CN214852018U

CN214852018U - High-precision multilayer PCB circuit board

Info

Publication number: CN214852018U
Application number: CN202121451114.XU
Authority: CN
Inventors: 郭亚楠; 张秀英
Original assignee: Jiangxi Heying Circuit Co ltd
Current assignee: Jiangxi Heying Circuit Co ltd
Priority date: 2021-06-29
Filing date: 2021-06-29
Publication date: 2021-11-23
Anticipated expiration: 2031-06-29

Abstract

The utility model relates to a high-precision multilayer PCB circuit board, which comprises a circuit board main body, a plurality of single-layer circuit boards are arranged in the circuit board main body, connecting plates are arranged at two sides of the single-layer circuit boards, mounting holes are dug at two ends of the connecting plates, radiating fins are arranged at one side of the mounting holes, a connecting structure is arranged at the middle part of the connecting plates, a connecting line structure is dug at the top of the single-layer circuit boards, the single-layer circuit boards can be fixed and connected by arranging a strip-shaped groove and a pushing block, the multi-layer circuit boards can be assembled and disassembled and maintained conveniently according to the needs, meanwhile, the connecting effect and the fixing effect between the circuit boards are increased by matching with the connecting line holes and the connecting pins, the performance of the circuit boards is improved, when the circuit boards are used, heat on the circuit boards is conducted and transmitted to the radiating fins by the fixing blocks of the inner cavities, the heat dissipation performance of the circuit board is improved by matching with the grid type heat dissipation sheet to quickly dissipate heat.

Description

High-precision multilayer PCB circuit board

Technical Field

The utility model relates to a high-accuracy multilayer PCB circuit board belongs to the relevant technical field of circuit board.

Background

The PCB board is the abbreviation of the English (PrintedcuieBoard) printed wiring board, usually on the insulating material, according to the predetermined design, make the conductive pattern that the printed-circuit, printed-circuit component or both are made up, called the printed circuit, and provide the conductive pattern of the electrical connection between the components and parts on the insulating substrate, called the printed-circuit, but most multilayer breadboards pass the machine pressfitting through glue and form, the damage rate of the breadboard will be high, meanwhile, can only change the whole when the breadboard of the inner layer is damaged, moreover, the breadboard is bad in use radiating effect, cause and generate heat and cause the damage to the circuit, therefore we improve this, make the breadboard easy to assemble, the fixed effect is better, dispel the heat to the breadboard, for this, provide a high-accuracy multilayer PCB breadboard.

SUMMERY OF THE UTILITY MODEL

The utility model discloses the technical problem who solves overcomes current defect, provides a high-accuracy multilayer PCB circuit board, can effectively solve the problem in the background art.

In order to solve the technical problem, the utility model provides a following technical scheme:

the utility model provides a high-accuracy multilayer PCB circuit board, includes the circuit board main part, be equipped with a plurality of individual layer circuit boards in the circuit board main part, the connecting plate is installed to individual layer circuit board both sides, the connecting plate both ends are dug and are equipped with the mounting hole, the fin is installed to mounting hole one side, the connecting plate middle part is equipped with connection structure, individual layer circuit board top is dug and is equipped with the line structure.

Further, connection structure includes bar groove, ejector pad and spring, the connecting plate both sides middle part is all dug and is equipped with the bar groove, one side bar inslot chamber installs the ejector pad, ejector pad one end fixedly connected with connecting block, the connecting block runs through bar inslot wall connection and has the fly leaf, the connecting plate inner chamber is dug with the corresponding position of fly leaf and is equipped with the recess, the spring is installed to the recess inner chamber, spring one end connection recess inner wall, and spring other end fixed connection fly leaf.

Further, a clamping groove is dug in the inner cavity of the strip-shaped groove on one side, a clamping block is fixedly connected to the bottom of the push block, and the clamping block is connected with the clamping groove in a clamping mode.

Furthermore, the line structure includes line hole and connection needle, the symmetry is dug in the middle part of the individual layer circuit board and is equipped with a plurality of line holes, the connection needle is worn to be equipped with in the line hole inner chamber, connect needle and line hole and be nested connection.

Further, the connecting plate is connected for dismantling with the individual layer circuit board, the fixed block is installed to connecting plate one side symmetry, the fixed block runs through the connecting plate and is connected with the fin, the equal symmetry in individual layer circuit board both ends is dug and is equipped with the spread groove, the fixed block is connected for the block with the spread groove.

