CN213977865U - Novel magnetron sputtering coating film device carrier - Google Patents

Novel magnetron sputtering coating film device carrier Download PDF

Info

Publication number
CN213977865U
CN213977865U CN202023065560.5U CN202023065560U CN213977865U CN 213977865 U CN213977865 U CN 213977865U CN 202023065560 U CN202023065560 U CN 202023065560U CN 213977865 U CN213977865 U CN 213977865U
Authority
CN
China
Prior art keywords
baffle
hole
magnetron sputtering
vacuum chamber
carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202023065560.5U
Other languages
Chinese (zh)
Inventor
欧阳俊鑫
马英鹤
吴鹏
李正阳
朱先帅
郑文健
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zhejiang University of Technology ZJUT
Original Assignee
Zhejiang University of Technology ZJUT
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zhejiang University of Technology ZJUT filed Critical Zhejiang University of Technology ZJUT
Priority to CN202023065560.5U priority Critical patent/CN213977865U/en
Application granted granted Critical
Publication of CN213977865U publication Critical patent/CN213977865U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Abstract

The utility model belongs to the technical field of frock clamp, concretely relates to novel magnetron sputtering coating device carrier, which comprises a base, a fixed seat and a vacuum chamber, wherein the fixed seat is arranged on the base, a first through hole is arranged at the bottom end of the fixed seat, a fixed cavity is arranged in the fixed seat, a baffle is arranged in the fixed cavity, a second through hole is arranged on the baffle, a coating substrate is placed on the baffle, and the vacuum chamber is communicated with the first through hole and the second through hole; the vacuum chamber is pumped to enable the coated substrate to be adsorbed on the baffle; the utility model discloses can be through adsorbing the sample, and then reach sample coating film utmost point substrate surface and do not have the shelter from the thing, make its surface coating film tend to the completeness, realize carrying out the centre gripping to the sample of different standards through changing the baffle.

