CN214041188U

CN214041188U - Solar silicon wafer detection system

Info

Publication number: CN214041188U
Application number: CN202022955906.2U
Authority: CN
Inventors: 凌步军; 朱鹏程; 袁明峰; 赵有伟; 冯高俊; 滕宇; 吕金鹏; 冷志斌
Original assignee: Jiangsu Yawei Aosi Laser Technology Co ltd
Current assignee: Jiangsu Yawei Aosi Laser Technology Co ltd
Priority date: 2020-12-09
Filing date: 2020-12-09
Publication date: 2021-08-24
Anticipated expiration: 2030-12-09

Abstract

The utility model discloses a detecting system of solar energy silicon chip, including host computer, positioner and detection device, the host computer with positioner communication connection, the host computer with detection device connection communication, detection device is located positioner's center, the utility model discloses a positioner carries out the location calibration to the solar energy silicon chip that awaits measuring, and simultaneously, detection device carries out the damage to the solar energy silicon chip that awaits measuring and detects, has so both improved positioning accuracy, has damaged detection function again, has improved detection efficiency.

Description

Solar silicon wafer detection system

Technical Field

The utility model relates to a detection area, concretely relates to detection technology of solar energy silicon chip.

Background

Solar cells are devices that directly convert light energy into electrical energy through the photoelectric effect or the photochemical effect, and silicon-based solar cells that operate with the photoelectric effect are the mainstream. In the preparation process of the silicon-based solar cell, the processing and detection of the silicon wafer are very important. Due to the characteristics of the crystal structure, the crystalline silicon cell is very easy to crack, the process flow of the crystalline silicon component production is long, and the cell is likely to crack in many links. The subfissure directly affects the performance of the photovoltaic module, and is one of the defects needing to be mainly detected and sorted in the production of the cell. For example, if the damage is serious, the appearance and yield of the solar cell are affected, and the photoelectric conversion efficiency and cost of the solar cell are affected. Therefore, it is necessary to perform inspection on the silicon wafer.

The traditional solar silicon wafer detection mode comprises manual detection, professional detection equipment detection and the like, and in the manual detection mode, the working efficiency of personnel is low, and the detection precision is relatively poor.

SUMMERY OF THE UTILITY MODEL

In view of the above-mentioned shortcomings of the prior art, the present invention provides a solar silicon wafer detecting system with positioning and damage detecting functions.

In order to solve the technical problem, the utility model provides a following technical scheme:

the solar silicon wafer detection system comprises an upper computer, a positioning device and a detection device, wherein the upper computer is in communication connection with the positioning device, the upper computer is in communication connection with the detection device, and the detection device is located at the center of the positioning device.

The utility model discloses an in the embodiment, positioner includes controller, a plurality of location camera, a plurality of light source, a plurality of location camera with a plurality of light sources one-to-one respectively are connected, the controller with a plurality of location cameras are connected.

In an embodiment of the present invention, the detecting device includes a detecting camera and a backlight source, the backlight source is disposed under the detecting camera.

In an embodiment of the present invention, the positioning camera includes a camera module and a lens, the lens is connected to the camera module, and an image sensor for converting an optical image into an electrical signal is disposed in the camera module.

In an embodiment of the present invention, the detecting system of the solar silicon wafer includes a support, the support includes a first mounting plate, a second mounting plate and a support body, the second mounting plate is connected to the first mounting plate, the first mounting plate is connected to the support body.

In an embodiment of the present invention, the first mounting plate includes a first vertical plate and a first horizontal plate, and the first vertical plate is fixedly connected to the first horizontal plate; the second mounting plate comprises a second vertical plate and a second transverse plate, and the second vertical plate is fixedly connected with the second transverse plate; the first vertical plate is connected with the second vertical plate.

In an embodiment of the present invention, the second horizontal plate is shaped like a horseshoe and has a circular through hole.

The utility model provides a pair of solar silicon wafer's detecting system, including host computer, positioner and detection device, the host computer with positioner communication connection, the host computer with detection device connection communication, detection device is located positioner's center, the utility model discloses a positioner carries out the location calibration to the solar silicon wafer that awaits measuring, and simultaneously, detection device carries out the damage to the solar silicon wafer that awaits measuring and detects, has so both improved positioning accuracy, has damaged detection function again, has improved detection efficiency.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a detection system for solar silicon wafers according to an embodiment of the present invention;

fig. 2 is a schematic structural diagram of a positioning device according to an embodiment of the present invention;

fig. 3 is a schematic structural diagram of a detection device according to an embodiment of the present invention;

fig. 4 is a perspective view of a positioning device according to an embodiment of the present invention;

fig. 5 is a schematic structural diagram of a positioning camera according to an embodiment of the present invention;

fig. 6 is a schematic structural diagram of a bracket according to an embodiment of the present invention.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.

