CN213958909U

CN213958909U - Wafer back cleaning mechanism for photoresist machine

Info

Publication number: CN213958909U
Application number: CN202022328139.2U
Authority: CN
Inventors: 冯嘉荔
Original assignee: Guangzhou Honghao Optoelectronic Semiconductor Co ltd
Current assignee: Guangzhou Honghao Optoelectronic Semiconductor Co ltd
Priority date: 2020-10-19
Filing date: 2020-10-19
Publication date: 2021-08-13
Anticipated expiration: 2030-10-19

Abstract

The utility model discloses a wafer back cleaning mechanism for a photoresist machine, which belongs to the technical field of cleaning round wafers in photoresist machines, and comprises an outer shell, wherein an air blowing pipe is assembled in the outer shell, an injection pipe is assembled on the surface of the outer shell, and the injection pipe is communicated with the air blowing pipe in the outer shell; the blowing pipe comprises a vertical section and an inclined section, the inclined section is communicated with the vertical section, and the vertical section is communicated with the blowing pipe. The inclined arrangement of the injection tube improves the cleaning effect of the wafer, and the injection direction of the injection tube is adjusted as required, so that the wafer cleaning device is convenient for people to use; the utility model provides a jetting speed of jetting pipe is convenient for adjust because adjustment mechanism's setting has further improved the clearance effect of wafer, in addition, the utility model discloses well gas blow pipe is convenient for dismantle the installation in the shell, convenient to use, and the practicality is strong.

Description

Wafer back cleaning mechanism for photoresist machine

Technical Field

The utility model belongs to the technical field of clean wafer among the photoresistor machine, specifically speaking relates to a clean mechanism of brilliant back of body for photoresistor machine.

Background

In the production and processing process of the circular wafer, after the wafer finishes a photoresist coating procedure in a photoresist machine, the wafer is transmitted to an exposure machine by a transmission and exchange unit for exposure, and if particles exist on the wafer back of the wafer during exposure, the phenomenon of defocusing can occur. Therefore, in the prior art photoresist machine, the wafer needs to be cleaned before the wafer is exposed, and the existence of particles is avoided.

In the prior art, the particles on the back of the wafer are cleaned in a blowing mode, and the gas blowing pipe blows high-speed gas to blow the particles on the back of the wafer down, so that the purpose of cleaning the back of the wafer is achieved. However, the following technical problems still exist in the prior art in the process of cleaning the wafer back:

because the blowing direction of the high-speed gas is vertical to the crystal back, some particles on the crystal back are difficult to fall off from the crystal back due to the blowing of the vertical airflow, and the cleaning effect of the crystal back is poor, so that it is necessary to design an efficient cleaning mechanism to clean the crystal back.

SUMMERY OF THE UTILITY MODEL

Clean mechanism is difficult to the high efficiency to the brilliant back of body and carries out clear problem to current brilliant back of body, the utility model provides a clean mechanism of brilliant back of body for photoresistor, the mechanism includes the shell body, install the gas blow pipe in the shell body, be connected with the jetting pipe through coupling mechanism on the shell body, the jetting pipe includes vertical section and slope section, the slope section sets up with the slope of the brilliant back of body, consequently, air current oblique cutting blows to the brilliant back of body when blowing the clearance to the brilliant back of body, with the particle flagging, the clean effect of the brilliant back of body has been improved greatly, the problem of proposing in the background art has been solved effectively.

In order to solve the above problems, the utility model adopts the following technical proposal.

A crystal back cleaning mechanism for a light resistance machine comprises an outer shell, wherein an air blowing pipe is assembled in the outer shell, an injection pipe is assembled on the surface of the outer shell, and the injection pipe is communicated with the air blowing pipe in the outer shell; the blowing pipe comprises a vertical section and an inclined section, the inclined section is communicated with the vertical section, and the vertical section is communicated with the blowing pipe.

Preferably, the angle between the inclined section and the horizontal is defined as alpha, which is between 30 deg. and 45 deg..

Preferably, the blowing pipe is assembled with the blowing pipe through a connecting piece;

the surface of the outer shell is provided with a mounting hole, the connecting piece is communicated with the air outlet hole on the air blowing pipe through the mounting hole, and the air blowing pipe is communicated with the connecting piece.

