CN214042250U - CPU module heat dissipation device - Google Patents
CPU module heat dissipation device Download PDFInfo
- Publication number
- CN214042250U CN214042250U CN202120009115.2U CN202120009115U CN214042250U CN 214042250 U CN214042250 U CN 214042250U CN 202120009115 U CN202120009115 U CN 202120009115U CN 214042250 U CN214042250 U CN 214042250U
- Authority
- CN
- China
- Prior art keywords
- fin
- copper pipe
- groove
- fixedly connected
- close
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000017525 heat dissipation Effects 0.000 title description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 34
- 229910052802 copper Inorganic materials 0.000 claims abstract description 34
- 239000010949 copper Substances 0.000 claims abstract description 34
- 230000002146 bilateral effect Effects 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 2
- 238000001125 extrusion Methods 0.000 abstract description 2
- 238000009434 installation Methods 0.000 description 10
- 230000005489 elastic deformation Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
Images
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a CPU module heat abstractor, including the copper pipe, the copper pipe is the setting of U type and copper pipe lateral wall is close to the equal fixedly connected with holding ring in top position. The utility model discloses in, through setting up first logical groove, the second leads to the groove, the rectangular plate, a groove, three corner posts and support bar, be convenient for realize through the extrusion that three corner posts get into first logical groove and the logical inslot of second, simultaneously because radiator fin itself has certain elasticity, and then realize that three corner posts take place certain deformation when the gliding in downshifting and first logical groove and second logical groove, the rectangular plate resets when three corner posts continue to move and pass first logical groove and second logical groove and realizes three corner posts and first fin and second fin bottom block, the spacing effect through the recess realizes spacing the support of three corner posts bottom simultaneously, two three corner posts through the symmetry setting realize the stability between a plurality of first fins and the second fin.
Description
Technical Field
The utility model relates to a CPU field especially relates to a CPU module heat abstractor.
Background
With the upgrading and upgrading of computer CPUs, the CPUs have stronger and stronger operational performance and functions, and some problems also occur, one of which is that the CPUs generate more and more heat, which puts higher requirements on CPU heat dissipation equipment.
When the existing computer mainframe dissipates heat, a plurality of heat dissipation fins are usually matched with a copper pipe, the plurality of heat dissipation fins are fixedly connected through the copper pipe to absorb heat of a CPU, the temperature of the CPU is reduced by matching with a fan, the installation modes of the fins are divided into two installation modes of reflow soldering and sheet penetrating, the sheet penetrating mode is simple to install, the manufacturing cost is low, but the stability between the fins cannot be guaranteed, the reflow soldering connection mode is firm to install, but the manufacturing cost is high.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving the defects existing in the prior art and providing a CPU module heat dissipation device.
In order to achieve the above purpose, the utility model adopts the following technical scheme: a CPU module heat dissipation device comprises a copper pipe, wherein the copper pipe is arranged in a U shape, the positions, close to the top, of the outer side wall of the copper pipe are fixedly connected with positioning rings, the positions, close to the bottom, of the outer side wall of the copper pipe are provided with spiral grooves, the positions, close to the bottom, of the outer side wall of the bottom of the copper pipe are provided with nuts, the position, close to the bottom, of the outer side wall of the copper pipe is provided with a second fin, the second fin is positioned at the top of the nut, the centers of the two sides of the top of the second fin are symmetrically provided with two second through grooves, the positions, close to the middle, of the top of the second fin are symmetrically provided with two second through holes, the tops of the second fin are uniformly provided with a plurality of first fins, the tops of the first fins are symmetrically provided with two first through holes, the centers of the two sides of the top of the first fin are symmetrically provided with two first through grooves, and the bottoms of the first fins are fixedly connected with two supporting bars symmetrically, and two support bar top center departments all open flutedly, two equal fixedly connected with rectangular plate of support bar bottom center department and two relative one sides of rectangular plate are close to bottom fixedly connected with triangular prism.
As a further description of the above technical solution:
the second through hole is matched with the first through hole in position, and the inner side wall of the second through hole and the inner side wall of the first through hole are both in sliding connection with the outer side wall of the copper pipe.