Unless defined otherwise, technical or scientific terms used herein shall have the ordinary meaning as understood by those of ordinary skill in the art to which the invention belongs. The use of "first," "second," and similar terms in the description herein do not denote any order, quantity, or importance, but rather the terms are used to distinguish one element from another. The word "comprising" or "comprises", and the like, means that the element or item listed before the word covers the element or item listed after the word and its equivalents, but does not exclude other elements or items. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", and the like are used merely to indicate relative positional relationships, and when the absolute position of the object being described is changed, the relative positional relationships may also be changed accordingly.

As shown in fig. 1 to 4, the utility model firstly provides a solar silicon wafer's detecting system, including host computer 1, positioner 2 and detection device 3, host computer 1 with positioner 2 communication connection, host computer 1 with detection device 3 connects communication, detection device 3 is located positioner 2's center. In this embodiment, the positioning apparatus 2 includes a controller 201, a plurality of positioning cameras 202, and a plurality of light sources 203, the plurality of positioning cameras 202 are respectively connected to the plurality of light sources 203 in a one-to-one correspondence, and the controller 201 is connected to the plurality of positioning cameras 202. The detection device 3 includes a detection camera 301 and a backlight source 302, and the backlight source 302 is disposed right below the detection camera 301. In this embodiment, the detection system for the solar silicon wafer includes a solar silicon wafer 5 to be detected, a plurality of mark points are arranged on the solar silicon wafer 5 to be detected, and the diameter range of the mark points is 0.4-1mm, for example, 0.5 mm. In this embodiment, the number of the mark points is four, and the mark points are respectively arranged at four corners of the solar silicon wafer 5 to be tested. The arrangement of the mark points can facilitate the calibration of the central position of the solar silicon wafer 5 to be tested. In this embodiment, the upper computer 1 establishes a communication connection with the controller 201, and the controller 201 controls the positioning cameras 202 to shoot the mark points to obtain an image. The controller 201 obtains the image, performs algorithm processing, extracts a character string, sends the character string to the upper computer 1, and the upper computer 1 converts the character string into a numerical value and extracts an offset value. And the upper computer 1 assigns the deviation value to a deviation variable to calibrate the central position of the solar silicon wafer 5 to be tested. The detection device 3 detects damage of the solar silicon wafer 5 to be detected and sends a detection result to the upper computer 1.

As shown in fig. 3 to 4, in this embodiment, the detection camera 301 is disposed at a central position of the positioning cameras 201, the backlight source 302 is located right below the detection camera 301, specifically, the backlight source 302 is located right below the solar silicon wafer 5 to be detected, and light is irradiated upward from below the solar silicon wafer 5 to be detected, so that the detection camera 301 can clearly capture the outline of the solar silicon wafer 5 to be detected. In this embodiment, the detection camera 301 is a large-field-of-view camera and is disposed in the center of the positioning cameras 202. Before starting detection, required silicon wafer parameters such as the length, the width and the area of a silicon wafer image are set in the upper computer 1, and when damage detection is carried out, if the image of the solar silicon wafer to be detected obtained by the detection camera 301 does not accord with the set silicon wafer parameters, the upper computer 1 sends an alarm prompt.

As shown in fig. 5, in the present embodiment, the plurality of positioning cameras 202 have the same structure, and a specific description will be given below by taking one of the positioning cameras 202 as an example. The positioning camera 202 includes a camera module 2021 and a lens 2022, the lens 2022 is connected to the camera module 2021, an image sensor, such as a CCD or a CMOS, is disposed in the camera module 2021, the image sensor can convert an optical image into an electrical signal, and the camera module 2021 processes the electrical signal to complete image analysis and recognition. In this embodiment, the light source 203 includes a base 2031, a side shield 2032, and a power cord 2033, the base 2031 is detachably connected to the side shield 2032, the base 2031 is provided with an LED light source, and the power cord 2033 is connected to the LED light source. The camera module 2021 includes a base 20211 and a slot 20212, the slot 20212 is disposed on a side of the base 20211 where the lens 2022 is connected, the slot 20212 is circular, the lens 2022 can be clamped on the slot 20212, and the base 20211 is provided with a plurality of mounting holes for fixing with other components.

