CN214052793U - Silicon wafer cleaning machine - Google Patents
Silicon wafer cleaning machine Download PDFInfo
- Publication number
- CN214052793U CN214052793U CN202022745234.2U CN202022745234U CN214052793U CN 214052793 U CN214052793 U CN 214052793U CN 202022745234 U CN202022745234 U CN 202022745234U CN 214052793 U CN214052793 U CN 214052793U
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- Prior art keywords
- silicon wafer
- cleaning machine
- silicon
- guide
- wafer cleaning
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 122
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 118
- 239000010703 silicon Substances 0.000 title claims abstract description 118
- 238000004140 cleaning Methods 0.000 title claims abstract description 50
- 230000007246 mechanism Effects 0.000 claims abstract description 100
- 238000005507 spraying Methods 0.000 claims abstract description 34
- 238000001035 drying Methods 0.000 claims abstract description 21
- 238000001179 sorption measurement Methods 0.000 claims abstract description 18
- 235000012431 wafers Nutrition 0.000 claims description 68
- 230000005540 biological transmission Effects 0.000 claims description 22
- 230000007306 turnover Effects 0.000 claims description 16
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 13
- 230000005484 gravity Effects 0.000 claims description 2
- 230000006872 improvement Effects 0.000 description 7
- 230000007723 transport mechanism Effects 0.000 description 7
- 238000010521 absorption reaction Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 239000012535 impurity Substances 0.000 description 4
- 239000003814 drug Substances 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- 230000003749 cleanliness Effects 0.000 description 2
- 238000005034 decoration Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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- Cleaning Or Drying Semiconductors (AREA)
Abstract
The utility model provides a silicon wafer cleaning machine, which relates to the technical field of silicon wafer cleaning and comprises a conveying mechanism, wherein a feeding mechanism, a guide mechanism, a mechanical cleaning mechanism, a spraying mechanism and a drying mechanism are sequentially arranged on the conveying track of the conveying mechanism; feed mechanism includes feeding frame, turning device and drive arrangement, turning device sets up on the feeding frame, drive arrangement fixes on the feeding frame just drive arrangement's power take off end is connected with the pivot, a plurality of the turning device cover is established the pivot outside, be provided with the adsorption element that a plurality of was used for fixed silicon chip on the contact surface of turning device and silicon chip, the utility model discloses the silicon chip is difficult damaged, clean effectual.
Description
Technical Field
The utility model relates to a silicon chip washs technical field, especially relates to a silicon chip cleaning machine.
Background
After the chemical mechanical polishing of the silicon wafer is completed, a layer of active monocrystalline silicon atoms is formed on the surface of the silicon wafer, the active silicon atoms have an unpaired electron and can adsorb external impurities such as positive charges, negative charges and the like, so the silicon wafer is required to be cleaned. After cleaning, the silicon wafers in the cleaning basket need to be replaced for cleaning next time, and the existing replacement mode is that the workers take the silicon wafers in the cleaning basket out in sequence and then place the unwashed silicon wafers in the cleaning basket, so that the efficiency is extremely low.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the technical problem of overcoming the defects in the prior art, providing a silicon wafer cleaning machine with good cleaning effect and convenient feeding,
the utility model discloses a realize through following technical scheme: a silicon wafer cleaning machine is characterized in that: the automatic feeding and drying device comprises a conveying mechanism, wherein a feeding mechanism, a guide mechanism, a mechanical cleaning mechanism, a spraying mechanism and a drying mechanism are sequentially arranged on a conveying track of the conveying mechanism; the feeding mechanism comprises a feeding frame, a turnover device and a driving device, wherein the turnover device is arranged on the feeding frame, the driving device is fixed on the feeding frame, the power output end of the driving device is connected with the rotating shaft, the turnover device is sleeved on the outer side of the rotating shaft, and a plurality of adsorption pieces used for fixing the silicon wafer are arranged on the contact surface of the turnover device and the silicon wafer.
The utility model discloses technical scheme's further improvement lies in: the turnover device is a rectangular rod, a through hole which is matched with the diameter of the rotating shaft is formed in the center of the rectangular rod, and a plurality of adsorption pieces are arranged on the contact surface of the rectangular rod and the silicon wafer.
The utility model discloses technical scheme's further improvement lies in: the adsorption piece on the rectangular rod is provided with two groups, wherein the two groups are centrosymmetric, and the two groups are centered at the center of gravity of the rectangular rod.