Preferably, the connecting piece comprises a vertically arranged air duct, one end of the air duct is communicated with the air outlet hole, and one end of the blowing pipe is inserted into the air duct.

Preferably, the vertical section of the injection pipe is fixedly provided with a clamping piece, the air guide pipe is provided with a clamping groove used in cooperation with the clamping piece, and the clamping piece is inserted into the clamping groove and used for fixing the injection pipe on the connecting piece.

In order to improve the blowing speed of the blowing pipe, the utility model discloses still adopt following technical scheme.

The crystal back cleaning mechanism for the photoresist machine further comprises an adjusting mechanism, the adjusting mechanism comprises a sealing member arranged in the air blowing pipe and a power mechanism arranged on the outer side of the outer shell, and a power output end of the power mechanism extends into the air blowing pipe and is connected with the sealing member; the power mechanism works to push the sealing component to slide in the blowing pipe along the length direction of the blowing pipe, and the sealing component is connected with the blowing pipe in a sealing and sliding mode.

In order to facilitate the installation and the disassembly of the air blowing pipe, the utility model also adopts the following technical proposal.

In the crystal back cleaning mechanism for the light resistance machine, the assembly part is arranged on the inner wall of the right side of the outer shell, the inner thread is arranged on the inner wall of one end, opposite to the assembly part, of the air blowing pipe, the outer thread is arranged on the outer wall of the assembly part, and the air blowing pipe and the assembly part are assembled inside the outer shell in a threaded mode.

Advantageous effects

Compared with the prior art, the beneficial effects of the utility model are that:

(1) the cleaning mechanism in the utility model adopts the blowing pipe which is arranged obliquely to blow the crystal back, thereby greatly improving the removal efficiency of microfiltration on the crystal back, improving the cleaning effect, and avoiding the defocusing problem caused by the adhesion of particles on the crystal back, thereby improving the use effect of the wafer;

(2) the middle injection pipe of the utility model is assembled on the outer shell through the connecting piece, the connecting piece is provided with the clamping groove, the vertical section of the injection pipe is provided with the clamping piece, the injection pipe can be fixed on the connecting piece through the matching use of the clamping groove and the clamping piece, and the injection direction of the injection pipe can be adjusted, thereby avoiding the problem of cleaning dead angles and improving the cleaning effect;

(3) the sealing member is arranged in the air blowing pipe, and the sealing member moves along the air blowing pipe along the moving direction of the wafer under the action of the power mechanism, so that the air outlet speed of the air blowing pipe is improved on the basis of certain air input, the blowing effect is improved, the purpose of efficiently cleaning the wafer back is achieved, and the cleaning efficiency of the wafer back is improved;

(4) the utility model provides a gas blow pipe makes things convenient for people to maintain the gas blow pipe and change at the inside convenient to detach and the installation of shell body, has improved the life of gas blow pipe, convenient operation.

Drawings

Fig. 1 is a schematic structural view of a cleaning mechanism of the present invention;

FIG. 2 is an enlarged view of the structure at A in FIG. 1;

FIG. 3 is a schematic view of an assembly mechanism of the middle blowing pipe and the connecting member of the present invention;

FIG. 4 is a schematic view of an assembly structure of the outer shell and the blowing pipe in the present invention;

fig. 5 is a schematic structural view of a middle blowing pipe of the present invention;

fig. 6 is a schematic structural view of the assembly of the outer shell and the adjusting mechanism in the present invention;

fig. 7 is a schematic structural view of the outer shell of the present invention;

fig. 8 is a schematic view of the installation structure of the blowing pipe in the present invention.

The corresponding relationship between the reference numbers of the figures and the names of the components in the figures is as follows:

10. an outer housing; 101. mounting holes; 11. an air blowing pipe; 111. an air outlet; 12. an assembly member;

20. a connecting member; 21. an air duct; 22. a card slot;

30. a blowing pipe; 31. a clamping piece; 311. a vertical section; 312. an inclined section;

40. an adjustment mechanism; 41. a sealing member.

