CN213772191U - Evaporation coating cavity internal cooling structure and evaporation coating device - Google Patents
Evaporation coating cavity internal cooling structure and evaporation coating device Download PDFInfo
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- CN213772191U CN213772191U CN202022633430.0U CN202022633430U CN213772191U CN 213772191 U CN213772191 U CN 213772191U CN 202022633430 U CN202022633430 U CN 202022633430U CN 213772191 U CN213772191 U CN 213772191U
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Abstract
The utility model relates to an evaporation equipment technical field specifically discloses an evaporation coating cavity internal cooling structure and evaporation coating device. The cooling structure in the evaporation cavity comprises at least one cooling plate, the cooling plate is arranged between the crucible and the evaporation plate, the periphery of the cooling plate is connected with the side wall of the evaporation cavity, and a through hole which can enable the crucible to evaporate substances to the substrate is formed in the cooling plate in an evaporation mode. The utility model provides an evaporation coating cavity internal cooling structure sets up the cooling plate in the evaporation coating cavity, and between crucible and the evaporation coating dish were arranged in to the cooling plate, on the heat radiation of crucible cooled plate, the heat was directly taken away to the cooling plate, had reduced the heat that radiates on substrate and the evaporation coating cavity lateral wall to evaporation coating material and the foreign gas of deposit on the cooling plate can be because of the low difficult desorption of cooling plate temperature, have reduced the influence to the substrate coating film. In addition, the heat radiation on the substrate is transferred to the cooling plate, so that the ambient temperature of the substrate is reduced, and the organic coating of the substrate is prevented from being damaged.
Description
Technical Field
The utility model relates to an evaporation equipment technical field especially relates to an evaporation coating cavity internal cooling structure and evaporation coating device.
Background
Organic thin film electroluminescent display devices (OLEDs) are an emerging technology in which organic semiconductor materials emit light under the action of an electric field, and have been rapidly developed in recent years. The OLED display has the advantages of low energy consumption, environmental protection, ultrathin property, high color saturation, surface light source and the like. At present, OLED display devices are mainly prepared by an evaporation coating method, and in large evaporation equipment, a metal anode is deposited on a substrate by evaporating metals such as Ag, Mg, Al and the like through a large point source to form an anode pattern. The higher melting point of the metal requires a higher heating temperature of the point source to maintain a stable deposition rate. In the vacuum chamber, heat transfer between non-contact parts is mainly heat radiation, and heat brought by metal atoms deposited on the surface of the parts. When the temperature of the metal point source is higher, the temperature of the parts radiated into the vacuum cavity and the vacuum cavity is higher, so that the surface temperature of the part is increased, the gas adsorbed on the surface of the material is released, and meanwhile, the metal material adsorbed on the surface of the part is desorbed again and possibly deposited on the substrate to influence the quality of the film layer.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a cooling structure and coating by vaporization device in coating by vaporization cavity effectively cools off the temperature in the coating by vaporization cavity, improves the quality of substrate coating by vaporization.
To achieve the purpose, the utility model adopts the following technical proposal:
the utility model provides a cooling structure in coating by vaporization cavity, the bottom is equipped with the crucible in the coating by vaporization cavity, the top is equipped with the coating by vaporization dish that is used for installing the substrate in the coating by vaporization cavity, cooling structure includes at least one cooling plate, the cooling plate set up in the crucible with between the coating by vaporization dish, just the cooling plate periphery with the lateral wall of coating by vaporization cavity is connected, seted up on the cooling plate and enabled the material coating by vaporization of crucible evaporation extremely through-hole on the substrate.
Preferably, the number of the cooling plates is at least two, one cooling plate is arranged close to the crucible, and the other cooling plate is arranged close to the evaporation disc.
Preferably, the through holes of the cooling plate disposed near the evaporation pan have a larger aperture than the through holes of the cooling plate disposed near the crucible.
Preferably, each cooling plate is provided with an inlet and an outlet;
a plurality of cooling plates are connected in series, wherein one cooling plate is connected with a cooling medium supply device; or the like, or, alternatively,
each cooling plate is connected with the cooling medium supply device.
Preferably, a cooling pipeline is arranged in the cooling plate, and the cooling pipeline is coiled in the cooling plate.
Preferably, the cooling plate is detachably connected with an inner lining plate on both sides.
Preferably, the inner side walls of the evaporation chamber are detachably connected with lining plates.
Preferably, the cooling plate is detachably arranged on the side wall of the evaporation cavity.
Preferably, the material of the cooling plate is stainless steel.
The evaporation device comprises an evaporation cavity, a crucible arranged at the bottom in the evaporation cavity, an evaporation disc arranged at the top in the evaporation cavity and used for mounting a substrate, and a cooling structure arranged in the evaporation cavity and used as above.