As a further description of the above technical solution:
the two sets of first card groups of first fin bottom bilateral symmetry fixedly connected with and every first card group of group comprise two first cards, every group first card is the symmetry about the first through-hole centre of a circle and sets up, and the relative even fixedly connected with of one side first card strip that a plurality of slants set up of two first cards.
As a further description of the above technical solution:
the outer side wall of the rectangular plate is in sliding connection with the inner side walls of the first through groove and the second through groove.
As a further description of the above technical solution:
two sets of second card groups of second fin bottom bilateral symmetry fixedly connected with and every group second card group comprises two second cards, and every group the second card is the symmetry about the second through-hole centre of a circle and sets up, and the relative even fixedly connected with of one side of two second cards second card strip that a plurality of slants set up.
As a further description of the above technical solution:
the triangular columns are matched with the grooves in size.
The utility model discloses following beneficial effect has:
1. the utility model discloses a first card group and second card group realize through the first card in the first card group that distance between two adjacent first fins is injectd, can realize the elasticity realization of the first card of cooperation through the first card strip that sets up simultaneously and realize stable centre gripping to the copper pipe lateral wall.
2. The utility model discloses a set up first logical groove, the second leads to the groove, the rectangular plate, a groove, three corner posts and support bar, be convenient for realize through the extrusion that three corner posts get into first logical groove and the logical inslot of second, simultaneously because radiator fin itself has certain elasticity, and then realize that three corner posts take place certain deformation when downstream and first logical groove and the second inslot gliding, the rectangular plate resets when first logical groove and the logical groove of second are passed in the continuation of three corner posts removal realizes three corner posts and first fin and second fin bottom block, it is spacing to realize the support of three corner posts bottom simultaneously through the limiting displacement of recess, two three corner posts that set up through the symmetry realize the stability between a plurality of first fins and the second fin.
Drawings
Fig. 1 is a front sectional view of a CPU module heat dissipation device according to the present invention;
FIG. 2 is an enlarged view of FIG. 1A;
fig. 3 is a schematic structural view of the rectangular plate of fig. 1.
Illustration of the drawings:
1. a copper pipe; 2. a first fin; 3. a first through groove; 4. a rectangular plate; 5. a second through groove; 6. a second fin; 7. a nut; 8. a positioning ring; 9. a supporting strip; 10. a groove; 11. a triangular column; 12. a first card; 13. a first through hole; 14. a second through hole; 15. a second card.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance, and furthermore, unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Referring to fig. 1-3, the present invention provides an embodiment: the utility model provides a CPU module heat abstractor, including copper pipe 1, copper pipe 1 is convenient for realize absorbing the heat of first fin 2 and second fin 6, can play the effect of fixed first fin 2 and second fin 6 simultaneously, copper pipe 1 is the setting of U type and copper pipe 1 lateral wall is close to the equal fixedly connected with holding ring 8 of top position, holding ring 8 can realize the injecing to 2 top positions of first fin, copper pipe 1 lateral wall is opened near the bottom has the helicla flute and copper pipe 1 bottom lateral wall is close to the equal threaded connection of bottom position has nut 7, be convenient for realize the support to 6 bottom positions of second fin through threaded connection's nut 7, the personnel of being convenient for simultaneously realize the installation and the dismantlement of first fin 2 and second fin 6 through unloading nut 7, copper pipe 1 tube face is close to bottom position and is provided with second fin 6 and second fin 6 is located nut 7 tops, second fin 6 top both sides center department symmetry division has two second through-groove 5 and second fin 6 top is close to middle part position to the installation and to first fin 6 to middle part position to the installation of second fin 6 The two second through holes 14 are symmetrically formed, the plurality of first fins 2 are uniformly arranged at the tops of the second fins 6, the heat absorption of a CPU is conveniently realized through the plurality of first fins 2 and the second fins 6, the two first through holes 13 are symmetrically formed at positions, close to the middle, of the tops of the plurality of first fins 2, the two first through grooves 3 are symmetrically formed at the centers of the two sides of the tops of the first fins 2, the two support bars 9 are symmetrically and fixedly connected to the bottoms of the first fins 2, the grooves 10 are formed at the centers of the tops of the two support bars 9, the rectangular plate 4 is fixedly connected to the centers of the bottoms of the two support bars 9, the triangular column 11 is fixedly connected to the opposite side of the two rectangular plates 4, the rectangular plate 4 and the triangular column 11 are made of copper sheets, the assembling of the first fins 2 is convenient, and the rectangular plate 4 can generate certain elastic deformation.