Further, the radiating fins are of a grid type structure, are located on two sides of the connecting plate and are consistent with the vertical cross section of the connecting plate in size.

The utility model discloses beneficial effect:

1. through being equipped with bar groove and ejector pad, can fix and connect a plurality of individual layer circuit boards, carry out the equipment of multilayer circuit board to needs, convenient to detach and maintenance, the connection hole that the cooperation was equipped with simultaneously increases the connection effect and the fixed effect between the circuit board with connecting the needle, promotes the performance of circuit board.

2. Through being equipped with fixed block and fin, when using the circuit board, heat on the circuit board is conducted heat and is transmitted to the fin through the fixed block of inner chamber, and the fin of cooperation grid formula gives off the heat fast, promotes the heat dispersion of circuit board.

Drawings

The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention.

FIG. 1 is a front view of the high-precision multi-layer PCB of the present invention;

FIG. 2 is a view of the high-precision multi-layer PCB structure of the present invention;

FIG. 3 is a sectional view of the connecting board structure of the high-precision multilayer PCB of the present invention;

FIG. 4 is an internal view of the high-precision multi-layer PCB circuit board connection structure of the present invention;

reference numbers in the figures: 1. a circuit board main body; 2. a single-layer circuit board; 3. a connecting plate; 4. mounting holes; 5. a heat sink; 6. a connecting structure; 7. a wiring structure; 8. a strip-shaped groove; 9. a push block; 10. a spring; 11. connecting blocks; 12. a movable plate; 13. a card slot; 14. a clamping block; 15. a wire connecting hole; 16. a connecting needle; 17. a fixed block; 18. and connecting the grooves.

Detailed Description

The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are presented herein only to illustrate and explain the present invention, and not to limit the present invention.

As shown in fig. 1-4, a high-precision multilayer PCB comprises a circuit board main body 1, a plurality of single-layer circuit boards 2 are arranged in the circuit board main body 1, connecting plates 3 are arranged on two sides of the single-layer circuit boards 2, mounting holes 4 are dug at two ends of the connecting plates 3 for mounting the circuit board main body 1, a heat sink 5 is arranged on one side of each mounting hole 4, a connecting structure 6 is arranged in the middle of each connecting plate 3, a connecting line structure 7 is dug at the top of each single-layer circuit board 2, each connecting structure 6 comprises a bar-shaped groove 8, a push block 9 and a spring 10, a bar-shaped groove 8 is dug in the middle of each of two sides of each connecting plate 3, a push block 9 is arranged in an inner cavity of the bar-shaped groove 8 on one side, a connecting block 11 is fixedly connected to one end of each push block 9, the connecting block 11 penetrates through the inner wall of the bar-shaped groove 8 to be connected with a movable plate 12, and a groove is dug at a position, corresponding to the inner cavity of each connecting plate 3 and the movable plate 12, spring 10 is installed to the recess inner chamber, spring 10 one end connection recess inner wall, and spring 10 other end fixed connection fly leaf 12, one side the 8 inner chambers in bar groove dig and are equipped with draw-in groove 13, ejector pad 9 bottom fixedly connected with fixture block 14, fixture block 14 is connected for the block with draw-in groove 13, can carry out the aggregate erection at the ejector pad 9 of 8 inner chambers in bar groove with a plurality of individual layer circuit boards 2 through controlling the circulation, is convenient for increase and fix the number of piles of multilayer circuit board, also is convenient for overhaul the circuit board simultaneously and dismantle.

As shown in fig. 2-4, the wiring structure 7 includes a wiring hole 15 and a connecting needle 16, a plurality of connecting wire holes 15 are symmetrically dug in the middle of the single-layer circuit board 2, connecting needles 16 penetrate through the inner cavities of the connecting wire holes 15, the connecting pins 16 are connected with the connecting wire holes 15 in a nested way, so that the circuit communication effect of the circuit board main body 1 is enhanced, the plurality of single-layer circuit boards 2 are limited and fixed at the same time, the connecting board 3 is detachably connected with the single-layer circuit boards 2, one side of the connecting plate 3 is symmetrically provided with fixed blocks 17, the fixed blocks 17 penetrate through the connecting plate 3 and are connected with the radiating fins 5, connecting grooves 18 are symmetrically dug at both ends of the single-layer circuit board 2, the fixing block 17 is connected with the connecting grooves 18 in a clamping way, the connecting plate 3 and the single-layer circuit board 2 can be disassembled and assembled, and the two sides of the single-layer circuit board 2 are protected, so that the circuit board is prevented from being damaged by rubbing and damage.

