CN213897972U - Outer heat conduction prefabricated groove floor heating PC template - Google Patents
Outer heat conduction prefabricated groove floor heating PC template Download PDFInfo
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- CN213897972U CN213897972U CN202021594086.2U CN202021594086U CN213897972U CN 213897972 U CN213897972 U CN 213897972U CN 202021594086 U CN202021594086 U CN 202021594086U CN 213897972 U CN213897972 U CN 213897972U
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- floor heating
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- 238000010438 heat treatment Methods 0.000 title claims abstract description 49
- 239000011248 coating agent Substances 0.000 claims abstract description 39
- 238000000576 coating method Methods 0.000 claims abstract description 39
- 239000011381 foam concrete Substances 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 5
- 238000012423 maintenance Methods 0.000 abstract description 9
- 230000017525 heat dissipation Effects 0.000 abstract description 4
- 238000009413 insulation Methods 0.000 abstract description 3
- 230000006835 compression Effects 0.000 abstract description 2
- 238000007906 compression Methods 0.000 abstract description 2
- 238000004321 preservation Methods 0.000 abstract description 2
- 239000004568 cement Substances 0.000 description 5
- 229910010272 inorganic material Inorganic materials 0.000 description 4
- 239000011147 inorganic material Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 239000003973 paint Substances 0.000 description 3
- 229910052582 BN Inorganic materials 0.000 description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000004567 concrete Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920006327 polystyrene foam Polymers 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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Abstract
The utility model relates to a warm up board technical field specifically is a PC template warms up prefabricated recess of outer heat conduction, the PC template warms up includes the mainboard and is located two upper grooves that mainboard surface upper end was seted up side by side, the surperficial lower extreme of mainboard corresponds upper groove department and is provided with two low grooves side by side, every upper groove and low groove all communicate each other, the inboard correspondence that the surperficial upper end of mainboard was located the upper groove is provided with two lugs, the accessory includes the first cover groove module of block in upper groove and low groove, second cover groove module and third cover groove module, the lower surface of mainboard is provided with the bottom surface coating, and the upper surface of mainboard is provided with the top surface coating. The high-strength light heat-preservation floor heating plate with the grooves is strong in compression resistance and heat insulation performance, not prone to deformation, high in surface strength, good in heat dissipation performance and high in fire resistance, meanwhile, accessories attached to the floor heating plate can cover the redundant grooves and fix the floor heating pipes, and later-stage heating pipe maintenance is facilitated.
Description
Technical Field
The utility model relates to a warm up the board technical field, specifically be a PC template warms up outer heat conduction prefabricated recess.
Background
The floor heating is divided into dry floor heating and wet floor heating, the wet floor heating belongs to a traditional operation method, the construction time is long, and the problem occurs in the use process, so that the maintenance is difficult, and the wet floor heating is gradually eliminated due to the defects; the dry floor heating is paved and spliced on site by using the manufactured template, so that the construction time is short and the maintenance is simple.
However, most of the existing floor heating modules are made of polystyrene foam plastics, although the heat insulation performance of the materials is good, the compressive strength of the materials is too low, when the floor is placed with areas with large mass and small stress surface, such as a piano, a wardrobe and a bathtub, and the like, which are frequently walking in a path, the floor heating modules are deformed, broken or inclined, the floor heating pipelines are broken, furniture and the like are inclined, and the maintenance is very troublesome. Therefore, the technical personnel in the field provide an outer heat conduction prefabricated groove floor heating PC template to solve the problems in the background art.
Disclosure of Invention
An object of the utility model is to provide a PC template warms up outer heat conduction prefabricated recess to it is poor to provide current ground heating plate compressive strength among the above-mentioned background art of solution, and is yielding, causes the damaged problem that makes later stage maintenance difficulty of ground heating coil pressurized easily.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a PC template warms up prefabricated recess of outer heat conduction, the PC template warms up includes the mainboard and is located two upper grooves that mainboard surface upper end was seted up side by side, still including installing the accessory in PC template warms up, the surperficial lower extreme of mainboard corresponds upper groove department and is provided with two low grooves side by side, every upper groove and low groove all communicate each other, the inboard correspondence that the surperficial upper end of mainboard is located the upper groove is provided with two lugs, the accessory includes first cover groove module, second cover groove module and the third cover groove module of block in upper groove and low groove, the lower surface of mainboard is provided with the bottom surface coating, and the upper surface of mainboard is provided with the top surface coating.
