CN214675754U

CN214675754U - Electronic circuit module

Info

Publication number: CN214675754U
Application number: CN202121128513.2U
Authority: CN
Inventors: 孔祥路
Original assignee: Guangdong Menlo Electric Power Co ltd
Current assignee: Guangdong Menlo Electric Power Co ltd
Priority date: 2021-05-24
Filing date: 2021-05-24
Publication date: 2021-11-09
Anticipated expiration: 2031-05-24

Abstract

The utility model relates to an electronic circuit module, which comprises an electronic element, a circuit conducting layer and a PCB board; the electronic element is connected with the PCB into a whole, the pins are exposed out of the surface of the PCB, and the circuit conducting layer is arranged on the outer surface of the PCB and connected with the pins to realize an electrical function; and after the electronic element, the circuit conducting layer and the PCB are connected, the electronic element, the circuit conducting layer and the PCB are encapsulated by potting or injection molding materials to form a module. The potting or injection molding material can encapsulate, wrap and conduct heat to all the circuit conducting layers and the PCB and at least parts of the electronic elements, so that capacitors, and/or resistors, and/or inductors of the electronic elements can be arranged in a shell-free mode, manufacturing cost is reduced, and production process is simplified; meanwhile, when the module is an electromagnetic induction heating module, the IGBT and the rectifier bridge stack of the electronic element are also connected with a radiator, and the IGBT, the rectifier bridge stack and the radiator can be encapsulated or semi-encapsulated by potting or injection molding materials, so that the manufacturing cost is further reduced, and the production process is simplified.

Description

Electronic circuit module

Technical Field

The utility model relates to an electronic circuit technical field specifically is an electronic circuit module.

Background

Chinese patent document No. CN205607181U discloses a heating control module of a high-frequency electromagnetic induction heating furnace in 2016, 9, 28, which includes a first dc input bus bar, a second dc input bus bar, a first output bus bar, a second output bus bar, and an IGBT module; a plurality of filter capacitors connected in parallel are arranged between the first direct current input bus bar and the second direct current input bus bar; the input end of the IGBT module is connected with a first direct current input bus bar and a second direct current input bus bar through the filter capacitor, the output end of the IGBT module is connected with a first output bus bar and a second output bus bar, and the driving end of the IGBT module is connected with the driving board. The structure adopts the matching of the mounting bottom plate and the protective cover to coat the three mother row sheets so as to realize the module setting of the whole product. However, the structure is quite complex, a cavity is formed inside the mounting base plate and the protective cover after the mounting base plate and the protective cover are assembled, and the three bus bars are arranged in the cavity respectively, so that the capacitors on the three bus bars must be provided with the shell when being arranged, the manufacturing cost of the product is high, and the production process is complex. Therefore, further improvements are necessary.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing an electronic circuit module rational in infrastructure, with low costs to overcome the weak point among the prior art.

An electronic circuit module designed for this purpose, comprising an electronic component and a circuit conducting layer, characterized in that: the PCB board is also included; the electronic element is connected with the PCB into a whole, the pins are exposed out of the surface of the PCB, and the circuit conducting layer is arranged on the outer surface of the PCB and connected with the pins to realize an electrical function; and the electronic element, the circuit conducting layer and the PCB are connected and then encapsulated by potting or injection molding materials to form a module.

The potting or injection molding material has certain insulation and heat conductivity, and encapsulates and wraps the circuit conducting layer, all the PCB and at least part of the electronic element.

The potting or injection molding material is solid epoxy material, polyurethane or modified resin, and the surface of the potting or injection molding material is provided with a tooth sheet which is beneficial to heat dissipation.

The circuit conducting layer is a PCB technology copper-clad connecting circuit layer, a metal deposition connecting circuit layer or a 3D printing connecting circuit layer attached to the surface of the PCB, or the circuit conducting layer is a wire overline connecting circuit layer.

The electronic element comprises a capacitor, a resistor, an inductor, a wiring terminal and a quick connection socket; the capacitor, the resistor, the inductor, the wiring terminal and the quick-connection socket are respectively connected with the PCB into a whole, and the pins are exposed out of the surface of the PCB; and the circuit conducting layer is respectively connected with the capacitor, the resistor, the inductor, the wiring terminal and a pin of the quick-connection socket.