The second through hole 14 is matched with the first through hole 13 in position, the inner side walls of the second through hole 14 and the first through hole 13 are both connected with the outer side wall of the copper tube 1 in a sliding manner, so that the installation of a plurality of first fins 2 and second fins 6 is realized through the matching of the copper tube 1 with the first through hole 13 and the second through hole 14, two groups of first clamping groups are symmetrically and fixedly connected to the bottom of the first fin 2, each group of first clamping groups consists of two first clamping pieces 12, each group of first clamping pieces 12 is symmetrically arranged around the center of the first through hole 13, and a plurality of obliquely arranged first clamping strips are symmetrically and uniformly and fixedly connected to the opposite sides of the two first clamping pieces 12, so that the outer side wall of the copper tube 1 is clamped and fixed through the obliquely arranged first clamping strips, as shown in figure 1, the distance between the two adjacent first fins 2 is fixed through the contact of the bottom of the first clamping pieces 12 and the top of the adjacent first fin 2, the outer side wall of the rectangular plate 4 is connected with the inner side walls of the first through groove 3 and the second through groove 5 in a sliding manner, when the rectangular plate 4 enters the first through groove 3 and the second through groove 5 during installation, the triangular column 11 penetrates through the first through groove 3 and the second through groove 5, two groups of second clamping groups are symmetrically and fixedly connected to the two sides of the bottom of the second fin 6, each group of second clamping groups consists of two second clamping pieces 15, each group of second clamping pieces 15 is symmetrically arranged around the center of the second through hole 14, and a plurality of obliquely arranged second clamping strips are symmetrically and uniformly and fixedly connected to the opposite sides of the two second clamping pieces 15, as shown in figure 1, the position of the second fin 6 is fixed by the contact between the second clamping pieces 15 and the top of the nut 7, the triangular column 11 is matched with the size of the groove 10, when the triangular column 11 penetrates through the first through groove 3 and the second through groove 5 to enter the inside of the groove 10, the reset is realized due to elastic deformation generated when the rectangular plate 4 moves, and the clamping connection between the triangular column 11 and the bottom of the first through groove 3 and the second through groove 5, the side fixing of two adjacent first fins 2 and second fins 6 is realized.
The working principle is as follows: the personnel contact the first fins 2 with the outer side wall of the copper tube 1 through the first through holes 13 to realize the installation of the first fins 2, and realize the limitation of the position of the first fins 2 through the positioning rings 8, then the personnel realize the installation of the second first fins 2 through the sliding connection of the first through holes 13 and the outer side wall of the copper tube 1 again, simultaneously realize the entering of the triangular column 11 into the first through groove 3 through the pressing of the second first fins 2, when the triangular column 11 slides in the first through groove 3, the rectangular plate 4 generates certain elastic deformation, when the triangular column 11 completely enters the groove 10, the rectangular plate 4 resets to realize the clamping connection of the triangular column 11 arranged on the first fins 2 and the bottom of the second first fins 2 to realize the connection and fixation between the two first fins 2, and so on to realize the installation of a plurality of the first fins 2 and the second fins 6, after the first fins 2 and the second fins 6 are assembled, the bottom of the second fins 6 is supported and limited through nuts 7 in threaded connection.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications and variations can be made in the embodiments or in part of the technical features of the embodiments without departing from the spirit and the scope of the invention.
Claims (6)
1. The utility model provides a CPU module heat abstractor, includes copper pipe (1), its characterized in that: the copper pipe (1) is arranged in a U shape, the outer side wall of the copper pipe (1) is close to the top, and is fixedly connected with a positioning ring (8), the outer side wall of the copper pipe (1) is close to the bottom, and is provided with a spiral groove, the outer side wall of the bottom of the copper pipe (1) is close to the bottom, and is in threaded connection with a nut (7), the pipe surface of the copper pipe (1) is provided with a second fin (6) close to the bottom, and the second fin (6) is positioned at the top of the nut (7), two second through grooves (5) are symmetrically formed in the centers of the two sides of the top of the second fin (6), two second through holes (14) are symmetrically formed in the positions of the top of the second fin (6), a plurality of first fins (2) are uniformly arranged at the top of the second fin (6), two first through holes (13) are symmetrically formed in the positions of the top of the first fins (2) close to the middle, and two first through grooves (3) are symmetrically formed in the centers of the two sides of the top of the first fin (2), first fin (2) bottom is close to two first logical groove (3) two support bars (9) of symmetry fixedly connected with, and all opens recess (10), two in center department of two support bars (9) top support bar (9) bottom center department equal fixedly connected with rectangular plate (4) and two rectangular plate (4) relative one side be close to bottom position fixedly connected with triangular column (11).
