CN213522530U - High-density HDI circuit board capable of realizing random layer interconnection - Google Patents
High-density HDI circuit board capable of realizing random layer interconnection Download PDFInfo
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- CN213522530U CN213522530U CN202022929128.XU CN202022929128U CN213522530U CN 213522530 U CN213522530 U CN 213522530U CN 202022929128 U CN202022929128 U CN 202022929128U CN 213522530 U CN213522530 U CN 213522530U
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Abstract
The utility model discloses a but high density HDI circuit board of arbitrary layer interconnection, including mount, coupling assembling and fixed subassembly, the connecting plate is installed through the bolt in the mount bottom, the line board is installed through the bolt in the connecting plate bottom, coupling assembling is openly installed through the bolt to the line board, it installs the connecting box through the bolt to go up the connecting block top, fixed subassembly is installed through the bolt in positive one side of line board, the welding of fixed block both sides has two sets of steadying plates, the fixed block is inside to install the rotary disk through the bolt, the mounting panel is installed through the bolt in the mount bottom. The utility model discloses a connecting assembly is installed on the line board front side, can utilize connecting assembly to carry out the stack connection to multilayer HDI circuit board to carry out the work of more precision, improve the accuracy of device, connecting assembly and the data to each HDI circuit board carry out mutual transmission simultaneously, have improved the work efficiency of device to a certain extent.
Description
Technical Field
The utility model relates to a HDI circuit board technical field specifically is a but high density HDI circuit board of arbitrary layer interconnection.
Background
With the improvement of science and technology, an electronic device, namely a circuit board, is required in the existing electronic equipment, in the development of the electronic device, the requirements of people on the size and the functionality of the electronic device become larger and larger, the requirements of an HDI circuit board also become larger, and a high-density HDI circuit board capable of being interconnected in any layer is required.
The existing high-density HDI circuit board capable of being interconnected by any layer has the following defects:
1. the existing high-density HDI circuit board which can be interconnected at any layer can only carry out double-layer circuit board connection, but can not carry out multi-group circuit board connection, thereby causing the circuit board to become very limited and inconvenient for more precise calculation and use;
2. the existing high-density HDI circuit board capable of being interconnected at any layer can not be detached after being installed, and when only a single circuit board is damaged, the whole replacement can be carried out, so that the maintenance burden of the device is increased, and the use efficiency of the HDI circuit board is reduced.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a but high density HDI circuit board of layer interconnect wantonly to solve the problem that proposes in the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a but high density HDI circuit board of arbitrary layer interconnection, includes mount, coupling assembling and fixed subassembly, the connecting plate is installed through the bolt in the mount bottom, the line board is installed through the bolt in the connecting plate bottom, the line board openly installs coupling assembling through the bolt, coupling assembling includes lower connecting block, goes up the connecting block, connects the needle, the connecting box, the welding of connecting block bottom has the connecting needle down, it installs the connecting box through the bolt to go up the connecting block top, fixed subassembly is installed through the bolt to line board openly one side, fixed subassembly includes fixed block, screw thread box, rotary disk, data transmission subassembly, steadying plate, the welding of fixed block both sides has two sets of steadying plates, the rotary disk is installed through the bolt in the fixed block inside, the mounting.
Preferably, the fixing plates are mounted on two sides of the top of the fixing frame through bolts, and the fixing bolts are mounted on the front faces of the fixing plates through thread structures.
Preferably, the line board openly is equipped with the buried jack, and the line board openly keeps away from the top of coupling assembling and installs the treater through the bolt.
Preferably, the mounting plate openly is equipped with the mounting hole, and the mounting plate openly keeps away from mounting hole one side and installs electronic component through the bolt.
Preferably, the data strip is installed at the top of the installation plate through a bolt, and a buckle is movably installed at the top of the data strip.
Preferably, the inside screw thread box that installs through the helicitic texture of fixed block, and screw thread box one side installs the rotary disk through the bolt.
Compared with the prior art, the beneficial effects of the utility model are that:
1. the utility model discloses a connecting assembly is installed on the line board front side, can utilize connecting assembly to carry out the stack connection to multilayer HDI circuit board to carry out the work of more precision, improve the accuracy of device, connecting assembly and the data to each HDI circuit board carry out mutual transmission simultaneously, have improved the work efficiency of device to a certain extent.