The capacitor is a shell-free capacitor core and is packaged and wrapped by potting or injection molding material, and/or the resistor is a shell-free resistor core and is packaged and wrapped by potting or injection molding material, and/or the inductor is a shell-free inductor core and is packaged and wrapped by potting or injection molding material.

And the wiring part of the wiring terminal and the quick-connection socket is exposed out of potting or injection molding materials.

The electronic element further comprises an IGBT and a rectifier bridge stack; the IGBT and the rectifier bridge stack are respectively connected with the radiator into a whole; the radiator is connected with the PCB into a whole; wherein, the IGBT, the rectifier bridge stack and the radiator are fully encapsulated or semi-encapsulated in potting or injection molding material. The capacitor, the resistor, the inductor, the IGBT, the rectifier bridge stack and the circuit conducting layer are connected to form an electromagnetic induction heating circuit used for the induction cooker. When the IGBT and the rectifier bridge stack are fully encapsulated, the IGBT and the rectifier bridge stack are in a shell structure or a shell-free structure, preferably a shell-free structure (i.e. without encapsulation), and the cost is lower.

The radiator is an aluminum radiator, a graphite radiator, a graphene radiator or a heat pipe radiator.

The PCB is also provided with a hollow part.

Through the improvement of the structure, the electronic element and the circuit conducting layer are respectively arranged on the PCB, and are encapsulated by adopting potting or injection molding materials after the three are connected to form a module, thereby realizing the finished product module arrangement of PCB; the encapsulating or injection molding material can encapsulate and wrap all the circuit conducting layer and the PCB and at least the part of the electronic element, so that a capacitor and/or a resistor and/or an inductor of the electronic element can be arranged in a shell-free mode, the manufacturing cost is further reduced, and the production process is simplified; the potting or injection molding material can also conduct heat to the electronic element, so that heat generated by the electronic element during working is flattened, and the use stability of the module is ensured; meanwhile, the module can be applied to products in various electronic fields, when the module is an electromagnetic induction heating module, the IGBT and the rectifier bridge stack of the electronic element are further connected with a radiator, and potting or injection molding materials can encapsulate or semi-encapsulate the IGBT, the rectifier bridge stack and the radiator, so that the manufacturing cost is further reduced, and the production process is simplified.

In summary, the novel LED lamp has the characteristics of simple and reasonable structure, low manufacturing cost, simple manufacturing process, convenience in matching and assembling, wide application range, easiness in production, easiness in implementation and the like, and is high in practicability.

Drawings

Fig. 1 is a schematic view (hidden inside) of an assembly structure of a first embodiment of the present invention.

Fig. 2 is another assembly structure diagram of the first embodiment of the present invention.

Fig. 3 is a schematic view of another assembly structure of the first embodiment of the present invention.

Fig. 4 is a schematic view of an assembly structure of the electronic component, the circuit conducting layer and the PCB according to the first embodiment of the present invention.

Fig. 5 is a schematic view of another assembly structure of the electronic component, the circuit conducting layer and the PCB according to the first embodiment of the present invention.

Fig. 6 is a schematic view of another assembly structure of the electronic component, the circuit conductive layer and the PCB according to the first embodiment of the present invention.

Fig. 7 is a schematic view of an assembly structure according to a second embodiment of the present invention.

Fig. 8 is a schematic view of another assembly structure according to the second embodiment of the present invention.

Detailed Description

The present invention will be further described with reference to the accompanying drawings and examples.

First embodiment, referring to fig. 1-6, the electronic circuit module includes an electronic component, a circuit conductive layer 1, and a PCB board 2; the electronic element is connected with the PCB 2 into a whole, the pins are exposed out of the surface of the PCB 2, and the circuit conducting layer 1 is arranged on the outer surface of the PCB 2 and connected with the pins to realize an electrical function; and the electronic element, the circuit conducting layer 1 and the PCB 2 are connected and then encapsulated by potting or injection molding material 3 to form a module.

The potting or injection molding material 3 has certain insulation and heat conductivity, and encapsulates and wraps the circuit conducting layer 1, the PCB 2 and the electronic elements.