Description

Novel magnetron sputtering coating film device carrier
Technical Field
The utility model belongs to the technical field of frock clamp, concretely relates to novel magnetron sputtering coating film device carrier.
Background
The magnetron sputtering is characterized in that the moving electrons are acted by Lorentz force in a magnetic field, so that the number of times of collision with working gas molecules is increased, the plasma density is increased, and the magnetron sputtering rate is greatly improved. Can work under very low sputtering voltage and atmospheric pressure, reduce the tendency of film pollution, improve the quality of the film to a great extent. Because the thickness and the uniformity of the magnetron sputtering coating are controllable, and the compactness, the bonding force and the purity of the film layer are high, the magnetron sputtering technology becomes an important means for preparing various functional films.
The carrier used by the magnetron sputtering coating device is a clamp and is used for clamping a metal sheet or a non-metal sheet to be coated so as to position the carrier and the coated sheet into a sputtering coating bin of the magnetron sputtering coating device for coating, after the magnetron sputtering coating is finished, an instrument tests the sputtered coated sheet, and the test content comprises the light reflectivity and the transmissivity of the optical performance; mechanical properties such as film-substrate bonding force and peeling strength. The metal sheet comprises various metal oxides such as aluminum, copper and the like; non-metallic sheets such as glass, silicon wafers, ceramic wafers, and the like.
When some nonstandard samples are subjected to magnetron sputtering coating, the traditional clamp is not easy to clamp the samples, the magnetron sputtering sample clamp clamps the surfaces of the samples, and the positions clamped by the clamp can shield the deposition of sputtering particles, so that the coating on a magnetron sputtering surface is incomplete, and further materials are wasted.
SUMMERY OF THE UTILITY MODEL
Based on the above-mentioned shortcomings and deficiencies of the prior art, it is an object of the present invention to at least solve one or more of the above-mentioned problems of the prior art, in other words, to provide a novel magnetron sputtering coating device carrier that satisfies one or more of the above-mentioned needs.
In order to achieve the purpose of the utility model, the utility model adopts the following technical scheme:
a novel carrier for a magnetron sputtering coating device comprises a base, a fixed seat and a vacuum chamber, wherein the fixed seat is installed on the base, a first through hole is formed in the bottom end of the fixed seat, a fixed cavity is formed in the fixed seat, a baffle is installed in the fixed cavity and provided with a second through hole, a coating substrate is placed on the baffle, and the vacuum chamber is communicated with the first through hole and the second through hole; the vacuum chamber is pumped to make the coated substrate adsorbed on the baffle.
As preferred scheme, the one end of base has the draw-in groove, and the draw-in groove joint cooperates in the fixing base, and the connection is installed to the other end of base.
Preferably, the thickness of the baffle is smaller than the height of the fixed cavity, and the opening area of the baffle is smaller than that of the fixed cavity.
As the preferred scheme, a plurality of compression bars are uniformly distributed on the fixed seat along the circumferential direction, and the compression bars are rotatably connected with the fixed seat so as to compress and fix the baffle.
Preferably, the centers of the first through hole, the second through hole and the vacuum chamber are on the same axis.
Preferably, the vacuum chamber is integrally connected to the holder.
Preferably, the vacuum chamber is provided with an air exhaust hole.
Preferably, the first through hole is provided with a rubber sealing ring.
Preferably, the baffle is circular.
Preferably, the aperture of the second through hole is smaller than that of the coated substrate.
Compared with the prior art, the utility model, beneficial effect is:
the utility model discloses can be through adsorbing the sample, and then reach sample coating film surface and do not have the shelter from the thing, make its surface coating film tend to the completeness.
The utility model discloses can be through changing different baffles, realize carrying out the centre gripping to the sample of different standards through the trompil diameter that the baffle is different.
The utility model discloses a local of carrier centre gripping can not shelter from the deposit of sputter particle, has guaranteed the integrality of magnetron sputtering face coating film, avoids extravagant material.
Drawings
Fig. 1 is a schematic connection diagram of an overall structure of a novel magnetron sputtering coating substrate carrier according to a first embodiment of the present invention;
fig. 2 is a schematic structural view of a vacuum chamber of a novel magnetron sputtering coating substrate carrier according to an embodiment of the present invention;