2. The utility model discloses an install fixed subassembly in positive one side of terminal board, can connect fixedly between two sets of line boards through fixed subassembly, the line board of being convenient for assembles the concatenation installation, and the staff of also being convenient for simultaneously dismantles the HDI circuit board of single damage, makes it not need the whole dismantlement of device, has reduced the maintenance degree of difficulty, makes things convenient for the staff to change, has increased the maintenance efficiency of HDI circuit board.
Drawings
Fig. 1 is a schematic top view of the present invention;
fig. 2 is a schematic front structural view of the present invention;
fig. 3 is a schematic view of a partial structure of the connection assembly of the present invention;
fig. 4 is a schematic view of a local structure of the fixing assembly of the present invention.
In the figure: 1. a fixed mount; 101. a fixing plate; 102. fixing the bolt; 2. a line board; 201. burying a hole; 202. a processor; 203. a connecting plate; 3. a connecting assembly; 301. a lower connecting block; 302. an upper connecting block; 303. a connecting needle; 304. a connection box; 4. mounting a plate; 401. mounting holes; 402. an electronic component; 5. a data strip; 501. buckling; 6. a fixing assembly; 601. a fixed block; 602. a thread box; 603. rotating the disc; 604. a data transmission component; 605. and a stabilizing plate.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "the other end" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element to which the reference is made must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "connected," and the like are to be construed broadly, and for example, "connected" may be either fixedly connected or detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Referring to fig. 1-4, the present invention provides an embodiment: a high-density HDI circuit board capable of being interconnected at any layer comprises a fixing frame 1, a connecting assembly 3 and a fixing assembly 6, wherein the bottom of the fixing frame 1 is provided with a connecting plate 203 through bolts, the fixing frame 1 can fix the connecting plate 203 and increase the stability of the connecting plate 203, the connecting plate 203 can support a line board 2 and increase the stability of the line board 2, the bottom of the connecting plate 203 is provided with the line board 2 through bolts, the line board 2 can support the connecting assembly 3 and increase the stability of the connecting assembly 3, the front of the line board 2 is provided with the connecting assembly 3 through bolts, the connecting assembly 3 comprises a lower connecting block 301, an upper connecting block 302, a connecting needle 303, a connecting box 304, a connecting needle 303 is welded at the bottom of the lower connecting block 301, the lower connecting block 301 can provide an installation position for the connecting needle 303 and increase the stability of the connecting needle 303, and, the practicability of the HDI circuit board is improved, the top of the upper connecting block 302 is provided with the connecting box 304 through a bolt, the upper connecting block 302 can fix the connecting box 304 and improve the stability of the connecting box 304, the connecting box 304 can support the connecting pin 303 and improve the stability of the connecting pin 303, one side of the front surface of the line board 2 is provided with the fixing component 6 through a bolt, the fixing component 6 comprises a fixing block 601, a thread box 602, a rotating disc 603, a data transmission component 604 and a stabilizing plate 605, two groups of stabilizing plates 605 are welded on two sides of the fixing block 601, the fixing block 601 can provide an installation position for the stabilizing plate 605 and improve the stability of the stabilizing plate 605, the stabilizing plate 605 can fix the fixing block 601 and improve the stability of the stabilizing plate 605, the rotating disc 603 is installed inside the fixing block 601 through a bolt, the rotating disc 603 can rotate to take down the fixing component 6, and a, the mounting plate 4 is installed at the bottom of the fixing frame 1 through bolts, and the mounting plate 4 can provide a mounting position for the electronic element 402, so that the stability of the electronic element 402 is increased.
Further, fixed plate 101 is installed through the bolt in mount 1 top both sides, and fixed plate 101 can provide the mounted position to fixing bolt 102, increases fixing bolt 102's stability, and fixing bolt 102 is installed through the helicitic texture in the front of fixed plate 101, and fixing bolt 102 can be fixed plate 101, increases fixing plate 101's stability.
Further, line board 2 openly is equipped with buried via 201, and buried via 201 is the inner layer via hole of doing for inner layer signal interconnection, and line board 2 openly keeps away from coupling assembling 3's top and installs treater 202 through the bolt, and treater 202 can handle the data of HDI circuit board, and the HDI circuit board of being convenient for runs.
Further, the front surface of the mounting plate 4 is provided with a mounting hole 401, the mounting hole 401 can facilitate a worker to mount a data line, and a HDI circuit board can be conveniently used, and one side of the front surface of the mounting plate 4, which is far away from the mounting hole 401, is provided with an electronic component 402 through a bolt, wherein the electronic component 402 is a basic element in an electronic circuit and is provided with two or more leads or metal contacts.
Further, data strip 5 is installed through the bolt in the 4 tops of mounting panel, and data strip 5 can be to mounting panel 4 and line board 2's data intercommunication to be convenient for the HDI circuit board to operate, and 5 top movable mounting of data strip have buckle 501, and buckle 501 can fix data strip 5, increases data strip 5's stability.
Further, the inside screw thread box 602 that installs through helicitic texture of fixed block 601, the rotary disk 603 that can be convenient for of screw thread box 602 is fixed, increases the stability of rotary disk 603, and screw thread box 602 installs rotary disk 603 through the bolt in one side, and rotary disk 603 can be convenient for the staff and dismantle single HDI circuit board, and the staff of being convenient for changes the HDI circuit board.
The working principle is as follows: before the device is used, a user firstly detects the device and confirms that the device is used after no problem exists, a worker can superpose and connect the multilayer HDI circuit boards through the connecting component 3 and connect the HDI circuit boards through the connecting box 304 in the upper connecting block 302 and the connecting pin 303 at the bottom of the lower connecting block 301, so that more precise work is carried out, the precision of the device is improved, meanwhile, the connecting component 3 and data of each HDI circuit board are mutually transmitted, the limitation of the device is increased to a certain extent, the worker can connect and fix the two groups of line boards 2 through the fixing component 6, the line boards 2 are convenient to assemble, splice and install, meanwhile, the worker can conveniently disassemble the single damaged HDI circuit board, the device is not required to be integrally disassembled, the overhauling difficulty is reduced, the worker can conveniently replace the HDI circuit boards, and the overhauling efficiency of the HDI circuit boards is increased, the staff can pass through mounting hole 401 fixed mounting in mounting panel 4 top with the circuit to with data transmission to mounting panel 4, inside mounting panel 4 passes through data strip 5 with data transmission to line board 2, thereby carry out the mutual calculation of data.
It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (6)
1. The utility model provides a but high density HDI circuit board of arbitrary layer interconnection, includes mount (1), coupling assembling (3) and fixed subassembly (6), its characterized in that: the utility model discloses a wire board, including mount (1), connecting plate (203), line board (2) are installed through the bolt to connecting plate (203) bottom, line board (2) openly install coupling assembling (3) through the bolt, coupling assembling (3) are including connecting block (301) down, go up connecting block (302), connect needle (303), connecting box (304), connecting block (301) bottom welding has connecting needle (303) down, go up connecting block (302) top and install connecting box (304) through the bolt, line board (2) openly one side is installed fixed subassembly (6) through the bolt, fixed subassembly (6) are including fixed block (601), screw thread box (602), rotary disk (603), data transmission subassembly (604), stabilising plate (605), fixed block (601) both sides welding has two sets of stabilising plate (605), rotary disk (603) are installed through the bolt to fixed block (601) inside, the mounting plate (4) is installed at the bottom of the fixing frame (1) through bolts.
2. A high density HDI wiring board interconnectable by any of claims 1 and further comprising: fixed plate (101) are installed through the bolt in mount (1) top both sides, and fixed plate (101) openly install fixing bolt (102) through helicitic texture.
3. A high density HDI wiring board interconnectable by any of claims 1 and further comprising: line board (2) openly are equipped with buried hole (201), and line board (2) openly keep away from the top of coupling assembling (3) and install treater (202) through the bolt.
4. A high density HDI wiring board interconnectable by any of claims 1 and further comprising: mounting panel (4) openly are equipped with mounting hole (401), and mounting panel (4) openly keep away from mounting hole (401) one side and install electronic component (402) through the bolt.
5. A high density HDI wiring board interconnectable by any of claims 1 and further comprising: data strip (5) are installed through the bolt in mounting panel (4) top, and data strip (5) top movable mounting has buckle (501).
6. A high density HDI wiring board interconnectable by any of claims 1 and further comprising: the fixed block (601) is internally provided with a thread box (602) through a thread structure, and one side of the thread box (602) is provided with a rotating disk (603) through a bolt.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022929128.XU CN213522530U (en) | 2020-12-09 | 2020-12-09 | High-density HDI circuit board capable of realizing random layer interconnection |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022929128.XU CN213522530U (en) | 2020-12-09 | 2020-12-09 | High-density HDI circuit board capable of realizing random layer interconnection |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213522530U true CN213522530U (en) | 2021-06-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022929128.XU Active CN213522530U (en) | 2020-12-09 | 2020-12-09 | High-density HDI circuit board capable of realizing random layer interconnection |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213522530U (en) |
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2020
- 2020-12-09 CN CN202022929128.XU patent/CN213522530U/en active Active
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