Detailed Description

The invention will be further described below in connection with specific embodiments.

Example 1

As shown in fig. 1, 2, 3 and 4, which are schematic structural views of a wafer backside cleaning mechanism for a photoresist machine according to a preferred embodiment of the present invention, the cleaning mechanism in this embodiment is located below a wafer for cleaning particles on the wafer backside.

In this embodiment, the cleaning mechanism includes an outer shell 10, an air blowing pipe 11 is assembled in the outer shell 10, an air blowing pipe 30 is assembled on the surface of the outer shell 10 through a connecting piece 20, the air blowing pipe 30 is communicated with the air blowing pipe 11 in the outer shell 10, in this embodiment, the air blowing pipe 11 is connected with an external air source, and air enters the air blowing pipe 11 and then enters the air blowing pipe 30 to blow and clean particles on the back of a wafer.

In this embodiment, the blowing tube 30 includes a vertical section 311 and an inclined section 312, the inclined section 312 is communicated with the vertical section 311, and the vertical section 311 is communicated with the blowing tube 11, in this embodiment, after entering the blowing tube 11, the gas enters the inclined section 312 through the vertical section 311, and the gas is blown to the back of the wafer through the inclined section 312, so as to achieve the effect of cleaning particles.

As shown in FIG. 4, in the present embodiment, the angle between the inclined section 312 and the horizontal direction is defined as α, which is between 30 ° and 45 °.

As a preferred embodiment, as shown in fig. 1 and 2, a mounting hole 101 is opened on the surface of the outer shell 10, the connector 20 is communicated with an air outlet hole 111 on the air blowing pipe 11 through the mounting hole 101, and the blowing pipe 30 is communicated with the connector 20, in this embodiment, the connector 20 includes an air duct 21 vertically arranged, one end of the air duct 21 is communicated with the air outlet hole 111, and one end of the blowing pipe 30 is inserted into the air duct 21. The utility model provides an air supply enters into in the connecting piece 20 and then passes through gas blow pipe 11 connecting piece 20 get into jetting pipe 30 inside, gaseous blowout is right wafer back clear up.

In this embodiment, the vertical section 311 of the blowing tube 30 is fixedly provided with a clamping member 31, the clamping member 31 is used to be matched with the air duct 21 to be provided with a clamping groove 22, as shown in fig. 3, the clamping member 31 is inserted into the clamping groove 22 to fix the blowing tube 30 on the connecting member 20. In this embodiment, when the blowing direction of the blowing tube 30 needs to be adjusted, the blowing tube 30 is pulled out, the direction is adjusted and then inserted into the connecting member 20, and the clamping member 31 is used in cooperation with the clamping groove 22 to fix the blowing tube 30, so that the purpose of adjusting the blowing direction of the blowing tube 30 is achieved.

Example 2

As shown in fig. 5, which is a schematic structural diagram of a wafer back cleaning mechanism for a photo-resist machine according to another preferred embodiment of the present invention, the cleaning mechanism of this embodiment further includes an adjusting mechanism 40 on the basis of embodiment 1, the adjusting mechanism 40 includes a sealing member 41 disposed in the blowing pipe 11 and a power mechanism disposed outside the outer housing 10, and a power output end of the power mechanism extends into the blowing pipe 11 and is connected to the sealing member 41. The power mechanism works to push the sealing member 41 to slide in the blowing pipe 11 along the length direction of the blowing pipe 11, and the sealing member 41 is connected with the blowing pipe 11 in a sealing and sliding manner.

In this embodiment, the wafer is in the transmission of the length direction of clean mechanism above clean mechanism, power unit promotes sealing member 41 and slides in gas blow pipe 11 along the wafer equidirectional, thereby make the jetting speed of the jetting pipe 30 of giving vent to anger increase gradually, and then reached gaseous jetting's speed and increased, the clearance effect to the wafer back is more and more good, the problem of particle adhesion at the back of the wafer has been avoided and the clearance effect of the back of the wafer has been improved, after the clearance of single wafer is accomplished, sealing member 41 resets because power unit effect, continue to clear up next wafer.

