CN214544232U - Four-side-path five-outlet diode module - Google Patents
Four-side-path five-outlet diode module Download PDFInfo
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- CN214544232U CN214544232U CN202023144206.1U CN202023144206U CN214544232U CN 214544232 U CN214544232 U CN 214544232U CN 202023144206 U CN202023144206 U CN 202023144206U CN 214544232 U CN214544232 U CN 214544232U
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- chip mounting
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Abstract
The utility model relates to a five diode modules that go out of four sides way, including the electrically conductive chip mounting panel of first electrically conductive chip mounting panel and second, the electrically conductive body one end in the middle of first electrically conductive chip mounting panel is connected through first chip, and the first electrically conductive chip mounting panel passes through the second chip and connects anodal current conducting plate, and the electrically conductive chip mounting panel of second passes through the third chip and connects the middle electric conductor other end, and the electrically conductive chip mounting panel of second passes through the fourth chip and connects the negative pole current conducting plate. The utility model has simple structure and small occupied space; the plastic packaging structure is suitable for a four-bypass assembly structure, the chip is directly connected with the electric conductor for plastic packaging, the chip is directly connected with the electric conductor for reducing intermediate connection, impedance heating is reduced, the heat conduction distance is shortened, and heat dissipation is faster.
Description
Technical Field
The utility model belongs to the technical field of terminal box for the solar module, a five diode modules that go out of four bypasses is related to.
Background
At present, a photovoltaic module mainly comprises glass, a battery, a frame, EVA sealant, a back plate, a junction box and the like. The junction box is the most important circuit structural member in the photovoltaic module, controls effective connection among the components, and simultaneously plays a bypass protection function for each photovoltaic module. The conventional integrated junction box mainly comprises a plastic box body box cover, 4 paths of metal conductors, 3 bypass diodes, a cable and a connector, internal circuits are formed by resistance welding or crimping, connection points are more, and the internal circuits are long-term reliable and face to test with stability. Particularly, with the continuous increase of the size of the battery, the requirement of rated current is larger and larger, the requirement of rated current of the existing assembly manufactured by using the whole battery and the half battery with the side length of 210mm reaches more than 25A, and the diode connecting circuit in the conventional integrated junction box cannot meet the actual requirement more and more.
Disclosure of Invention
An object of the utility model is to provide a five diode modules that go out on four sides way can improve long-term reliable and stability of internal circuit.
According to the utility model provides a technical scheme: the utility model provides a four-side way five-head diode module, includes the electrically conductive chip mounting panel of first electrically conductive chip and the electrically conductive chip mounting panel of second, the electrically conductive chip mounting panel of first electrically conductive is connected through first chip anodal current conducting plate, the electrically conductive chip mounting panel of first electrically conductive is connected intermediate conductor one end through the second chip, the electrically conductive chip mounting panel of second is connected the intermediate conductor other end through the third chip, the electrically conductive chip mounting panel of second is connected the negative pole current conducting plate through the fourth chip.
As a further improvement of the present invention, the first conductive chip mounting plate is connected to the first chip side and the second chip side by solder paste; and a first bus board connecting part is arranged on the first conductive chip mounting plate and is a rectangular groove.
As a further improvement, the intermediate conductor is provided with a second bus bar connecting portion, one end of the intermediate conductor is connected with the second chip through solder paste, the other end of the intermediate conductor is connected with the third chip through solder paste, and the second bus bar connecting portion is a rectangular groove.
As a further improvement of the present invention, a positive wire connecting portion is provided at one end of the positive conductive plate, a third bus bar connecting portion is provided in the positive conductive plate, and one end of the positive conductive plate is connected to one side of the first chip through solder paste; the third bus bar connecting part is a rectangular groove, and the positive electrode wire connecting part is of a groove type.
As a further improvement of the present invention, the second conductive chip mounting plate is connected to the third chip one side and the fourth chip one side by solder paste. A fourth bus bar connecting part is arranged on the second conductive chip mounting plate; the fourth bus bar connecting portion is a rectangular groove.
As a further improvement of the utility model, one end of the negative electrode current-conducting plate is provided with a negative electrode wire connecting part, and a negative electrode bus bar connecting part is arranged in the negative electrode current-conducting plate; one end of the negative conducting plate is connected with one side of the fourth chip through solder paste; the negative pole cylinder manifold connecting portion are rectangular grooves, and the negative pole wire connecting portion are groove-shaped.