The utility model discloses technical scheme's further improvement lies in: the guide mechanism comprises a plurality of groups of guide pieces arranged along the width direction of the silicon wafer cleaning machine, each guide piece comprises a pair of guide strips arranged in an opposite inclined mode and guide wheels arranged at the tops of the guide strips, and the distance between the guide strips is gradually reduced along the advancing direction of the silicon wafers.
The utility model discloses technical scheme's further improvement lies in: the spraying mechanism comprises a plurality of spraying pipes, the spraying pipes are arranged above the conveying mechanism, and a plurality of spraying heads are uniformly distributed on the spraying pipes. The spraying pipes are divided into two groups, one group of spraying pipes is connected with a pure water pipeline, and the other group of spraying pipes is connected with the circulating pure water pipeline through a water return pipe.
The utility model discloses technical scheme's further improvement lies in: the mechanical cleaning mechanism comprises a plurality of brush rollers and a transmission belt, the brush rollers and the transmission belt are arranged in a vertically staggered mode in the advancing direction of the silicon wafers, the brush rollers comprise rotating rollers and brushes arranged on the rotating rollers, and a plurality of groups are arranged on the mechanical cleaning mechanism in the width direction of the conveying mechanism.
The utility model discloses technical scheme's further improvement lies in: the drying mechanism is arranged above the conveying mechanism and comprises a plurality of air knives which are arranged in a vertically staggered mode along the advancing direction of the silicon wafer, and air outlets of the air knives face towards the silicon wafer.
The utility model discloses technical scheme's further improvement lies in: the conveying mechanism comprises a conveying belt and a transmission rod, the conveying belt is provided with a plurality of groups along the width direction of the silicon wafer cleaning machine, the transmission rod is arranged at the position of the guide mechanism and the drying mechanism, and the axial direction of the transmission rod is parallel to the width direction of the silicon wafer cleaning machine.
The utility model has the advantages that: the feeding mechanism drives the turnover device through the driving device, the turnover device fixes the silicon wafer through the adsorption piece, the turnover device overturns the silicon wafer to the guide mechanism, the impact between the silicon wafer and the turnover device is slowed down through the adsorption piece, the damage to the silicon wafer is avoided, the product quality is reduced, the static friction force between the silicon wafer and the turnover device is increased through the adsorption piece, the silicon wafer is not easy to fall off when the turnover device overturns along with the silicon wafer, the guide mechanism guides the adjustment direction of the silicon wafer to facilitate the cleaning of the upper surface and the lower surface of the silicon wafer by a subsequent mechanical cleaning mechanism, the spraying mechanism sprays and washes the silicon wafer, the silicon wafer is dried by a drying mechanism to obtain a clean silicon wafer, the cleaning efficiency is improved, the cleanliness of the silicon wafer is reduced, and the defective rate of the silicon wafer is reduced.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a partially enlarged view of the drying mechanism of the present invention;
FIG. 3 is a partial enlarged view of the feeding mechanism of the present invention;
FIG. 4 is a partially enlarged view of the guiding mechanism of the present invention;
FIG. 5 is a schematic view of the cross section of the utility model along the length direction;
FIG. 6 is a partial schematic view of the mechanical cleaning mechanism of the present invention;
fig. 7 is a front view of the present invention;
in the figure: 1. a feeding mechanism; 2. a guide mechanism; 3. a mechanical cleaning structure; 4. a spraying mechanism; 5. a drying mechanism; 6. a transport mechanism; 7. a turning device; 8. an adsorbing member; 9. a guide member; 10. a guide wheel; 11. a brush roller; 12. an air knife; 13. a transmission rod; .
Detailed Description
In order to make those skilled in the art better understand the technical solution of the present invention, the present invention will be further described in detail with reference to the accompanying drawings and preferred embodiments.