The utility model has the advantages that: set up the cooling plate in the coating by vaporization cavity, the cooling plate is arranged in between crucible and the coating by vaporization dish, and the heat radiation of crucible is to the cooling plate on, and the heat is directly taken away to the cooling plate, has reduced the heat that radiates on substrate and the coating by vaporization cavity lateral wall to the coating by vaporization material and the foreign gas of deposit on the cooling plate can be because of the low difficult desorption of cooling plate temperature, have reduced the influence to the substrate coating film. In addition, the heat radiation on the substrate is transferred to the cooling plate, so that the ambient temperature of the substrate is reduced, and the organic coating of the substrate is prevented from being damaged.
Drawings
Fig. 1 is a schematic structural diagram of a cooling structure in an evaporation chamber provided in an embodiment of the present invention.
In the figure:
100. evaporating a cavity; 200. a crucible; 300. evaporating and plating the plate;
1. a cooling plate; 11. a through hole; 2. and a lining plate.
Detailed Description
In order to make the technical problem solved by the present invention, the technical solutions adopted by the present invention and the technical effects achieved by the present invention clearer, the following will be described in further detail with reference to the accompanying drawings, and obviously, the described embodiments are only some embodiments of the present invention, but not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by the skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, unless expressly stated or limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, e.g., as meaning permanently connected, detachably connected, or integral to one another; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
When the coating by vaporization substrate among the prior art, when the metal point source temperature is higher, the temperature of radiating spare part in vacuum cavity and the vacuum cavity is higher, cause part surface temperature to rise, material surface adsorption's gas will be released, adsorb the metal material on the part surface simultaneously and will desorb once more, probably deposit on the substrate and go, influence the problem of coating by vaporization layer quality, this embodiment provides a coating by vaporization device, and set up the cooling structure in the coating by vaporization cavity in the coating by vaporization device in order to solve above-mentioned problem.
Specifically, as shown in fig. 1, this coating by vaporization device is including coating by vaporization cavity 100, the bottom is equipped with crucible 200 in the coating by vaporization cavity 100, the top is equipped with the coating by vaporization dish 300 that is used for installing the substrate in the coating by vaporization cavity 100, be equipped with cooling structure in the coating by vaporization cavity 100, cooling structure can effectively reduce the temperature in the coating by vaporization cavity 100 in the coating by vaporization cavity, reduce the heat that radiates on substrate and the 100 lateral walls of coating by vaporization cavity, avoid material surface adsorption's gas to be released, adsorb the metal material desorption once more on the part surface simultaneously, the quality that the coating by vaporization layer of substrate has been improved.
In this embodiment, the cooling structure in the evaporation chamber comprises at least one cooling plate 1, the cooling plate 1 is disposed between the crucible 200 and the evaporation plate 300, the periphery of the cooling plate 1 is connected to the sidewall of the evaporation chamber 100, and the cooling plate 1 is provided with a through hole 11 for evaporating the material evaporated from the crucible 200 onto the substrate. Set up cooling plate 1 in evaporation coating cavity 100, cooling plate 1 is arranged in between crucible 200 and evaporation coating disc 300, and crucible 200's heat radiation is to cooling plate 1 on, and the heat is directly taken away to cooling plate 1, has reduced the heat that radiates on substrate and the 100 lateral walls of evaporation coating cavity to evaporation coating material and foreign gas of deposit on cooling plate 1 can be because of cooling plate 1 low temperature and difficult desorption, have reduced the influence to the substrate coating film. In addition, the heat radiation on the substrate is transferred to the cooling plate 1, so that the temperature of the substrate is reduced, and the organic coating of the substrate is prevented from being damaged.
Specifically, in the present embodiment, the cooling plate 1 is detachably disposed on the sidewall of the evaporation chamber 100. Excessive deposition of impurities on the cooling plate 1 affects the cooling effect of the cooling plate 1, and the cooling plate 1 is detachably attached to replace the cooling plate 1.
At least two cooling plates 1 are provided, and one cooling plate 1 is disposed near the crucible 200, and the other cooling plate 1 is disposed near the evaporation pan 300. The heat on the substrate is transmitted to the periphery through radiation, the cooling plate 1 arranged close to the evaporation plate 300 enables the ambient temperature of the substrate on the evaporation plate 300 to be lower, evaporation materials and impurity gas deposited on the cooling plate 1 or on the side wall of the evaporation cavity 100 are prevented from being desorbed, and the organic coating of the substrate is prevented from being damaged. The cooling plate 1 arranged near the crucible 200 can effectively reduce the temperature around the crucible 200, avoid the desorption of evaporation materials and impurity gases deposited on the cooling plate 1 or on the side wall of the evaporation cavity 100, and reduce the influence on the coating of the substrate. The number of the cooling plates 1 may be three, four or more, and is not limited herein, and may be set according to the size of the evaporation chamber 100.
Further, the through holes 11 of the cooling plate 1 disposed near the evaporation plate 300 have a larger diameter than the through holes 11 of the cooling plate 1 disposed near the crucible 200, ensuring that the evaporated material of the crucible 200 can be evaporated onto the substrate. Specifically, the cooling plate 1 disposed near the crucibles 200 is opened with a through hole 11 corresponding to the evaporation port of each crucible 200. The arrangement of the cooling plates 1 and the through holes 11 arranged in multiple layers can disperse and deposit the evaporation materials on each cooling plate 1, thereby avoiding the frequent replacement caused by excessive evaporation materials deposited on one cooling plate 1.
