CN213634400U - Heat dissipation mainboard for computer - Google Patents
Heat dissipation mainboard for computer Download PDFInfo
- Publication number
- CN213634400U CN213634400U CN202022997435.1U CN202022997435U CN213634400U CN 213634400 U CN213634400 U CN 213634400U CN 202022997435 U CN202022997435 U CN 202022997435U CN 213634400 U CN213634400 U CN 213634400U
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- mainboard
- heat dissipation
- protecting sheathing
- heat
- main board
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Abstract
The utility model discloses a heat dissipation mainboard for a computer, which comprises a mainboard, wherein a protective shell is arranged outside the mainboard, a heat conduction mechanism is arranged at the bottom of the mainboard, the bottom of the heat conducting mechanism extends to the lower part of the protective shell, the four corners of the bottom of the protective shell are uniformly provided with supporting and fixing mechanisms, the top end of the inner cavity of the protective shell is provided with a blowing and heat dissipating mechanism which moves in a reciprocating manner from side to side, and the outer side wall of the protective shell is provided with a motor for driving the blowing heat dissipation mechanism to move left and right, the utility model has simple and reasonable structure, the protective shell and the radiating fins are in a hollow state, so that the radiating fins can be quickly radiated, thereby be favorable to heat conduction silica gel piece to dispel the heat fast to the mainboard to under the effect of vent, make the air current that the protecting sheathing inner chamber produced the convection current, thereby can effectively reduce the temperature of protecting sheathing inner chamber.
Description
Technical Field
The utility model relates to a computer motherboard technical field specifically is a heat dissipation mainboard for computer.
Background
A motherboard, also called a main board (main board), a system board (system board) or a motherboard (mother board); it is installed in the cabinet, and is one of the most basic and important parts of the microcomputer. The main board is generally a rectangular circuit board, on which the main circuit system forming the computer is installed, and generally includes elements such as a BIOS chip, an I/O control chip, a keyboard and a panel control switch interface, an indicator light plug-in, an expansion slot, a main board, and a direct current power supply plug-in of a plug-in card.
Mainboard among the prior art does not have self-contained heat-radiating equipment usually, mainly dispels the heat through the CPU fan, and the CPU fan mainly is to the CPU heat dissipation, and consequently the heat dissipation help to whole mainboard is less to seriously influence the use of mainboard, and greatly reduced the life of mainboard, in addition, the mainboard is mostly through rigid mounting in quick-witted incasement, does not possess the effect of shock attenuation buffering, thereby can not play good protection effect to the mainboard.
Disclosure of Invention
An object of the utility model is to provide a heat dissipation mainboard for computer to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme:
the utility model provides a heat dissipation mainboard for computer, includes the mainboard, the mainboard outside is provided with protecting sheathing, the mainboard bottom is provided with heat conduction mechanism, just heat conduction mechanism bottom extends to the protecting sheathing below, protecting sheathing's bottom four corners department evenly is provided with supports fixed establishment, reciprocating motion's the heat dissipation mechanism of blowing about protecting sheathing inner chamber top is provided with, just the protecting sheathing lateral wall is provided with and is used for driving the motor that removes about the heat dissipation mechanism of blowing, be provided with fixed extrusion mechanism between mainboard and the protecting sheathing.
As a further aspect of the present invention: the protective housing is the protruding type structure of cavity, just protective housing one side is provided with the draw-in groove that is used for holding the mainboard, just protective housing's both sides wall all is provided with equidistant distribution's vent, through the draw-in groove that sets up, is convenient for install the mainboard for the both sides of mainboard are located the draw-in groove, and under the effect of the vent on protective housing both sides wall, make the protective housing inner chamber produce the air current of convection current, thereby make external cold air get into the protective housing inner chamber, and the hot-air of protective housing inner chamber then is taken over protective housing by the air current that flows, thereby can effectively reduce protective housing inner chamber's temperature.
As a further aspect of the present invention: the heat conduction mechanism comprises a heat conduction silica gel sheet, the bottom of the heat conduction silica gel sheet is provided with radiating fins distributed at equal intervals, the upper surface of the heat conduction silica gel sheet is in contact with the bottom of the mainboard, the bottom of the protective shell is provided with an opening, the radiating fins penetrate through the opening and extend to the lower part of the protective shell, heat generated by the mainboard can be quickly conducted to the radiating fins through the arranged heat conduction silica gel sheet, and the heat is transferred out of the protective shell through the radiating fins, so that the interior of the protective shell is always kept in a low-temperature state, meanwhile, under the action of the radiating fins, the mainboard can be quickly cooled, the operation of the mainboard is facilitated, and meanwhile, the heat conduction silica gel sheet also plays roles of insulation and shock absorption.
As a further aspect of the present invention: the fixed stay mechanism includes the sleeve pipe, sheathed tube bottom sliding connection has a cover post, cover post bottom is provided with shock-absorbing pad, the cover is equipped with supporting spring on the cover post, through the cooperation between sleeve pipe, cover post and the supporting spring, not only makes the fin be in the fretwork state, still can play effectual shock attenuation cushioning effect to the mainboard, can effectively prevent to shake and cause the damage to the mainboard.
As a further aspect of the present invention: the heat dissipation mechanism of blowing includes radiator fan, radiator fan is located the top of mainboard, just radiator fan's top is provided with the movable block, the cover is equipped with the lead screw on the movable block, lead screw and movable block threaded connection, just the both ends of lead screw all are connected with the rotation of protecting sheathing inner wall through the bearing, the one end and the motor axial region of lead screw are connected, through the starter motor for the lead screw rotates, thereby makes the movable block drive radiator fan and carries out reciprocating motion about the mainboard top, thereby makes the mainboard surface can be bloied by radiator fan and dispels the heat, is favorable to accelerating the radiating rate of mainboard.
As a further aspect of the present invention: the both sides of radiator fan all are provided with the touch piece, just protective housing both sides inner wall corresponds with the touch piece and is provided with switching-over touch switch, switching-over touch switch and motor electric connection through the touch piece and the switching-over touch switch that set up for the device can be automatically controlled radiator fan's reciprocating motion.
As a further aspect of the present invention: the top of movable block is provided with the slider, protecting sheathing's top inner wall corresponds with the slider and is provided with the spout, slider and spout sliding connection have played spacing effect to the movable block through the cooperation between slider and the spout.
As a further aspect of the present invention: fixed extrusion mechanism includes the pull rod, pull rod and protecting sheathing sliding connection, just the one end of pull rod extends to the protecting sheathing inner chamber and is provided with the block rubber, surface contact on block rubber bottom and the mainboard, the other end of pull rod is located the protecting sheathing outside and is provided with the pull ring, the pull rod is located protecting sheathing inner chamber department cover and is equipped with reset spring, through the pulling pull ring, is convenient for put into the draw-in groove with the mainboard, loosens the pull ring after, under reset spring's effect for the pull rod promotes block rubber and mainboard surface contact, thereby compresses tightly fixedly the mainboard, and through the setting of block rubber, can not cause the damage to the mainboard.
Compared with the prior art, the beneficial effects of the utility model are that:
1. the utility model has simple and reasonable structure, through making the protective casing and the radiating fins in a hollow state, the radiating fins can be quickly radiated, thereby the heat-conducting silica gel sheet can be favorably used for quickly radiating the mainboard, and under the action of the ventilation opening, the inner cavity of the protective casing can generate convective airflow, thereby the external cold air can enter the inner cavity of the protective casing, and the hot air in the inner cavity of the protective casing can be taken out of the protective casing by the flowing airflow, thereby the temperature of the inner cavity of the protective casing can be effectively reduced, the radiating effect of the mainboard can be greatly improved, thereby the normal operation of the mainboard can be ensured, the lead screw can be rotated by starting the motor, thereby the movable block can drive the radiating fan to perform reciprocating movement from left to right above the mainboard, thereby the surface of the mainboard can be blown by the radiating fan to radiate heat, and the, the service life of the mainboard is prolonged.
2. Through the sleeve pipe, the cooperation between cover post and the supporting spring not only makes the fin be in the fretwork state, still can play effectual shock attenuation cushioning effect to the mainboard, can effectively prevent to shake and cause the damage to the mainboard, through the pulling pull ring, be convenient for put into the draw-in groove with the mainboard, loosen the pull ring after, under reset spring's effect, make the pull rod promote rubber block and mainboard surface contact, thereby compress tightly the mainboard fixedly, and through the setting of rubber block, can not cause the damage to the mainboard.
Drawings
Fig. 1 is a schematic structural diagram of a heat dissipation motherboard for a computer.
Fig. 2 is a schematic structural diagram of a heat conducting mechanism in a heat dissipating motherboard for a computer.
Fig. 3 is a partially enlarged view of a in a heat dissipating main board for a computer.
In the figure: 1. a protective housing; 2. a main board; 3. an opening; 4. a heat conducting mechanism; 5. a sleeve; 6. sleeving a column; 7. a support spring; 8. a shock-absorbing pad; 9. a screw rod; 10. a motor; 11. a movable block; 12. a chute; 13. a slider; 14. a heat radiation fan; 15. a touch block; 16. a reversing touch switch; 17. a pull ring; 18. a heat-conducting silica gel sheet; 19. a heat sink; 20. a rubber block; 21. a pull rod; 22. a return spring; 23. a vent; 24. a clamping groove.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Please refer to fig. 1-3, in the embodiment of the utility model, a heat dissipation mainboard for computer, including mainboard 2, 2 outsides of mainboard are provided with protecting sheathing 1, 2 bottoms of mainboard are provided with heat conduction mechanism 4, just 4 bottoms of heat conduction mechanism extend to protecting sheathing 1 below, protecting sheathing 1's bottom four corners department evenly is provided with the support fixed establishment, 1 inner chamber top of protecting sheathing is provided with the heat dissipation mechanism of blowing of controlling reciprocating motion, just 1 lateral wall of protecting sheathing is provided with and is used for driving the motor 10 that removes about the heat dissipation mechanism of blowing, be provided with fixed extrusion mechanism between mainboard 2 and the protecting sheathing 1.
Protection housing 1 is the protruding type structure of cavity, just protection housing 1 one side is provided with the draw-in groove 24 that is used for holding mainboard 2, just protection housing 1's both sides wall all is provided with equidistant distribution's vent 23.
Through the draw-in groove 24 that sets up, be convenient for install mainboard 2 for the both sides of mainboard 2 are located draw-in groove 24, and under the effect of vent 23 on the wall of protecting sheathing 1 both sides, make the air current of 1 inner chamber of protecting sheathing production convection current, thereby make external cold air get into protecting sheathing 1 inner chamber, and the hot-air of 1 inner chamber of protecting sheathing then is taken out protecting sheathing 1 by the air current that flows, thereby can effectively reduce the temperature of 1 inner chamber of protecting sheathing.
Heat conduction mechanism 4 includes heat conduction silica gel piece 18, heat conduction silica gel piece 18 bottom is provided with equidistant distribution's fin 19, the upper surface of heat conduction silica gel piece 18 contacts with the bottom of mainboard 2, just the bottom of protecting sheathing 1 is provided with opening 3, fin 19 passes opening 3 and extends to the below of protecting sheathing 1.
Through the heat conduction silica gel piece 18 that sets up, can be fast with the heat conduction of mainboard 2 production to fin 19 on to through fin 19 with heat transfer play protecting sheathing 1, make protecting sheathing 1 inside remain the low temperature state all the time, simultaneously, under the effect of fin 19, can carry out rapid cooling to mainboard 2, be favorable to mainboard 2's operation, heat conduction silica gel piece 18 still plays insulating, absorbing effect simultaneously.
The fixed support mechanism comprises a sleeve 5, the bottom of the sleeve 5 is connected with a sleeve column 6 in a sliding mode, a damping gasket 8 is arranged at the bottom of the sleeve column 6, and a support spring 7 is sleeved on the sleeve column 6.
Through the cooperation between sleeve pipe 5, cover post 6 and the supporting spring 7, not only make fin 19 be in the fretwork state, still can play effectual shock attenuation cushioning effect to mainboard 2, can effectively prevent to shake and cause the damage to mainboard 2.
The heat dissipation mechanism of blowing includes radiator fan 14, radiator fan 14 is located the top of mainboard 2, just radiator fan 14's top is provided with movable block 11, the cover is equipped with lead screw 9 on the movable block 11, lead screw 9 and 11 threaded connection of movable block, just the both ends of lead screw 9 are all rotated through bearing and 1 inner wall of protecting sheathing and are connected, the one end and the 10 axial region of motor of lead screw 9 are connected.
Through starter motor 10 for lead screw 9 rotates, thereby makes movable block 11 drive radiator fan 14 and carries out reciprocating motion about mainboard 2 top, thereby makes mainboard 2 surface can be bloied the heat dissipation by radiator fan 14, is favorable to accelerating mainboard 2's radiating rate.
Both sides of the heat radiation fan 14 are provided with touch blocks 15, the inner walls of both sides of the protective shell 1 are provided with reversing touch switches 16 corresponding to the touch blocks 15, and the reversing touch switches 16 are electrically connected with the motor 10.
The device can automatically control the reciprocating movement of the heat radiation fan 14 through the touch block 15 and the reversing touch switch 16.
The top of movable block 11 is provided with slider 13, the top inner wall of protecting sheathing 1 corresponds with slider 13 and is provided with spout 12, slider 13 and spout 12 sliding connection.
Through the cooperation between slider 13 and spout 12, played spacing effect to movable block 11.
Fixed extrusion mechanism includes pull rod 21, pull rod 21 and 1 sliding connection of protecting sheathing, just the one end of pull rod 21 extends to 1 inner chamber of protecting sheathing and is provided with block rubber 20, surface contact on 20 bottoms of block rubber and the mainboard 2, the other end of pull rod 21 is located the protecting sheathing 1 outside and is provided with pull ring 17, the cover that pull rod 21 is located 1 inner chamber of protecting sheathing is equipped with reset spring 22.
Through pulling pull ring 17, be convenient for put into draw-in groove 24 with mainboard 2, loosen pull ring 17 after, under reset spring 22's effect for pull rod 21 promotes rubber block 20 and mainboard 2 surface contact, thereby compresses tightly fixedly mainboard 2, and through the setting of rubber block 20, can not cause the damage to mainboard 2.
The utility model discloses a theory of operation is:
through the clamping groove 24, the mainboard 2 is convenient to install, the two sides of the mainboard 2 are positioned in the clamping groove 24, and under the action of the ventilation openings 23 on the two side walls of the protective shell 1, the inner cavity of the protective shell 1 generates convective air flow, so that the external cold air enters the inner cavity of the protective shell 1, and the hot air in the inner cavity of the protective shell 1 is taken out of the protective shell 1 by the flowing air flow, so that the temperature of the inner cavity of the protective shell 1 can be effectively reduced, the heat generated by the mainboard 2 can be quickly conducted to the cooling fins 19 through the arranged heat-conducting silica gel sheet 18, and the heat is conducted out of the protective shell 1 through the cooling fins 19, so that the inside of the protective shell 1 is always kept in a low-temperature state, meanwhile, under the action of the cooling fins 19, the mainboard 2 can be quickly cooled, the operation of the mainboard 2 is facilitated, and meanwhile, The damping function, through the sleeve 5, the sleeve column 6 and the supporting spring 7, not only the heat sink 19 is in a hollow state, but also the effective damping and buffering function can be played to the mainboard 2, the damage to the mainboard 2 caused by vibration can be effectively prevented, the lead screw 9 is rotated by starting the motor 10, so that the movable block 11 drives the heat dissipation fan 14 to reciprocate left and right above the mainboard 2, thereby the surface of the mainboard 2 can be blown by the heat dissipation fan 14 for heat dissipation, which is beneficial to accelerating the heat dissipation speed of the mainboard 2, through the arranged touch block 15 and the reversing touch switch 16, the device can automatically control the reciprocating movement of the heat dissipation fan 14, through pulling the pull ring 17, the mainboard 2 can be conveniently placed into the clamping groove 24, after the pull ring 17 is loosened, under the action of the reset spring 22, the pull ring 21 pushes the rubber block 20 to contact with the surface of the mainboard 2, thereby compress tightly mainboard 2 fixedly to through the setting of block rubber 20, can not cause the damage to mainboard 2.
The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.
Claims (8)
1. The utility model provides a heat dissipation mainboard for computer, includes mainboard (2), its characterized in that, mainboard (2) outside is provided with protecting sheathing (1), mainboard (2) bottom is provided with heat conduction mechanism (4), just heat conduction mechanism (4) bottom extends to protecting sheathing (1) below, the bottom four corners department of protecting sheathing (1) evenly is provided with the support fixed establishment, protecting sheathing (1) inner chamber top is provided with the heat dissipation mechanism of blowing of controlling reciprocating motion, just protecting sheathing (1) lateral wall is provided with and is used for driving motor (10) that the heat dissipation mechanism of blowing removed about, be provided with fixed extrusion mechanism between mainboard (2) and protecting sheathing (1).
2. The heat dissipation main board for the computer according to claim 1, wherein the protective casing (1) has a cavity convex structure, and a slot (24) for accommodating the main board (2) is disposed on one side of the protective casing (1), and the two side walls of the protective casing (1) are disposed with the ventilation openings (23) distributed at equal intervals.
3. The heat dissipation main board for the computer according to claim 1, wherein the heat conduction mechanism (4) comprises a heat conduction silicone sheet (18), the bottom of the heat conduction silicone sheet (18) is provided with heat dissipation fins (19) distributed at equal intervals, the upper surface of the heat conduction silicone sheet (18) is in contact with the bottom of the main board (2), the bottom of the protective housing (1) is provided with an opening (3), and the heat dissipation fins (19) pass through the opening (3) and extend to the lower side of the protective housing (1).
4. The heat dissipation main board for the computer according to claim 1, wherein the fixed supporting mechanism comprises a sleeve (5), a sleeve column (6) is slidably connected to the bottom of the sleeve (5), a damping gasket (8) is arranged at the bottom of the sleeve column (6), and a supporting spring (7) is sleeved on the sleeve column (6).
5. The heat dissipation main board for the computer according to claim 1, wherein the blowing heat dissipation mechanism comprises a heat dissipation fan (14), the heat dissipation fan (14) is located above the main board (2), a movable block (11) is arranged at a top end of the heat dissipation fan (14), a lead screw (9) is sleeved on the movable block (11), the lead screw (9) is in threaded connection with the movable block (11), two ends of the lead screw (9) are rotatably connected with an inner wall of the protective housing (1) through bearings, and one end of the lead screw (9) is connected with a shaft portion of the motor (10).
6. The heat dissipation motherboard for computer according to claim 5, wherein both sides of the heat dissipation fan (14) are provided with touch blocks (15), and the inner walls of both sides of the protection housing (1) are provided with reversing touch switches (16) corresponding to the touch blocks (15), the reversing touch switches (16) are electrically connected to the motor (10).
7. The heat dissipation main board for the computer according to claim 5, wherein a sliding block (13) is disposed at a top end of the movable block (11), a sliding groove (12) is disposed on an inner wall of a top end of the protective housing (1) corresponding to the sliding block (13), and the sliding block (13) is slidably connected to the sliding groove (12).
8. The heat dissipation main board for the computer according to claim 1, wherein the fixed pressing mechanism includes a pull rod (21), the pull rod (21) is slidably connected to the protective casing (1), one end of the pull rod (21) extends to an inner cavity of the protective casing (1) and is provided with a rubber block (20), the bottom of the rubber block (20) is in contact with the upper surface of the main board (2), the other end of the pull rod (21) is located outside the protective casing (1) and is provided with a pull ring (17), and a return spring (22) is sleeved on the position of the pull rod (21) located in the inner cavity of the protective casing (1).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202022997435.1U CN213634400U (en) | 2020-12-09 | 2020-12-09 | Heat dissipation mainboard for computer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN202022997435.1U CN213634400U (en) | 2020-12-09 | 2020-12-09 | Heat dissipation mainboard for computer |
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CN213634400U true CN213634400U (en) | 2021-07-06 |
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Application Number | Title | Priority Date | Filing Date |
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CN202022997435.1U Expired - Fee Related CN213634400U (en) | 2020-12-09 | 2020-12-09 | Heat dissipation mainboard for computer |
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CN (1) | CN213634400U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN118192772A (en) * | 2024-03-19 | 2024-06-14 | 盐城建佳科技有限公司 | Heat dissipation baffle and software management computer for mainboard installation |
-
2020
- 2020-12-09 CN CN202022997435.1U patent/CN213634400U/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN118192772A (en) * | 2024-03-19 | 2024-06-14 | 盐城建佳科技有限公司 | Heat dissipation baffle and software management computer for mainboard installation |
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Legal Events
Date | Code | Title | Description |
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210706 Termination date: 20211209 |