Referring to fig. 1-7, the utility model relates to a silicon wafer cleaning machine, which comprises a conveying mechanism 6, a feeding mechanism 1, a guiding mechanism 2, a mechanical cleaning mechanism, a spraying mechanism 4 and a drying mechanism 5; the feeding mechanism 1, the guide mechanism 2, the mechanical cleaning mechanism, the spraying mechanism 4 and the drying mechanism 5 are sequentially arranged on a conveying track of the conveying mechanism 6 from the conveying direction. The feeding mechanism 1 comprises a feeding frame, a turnover device 7 and a driving device, the driving device is a rotary motor, a rotating shaft is arranged on the feeding frame, the axial direction of the rotating shaft is parallel to the width direction of the conveying mechanism 6, a power output shaft of the motor drives the rotating shaft to rotate, a plurality of turnover devices 7 are sleeved on the rotating shaft, the turnover devices 7 are rectangular rods, open rectangular pole central authorities has the through-hole, the through-hole shape suits with the pivot, set up the absorption piece 8 that is used for fixed silicon chip on the rectangular pole, absorption piece 8 has two sets ofly, every group sets up on the face that rectangular pole tip to rectangular pole central authorities formed, two sets of absorption pieces 8 use the focus of rectangular pole to make central symmetry setting as the center, absorption piece 8 is a plurality of linear arrangement's sucking disc, the sucking disc plays the effect that the silicon chip slows down the impact of rectangular pole to the silicon chip and avoids the silicon chip damaged, the stiction is big between sucking disc and the silicon chip, the silicon chip is difficult for sliding. The pivot is rotatory, the rotatory contact silicon chip of rectangular rod, silicon chip contact sucking disc, the silicon chip falls to the transport mechanism 6 of guiding mechanism 2 one side along with the rotatory 180 degrees of rectangular rod on, the silicon chip is driven by transport mechanism 6 and continues to advance, the silicon chip of feeding frame is adsorbed to another group's absorption piece 8, the rectangular rod continues rotatory 180 degrees, the silicon chip falls to the transport mechanism 6 of guiding mechanism 2 one side along with the rotatory 180 degrees of rectangular rod on, the silicon chip is driven by transport mechanism 6 and continues to advance, turning device 7 accomplishes a duty cycle. The utility model discloses the outside is provided with the casing for prevent dust impurity's entering.
Referring to fig. 4, the guide mechanism 2 includes a plurality of sets of guide members 9, the guide members 9 are disposed on the conveying mechanism 6, the guide members 9 include a pair of guide bars disposed to be inclined with respect to each other and guide wheels 10 disposed on top of the guide bars, the number of the guide wheels 10 is plural, a distance between the pair of guide bars is gradually reduced along a silicon wafer advancing direction, and the distance between the guide bars is greater than a width of the silicon wafer. The silicon chip is guided by a guide wheel 10 arranged on the guide strip along with the advancing of the conveying mechanism 6, and the guide wheel 10 is arranged to avoid the silicon chip from colliding with the guide strip to generate defect and reduce the quality of the silicon chip.
Referring to fig. 6, the mechanical cleaning mechanism comprises a plurality of brush rollers 11 and transmission belts, the brush rollers 11 and the transmission belts are arranged in a vertically staggered mode in the advancing direction of the silicon wafer, the transmission belts are arranged on the corresponding lower surfaces of the silicon wafer when the brush rollers 11 are arranged on the upper surface of the silicon wafer, the transmission belts are arranged on the corresponding upper surfaces of the silicon wafer when the brush rollers 11 are arranged on the lower surface of the silicon wafer, and the brush rollers 11 and the transmission belts are arranged in a vertically staggered mode to ensure the cleaning of the upper and lower surfaces of the silicon wafer. The brush roller 11 comprises a rotating roller and a brush arranged on the rotating roller, the brush cleans the surface of the silicon wafer, and the brush roller 11 removes hard impurity particles on the upper surface and the lower surface of the silicon wafer. The mechanical cleaning mechanism is provided with a plurality of groups along the width direction of the conveying mechanism 6, so that the upper surface and the lower surface of a plurality of silicon wafers can be cleaned simultaneously.