The cooling medium in the cooling plate 1 is liquid or gas, and each cooling plate 1 is provided with an inlet and an outlet, so that the circulation of the cooling medium in the cooling plate 1 is realized. A plurality of cooling plates 1 can be connected in series, wherein one cooling plate 1 is connected to a cooling medium supply. Each cooling plate 1 may also be connected to a cooling medium supply device to increase cooling efficiency.
Further, the material of cooling plate 1 is the stainless steel, is equipped with cooling tube in the cooling plate 1, and cooling tube coils in cooling plate 1 to increase cooling area, cooling tube's one end is established to the import, and the other end is established to the export, is convenient for realize cooling medium's in cooling plate 1 circulation.
In this embodiment, the inner lining plate 2 is detachably connected to both sides of the cooling plate 1, so that the evaporation material and the impurity gas are deposited on the inner lining plate 2, the cooling effect of the cooling plate 1 is not affected, and the inner lining plate 2 can be detached, and when the material deposited on the inner lining plate 2 reaches a certain thickness, the inner lining plate 2 is removed for cleaning.
The inner side wall of the evaporation cavity 100 can be detachably connected with the lining plate 2, so that evaporation materials and impurity gases are prevented from being deposited on the inner side wall of the evaporation cavity 100, and the evaporation cavity is convenient to clean. The inner liner plate 2 is in contact with the cooling plate 1 and the inner side wall of the evaporation chamber 100, and reduces the temperature of the side wall of the evaporation chamber 100 by heat conduction.
The lining plate 2 is made of frosted stainless steel, so that the roughness of the surface of the lining plate 2 is increased, and the lining plate 2 is further convenient to clean. In other embodiments, the inner lining plate 2 may be made of other materials, which are not limited herein.
It is obvious that the above embodiments of the present invention are only examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.
Claims (10)
1. The utility model provides a cooling structure in coating by vaporization cavity, bottom is equipped with crucible (200) in coating by vaporization cavity (100), the top is equipped with coating by vaporization dish (300) that is used for the mounted substrate in coating by vaporization cavity (100), its characterized in that, cooling structure includes at least one cooling plate (1), cooling plate (1) set up in crucible (200) with between coating by vaporization dish (300), just cooling plate (1) periphery with the lateral wall of coating by vaporization cavity (100) is connected, seted up on cooling plate (1) and enabled the material coating by vaporization of crucible (200) evaporation extremely through-hole (11) on the substrate.
2. A cooling structure in evaporation chamber according to claim 1, wherein there are at least two cooling plates (1), and one of the cooling plates (1) is disposed near the crucible (200), and the other cooling plate (1) is disposed near the evaporation plate (300).
3. A cooling structure in a vapor deposition chamber according to claim 2, characterized in that the aperture of the through holes (11) in the cooling plate (1) arranged close to the vapor deposition plate (300) is larger than the aperture of the through holes (11) in the cooling plate (1) arranged close to the crucible (200).
4. A cooling structure in a vapour deposition chamber according to claim 2, wherein each cooling plate (1) is provided with an inlet and an outlet;
a plurality of cooling plates (1) are connected in series, wherein one cooling plate (1) is connected with a cooling medium supply device; or the like, or, alternatively,
each cooling plate (1) is connected with the cooling medium supply device.
5. A cooling structure in a vapor deposition cavity according to claim 4, characterized in that a cooling pipe is arranged in the cooling plate (1), and the cooling pipe is coiled in the cooling plate (1).
6. A cooling structure in evaporation chamber according to claim 1, wherein the cooling plate (1) is detachably connected with an inner lining plate (2) on both sides.
7. A cooling structure in evaporation chamber according to claim 1, wherein the inner side wall of the evaporation chamber (100) is detachably connected with the inner lining plate (2).
8. The cooling structure in evaporation chamber according to claim 1, wherein the cooling plate (1) is detachably disposed on the sidewall of the evaporation chamber (100).
9. The cooling structure in evaporation cavity according to claim 1, wherein the material of the cooling plate (1) is stainless steel.
10. An evaporation device, comprising an evaporation chamber (100), a crucible (200) disposed at the bottom of the evaporation chamber (100), an evaporation tray (300) disposed at the top of the evaporation chamber (100) for mounting a substrate, and a cooling structure disposed in the evaporation chamber (100) and defined in any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022633430.0U CN213772191U (en) | 2020-11-13 | 2020-11-13 | Evaporation coating cavity internal cooling structure and evaporation coating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022633430.0U CN213772191U (en) | 2020-11-13 | 2020-11-13 | Evaporation coating cavity internal cooling structure and evaporation coating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213772191U true CN213772191U (en) | 2021-07-23 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022633430.0U Active CN213772191U (en) | 2020-11-13 | 2020-11-13 | Evaporation coating cavity internal cooling structure and evaporation coating device |
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| Country | Link |
|---|---|
| CN (1) | CN213772191U (en) |
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2020
- 2020-11-13 CN CN202022633430.0U patent/CN213772191U/en active Active
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