As a further aspect of the present invention: the first cover groove module is of a cuboid structure, the second cover groove module is of a U-shaped structure, one side face of the first cover groove module and one side face of the second cover groove module are of semicircular structures, the other side face of the first cover groove module and the other side face of the second cover groove module are of planar structures, and the outer diameters of the first cover groove module and the second cover groove module are matched with the inner diameters of the upper groove and the lower groove.
As a further aspect of the present invention: the third cover groove module is of a cuboid structure, a semicircular groove is formed in one side face of the third cover groove module, the other side face of the third cover groove module is of a plane structure, and the outer diameter of the third cover groove module is matched with the inner diameters of the upper groove and the lower groove.
As a further aspect of the present invention: the depth of the upper groove and the lower groove is 10mm-25mm, and the height of the first cover groove module, the height of the second cover groove module and the height of the third cover groove module are 10mm-25 mm.
As a further aspect of the present invention: the thickness of the main plate is 30mm-40mm, and the thickness of the bottom surface coating and the thickness of the top surface coating are both 0.2mm-1 mm.
As a further aspect of the present invention: the main board is made of foam concrete, the first cover groove module, the second cover groove module and the third cover groove module are all modules with heat conduction properties on the outer surfaces, and the main material of the modules is made of the foam concrete.
Compared with the prior art, the beneficial effects of the utility model are that: the utility model relates to an outer heat conduction prefabricated groove floor heating PC template, in the actual operation, through designing the high-strength light heat preservation floor heating board with the groove, the floor heating pipe can be conveniently clamped and laid when the floor heating is laid, and the accessory can cover redundant grooves and fixed floor heating pipes, and after the accessory is clamped in the groove, the other side of the accessory is parallel to the surface of the mainboard, thereby the top surface of the whole mainboard is in a flat state, the later-stage maintenance of the heating pipe is convenient, simultaneously the top surface and the bottom surface of the mainboard are provided with a top surface coating and a bottom surface coating, or the top surface of the cover groove module is simultaneously provided with the top surface coating and the bottom surface coating, or the top surface of the mainboard is firstly covered with the bottom surface coating and then covered with the top surface coating, the compression resistance and the heat insulation performance of the floor heating PC template and the accessory of the design are conveniently improved, the floor heating PC template and the accessory are not easy to deform, good heat dissipation, fire behavior is high moreover, compares current product, and this product strength is high, and the water absorption rate is low, and is with low costs, and the later stage is to ground heating coil easy maintenance swift, and it is more efficient to let ground heat utilization ratio.
Drawings
Fig. 1 is a schematic structural diagram of an outer-layer heat-conducting prefabricated groove floor heating PC template;
fig. 2 is a schematic structural diagram of a main board in an outer-layer heat-conducting prefabricated groove floor heating PC template;
fig. 3 is a schematic structural diagram of a first cover groove module and a second cover groove module in an outer-layer heat-conducting prefabricated groove floor heating PC template;
fig. 4 is a schematic view of the installation of the bottom coating and the top coating in the outer-layer heat-conducting prefabricated groove floor heating PC template.
In the figure: 1. a main board; 2. an upper groove; 3. a lower groove; 4. a first cover and slot module; 5. a second cover and slot module; 6. a bump; 7. a third cover and slot module; 10. a bottom surface coating; 11. and (4) top coating.
