CN214474862U - Dustproof heat dissipation machine case of small-size host computer - Google Patents

Abstract

The utility model discloses a dustproof heat dissipation machine case of small-size host computer mainly relates to electronic equipment heat dissipation field. The heat dissipation device comprises a case, machine incasement one side is equipped with the treater, machine incasement opposite side is equipped with the equipment that generates heat, machine case one side is equipped with the air outlet, air outlet department is equipped with radiator fan, radiator fan sets up the side that generates heat at the equipment that generates heat, machine case one side still is equipped with the air intake, still be equipped with supplementary heat abstractor between radiator fan and the equipment that generates heat, be equipped with a temperature sensor on the equipment that generates heat, a temperature sensor is connected with the treater electricity. The beneficial effects of the utility model reside in that: the external air circulation of the equipment is forced, the heat dissipation efficiency is improved, and the heat dissipation rate and the heat dissipation mode can be flexibly adjusted according to the change of the temperature of the equipment.

Description

Dustproof heat dissipation machine case of small-size host computer

Technical Field

The utility model relates to an electronic equipment heat dissipation field specifically is a dustproof heat dissipation machine case of small-size host computer.

Background

At present, many electronic devices such as computer hosts, routers, firewalls and the like are developed towards miniaturization, the heat productivity of the CPUs or core socs of the small electronic devices is still large and concentrated, the devices are mainly used for naturally radiating heat to the air by utilizing device shells with good heat conduction performance during work, and the shell temperature is generally higher than 40 ℃.

Therefore, the problem of heat accumulation of small electronic devices due to local heat accumulation is a main cause of unstable operation of such devices, and the service life of the devices is greatly reduced due to long-term high-temperature operation.

The traditional mode of naturally radiating to the air by depending on the equipment shell is obviously not enough to meet the radiating requirement of the equipment, the traditional mode of circularly radiating by depending on natural air is also very slow and is not enough to meet the radiating requirement, and the common radiating equipment only has one radiating mode and cannot be flexibly adjusted according to the change of the temperature of the equipment.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a dustproof heat dissipation machine case of small-size host computer, it forces equipment outside air circulation, improves the radiating efficiency, and can adjust radiating rate and mode according to the change of equipment temperature in a flexible way.

The utility model discloses a realize above-mentioned purpose, realize through following technical scheme:

the utility model provides a dustproof heat dissipation machine case of small-size host computer, includes quick-witted case, machine incasement one side is equipped with the treater, machine incasement opposite side is equipped with the equipment that generates heat, machine case one side is equipped with the air outlet, air outlet department is equipped with radiator fan, radiator fan sets up the side that generates heat at the equipment that generates heat, machine case one side still is equipped with the air intake, still be equipped with supplementary heat abstractor between radiator fan and the equipment that generates heat, be equipped with a temperature sensor on the equipment that generates heat, a temperature sensor is connected with the treater electricity.

Furthermore, the auxiliary heat dissipation device selects a semiconductor refrigeration piece, the semiconductor refrigeration piece is electrically connected with the processor, and the refrigeration surface of the semiconductor refrigeration piece is in contact with the heating device.

Furthermore, a heat-conducting rubber cushion is arranged between the semiconductor refrigerating sheet and the heating device.

Furthermore, the air inlet and the air outlet are respectively arranged at two sides of the heating device.

Furthermore, a second temperature sensor is arranged in the case and electrically connected with the processor.

Furthermore, a dust filtering net is arranged at the air inlet.