In this embodiment, the sealing member 41 is made of a rubber material.

Example 3

As shown in fig. 7 and 8, it is a structural schematic diagram of a crystal back cleaning mechanism for a photoresist machine according to another preferred embodiment of the present invention, the cleaning mechanism of this embodiment, on the basis of embodiment 1 or 2, in order to improve the installation efficiency and facilitate the detachment of the gas blowing pipe 11, an assembly 12 is disposed on the inner wall of the right side of the outer shell 10, an inner thread is disposed on the inner wall of one end of the gas blowing pipe 11 opposite to the assembly 12, an outer thread is disposed on the outer wall of the assembly 12, and the gas blowing pipe 11 can be fixed in the outer shell 10 by the threaded assembly of the gas blowing pipe 11 and the assembly 12, thereby facilitating the detachment and installation of the gas blowing pipe 11 and providing convenience for people.

The above description is for further details of the present invention, and it is not assumed that the embodiments of the present invention are limited to these descriptions, and it is obvious to those skilled in the art that the present invention can be implemented by a plurality of simple deductions or replacements without departing from the concept of the present invention, and all should be considered as belonging to the protection scope defined by the claims submitted by the present invention.

Claims

1. A crystal back cleaning mechanism for a light resistance machine comprises an outer shell (10), wherein an air blowing pipe (11) is assembled in the outer shell (10), an air blowing pipe (30) is assembled on the surface of the outer shell (10), and the air blowing pipe (30) is communicated with the air blowing pipe (11) in the outer shell (10);

the method is characterized in that:

the blowing pipe (30) comprises a vertical section (311) and an inclined section (312), the inclined section (312) is communicated with the vertical section (311), and the vertical section (311) is communicated with the blowing pipe (11).

2. The wafer backside cleaning mechanism for a photoresist machine according to claim 1, wherein: the inclined section (312) is defined to form an angle alpha with the horizontal direction, and the angle alpha is 30-45 degrees.

3. The wafer backside cleaning mechanism for a photoresist machine according to claim 1, wherein: the blowing pipe (30) is assembled with the blowing pipe (11) through a connecting piece (20);

the surface of the outer shell (10) is provided with a mounting hole (101), the connecting piece (20) is communicated with an air outlet hole (111) on the air blowing pipe (11) through the mounting hole (101), and the blowing pipe (30) is communicated with the connecting piece (20).

4. The wafer back cleaning mechanism for a photoresist machine according to claim 3, wherein: the connecting piece (20) comprises a vertically arranged air duct (21), one end of the air duct (21) is communicated with the air outlet hole (111), and one end of the blowing pipe (30) is inserted into the air duct (21).

5. The wafer backside cleaning mechanism for a photoresist machine according to claim 4, wherein: the vertical section (311) of the blowing pipe (30) is fixedly provided with a clamping piece (31), the air guide pipe (21) is provided with a clamping groove (22) matched with the clamping piece (31), and the clamping piece (31) is inserted into the clamping groove (22) and used for fixing the blowing pipe (30) on the connecting piece (20).

6. The wafer back cleaning mechanism for a photoresist machine according to any one of claims 1 to 5, wherein: the air blowing pipe sealing device is characterized by further comprising an adjusting mechanism (40), wherein the adjusting mechanism (40) comprises a sealing component (41) arranged in the air blowing pipe (11) and a power mechanism arranged on the outer side of the outer shell (10), and a power output end of the power mechanism extends into the air blowing pipe (11) and is connected with the sealing component (41); the power mechanism works to push the sealing component (41) to slide in the blowing pipe (11) along the length direction of the blowing pipe (11), and the sealing component (41) is connected with the blowing pipe (11) in a sealing and sliding manner.

7. The wafer backside cleaning mechanism for a photoresist machine according to claim 1, wherein: an assembly part (12) is arranged on the inner wall of the right side of the outer shell (10), an inner thread is arranged on the inner wall of one end, opposite to the assembly part (12), of the air blow pipe (11), an outer thread is arranged on the outer wall of the assembly part (12), and the air blow pipe (11) and the assembly part (12) are assembled inside the outer shell (10) in a threaded mode.