2. The heat sink for CPU module set according to claim 1, wherein: the second through hole (14) is matched with the first through hole (13) in position, and the inner side walls of the second through hole (14) and the first through hole (13) are both in sliding connection with the outer side wall of the copper pipe (1).
3. The heat sink for CPU module set according to claim 1, wherein: first fin (2) bottom bilateral symmetry fixedly connected with two sets of first card groups and every first card group of group comprise two first cards (12), every group first card (12) are the symmetry setting about first through-hole (13) centre of a circle, and the first card strip that a plurality of slants of the even fixedly connected with of relative one side symmetry of two first cards (12) set up.
4. The heat sink for CPU module set according to claim 1, wherein: the outer side wall of the rectangular plate (4) is connected with the inner side walls of the first through groove (3) and the second through groove (5) in a sliding mode.
5. The heat sink for CPU module set according to claim 1, wherein: the two groups of second card groups are fixedly connected to the two sides of the bottom of the second fin (6) symmetrically, each second card group is composed of two second cards (15), each second card group (15) is symmetrically arranged relative to the circle center of the second through hole (14), and the two second cards (15) are symmetrically and fixedly connected with a plurality of obliquely arranged second card strips in opposite side symmetry.
6. The heat sink for CPU module set according to claim 1, wherein: the triangular column (11) is matched with the groove (10) in size.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120009115.2U CN214042250U (en) | 2021-01-05 | 2021-01-05 | CPU module heat dissipation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120009115.2U CN214042250U (en) | 2021-01-05 | 2021-01-05 | CPU module heat dissipation device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214042250U true CN214042250U (en) | 2021-08-24 |
Family
ID=77346197
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120009115.2U Active CN214042250U (en) | 2021-01-05 | 2021-01-05 | CPU module heat dissipation device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214042250U (en) |
-
2021
- 2021-01-05 CN CN202120009115.2U patent/CN214042250U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101873786A (en) | Heat sink | |
| CN212695143U (en) | Micro-channel heat sink with vein-shaped flow dividing structure | |
| TWM637919U (en) | Hard disk device and quick release module thereof | |
| CN214042250U (en) | CPU module heat dissipation device | |
| CN210534680U (en) | Mainframe box with heat dissipation function for big data | |
| CN101146427A (en) | Heat pipe radiator | |
| CN215451391U (en) | Quick detach formula multicore piece mounting structure | |
| CN213577742U (en) | Size and specification adjustable warmer panel | |
| CN114442773B (en) | Liquid cooling heat abstractor for DIMM | |
| CN222621448U (en) | Cold plate and heat exchanger | |
| CN219269333U (en) | Core board mounting structure convenient to maintain | |
| CN217982830U (en) | Hard disk device and quick-release module thereof | |
| CN215006557U (en) | Multiple heat radiation structure of computer chip | |
| CN219372944U (en) | Heat abstractor is used in integrated circuit board operation | |
| CN215566853U (en) | Fan blade and fan wing inserting structure for industrial fan | |
| CN215527686U (en) | Novel dry-type basket of flowers | |
| CN222460394U (en) | Heat dissipation device | |
| CN216014187U (en) | A heat dissipation mechanism for a drive extension | |
| CN217741984U (en) | Combined type circuit board | |
| CN211406616U (en) | Heat radiation structure for computer hard disk chip type circuit board | |
| CN216362413U (en) | Corrugated radiating fin and radiating system | |
| CN215984133U (en) | Aluminum foil heat exchanger | |
| CN218821798U (en) | High-efficiency heat exchanger with high specific surface area | |
| CN220456501U (en) | Liquid cooling plate, battery pack and energy storage device | |
| CN212298899U (en) | COB heat pipe radiator |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |