CN213733119U

CN213733119U - Embedded rubber coating mould of chip

Info

Publication number: CN213733119U
Application number: CN202022475282.4U
Authority: CN
Inventors: 李颂
Original assignee: Guangzhou Yaweite Auto Parts Co ltd
Current assignee: Guangzhou Yaweite Auto Parts Co ltd
Priority date: 2020-10-31
Filing date: 2020-10-31
Publication date: 2021-07-20
Anticipated expiration: 2030-10-31

Abstract

The utility model provides an embedded rubber coating mould of chip, including top board and holding down plate, the top board with be provided with the module group between the holding down plate, the outside of module group is provided with the nest of tubes of moulding plastics, the top board with the outside of holding down plate is provided with roof and bottom plate respectively, the roof with be provided with the fixed plate between the top board, the bottom plate with be provided with two backing plates between the holding down plate, the both sides of backing plate are provided with rectangular form fixed block, the roof with be provided with the cylinder between the fixed block, the cylinder runs through in proper order the top board with the holding down plate. The utility model discloses when using, successively mould plastics through the nest of tubes of moulding plastics module group, mould plastics out product A, paste the chip on product A, then injection moulding product B on product A's basis makes the complete product of moulding plastics directly wrap up the chip in inside, reduces product manufacturing cost, has waterproof function moreover, makes the product more pleasing to the eye durable.

Description

Embedded rubber coating mould of chip

Technical Field

The utility model belongs to the technical field of the mould technique and specifically relates to an embedded rubber coating mould of chip is related to.

Background

The die is various dies and tools for obtaining required products by injection molding, blow molding, extrusion, die casting or forging forming, smelting, stamping and other methods in industrial production. In short, a mold is a tool used to make a shaped article, the tool being made up of various parts, different molds being made up of different parts. The processing of the appearance of an article is realized mainly through the change of the physical state of a formed material. The element has the name of "industrial mother". The die has a specific contour or cavity shape, and the blank can be separated (blanked) according to the contour shape by applying the contour shape with the cutting edge. The blank can obtain a corresponding three-dimensional shape by using the shape of the inner cavity. The mold generally comprises a movable mold and a fixed mold (or a male mold and a female mold), which can be separated or combined. When the blank is closed, the blank is injected into the die cavity for forming. The die is a precise tool, has a complex shape, bears the expansion force of a blank, has higher requirements on structural strength, rigidity, surface hardness, surface roughness and processing precision, and the development level of die production is one of important marks of the mechanical manufacturing level.

Some current TPE products are carrying out injection moulding's in-process through the mould, often put into the TPE product with the chip, then drip to glue fixedly, but drip to glue fixed with high costs, can not play waterproof effect moreover, influence product quality.

SUMMERY OF THE UTILITY MODEL

The utility model provides an embedded rubber coating mould of chip to solve some current TPE products that propose among the above-mentioned background art and carrying out injection moulding's in-process through the mould, often put into the TPE product with the chip, then drip to glue fixedly, but drip to glue fixed with high costs, can not play waterproof effect moreover, influence product quality scheduling problem.

The technical scheme of the utility model is realized like this:

the utility model provides an embedded rubber coating mould of chip, includes top board and holding down plate, the top board with be provided with the module group between the holding down plate, the outside of module group is provided with the nest of tubes of moulding plastics, the top board with the outside of holding down plate is provided with roof and bottom plate respectively, the roof with be provided with the fixed plate between the top board, the bottom plate with be provided with two backing plates between the holding down plate, the both sides of backing plate are provided with rectangular form fixed block, the roof with be provided with the cylinder between the fixed block, the cylinder runs through in proper order the top board with the holding down plate.

Preferably, the module group comprises an upper module and a lower module, and the opposite surfaces of the upper module and the lower module are respectively provided with corresponding die cavities.

Preferably, the injection pipe set comprises an upper injection pipe and a lower injection pipe, and the upper injection pipe and the lower injection pipe respectively extend into the upper module and the lower module and are respectively communicated with the two die cavities.

Preferably, locking blocks are arranged between the upper pressing plate and the lower pressing plate, the number of the locking blocks is four, and the locking blocks are distributed on the outer sides of the upper module and the lower module in an annular mode.

Preferably, a spring rod is arranged between the base plate and the lower pressing plate.

By adopting the technical scheme, the beneficial effects of the utility model are that:

the utility model discloses when using, successively mould plastics through the nest of tubes of moulding plastics module group, mould plastics out product A, paste the chip on product A, then injection moulding product B on product A's basis makes the complete product of moulding plastics directly wrap up the chip in inside, reduces product manufacturing cost, has waterproof function moreover, makes the product more pleasing to the eye durable.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.

Fig. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is an exploded view of FIG. 1;

fig. 3 is a schematic structural diagram of a module group according to the present invention;

fig. 4 is a schematic structural diagram of a module group according to the present invention;

FIG. 5 is a schematic structural diagram of product A of the present invention;

fig. 6 is a schematic structural diagram of a product B of the present invention.

Wherein:

1. an upper pressure plate; 2. a lower pressing plate; 3. a top plate; 4. a fixing plate; 5. a base plate; 6. a fixed block; 7. a base plate; 8. a cylinder; 9. a module group; 901. an upper module; 902. a lower module; 10. injection molding a pipe group; 1001. an upper injection molding pipe; 1002. a lower injection molding pipe; 11. a spring lever; 12. a locking block; 13. a die cavity; 14. product A; 15. and (C) a product B.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

Referring to fig. 1-6, an embedded rubber coating mould of chip, including top board 1 and holding down plate 2, be provided with module group 9 between top board 1 and holding down plate 2, the outside of module group 9 is provided with moulds plastics nest of tubes 10, the outside of top board 1 and holding down plate 2 is provided with roof 3 and bottom plate 5 respectively, be provided with fixed plate 4 between roof 3 and top board 1, be provided with two backing plates 7 between bottom plate 5 and holding down plate 2, the both sides of backing plate 7 are provided with rectangular form fixed block 6, be provided with cylinder 8 between roof 3 and the fixed block 6, cylinder 8 runs through top board 1 and holding down plate 2 in proper order.

Specifically, the module group 9 includes an upper module 901 and a lower module 902, the facing surfaces of the upper module 901 and the lower module 902 are respectively provided with corresponding mold cavities 13, the injection tube group 10 includes an upper injection tube 1001 and a lower injection tube 1002, the upper injection tube 1001 and the lower injection tube 1002 respectively extend into the upper module 901 and the lower module 902 and are respectively communicated with the two mold cavities 13; with the arrangement, when the chip packaging structure is used, the upper module 901 and the lower module 902 can be respectively and sequentially injected through the upper injection molding pipe 1001 and the lower injection molding pipe 1002, and a product B15 and a product A14 are sequentially injected, so that the chip can be conveniently packaged in the product.

Specifically, four locking blocks 12 are arranged between the upper pressure plate 1 and the lower pressure plate 2, and the locking blocks 12 are annularly distributed on the outer sides of the upper module 901 and the lower module 902; through setting up latch segment 12, can lock fixedly upper press plate 1 and holding down plate 2, and then seal fixedly upper die block 901 and lower module 902 through upper press plate 1 to holding down plate 2, ooze in the gap between raw materials follow upper die block 901 and the lower module 902 when avoiding moulding plastics.

Specifically, a spring rod 11 is arranged between the backing plate 7 and the lower pressing plate 2; so set up, when top board 1 and holding down plate 2 are closed, utilize the elasticity of spring beam 11 to continue upwards to promote holding down plate 2, provide lasting extrusion force for holding down plate 2, make top board 1 and holding down plate 2 keep the tight closed state, and then make cope module 901 and lower module 902's structure inseparabler.

The working principle is as follows:

when in use, the air cylinder 8 contracts, and the upper pressing plate 1 and the lower pressing plate 2 are tightly combined together through the matching of the spring rod 11, so that the upper module 901 and the lower module 902 are tightly combined together, the raw materials are injected into the lower module 902 through the lower injection pipe 1002, and a product A14 is formed by injection molding, the cylinder 8 extends out, the elasticity of the spring rod 11 is overcome, the upper pressing plate 1 drives the upper module 901 to move upwards until the upper module 901 and the lower module 902 are completely separated, a chip is placed on the product A14, the upper module 901 and the lower module 902 are combined together when the cylinder 8 contracts again, then raw materials are injected into the upper module 901 through the upper injection molding pipe 1001, since the cavities 13 of the upper mold block 901 and the cavities 13 of the lower mold block 902 correspond to each other, the feedstock thus injected into upper mold block 901 is then directly injected into product B15 based on product a14 to form the finished product.

The utility model discloses when using, successively mould plastics through moulding plastics nest of tubes 10 to module group 9, mould plastics out product A14, paste the chip on product A14, then mould plastics product B15 on product A14's basis, make the complete product of moulding plastics out directly wrap up the chip in inside, reduce product manufacturing cost, have waterproof function moreover, make the product more pleasing to the eye durable.

The above description is only a preferred embodiment of the present invention, and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. The utility model provides an embedded rubber coating mould of chip which characterized in that: including top board (1) and holding down plate (2), top board (1) with be provided with module group (9) between holding down plate (2), the outside of module group (9) is provided with moulds plastics nest of tubes (10), top board (1) with the outside of holding down plate (2) is provided with roof (3) and bottom plate (5) respectively, roof (3) with be provided with between top board (1) fixed plate (4), bottom plate (5) with be provided with two backing plates (7) between holding down plate (2), the both sides of backing plate (7) are provided with rectangular form fixed block (6), roof (3) with be provided with cylinder (8) between fixed block (6), cylinder (8) run through in proper order top board (1) with holding down plate (2).

2. The chip-embedded encapsulated die of claim 1, wherein: the module group (9) comprises an upper module (901) and a lower module (902), and the opposite surfaces of the upper module (901) and the lower module (902) are respectively provided with corresponding die cavities (13).

3. The chip-embedded encapsulated die of claim 2, wherein: the injection molding pipe group (10) comprises an upper injection molding pipe (1001) and a lower injection molding pipe (1002), wherein the upper injection molding pipe (1001) and the lower injection molding pipe (1002) respectively extend into the upper module (901) and the lower module (902) and are respectively communicated with the two mold grooves (13).

4. The chip-embedded encapsulated die of claim 2, wherein: locking blocks (12) are arranged between the upper pressing plate (1) and the lower pressing plate (2), and four locking blocks (12) are annularly distributed on the outer sides of the upper module (901) and the lower module (902).

5. The chip-embedded encapsulated die of claim 1, wherein: and a spring rod (11) is arranged between the base plate (7) and the lower pressing plate (2).