As shown in fig. 6, the solar silicon wafer detection system includes a support 4, the positioning cameras 202 and the light sources 203 are mounted on the support 4, and the detection camera 301 is mounted on the support 4. In this embodiment, the bracket 4 includes a first mounting plate 401, a second mounting plate 402, and a bracket body 403, the second mounting plate 402 is connected to the first mounting plate 401, and the first mounting plate 401 is connected to the bracket body 403. In this embodiment, the support body 403 includes a support portion 4031 and a mounting portion 4032, the support portion 4031 is connected to the first mounting plate 401, and the first mounting plate 401 is used to fix the positioning cameras 202 and the detection camera 301. In this embodiment, the support 4031 is square and has four square through holes 40311, and the positioning camera 202 and the light source 203 are mounted on one side of the square through holes. In this embodiment, the camera module 2021 is fixedly connected to the first mounting plate 401. In this embodiment, the first mounting plate 401 is L-shaped, and may be made by bending a section bar, for example, and includes a first vertical plate 4011 and a first horizontal plate 4012, the first vertical plate 4011 is fixedly connected to the first horizontal plate 4012, the first horizontal plate 4012 is provided with a mounting hole for being fixedly connected to the support portion 4031, the first vertical plate 4011 includes a protrusion 40111, and the protrusion 40111 is provided with a mounting hole for being fixedly connected to the camera module 2021. In this embodiment, the second mounting plate 402 is also L-shaped, and can be formed by bending a metal plate, and includes a second vertical plate 4021 and a second transverse plate 4022, the second vertical plate 4021 and the second transverse plate 4022 are fixedly connected, the second vertical plate 4021 is provided with mounting holes for connecting with the first vertical plate 4011, the second transverse plate 4022 is horseshoe-shaped, and is provided with a circular through hole 40221 and a plurality of mounting holes, the circular through hole 40221 is for avoiding blocking the visual field of the lens 2022, and the mounting holes are used for mounting the light source 203. In this embodiment, the positioning device 2 includes four positioning cameras 201 and four light sources 202, the light sources 202 are annular light sources, and the illumination of the annular light sources is uniform, so that the illumination of the annular light sources can be directly performed on a measured object at different illumination angles and different color combinations, thereby avoiding the shadow phenomenon and highlighting the imaging characteristics. The positioning cameras 201 are all cameras with 500 ten thousand pixels, and the camera module 2021 can adjust the magnification of the lens 2022 to control the size of the visual field, so as to clearly capture the mark points.

To sum up, the utility model provides a solar silicon wafer's detecting system, including host computer 1, positioner 2 and detection device 3, host computer 1 with positioner 2 communication connection, host computer 1 with detection device 3 links communication connection, detection device 3 is located positioner 2's center. The utility model discloses a positioner fixes a position the calibration to the solar energy silicon chip that awaits measuring, simultaneously, detection device carries out the damage to the solar energy silicon chip that awaits measuring and detects, has so both improved positioning accuracy, has the damaged function that detects again, has improved detection efficiency.

The preferred embodiments of the present invention have been disclosed merely to help explain the invention, and they are not intended to describe in detail all of the details of the invention nor to limit the invention to the particular embodiments described. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and its practical applications, to thereby enable others skilled in the art to best understand the invention for and utilize the invention. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. The solar silicon wafer detection system is characterized by comprising an upper computer, a positioning device and a detection device, wherein the upper computer is in communication connection with the positioning device, the upper computer is in communication connection with the detection device, and the detection device is located at the center of the positioning device.

2. The system according to claim 1, wherein the positioning device comprises a controller, a plurality of positioning cameras, and a plurality of light sources, the positioning cameras are connected to the light sources in a one-to-one correspondence, and the controller is connected to the positioning cameras.

3. The system according to claim 1, wherein the inspection device comprises an inspection camera and a backlight source, and the backlight source is disposed directly below the inspection camera.

4. The system for inspecting solar silicon wafer according to claim 2, wherein the positioning camera comprises a camera module and a lens, the lens is connected with the camera module, and an image sensor for converting an optical image into an electrical signal is disposed in the camera module.

5. The system for detecting the solar silicon wafer as claimed in any one of claims 1 to 4, wherein the system for detecting the solar silicon wafer comprises a bracket for fixing the positioning device and the detection device, the bracket comprises a first mounting plate, a second mounting plate and a bracket body, the second mounting plate is connected with the first mounting plate, and the first mounting plate is connected with the bracket body.

6. The system for detecting the solar silicon wafer as claimed in claim 5, wherein the first mounting plate comprises a first vertical plate and a first transverse plate, and the first vertical plate is fixedly connected with the first transverse plate; the second mounting plate comprises a second vertical plate and a second transverse plate, and the second vertical plate is fixedly connected with the second transverse plate; the first vertical plate is connected with the second vertical plate.

7. The system for detecting the solar silicon wafer as claimed in claim 6, wherein the second transverse plate is horseshoe-shaped and is provided with a circular through hole.