Detailed Description
Referring to fig. 1 to 4, in the embodiment of the present invention, an outer heat conducting prefabricated groove floor heating PC template comprises a main board 1, two upper grooves 2 arranged at the upper end of the surface of the main board 1 in parallel, and a fitting installed on the floor heating PC template, wherein two lower grooves 3 are arranged at the lower end of the surface of the main board 1 corresponding to the upper grooves 2 in parallel, each upper groove 2 and each lower groove 3 are communicated with each other, two protrusions 6 are arranged at the upper end of the surface of the main board 1 corresponding to the inner side of the upper groove 2, the fitting comprises a first cover groove module 4, a second cover groove module 5 and a third cover groove module 7 which are clamped in the upper grooves 2 and the lower grooves 3, a bottom coating 10 is arranged on the lower surface of the main board 1, a top coating 11 is arranged on the upper surface of the main board 1, and the thicknesses of the bottom coating 10 and the top coating 11 are both 0.2mm to 1mm, it should be noted that the top coating 11 is a heat-conducting coating, and is formed by mixing and stirring a matrix slurry, aluminum nitride, silicon carbide, hexagonal boron nitride (boron nitride), graphite and an additive, the top coating 11 is an inorganic material, is high temperature resistant, stable in property, good in adhesion with related inorganic materials, high in surface strength, good in heat dissipation and easy to form a film, and the bottom coating 10 is a heat-insulating coating or a heat-insulating paint which is common in the market, wherein the heat-insulating coating can be ZS-1 coating of Shishenghua.
As shown in fig. 3: the first cover groove module 4 is of a cuboid structure, the second cover groove module 5 is of a U-shaped structure, one side surfaces of the first cover groove module 4 and the second cover groove module 5 are of semicircular structures, the other side surfaces of the first cover groove module 4 and the second cover groove module 5 are of planar structures, the outer diameters of the first cover groove module 4 and the second cover groove module 5 are matched with the inner diameters of the upper groove 2 and the lower groove 3, the third cover groove module 7 is of a cuboid structure, a semicircular groove is formed in one side surface of the third cover groove module 7, the other side surface of the third cover groove module 7 is of a planar structure, the outer diameter of the third cover groove module 7 is matched with the inner diameters of the upper groove 2 and the lower groove 3, the depths of the upper groove 2 and the lower groove 3 are 10mm-25mm, the heights of the first cover groove module 4, the second cover groove module 5 and the third cover groove module 7 are 10mm-25mm, and the first cover groove module 4, the second cover groove module 5 and the third cover groove module 7 are matched with the sizes of the upper groove 3 and the lower groove 2 Therefore, when in use, the first cover groove module 4 and the second cover groove module 5 can be used for filling the redundant grooves (namely the upper groove 2 and the lower groove 3) on the main board 1, and after the floor heating pipe is paved through the third cover groove module 7, the semicircular groove on one side surface of the third cover groove module 7 is used for being just clamped on the floor heating pipe, and after the third cover groove module 7 is clamped, the other side surface of the third cover groove module is just parallel to the surface of the main board 1, and the upper surfaces of the first cover groove module 4, the second cover groove module 5 and the third cover groove module 7 are also provided with the top surface coating 11 and the lower surfaces are also provided with the bottom surface coating 10, or the top surfaces of the first cover groove module 4, the second cover groove module 5 and the third cover groove module 7 are simultaneously covered with the bottom surface coating 10 and the top surface coating 11, or the top surface of the main board 1 is firstly covered with the bottom surface coating 10 and then covered with the top surface coating 11, if cost is taken into consideration, the thermal conductive paint and the thermal insulating paint (i.e., the under coat 10 and the over coat 11) may not be sprayed, and only the aluminum foil may be applied on the upper side of the main board 1.
As shown in fig. 2 and 4: the main board 1 is made of foam concrete, and can be made of one of foam cement, foamed ceramic and foamed cement, the first cover groove module 4, the second cover groove module 5 and the third cover groove module 7 are all modules with heat-conducting properties on the outer surfaces, and the main material of the modules is made of the foam concrete, and can also be made of one of aluminum alloy, foamed cement, foamed ceramic, foamed cement and polystyrene.