The spraying mechanism 4 comprises a plurality of spraying pipes, the spraying pipes are arranged above the conveying mechanism 6, and a plurality of spraying heads are uniformly distributed on the spraying pipes. The spraying pipes are divided into two groups, one group of spraying pipes is connected with the pure water pipeline, and the other group of spraying pipes is connected with the circulating pure water pipeline through a water return pipe. The spraying device is started, the spraying pipe is firstly sprayed on the silicon wafer by the circulating pure water through the spraying head to clean, the concentration of the liquid medicine on the silicon wafer is large at the moment, and the concentration of the liquid medicine in the circulating pure water is smaller than that of the liquid medicine on the silicon wafer, so that the cleaning effect can be achieved. By adopting the washing mode, water can be saved, the utilization rate of clean water is improved, and the investment cost is reduced. After cleaning, drying device carries out the drying to the silicon chip, and drying mechanism 5 includes the crisscross air knife 12 that sets up about a plurality of edge silicon chip advancing direction, 12 air outlets of air knife are towards the silicon chip, and 12 air outlet widths of air knife are in 0.05mm to 0.01 mm's scope, and air knife 12 adopts compressed air, vortex fan or high-pressure centrifugal fan drive air knife 12 to produce powerful air curtain for blow off the impurity on silicon chip surface, weather silicon chip surface moisture rapidly, and air knife 12 material can select for use aluminum alloy or stainless steel to make. The stainless steel air knife 12 is suitable for high-temperature and high-corrosion environments. The silicon chip is driven by the conveying mechanism 6 to discharge. The conveying mechanism 6 comprises a conveying belt and a transmission rod 13, the conveying belt is provided with a plurality of groups along the width direction of the silicon wafer cleaning machine, the transmission rod 13 is arranged at the position of the guide mechanism 2 and the drying mechanism 5, the axial direction of the transmission rod 13 is parallel to the width direction of the silicon wafer cleaning machine, the transmission rod 13 rotates to drive the silicon wafer to move, the guide part 9 of the guide mechanism 2 is arranged below the transmission rod 13, and the air knives 12 of the drying mechanism 5 are arranged above and below the transmission rod 13 in a staggered mode. In a further embodiment, a transmission rod 13 is arranged at the feeding frame, the axial direction of the transmission rod 13 is perpendicular to the rotating shaft, and the transmission rod 13 rotates to transversely move the silicon wafer to the rectangular rod of the turnover device 7.
In a further embodiment, the adsorption part 8 is a vacuum chuck, the chuck is communicated with the inside of the rectangular rod, the rotating shaft is communicated with the rectangular rod, and one end of the rotating shaft, which is far away from the driving device, is provided with a negative pressure device for providing negative pressure for the chuck. The pivot is rotatory, and the rotatory contact silicon chip of rectangular rod adsorbs 8 silicon chips, and the silicon chip falls to transport mechanism 6 of guiding mechanism 2 one side along with the rotatory 180 degrees of rectangular rod on, and negative pressure device stop work, the silicon chip falls to transport mechanism 6, opens negative pressure mechanism, adsorbs 8 silicon chips that adsorb the feed frame, and the rectangular rod continues to rotate 180 degrees, closes negative pressure device, and turning device 7 accomplishes a duty cycle. The vacuum chuck is used for carrying out negative pressure adsorption on the silicon wafer, the adsorption effect is good, and the silicon wafer is not easy to fall off.
The utility model has the advantages that: feed mechanism 1 drives turning device 7 through drive arrangement, turning device 7 is fixed through adsorption element 8 with the silicon chip, turning device 7 overturns the silicon chip to guiding mechanism 2 on, the impact between silicon chip and turning device 7 has been slowed down through adsorption element 8, avoid the silicon chip damage to reduce product quality, adsorption element 8 has increased the static friction force between silicon chip and the turning device 7, the silicon chip is difficult for droing when following the turning device 7 upset, guiding mechanism 2 guides the silicon chip adjustment direction and is convenient for follow-up mechanical cleaning mechanism to clean the upper and lower surfaces of silicon chip, spray mechanism 4 and spray the washing to the silicon chip, carry out the drying to the silicon chip through drying mechanism 5 and obtain clear silicon chip, improved clean efficiency and improved the silicon chip cleanliness and reduced the defective percentage of silicon chip.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.
Claims (8)
1. A silicon wafer cleaning machine is characterized in that: the device comprises a conveying mechanism (6), wherein a feeding mechanism (1), a guide mechanism (2), a mechanical cleaning mechanism, a spraying mechanism (4) and a drying mechanism (5) are sequentially arranged on a conveying track of the conveying mechanism (6); feeding mechanism (1) is including feeding frame, turning device (7) and drive arrangement, turning device (7) set up on the feeding frame, drive arrangement fixes on the feeding frame just drive arrangement's power take off end is connected with the pivot, a plurality of turning device (7) cover is established the pivot outside, be provided with adsorption component (8) that a plurality of is used for fixed silicon chip on the contact surface of turning device (7) and silicon chip.