Contrast prior art, the beneficial effects of the utility model reside in that:

the heating equipment generates heat when working, the first temperature sensor arranged on the heating equipment is used for monitoring the amount of heat generated by the heating equipment, and transmitting information to the processor for analysis and processing, when the generated heat is less and the temperature is lower, the processor controls the cooling fan to slowly rotate to generate air flow circulation, or only depends on the case to perform heat dissipation, when the first temperature sensor detects temperature rise, the processor controls the cooling fan to rapidly rotate, so as to force air circulation inside and outside the case to perform heat dissipation, if the indoor temperature is originally high in hot seasons, the temperature value detected by the first temperature sensor is higher when the good heat dissipation effect cannot be achieved by the cooling fan alone, the processor controls the auxiliary heat dissipation device to start while controlling the cooling fan to operate fully, so that the cooling fan and the auxiliary heat dissipation device are matched to dissipate heat of the heating equipment, compare in traditional quick-witted case, this patent quick-witted case can initiatively force and carry out air cycle to the machine incasement and outside, and carry out real-time supervision to the temperature of the equipment that generates heat to make corresponding heat dissipation measure adjustment according to temperature variation, the radiating mode is nimble changeable more, guarantees that the radiating effect is better, thereby guarantees the normal work of equipment.

Drawings

Fig. 1 is a structural sectional view of the present invention.

Reference numerals shown in the drawings:

1. a chassis; 2. a processor; 3. a heat generating device; 4. an air outlet; 5. a heat radiation fan; 6. an air inlet; 7. a first temperature sensor; 8. a semiconductor refrigeration sheet; 9. a heat-conducting rubber pad; 10. a second temperature sensor; 11. and (4) a dust filter screen.

Detailed Description

The present invention will be further described with reference to the following specific examples. It should be understood that these examples are for illustrative purposes only and are not intended to limit the scope of the present invention. Furthermore, it should be understood that various changes or modifications of the present invention may be made by those skilled in the art after reading the teachings of the present invention, and these equivalents also fall within the scope defined in the present application.

Example (b): a dustproof heat dissipation case of a small host comprises a case 1, wherein a processor 2 is arranged on one side in the case 1, a control chip is arranged in the processor 2 and used for receiving signals and issuing control instructions, a heating device 3 is arranged on the other side in the case 1 and is an assembly of main working devices, the heating device 3 generates heat when working, an air outlet 4 is arranged on one side of the case 1, a heat dissipation fan 5 is arranged at the air outlet 4, the heat dissipation fan 5 is arranged on the heating side of the heating device 3 and can rapidly discharge the heat generated when the heating device 3 works, a radiator consisting of a plurality of heat dissipation fins is arranged between the heat dissipation fan 5 and the heating device 3, an air inlet 6 is further arranged on one side of the case 1, the air inlet 6 and the air outlet 4 are respectively arranged on two sides of the heating device 3, so that air circulates around the heating device 3, more be favorable to the ventilation cooling of equipment 3 department that generates heat, 6 departments of air intake are equipped with dust filter 11, prevent that equipment 3 that generates heat from influencing the heat dissipation because of the surperficial laying dust, and dust filter 11 ensures radiator fan 5 simultaneously and radiating fin surface cleaning, unlikely fan stifled commentaries on classics, radiating fin radiating efficiency that cause radiator fan 5 because of the laying dust are low, still be equipped with semiconductor refrigeration piece 8 between radiator and the equipment 3 that generates heat, semiconductor refrigeration piece 8 is connected with 2 electricity of treater, be equipped with heat conduction cushion 9 between semiconductor refrigeration piece 8 and the equipment 3 that generates heat, heat conduction cushion 9 is fixed to be laminated on the equipment 3's that generates heat side, the refrigeration face and the heat conduction cushion 9 contact of semiconductor piece 8, the installation order is: the heat-radiating device comprises a heating device 3, a heat-conducting rubber cushion 9, a semiconductor refrigerating sheet 8, a radiator and a cooling fan 5, wherein a first temperature sensor 7 is arranged on the heating device 3, the first temperature sensor 7 is electrically connected with a processor 2, a second temperature sensor 10 is arranged in a case 1, the second temperature sensor 10 is electrically connected with the processor 2, a wire inlet is formed in one side of the case 1, and a data wire is connected with equipment inside the case 1 from the wire inlet.