As shown in fig. 2, the heat dissipation fins 5 are of a grid structure, the heat dissipation fins 5 are located on two sides of the connecting plate 3 and are consistent with the vertical cross-sectional dimension of the connecting plate 3, heat generated by the circuit board is transmitted to the heat dissipation fins 5 through the fixing block 17, and heat dissipation is performed through the grid structure, so that the heat dissipation effect is enhanced.

The utility model discloses a theory of operation: when using, when the staff assembles circuit board main part 1, pass through fixed block 17 and spread groove 18 block with connecting plate 3, install the connecting plate 3 at both ends, then press and promote the shrink of ejector pad 9 compression spring 10, make fixture block 14 retrieve, aim at bar groove 8 of opposite side individual layer circuit board 2 and place and the block, line hole 15 has also been connected with connecting pin 16 simultaneously, circuit intercommunication effect between two individual layer circuit boards 2 has been strengthened, fix and lock the structure, dispel the heat on the fin 5 of grid formula is transmitted the heat through being equipped with fixed block 17 at the 2 inner chambers of individual layer circuit board, when the multilayer circuit board to needs preparation, can be through the inner chamber of installing ejector pad 9 reverse at opposite side bar groove 8 on a plurality of individual layer circuit boards 2, carry out the equipment of multilayer, and is simple in operation, and convenient for popularization.

The above is the preferred embodiment of the present invention, and the technical personnel in the field of the present invention can also change and modify the above embodiment, therefore, the present invention is not limited to the above specific embodiment, and any obvious improvement, replacement or modification made by the technical personnel in the field on the basis of the present invention all belong to the protection scope of the present invention.

Claims

1. The utility model provides a high-accuracy multilayer PCB circuit board, includes circuit board main part (1), its characterized in that: be equipped with a plurality of individual layer circuit boards (2) in circuit board main part (1), connecting plate (3) are installed to individual layer circuit board (2) both sides, digging at connecting plate (3) both ends and being equipped with mounting hole (4), fin (5) are installed to mounting hole (4) one side, connecting plate (3) middle part is equipped with connection structure (6), digging at individual layer circuit board (2) top is equipped with line structure (7).

2. A high precision multi-layer PCB circuit board according to claim 1, wherein: connection structure (6) include bar groove (8), ejector pad (9) and spring (10), connecting plate (3) both sides middle part all digs and is equipped with bar groove (8), one side bar groove (8) inner chamber is installed ejector pad (9), ejector pad (9) one end fixedly connected with connecting block (11), connecting block (11) run through bar groove (8) inner wall connection has fly leaf (12), connecting plate (3) inner chamber digs with fly leaf (12) corresponding position and is equipped with the recess, spring (10) are installed to the recess inner chamber, spring (10) one end connecting groove inner wall, and spring (10) other end fixed connection fly leaf (12).

3. A high precision multi-layer PCB circuit board according to claim 2, wherein: a clamping groove (13) is dug in the inner cavity of the strip-shaped groove (8) on one side, a clamping block (14) is fixedly connected to the bottom of the push block (9), and the clamping block (14) is connected with the clamping groove (13) in a clamping mode.

4. A high precision multi-layer PCB circuit board according to claim 3, wherein: line structure (7) include line hole (15) and be connected needle (16), individual layer circuit board (2) middle part symmetry is dug and is equipped with a plurality of line holes (15), connection needle (16) are worn to be equipped with by line hole (15) inner chamber, connect needle (16) and line hole (15) and be nested connection.

5. A high precision multilayer PCB circuit board according to claim 4, wherein: connecting plate (3) are connected for dismantling with individual layer circuit board (2), fixed block (17) are installed to connecting plate (3) one side symmetry, fixed block (17) run through connecting plate (3) and are connected with fin (5), the equal symmetry in individual layer circuit board (2) both ends is dug and is equipped with spread groove (18), fixed block (17) are connected for the block with spread groove (18).

6. A high precision multilayer PCB circuit board according to claim 5, wherein: the radiating fins (5) are of a grid type structure, and the radiating fins (5) are located on two sides of the connecting plate (3) and are consistent with the vertical section of the connecting plate (3) in size.