2. The silicon wafer cleaning machine according to claim 1, wherein: the turnover device (7) is a rectangular rod, a through hole which is matched with the diameter of the rotating shaft is formed in the center of the rectangular rod, and a plurality of adsorption pieces (8) are arranged on the contact surface of the rectangular rod and the silicon wafer.
3. The silicon wafer cleaning machine according to claim 2, wherein: the adsorption piece (8) on the rectangular rod is provided with two groups, the two groups are centrosymmetric to the adsorption piece (8), and the two groups of adsorption pieces (8) take the gravity center of the rectangular rod as the center.
4. The silicon wafer cleaning machine according to claim 1, wherein: the guide mechanism (2) comprises a plurality of groups of guide pieces (9) arranged along the width direction of the silicon wafer cleaning machine, each guide piece (9) comprises a pair of guide strips arranged in a relatively inclined mode and guide wheels (10) arranged at the tops of the guide strips, and the distance between the guide strips is gradually reduced along the advancing direction of the silicon wafers.
5. The silicon wafer cleaning machine according to claim 1, wherein: the spraying mechanism (4) comprises a plurality of spraying pipes, the spraying pipes are arranged above the conveying mechanism (6), a plurality of spraying heads are uniformly distributed on the spraying pipes, the spraying pipes are divided into two groups, one group of spraying pipes is connected with a pure water pipeline, and the other group of spraying pipes is connected with the circulating pure water pipeline through a water return pipe.
6. The silicon wafer cleaning machine according to claim 1, wherein: the mechanical cleaning mechanism comprises a plurality of brush rollers (11) and a transmission belt, wherein the brush rollers (11) and the transmission belt are arranged in a vertically staggered mode in the advancing direction of the silicon wafers, the brush rollers (11) comprise rotating rollers and brushes arranged on the rotating rollers, and a plurality of groups are arranged on the mechanical cleaning mechanism in the width direction of the conveying mechanism (6).
7. The silicon wafer cleaning machine according to claim 1, wherein: the drying mechanism (5) is arranged above the conveying mechanism (6), the drying mechanism (5) comprises a plurality of air knives (12) which are arranged in a vertically staggered mode along the advancing direction of the silicon wafer, and air outlets of the air knives (12) face the silicon wafer.
8. The silicon wafer cleaning machine according to claim 1, wherein: conveying mechanism (6) include conveyor belt and transfer line (13), conveyor belt is provided with a plurality of groups along silicon chip cleaning machine width direction, transfer line (13) set up guiding mechanism (2) with drying mechanism (5) department, the axial direction and the silicon chip cleaning machine width direction of transfer line (13) are parallel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022745234.2U CN214052793U (en) | 2020-11-24 | 2020-11-24 | Silicon wafer cleaning machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022745234.2U CN214052793U (en) | 2020-11-24 | 2020-11-24 | Silicon wafer cleaning machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214052793U true CN214052793U (en) | 2021-08-27 |
Family
ID=77403356
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022745234.2U Expired - Fee Related CN214052793U (en) | 2020-11-24 | 2020-11-24 | Silicon wafer cleaning machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214052793U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115945422A (en) * | 2022-12-26 | 2023-04-11 | 张家港杰茂铝业有限公司 | A quick cleaning device for aluminum profiles before packaging |
| CN116435230A (en) * | 2023-06-15 | 2023-07-14 | 常州比太科技有限公司 | A silicon wafer plate conveying and cleaning equipment and working method |
| CN116741889A (en) * | 2023-08-10 | 2023-09-12 | 苏州昊建自动化系统有限公司 | An equipment for removing BSG from the surface of silicon wafers |
-
2020
- 2020-11-24 CN CN202022745234.2U patent/CN214052793U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115945422A (en) * | 2022-12-26 | 2023-04-11 | 张家港杰茂铝业有限公司 | A quick cleaning device for aluminum profiles before packaging |
| CN116435230A (en) * | 2023-06-15 | 2023-07-14 | 常州比太科技有限公司 | A silicon wafer plate conveying and cleaning equipment and working method |
| CN116435230B (en) * | 2023-06-15 | 2023-08-11 | 常州比太科技有限公司 | Silicon wafer plate conveying and cleaning equipment and working method |
| CN116741889A (en) * | 2023-08-10 | 2023-09-12 | 苏州昊建自动化系统有限公司 | An equipment for removing BSG from the surface of silicon wafers |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210827 |
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| CF01 | Termination of patent right due to non-payment of annual fee |