As a further improvement, the first conductive chip mounting plate, the intermediate conductor, the positive conductive plate, the second conductive chip mounting plate, and the negative conductive plate are made of metal material.
The positive progress effect of this application lies in:
1. the utility model has simple structure and small occupied space; the plastic packaging structure is suitable for a four-bypass assembly structure, the chip is directly connected with the electric conductor for plastic packaging, the chip is directly connected with the electric conductor for reducing intermediate connection, impedance heating is reduced, the heat conduction distance is shortened, and heat dissipation is faster.
2. The utility model discloses whole module structural design reduces the electrified connection of outside, promotes terminal box production technology reliability.
Drawings
Fig. 1 is a schematic structural diagram of the present invention.
Fig. 2 is a schematic structural diagram of the first conductive chip mounting plate of the present invention.
Fig. 3 is a schematic structural diagram of a second conductive chip mounting plate according to the present invention.
Fig. 4 is a schematic structural diagram of the installation of the present invention.
Detailed Description
It should be noted that the embodiments and features of the embodiments of the present invention may be combined with each other without conflict. The present invention will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.
In order to make the technical solution of the present invention better understood, the technical solution of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts shall belong to the protection scope of the present invention.
It should be noted that the terms "first," "second," and the like in the description and claims of the present invention and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged under appropriate circumstances for purposes of describing the embodiments of the invention herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover such processes, methods, systems, articles, or apparatus that comprise a list of steps or elements, are not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such processes, methods, articles, or apparatus.
In fig. 1-4, the chip includes a first conductive chip mounting board 1, an intermediate conductor 2, a positive conductive plate 3, a second conductive chip mounting board 4, a negative conductive plate 5, a first chip 6-1, a second chip 6-2, a third chip 6-3, a fourth chip 6-4, a junction box 7, and the like.
As shown in fig. 1, the utility model relates to a four-side five-head diode module, including first electrically conductive chip mounting panel 1 and the electrically conductive chip mounting panel 4 of second, first electrically conductive chip mounting panel 1 is through the anodal current conducting plate 3 of first chip 6-1 connection, and first electrically conductive chip mounting panel 1 is through second chip 6-2 connection intermediate conductor 2 one end, and the electrically conductive chip mounting panel 4 of second is through the 2 other ends of third chip 6-3 connection intermediate conductor, and the electrically conductive chip mounting panel 4 of second is through fourth chip 6-4 connection negative pole current conducting plate 5.
As shown in fig. 2, the first conductive chip mounting board 1 is connected to the first chip 6-1 side and the second chip 6-2 side by solder paste. The first conductive chip mounting plate 1 is provided with a first bus bar connecting portion 1-1.
The first bus bar connecting portion 1-1 is a rectangular groove.
The intermediate conductor 2 is provided with a second bus bar connecting part 2-1. One end of the intermediate conductor 2 is connected with one side of the second chip 6-2 through solder paste. The other end of the intermediate conductor 2 is connected with one side of the third chip 6-3 through solder paste.
The second bus bar connecting part 2-1 is a rectangular groove.
One end of the positive conductive plate 3 is provided with a positive wire connecting part 3-1, and the positive conductive plate 3 is provided with a third bus bar connecting part 3-2. One end of the positive conductive plate 3 is connected with one side of the first chip 6-1 through solder paste.
The third bus bar connecting part 3-2 is a rectangular groove. The positive electrode wire connecting portion 3-1 is of a groove type.
As shown in fig. 3, the third chip 6-3 side and the fourth chip 6-4 side are connected to the second conductive chip mounting board 4 by solder paste. The second conductive chip mounting plate 4 is provided with a fourth bus bar connecting portion 4-1.
The fourth bus bar connecting portion 4-1 is a rectangular groove.
One end of the negative electrode conducting plate 5 is provided with a negative electrode wire connecting part 5-1, and the negative electrode conducting plate 5 is provided with a negative electrode bus bar connecting part 5-2. One end of the negative electrode conductive plate 5 is connected with one side of the fourth chip 6-4 through solder paste.
The negative electrode bus bar connecting part 5-2 is a rectangular groove. The negative electrode wire connecting portion 5-1 is of a groove type.
The first conductive chip mounting plate 1, the intermediate conductor 2, the positive conductive plate 3, the second conductive chip mounting plate 4 and the negative conductive plate 5 are all made of metal materials.