The utility model discloses a theory of operation is: the utility model discloses at the during operation, lay mainboard 1 after making level with self-leveling cement, after mainboard 1 lays and accomplishes, arrange the installation on mainboard 1 with the ground heating coil, make the ground heating coil block in the recess (being upper groove 2 and lower groove 3) of mainboard 1 upper surface, thereby accomplish the laying of ground heating coil, after the installation of ground heating coil, remaining recess on mainboard 1, can utilize first cover groove module 4 and second cover groove module 5 to fill it, thereby ensure the planarization of mainboard 1 surface, utilize the one side that third cover groove module 7 has semicircular groove to carry out the block fixation to the ground heating coil of laying simultaneously, after the block is accomplished, the another side of third cover groove module 7 just parallels with the face of mainboard 1, make things convenient for later stage heating coil maintenance, and added bottom surface coating 10 in mainboard 1 bottom, make mainboard 1 later stage maintenance and compressive property and can obtain promoting, meanwhile, the top surface coating 11 designed on the top surface of the main board 1 is made of an inorganic material, is high-temperature resistant, stable in property, good in adhesiveness with related inorganic materials, high in surface strength, good in heat dissipation performance and easy to form a film, and enables the floor heating utilization rate to be more efficient.
The above-mentioned, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.
Claims (6)
1. An outer-layer heat-conducting prefabricated groove floor heating PC template is characterized by comprising a main board (1), two upper grooves (2) which are formed in the upper end of the surface of the main board (1) in parallel and accessories arranged on the floor heating PC template, two lower grooves (3) are arranged in parallel at the lower end of the surface of the main board (1) corresponding to the upper grooves (2), each upper groove (2) and each lower groove (3) are communicated with each other, two convex blocks (6) are correspondingly arranged at the upper end of the surface of the main board (1) and positioned at the inner side of the upper groove (2), the accessories comprise a first cover groove module (4), a second cover groove module (5) and a third cover groove module (7) which are clamped in the upper groove (2) and the lower groove (3), the lower surface of the main board (1) is provided with a bottom surface coating (10), and the upper surface of the main board (1) is provided with a top surface coating (11).
2. The outer-layer heat-conducting prefabricated groove floor heating PC template as claimed in claim 1, wherein the first cover and groove module (4) is of a cuboid structure, the second cover and groove module (5) is of a U-shaped structure, one side face of each of the first cover and groove module (4) and the second cover and groove module (5) is of a semicircular structure, the other side face of each of the first cover and groove module (4) and the second cover and groove module (5) is of a planar structure, and the outer diameters of the first cover and groove module (4) and the second cover and groove module (5) are matched with the inner diameters of the upper groove (2) and the lower groove (3).
3. The outer-layer heat-conducting prefabricated groove floor heating PC template as claimed in claim 1, wherein the third cover groove module (7) is of a cuboid structure, a semicircular groove is formed in one side face of the third cover groove module (7), the other side face of the third cover groove module (7) is of a plane structure, and the outer diameter of the third cover groove module (7) is matched with the inner diameters of the upper groove (2) and the lower groove (3).
4. An outer heat-conducting prefabricated groove floor heating PC template as claimed in claim 1, wherein the depth of the upper groove (2) and the lower groove (3) is 10mm-25mm, and the height of the first cover groove module (4), the height of the second cover groove module (5) and the height of the third cover groove module (7) are 10mm-25 mm.
5. An outer heat-conducting prefabricated grooved floor heating PC template as claimed in claim 1, wherein the thickness of the main board (1) is 30mm-40mm, and the thickness of the bottom surface coating (10) and the thickness of the top surface coating (11) are both 0.2mm-1 mm.
6. An outer heat-conducting prefabricated groove floor heating PC template as claimed in claim 1, wherein the main board (1) is made of foam concrete, the first cover groove module (4), the second cover groove module (5) and the third cover groove module (7) are all modules with heat-conducting property on the outer surfaces, and the main material of the modules is made of foam concrete.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021594086.2U CN213897972U (en) | 2020-08-04 | 2020-08-04 | Outer heat conduction prefabricated groove floor heating PC template |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021594086.2U CN213897972U (en) | 2020-08-04 | 2020-08-04 | Outer heat conduction prefabricated groove floor heating PC template |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213897972U true CN213897972U (en) | 2021-08-06 |
Family
ID=77096655
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021594086.2U Active CN213897972U (en) | 2020-08-04 | 2020-08-04 | Outer heat conduction prefabricated groove floor heating PC template |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213897972U (en) |
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2020
- 2020-08-04 CN CN202021594086.2U patent/CN213897972U/en active Active
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