The encapsulating or injection molding material 3 is solid epoxy material, polyurethane or modified resin, wherein the modified resin is formed by mixing and injection molding resin material and microcrystalline paraffin. The surface of the potting or injection molding material 3 after curing is provided with fins 4 which help to dissipate heat.

The circuit conducting layer 1 is a PCB technology copper-clad connecting circuit layer, a metal deposition connecting circuit layer or a 3D printing connecting circuit layer attached to the surface of the PCB 2, or the circuit conducting layer 1 is a wire overline connecting circuit layer.

The electronic components comprise a capacitor 5, a resistor 6, an inductor 7, a wiring terminal 8 and a quick-connection socket 9; the capacitor 5, the resistor 6, the inductor 7, the wiring terminal 8 and the quick-connection socket 9 are respectively connected with the PCB 2 into a whole, and pins are exposed out of the surface of the PCB 2; the circuit conducting layer 1 is connected with the pins of the capacitor 5, the resistor 6, the inductor 7, the connecting terminal 8 and the quick-connection socket 9 respectively.

The capacitor 5 is a shell-free capacitor core and is encapsulated and wrapped by the potting or injection molding material 3, the resistor 6 is a shell-free resistor core and is encapsulated and wrapped by the potting or injection molding material 3, and/or the inductor 7 is a shell-free inductor core and is encapsulated and wrapped by the potting or injection molding material 3. Therefore, the capacitor 5 and/or the resistor 6 and/or the inductor 7 can be arranged in a shell-free mode, and the potting or injection molding material 3 can serve as the shell of the capacitor 5 and/or the resistor 6 and/or the inductor 7, so that the manufacturing cost is reduced, and the production process is simplified.

The wiring part of the wiring terminal 8 and the quick-connection socket 9 is exposed out of the potting or injection molding material 3, so that the power input and output connection is facilitated.

The electronic components in the module can be added with a small module consisting of a plurality of other electronic components to realize more functions. The electromagnetic induction heating power with different requirements can change the parameters of electronic elements to realize cost reduction.

When the module is an induction cooker module, the electronic elements further comprise an IGBT 10 (field effect transistor) and a rectifier bridge stack 11; the IGBT 10 and the rectifier bridge stack 11 are respectively connected with a radiator 12 into a whole; the radiator 12 is connected with the PCB 2 into a whole; wherein, IGBT 10, rectifier bridge stack 11 and radiator 12 are totally enveloped in potting or injection molding material 3.

The radiator 12 is an aluminum radiator, a graphite radiator, a graphene radiator or a heat pipe radiator. The heat sink 12 may be connected with the IGBT 10 and the bridge stack 11 in advance, and then may be attached to the PCB board 2, or may be designed to be detachable.

The circuit conducting layer 1, the capacitor 5, the resistor 6, the inductor 7, the connecting terminal 8, the quick-connection socket 9, the IGBT 10, the rectifier bridge stack 11 and the radiator 12 are respectively arranged on the PCB 2, and are encapsulated by the potting or injection molding material 3 after being connected with each other to form a module, so that the PCB electromagnetic induction heating finished product module is arranged, the manufacturing cost is reduced, and the production process is simplified; and the potting or injection molding material 3 can also conduct heat to the electronic element, so that the heat generated by the electronic element during working is flattened, and the use stability of the module is ensured.

The PCB board 2 is further provided with a hollow-out part 13, the arrangement of the hollow-out part 13 is convenient for flowing of the potting or injection molding material 3 at the initial stage of packaging, so that the uncured potting or injection molding material 3 can be uniformly packaged on the electronic element, the circuit conducting layer 1 and the PCB board 2.

During production, the pins of the PCB 2 corresponding to the electronic elements are provided with grooves or holes, the electronic elements and the radiators 12 are distributed on the PCB 2, the pins of the electronic elements fall into the grooves or holes, the overlong pins are cut short or bent, then the circuit conducting layer 1 is arranged on the PCB 2, then the potting or injection molding material 3 is placed on the PCB 2, the potting or injection molding material 3 is a solidifiable insulating material with fluidity initially, the shape of the potting or injection molding material 3 shown in figures 1-3 is formed after the solidification of the flowable insulating material, and meanwhile the electronic elements, the circuit conducting layer 1 and the PCB 2 are packaged. The pins (wiring portions) of the electronic components are exposed out of the potting or injection molding material 3, and lead lines are arranged on the pins, so that the electromagnetic induction heating circuit module is formed.