fig. 3 is a schematic view of a baffle structure of a novel magnetron sputtering coating substrate carrier according to an embodiment of the present invention;
fig. 4 is a side view of a baffle plate of a novel magnetron sputtering coating substrate carrier according to a first embodiment of the present invention;
in the figure: the device comprises a base 1, a fixed seat 2, a connecting handle 3, a fixed cavity 4, a baffle 5, a rubber sealing ring 51, a pressure rod 6, a vacuum cavity 7 and an air extraction hole 71.
Detailed Description
In order to more clearly illustrate the embodiments of the present invention, the following description will explain embodiments of the present invention with reference to the accompanying drawings. It is obvious that the drawings in the following description are only examples of the invention, and that for a person skilled in the art, other drawings and embodiments can be obtained from these drawings without inventive effort.
The first embodiment is as follows:
as shown in fig. 1 to 4, the embodiment provides a novel magnetron sputtering coating device carrier, including base 1, fixing base 2 and vacuum chamber 7, base 1 fixed connection fixing base 2, first through-hole has been seted up to fixing base 2, be equipped with fixed chamber 4 within the fixing base 2, install baffle 5 in the fixed chamber 4, baffle 5 is equipped with the second through-hole, the coating film substrate is placed on baffle 5, vacuum chamber 7 and first through-hole and second through-hole intercommunication, through bleeding 7 to the vacuum chamber to make the coating film substrate adsorb on baffle 5, realize the loading to the coating film substrate.
Specifically, vacuum chamber 7 is installed to the bottom of fixing base 2, and vacuum chamber 7 and fixing base 2 an organic whole are connected, and first through-hole is seted up to the bottom of fixing base 2, and vacuum chamber 7 communicates with first through-hole and second through-hole, through bleeding vacuum chamber 7 to make the coating film substrate adsorb on baffle 5.
Wherein, the one end of base 1 is equipped with the draw-in groove, and the draw-in groove cooperates with the fixing base joint to fasten through the screw, the other end of fixing base 2 is installed and is connected 3, so that connect 3, base 1 and 2 body coupling of fixing base.
The base 1 is connected with the fixing seat 2 to form a fixing structure, the thickness of the baffle 5 is smaller than the height of the fixing cavity 4, and the opening area of the baffle 5 is smaller than the opening area of the fixing cavity 4, so that the baffle is placed in the fixing cavity.
The baffle 5 is circular, and the second through hole of baffle 5 can set up to different apertures, through changing baffle 5 in order to change the trompil area. A rubber sealing ring 51 is arranged at the second through hole of the baffle 5 to seal the magnetron sputtering chamber and prevent leakage.
The fixing base 2 is evenly provided with a plurality of pressing rods 6 along the circumferential direction, and the pressing rods 6 are rotatably connected with the fixing base 2 to compress and fix the baffle 5. Four pressing rods are arranged in the implementation, the pressing plates are uniformly distributed along the circumferential direction of the fixing seat, the pressing rods can rotate by 360 degrees, the circular baffle is pressed and fixed through screws above the rotating pressing rods, and the circular baffle is prevented from falling off from the fixing cavity. When the baffle needs to be unloaded, the pressing rod is rotated to enable the baffle to slide out along the fixing cavity. The number of the pressing plates can be set according to actual requirements, and is not limited to the number.
The aperture of the second through hole is smaller than that of the coated substrate, and the centers of the first through hole, the second through hole and the vacuum chamber 7 are positioned on the same axis. When the vacuum chamber 7 is evacuated, the coated substrate can be completely adsorbed on the baffle 5. An air suction hole 71 is formed in one side of the vacuum chamber, and an air suction function is realized through the air suction hole 71.
Before magnetron sputtering coating, a baffle 5 is placed in a fixed cavity 4, the diameter of an opening of the baffle 5 is smaller than the coating area of a sample, screws on four pressure rods 6 are simultaneously screwed down to pre-fix the baffle 5, and a coating substrate is placed above the baffle 5. The vacuum chamber 7 is pumped to a low pressure state by using an air pump, and the pressure in the vacuum chamber 7 is ensured to be smaller than that in the magnetron sputtering chamber, so that the adsorption and fixation effects are achieved. The vacuum chamber 7 is then sealed, and the clamped place does not shield the deposition of the sputtered particles, so that the integrity of the magnetron sputtering surface coating is ensured, and the material waste is avoided.
The foregoing has been a detailed description of the preferred embodiments and principles of the present invention, and it will be apparent to those skilled in the art that variations may be made in the specific embodiments based on the concepts of the present invention, and such variations are considered as within the scope of the present invention.