The first chip 6-1, the second chip 6-2, the third chip 6-3 and the fourth chip 6-4 are schottky wafers (also called metal doped wafers) and are used for replacing bypass diodes.
As shown in fig. 4, the module is mounted inside the junction box 7.
The working process of the utility model is as follows:
the first bus bar connecting part 1-1, the second bus bar connecting part 2-1, the third bus bar connecting part 3-2, the fourth bus bar connecting part 4-1 and the negative bus bar connecting part 5-2 are connected with the bus bars through wires.
The positive cable is embedded in the positive wire connecting part 3-1, and the negative cable is embedded in the negative wire connecting part 5-1. And completing the connection of the whole module.
It is to be understood that the above embodiments are merely exemplary embodiments that have been employed to illustrate the principles of the present invention, and that the present invention is not limited thereto. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit and substance of the invention, and these modifications and improvements are also considered to be within the scope of the invention.
Claims (7)
1. The utility model provides a four-way five-outlet diode module which characterized in that: the module comprises a first conductive chip mounting plate (1) and a second conductive chip mounting plate (4), wherein the first conductive chip mounting plate (1) is connected with a positive conductive plate (3) through a first chip (6-1), the first conductive chip mounting plate (1) is connected with one end of an intermediate conductive body (2) through a second chip (6-2), the second conductive chip mounting plate (4) is connected with the other end of the intermediate conductive body (2) through a third chip (6-3), and the second conductive chip mounting plate (4) is connected with a negative conductive plate (5) through a fourth chip (6-4).
2. The four-way five-head diode module of claim 1, wherein: the first conductive chip mounting plate (1) is connected with one side of the first chip (6-1) and one side of the second chip (6-2) through solder paste; the first conductive chip mounting plate (1) is provided with a first bus plate connecting portion (1-1), and the first bus plate connecting portion (1-1) is a rectangular groove.
3. The four-way five-head diode module of claim 1, wherein: the middle conductor (2) is provided with a second bus plate connecting part (2-1), one end of the middle conductor (2) is connected with one side of the second chip (6-2) through solder paste, the other end of the middle conductor (2) is connected with one side of the third chip (6-3) through solder paste, and the second bus plate connecting part (2-1) is a rectangular groove.
4. The four-way five-head diode module of claim 1, wherein: one end of the positive conductive plate (3) is provided with a positive wire connecting part (3-1), a third bus bar connecting part (3-2) is arranged in the positive conductive plate (3), and one end of the positive conductive plate (3) is connected with one side of the first chip (6-1) through solder paste; the third bus bar connecting part (3-2) is a rectangular groove, and the positive electrode wire connecting part (3-1) is of a groove type.
5. The four-way five-head diode module of claim 1, wherein: the second conductive chip mounting plate (4) is connected with one side of the third chip (6-3) and one side of the fourth chip (6-4) through solder paste; a fourth bus bar connecting part (4-1) is arranged on the second conductive chip mounting plate (4); the fourth bus bar connecting part (4-1) is a rectangular groove.
6. The four-way five-head diode module of claim 1, wherein: a negative wire connecting part (5-1) is arranged at one end of the negative conductive plate (5), and a negative bus bar connecting part (5-2) is arranged in the negative conductive plate (5); one end of the negative conductive plate (5) is connected with one side of the fourth chip (6-4) through solder paste; the negative pole bus board connecting part (5-2) is a rectangular groove, and the negative pole wire connecting part (5-1) is of a groove type.
7. The four-way five-head diode module of claim 1, wherein: the first conductive chip mounting plate (1), the intermediate conductor (2), the positive conductive plate (3), the second conductive chip mounting plate (4) and the negative conductive plate (5) are all made of metal materials.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023144206.1U CN214544232U (en) | 2020-12-23 | 2020-12-23 | Four-side-path five-outlet diode module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023144206.1U CN214544232U (en) | 2020-12-23 | 2020-12-23 | Four-side-path five-outlet diode module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214544232U true CN214544232U (en) | 2021-10-29 |
Family
ID=78295971
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202023144206.1U Active CN214544232U (en) | 2020-12-23 | 2020-12-23 | Four-side-path five-outlet diode module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214544232U (en) |
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2020
- 2020-12-23 CN CN202023144206.1U patent/CN214544232U/en active Active
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