Second embodiment, referring to fig. 7 and 8, the electronic circuit module differs from the first embodiment in that: the IGBT 10, the rectifier bridge stack 11 and the radiator 12 are semi-encapsulated in the potting or injection molding material 3, namely the IGBT 10, the rectifier bridge stack 11 and the radiator 12 can be directly contacted with the outside air, and the heat dissipation efficiency is improved.

The other parts not described are the same as those of the first embodiment.

The foregoing is a preferred embodiment of the present invention showing and describing the basic principles, main features and advantages of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are intended to illustrate the principles of the invention, but rather that various changes and modifications may be made without departing from the spirit and scope of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An electronic circuit module comprising an electronic component and a circuit conductive layer (1), characterized in that: the PCB board (2) is also included; the electronic element is connected with the PCB (2) into a whole, the pins are exposed out of the surface of the PCB (2), and the circuit conducting layer (1) is arranged on the outer surface of the PCB (2) and connected with the pins to realize the electrical function; and the electronic element, the circuit conducting layer (1) and the PCB (2) are connected and then encapsulated by potting or injection molding material (3) to form a module.

2. The electronic circuit module of claim 1, wherein: the potting or injection molding material (3) has certain insulation and heat conductivity, and encapsulates and wraps the circuit conducting layer (1), the PCB (2) and at least the part of the electronic element.

3. The electronic circuit module of claim 1, wherein: the potting or injection molding material (3) is solid epoxy material, polyurethane or modified resin, and tooth sheets (4) which are beneficial to heat dissipation are arranged on the surface of the potting or injection molding material.

4. The electronic circuit module of claim 1, wherein: the circuit conducting layer (1) is a PCB technology copper-clad connecting circuit layer, a metal deposition connecting circuit layer or a 3D printing connecting circuit layer attached to the surface of the PCB (2), or the circuit conducting layer (1) is a wire overline connecting circuit layer.

5. The electronic circuit module of claim 1, wherein: the electronic element comprises a capacitor (5), a resistor (6), an inductor (7), a wiring terminal (8) and a quick-connection socket (9); the capacitor (5), the resistor (6), the inductor (7), the wiring terminal (8) and the quick-connection socket (9) are respectively connected with the PCB (2) into a whole, and the pins are exposed out of the surface of the PCB (2); the circuit conducting layer (1) is respectively connected with the capacitor (5), the resistor (6), the inductor (7), the wiring terminal (8) and pins of the quick-connection socket (9).

6. The electronic circuit module of claim 5, wherein: the capacitor (5) is a shell-free capacitor core and is encapsulated and wrapped by encapsulation or injection molding material (3), the resistor (6) is a shell-free resistor core and is encapsulated and wrapped by encapsulation or injection molding material (3), and/or the inductor (7) is a shell-free inductor core and is encapsulated and wrapped by encapsulation or injection molding material (3).

7. The electronic circuit module of claim 5, wherein: and the wiring part of the wiring terminal (8) and the quick-connection socket (9) is exposed out of the potting or injection molding material (3).

8. The electronic circuit module of claim 5, wherein: the electronic components further comprise an IGBT (10) and a bridge rectifier (11); the IGBT (10) and the rectifier bridge stack (11) are respectively connected with a radiator (12) into a whole; the radiator (12) is connected with the PCB (2) into a whole; wherein, the IGBT (10), the rectifier bridge stack (11) and the radiator (12) are completely or semi-encapsulated in the potting or injection molding material (3); the capacitor (5), the resistor (6), the inductor (7), the IGBT (10), the rectifier bridge stack (11) and the circuit conducting layer (1) are connected to form an electromagnetic induction heating circuit; when the IGBT (10) and the rectifier bridge stack (11) are completely encapsulated, the IGBT (10) and the rectifier bridge stack (11) are in a shell structure or a shell-free structure.

9. The electronic circuit module of claim 8, wherein: the radiator (12) is an aluminum radiator, a graphite radiator, a graphene radiator or a heat pipe radiator.

10. The electronic circuit module of claim 1, wherein: the PCB (2) is also provided with a hollow part (13).