Several temperature nodes are arranged in the processor 2 in advance, the temperature is respectively high and high, the temperature value corresponding to each node is set by itself,

when a control chip of the processor 2 detects that the temperature of the heating equipment 3 rises through the first temperature sensor 7, and the cooling fan 5 needs to be started to operate, the processor 2 starts the cooling fan 5 to operate, the cooling fan 5 enables hot air around the heating equipment 3 in the case 1 to be exhausted out of the case through the radiator, the cooling fan 5 and the air outlet 4, and negative pressure in the case 1 after the air is exhausted enables air outside the case to flow into the case after being filtered by the air inlet 6 and the dust filter 11, so that natural heat dissipation of air circulation is realized, external air circulation of the equipment is forced, and the air flow participating in heat exchange of the equipment is greatly increased;

when the control chip of the processor 2 detects that the temperature of the heating device 3 is high through the first temperature sensor 7 and the heat cannot be effectively dissipated only through air circulation, and the semiconductor refrigerating sheet 8 needs to be started to enhance refrigeration, the processor 2 starts the heat dissipation fan 5 to operate and simultaneously energizes the semiconductor refrigerating sheet 8; at this time, due to the peltier effect, the semiconductor cooling plate 8 is cooled by abutting against one side of the heating device 3, and absorbs the heat conducted by the heating device 3 through the heat conducting rubber pad 9; the semiconductor refrigerating sheet 8 is heated up by abutting against one side of the radiator, when the heat dissipation fan 5 enables the hot air around the heating equipment in the box to pass through the radiator, the hot air is collected and conducted again by the radiator and then is exhausted out of the box through the air outlet 4, the negative pressure in the box after the air is exhausted enables the air outside the box to flow into the box after being filtered by the air inlet 6 and the dust filter 11, and therefore the composite heat dissipation of combining the air circulation with the semiconductor refrigerating sheet 8 is achieved;

when the processor 2 detects that the temperature in the case 1 is close to the temperature of the heat generating device 3 through the second temperature sensor 10, that is, the temperature value detected by the second temperature sensor 10 is close to the temperature value detected by the first temperature sensor 7, if heat needs to be dissipated from the heat generating device 3 at the moment, the processor 2 directly and simultaneously starts the operation of the heat dissipating fan 5 and the power on of the semiconductor chilling plates 8.

The invention has good heat dissipation effect, can effectively solve the problem of poor heat dissipation of equipment such as a small computer host, small network core equipment and the like during long-time running, and can adjust the heat dissipation mode in time according to the temperature change, so that the heat dissipation effect is better.

Claims (6)

1. The utility model provides a dustproof heat dissipation machine case of small-size host computer which characterized in that: including quick-witted case (1), one side is equipped with treater (2) in quick-witted case (1), the opposite side is equipped with equipment (3) that generates heat in quick-witted case (1), machine case (1) one side is equipped with air outlet (4), air outlet (4) department is equipped with radiator fan (5), radiator fan (5) set up the side that generates heat at equipment (3) that generates heat, machine case (1) one side still is equipped with air intake (6), still be equipped with supplementary heat abstractor between radiator fan (5) and the equipment (3) that generates heat, be equipped with first temperature sensor (7) on equipment (3) that generates heat, first temperature sensor (7) are connected with treater (2) electricity.

2. The dustproof heat dissipation case of the small host according to claim 1, characterized in that: the auxiliary heat dissipation device is characterized in that a semiconductor refrigerating piece (8) is selected for use, the semiconductor refrigerating piece (8) is electrically connected with the processor (2), and a refrigerating surface of the semiconductor refrigerating piece (8) is in contact with the heating equipment (3).

3. The dustproof heat dissipation case of the small host according to claim 2, characterized in that: and a heat-conducting rubber cushion (9) is arranged between the semiconductor refrigerating sheet (8) and the heating equipment (3).

4. The dustproof heat dissipation case of the small host according to claim 1, characterized in that: the air inlet (6) and the air outlet (4) are respectively arranged on two sides of the heating equipment (3).

5. The dustproof heat dissipation case of the small host according to claim 1, characterized in that: and a second temperature sensor (10) is arranged in the case (1), and the second temperature sensor (10) is electrically connected with the processor (2).

6. The dustproof heat dissipation case of the small host according to claim 1, characterized in that: and a dust filtering net (11) is arranged at the air inlet (6).

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