposure platform 2 adapt to PCB board 4 position, need not clap the board to PCB board 4, need not consume the movement time of traditional clapping board shelves pole 81 promptly, use signal transmission and signal processing to replace mechanical motion, make speed be the order of magnitude promotion, shorten this part consumed time greatly.

Example two

The manipulator 3 in the first embodiment can accommodate any position of the PCB board, and the manipulator 3 is controlled to perform the grabbing action after the PCB board 4 is transported to the end near the exposure platform 2. The present embodiment is similar to the present embodiment, except that the robot 3 of the present embodiment cannot grasp the PCB 4 at any position, for example, the robot 3 having a set or a small number of suction cups may need to adjust the position of the robot 3. As shown in fig. 8 and 9, the control module 6 receiving the position information is connected to the robot arm 3 so that the robot arm 3 is adjusted to a target position adapted to the position of the PCB 4 before gripping the PCB 4, i.e., the controller 9 grips the PCB 4 after adjusting the robot arm 3 according to the position information of the PCB 4.

EXAMPLE III

As shown in fig. 3, this embodiment is similar to the first embodiment or the second embodiment, except that the manipulator of this embodiment employs a sufficient number of suckers, and the PCB board at any different position can be effectively grasped by controlling different suckers, in this embodiment, the control module 6 is connected to the manipulator 3, and the control module 6 controls the corresponding sucker of the manipulator 3 to be effective according to the positioning result, so as to grasp the PCB board at the current position. Namely, the automatic controller 9 controls the manipulator 3 to grab the PCB 4 and controls the corresponding sucker of the manipulator 3 to be effective according to the position information.

The utility model discloses the people has carried out many times the experiment to the LDI automation equipment that uses this embodiment scheme, and the result shows, and the productivity of 7.5 pieces/minute can be realized to the device of this scheme, has broken through the productivity limit of the automatic wiring equipment 5.9 pieces/minute of present LDI to use this device to carry out the PCB board yield performance of automizing the exposure also fairly good, following is five continuous test data of group, long 1 hour at every turn test:

test sequence number	1 hour capacity	Yield of PCB
			1	450	100％
2	451	100％
			3	450	100％
4	450	100％
			5	450	100％

The specific embodiments described herein are merely illustrative of the spirit of the invention. Various modifications, additions and substitutions for the specific embodiments described herein may be made by those skilled in the art without departing from the spirit of the invention or exceeding the scope of the invention as defined in the accompanying claims.

Although the transport platform 1 is used more herein; a roller 11; an exposure stage 2; a manipulator 3; a PCB board 4; a positioning system 5; a visual information acquisition module 51; a visual information processing module 52; a control module 6; an alignment camera 53; a Y-direction limiting plate 7; an X-direction clapper structure 8; a paddle catch lever 81; automation controller 9, etc., but does not exclude the possibility of using other terms. These terms are used merely to more conveniently describe and explain the nature of the present invention; they are to be construed in a manner that is inconsistent with the spirit of the invention.

Claims

1. The utility model provides a counterpoint device of LDI automatic line, includes conveying platform (1), exposure platform (2) and manipulator (3), its characterized in that, still including being used for carrying out positioning system (5) of location to PCB board (4) on conveying platform (1), positioning system (5) connect and be used for sending the location result for control module in control module (6), control module (6) connect in exposure platform (2) so that exposure platform (2) move to the relevant position that is adapted to PCB board (4) position.

2. The LDI automatic wiring alignment device as claimed in claim 1, wherein said positioning system (5) is a visual positioning system.

3. The LDI automatic wiring alignment device as claimed in claim 2, wherein said visual positioning system comprises a visual information acquisition module (51) and a visual information processing module (52) connected to said visual information acquisition module (51), said visual information processing module (52) being connected to said control module (6).

4. The LDI automatic wiring alignment device according to claim 3, wherein the visual information acquisition module (51) comprises an alignment camera (53), and the alignment camera (53) is used for collecting CCD image data and sending the CCD image data to the visual information processing module (52).

5. The LDI automatic line alignment device according to claim 4, wherein said alignment camera (53) is installed above/below/side/back/front/oblique back/oblique above/oblique below/oblique front of the transportation platform (1).

6. The LDI automatic wiring alignment device according to claim 5, wherein said control module (6) is embedded in the automatic controller (9) of the corresponding LDI automatic wiring device.

7. The LDI automatic wiring alignment device according to claim 6, wherein said visual information processing module (52) and said control module (6) are embedded into the automatic controller (9) of the corresponding LDI automatic wiring device at the same time.

8. The LDI automatic line alignment device according to any of claims 1 to 7, wherein the conveying platform (1) is provided with a Y-direction limiting plate (7).

9. The LDI automatic wiring alignment apparatus as claimed in any of claims 1 to 7, wherein said control module (6) is connected to said robot (3) so that said robot (3) can adjust to a target position adapted to the position of the PCB (4) before gripping the PCB (4).

10. The LDI automatic line alignment device according to any of claims 1 to 7, wherein said robot arm (3) has a plurality of sets of suckers, and said control module (6) is connected to said robot arm (3) and controls the corresponding sucker to be effective for PCB grabbing according to the positioning result.