Claims (10)

1. A novel carrier for a magnetron sputtering coating device is characterized by comprising a base, a fixed seat and a vacuum chamber, wherein the fixed seat is arranged on the base, the fixed seat is provided with a first through hole, a fixed cavity is arranged in the fixed seat, a baffle is arranged in the fixed cavity, the baffle is provided with a second through hole, a coating substrate is placed on the baffle, and the vacuum chamber is communicated with the first through hole and the second through hole; the vacuum chamber is pumped to make the coated substrate adsorbed on the baffle.
2. The carrier for the novel magnetron sputtering coating device according to claim 1, wherein one end of the base is provided with a clamping groove, the clamping groove is in clamping fit with the fixed base, and the other end of the base is provided with a connecting handle.
3. The carrier for the novel magnetron sputtering coating device of claim 1, wherein the thickness of the baffle plate is smaller than the height of the fixing cavity, and the opening area of the baffle plate is smaller than that of the fixing cavity.
4. The carrier for a magnetron sputtering coating apparatus as claimed in claim 1, wherein the fixing base is uniformly distributed with a plurality of pressing rods along a circumferential direction, and the pressing rods are rotatably connected with the fixing base to press and fix the baffle.
5. The carrier for the novel magnetron sputtering coating device of claim 1, wherein centers of the first through hole, the second through hole and the vacuum chamber are on the same axis.
6. The carrier for magnetron sputtering coating equipment according to claim 1, wherein the vacuum chamber is integrally connected with the fixing base.
7. The carrier for the novel magnetron sputtering coating device of claim 1, wherein the vacuum chamber is provided with a suction hole.
8. The carrier for the novel magnetron sputtering coating device of claim 1, wherein the first through hole is provided with a rubber sealing ring.
9. The carrier for the novel magnetron sputtering coating device of claim 1, wherein the baffle plate is circular.
10. The carrier for the novel magnetron sputtering coating device of claim 1, wherein the aperture of the second through hole is smaller than that of the coating substrate.
CN202023065560.5U 2020-12-18 2020-12-18 Novel magnetron sputtering coating film device carrier Active CN213977865U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202023065560.5U CN213977865U (en) 2020-12-18 2020-12-18 Novel magnetron sputtering coating film device carrier

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202023065560.5U CN213977865U (en) 2020-12-18 2020-12-18 Novel magnetron sputtering coating film device carrier

Publications (1)

Publication Number Publication Date
CN213977865U true CN213977865U (en) 2021-08-17

Family

ID=77246415

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202023065560.5U Active CN213977865U (en) 2020-12-18 2020-12-18 Novel magnetron sputtering coating film device carrier

Country Status (1)

Country Link
CN (1) CN213977865U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114112573A (en) * 2021-11-15 2022-03-01 哈尔滨工业大学(威海) Magnetron sputtering forming device for mechanical property test of mesoscopic scale tensile sample

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114112573A (en) * 2021-11-15 2022-03-01 哈尔滨工业大学(威海) Magnetron sputtering forming device for mechanical property test of mesoscopic scale tensile sample

Similar Documents

Publication Publication Date Title
CN213977865U (en) Novel magnetron sputtering coating film device carrier
CN100343416C (en) Technology of vacuum metal film plating on microparticle surface and its equipment
CN108531877B (en) TiZrVHf quaternary getter film
US4943363A (en) Cathode sputtering system
CN110055496B (en) Preparation process for preparing Cr coating on surface of nuclear zirconium alloy substrate
US3616450A (en) Sputtering apparatus
EP1617457A3 (en) Ultra high speed uniform plasma processing system
CN110318027B (en) Method for preparing low-reflection silver-molybdenum alloy film on surface of silver sheet
CN108570651A (en) A kind of horizontal magnetron sputtering film production line of multi-chamber and its film plating process
CN102330057B (en) Method for preparing metal ruthenium film for hard semiconductor component
CN1776003A (en) Ceramic-substrate sputtered copper foil production method
CN108950510A (en) Deposition ring and Pvd equipment for physical vapour deposition (PVD)
CN105887036B (en) A kind of workpiece fixture
CN209836292U (en) TFT rotating molybdenum target binding device
CN211256073U (en) Device for preparing low-oxygen-content easily-oxidized film by ion plating in non-ultrahigh vacuum environment
CN109136831B (en) A mass thickness of 700-2Self-supporting germanium film and preparation method thereof
CN110137130A (en) A kind of dry etching systems size conversion pallet
CN216192675U (en) Glass double-sided coating magnetron sputtering coating machine
CN206467286U (en) A kind of improved magnetic-controlled sputtering coating equipment
CN208995590U (en) A kind of magnetic-controlled sputtering coating equipment
CN2848872Y (en) Equipment used for vacuum plating metal film on micro particle surface
JPH05132774A (en) Sputtering apparatus
CN209194041U (en) A kind of multi-arc ion plating equipment that arc source is staggered
CN108531878A (en) A kind of method of magnetron sputtering deposition nickel film and nickel oxide film
CN211897097U (en) Film coating machine

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant