CN213368423U - High-safety direct-current power supply - Google Patents

High-safety direct-current power supply Download PDF

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Publication number
CN213368423U
CN213368423U CN202022227823.1U CN202022227823U CN213368423U CN 213368423 U CN213368423 U CN 213368423U CN 202022227823 U CN202022227823 U CN 202022227823U CN 213368423 U CN213368423 U CN 213368423U
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power supply
housing
control box
processor unit
current power
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CN202022227823.1U
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Chinese (zh)
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陈利军
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Hunan Zhongyuan Technology Co ltd
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Hunan Zhongyuan Technology Co ltd
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Abstract

A high security DC power supply, includes the casing and sets up in the casing: a direct current power supply main circuit; the main cooling equipment is used for discharging heat in the shell; a semiconductor refrigeration device for directly neutralizing heat in the housing; a temperature sensor for detecting a temperature in the housing; the processor unit is respectively connected with the main cooling equipment, the semiconductor refrigeration equipment and the temperature sensor; and the power supply module is respectively connected with the direct-current power supply main circuit, the main cooling equipment, the semiconductor refrigeration equipment, the temperature sensor and the processor unit and is used for converting working power supply supplied to the main cooling equipment, the semiconductor refrigeration equipment, the temperature sensor and the processor unit from the direct-current power supply main circuit. The embodiment of the utility model provides a mode through combining main cooling equipment and semiconductor refrigeration plant can make air conditioning cooling and fan heat dissipation combine, very big improvement radiating efficiency, and compare in water-cooled mode, very big improvement the security of using.

Description

High-safety direct-current power supply
Technical Field
The utility model belongs to the power field, concretely relates to high security DC power supply.
Background
A dc power supply is a commonly used power supply device, but because of its working principle and the large output power when used in industrial production, a heating phenomenon often occurs during the use. After the direct current power supply generates heat, if the direct current power supply can not timely dissipate heat, internal components can be overheated, so that the power supply is damaged, and even the direct burning-out situation can be caused.
In order to solve this problem, various dc power supplies with cooling devices are available on the market, and there are two main cooling methods: fan heat dissipation and water-cooling coil pipe heat dissipation. After the heat dissipation is carried out through the two modes, the overheating phenomenon of components can be effectively reduced, and the normal output of a power supply is guaranteed.
However, if the fan or the water-cooling coil pipe is used for heat dissipation singly, the heat dissipation efficiency is low, the heat can be high when the direct-current power supply runs at high power, and the heat dissipation effect can be directly lost when the single heat dissipation fails. Therefore, someone has promoted the direct mode that combines fan heat dissipation and water-cooling coil pipe heat dissipation in the market, but the water-cooling coil pipe heat dissipation is higher to the requirement of structure, in case the cracked condition of coil pipe appears, can directly cause the trouble of power short circuit, has very big possibility direct open fire trouble of appearing.
SUMMERY OF THE UTILITY MODEL
The utility model discloses aim at solving one of the technical problem that exists among the prior art at least. Therefore, the utility model provides a high security DC power supply, high security DC power supply simple structure has solved the poor, the low problem of security of DC power supply radiating effect.
According to the utility model discloses high security DC power supply, include: including the casing and set up in the casing: a direct current power supply main circuit; the main cooling equipment is used for discharging heat in the shell; a semiconductor refrigeration device for directly neutralizing heat in the housing; a temperature sensor for detecting a temperature in the housing; the processor unit is respectively connected with the main cooling equipment, the semiconductor refrigeration equipment and the temperature sensor; and the power supply module is respectively connected with the direct-current power supply main circuit, the main cooling equipment, the semiconductor refrigeration equipment, the temperature sensor and the processor unit and used for converting working power supply supplied to the main cooling equipment, the semiconductor refrigeration equipment, the temperature sensor and the processor unit from the direct-current power supply main circuit.
According to the utility model discloses high security DC power supply has following technological effect at least: the heat generated by the main circuit of the direct-current power supply can be continuously discharged from the shell through the main cooling equipment; cold air can be continuously released through the semiconductor refrigeration equipment, and heat in the shell is neutralized through the cold air; can make air conditioning cooling and fan heat dissipation combine through the mode that combines main cooling equipment and semiconductor refrigeration plant, very big improvement radiating efficiency, and compare in water-cooled mode, very big improvement the security of using. The temperature in the shell can be effectively detected through the temperature sensor, and meanwhile, the processor unit is convenient to control the starting and stopping of the main cooling equipment and the semiconductor refrigerating equipment. The power supply module can directly obtain a working power supply from the main circuit of the direct-current power supply, and an external power supply does not need to be connected, so that the circuit structure is simplified.
According to some embodiments of the utility model, above-mentioned high security DC power supply still including set up in the casing and with the dust removal subassembly that the treater unit is connected, the dust removal subassembly is used for detecting the dust concentration in the casing and reduces dust concentration in the casing.
According to some embodiments of the utility model, the dust removal subassembly includes: a dust sensor disposed in the housing and connected to the processor unit for detecting a dust concentration in the housing; the dust collection device is arranged in the shell, connected with the processor unit and the power supply module and used for absorbing dust; the shell is provided with a detachable mounting plate corresponding to the dust suction device.
According to some embodiments of the present invention, the high-safety dc power supply further comprises a control box, a first terminal is disposed in the control box, and the processor unit is disposed in the control box and connected to the first terminal; the cooling device comprises a shell and is characterized in that a control box mounting groove is formed in one side of the shell, a second terminal corresponding to the first terminal is arranged in the control box mounting groove, and the main cooling device and the semiconductor refrigeration device are connected with the second terminal.
According to some embodiments of the utility model, temperature sensor, power module all set up in the control box, be provided with on the control box at least one with the through-hole of intercommunication in the casing.
According to some embodiments of the utility model, above-mentioned high security DC power supply still including set up in humidity transducer in the control box.
According to some embodiments of the utility model, above-mentioned high security DC power supply still including set up in wireless communication module in the control box.
According to some embodiments of the utility model, above-mentioned high security DC power supply still including set up in air-cooled coil pipe in the casing, air intake and the air outlet of air-cooled coil pipe all set up in on the casing.
According to some embodiments of the utility model, main cooling equipment include a plurality ofly all set up in fan on the casing, be provided with on the casing a plurality ofly and a plurality of the vent that the fan corresponds, the vent adopts the shutter structure.
According to some embodiments of the present invention, the semiconductor refrigeration device is disposed in the casing and near one side of the air inlet of the main cooling device.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
fig. 1 is a top view of a high safety dc power supply of an embodiment of the present invention (with the top of the housing removed);
fig. 2 is a rear view of a high safety dc power supply according to an embodiment of the present invention;
fig. 3 is a front view of a high safety dc power supply according to an embodiment of the present invention;
fig. 4 is an electrical system block diagram of a high-safety dc power supply according to an embodiment of the present invention.
Reference numerals:
a casing 100, a control box mounting groove 110, a chute 120, a mounting base 130,
A main cooling device 200,
A semiconductor refrigeration device 300,
A temperature sensor 400,
A processor unit 500,
A power supply module 600,
A dust removing assembly 700, a dust sensor 710, a dust sucking device 720,
A control box 810, an air-cooled coil 820,
Humidity sensor 910, wireless communication module 920, display controller 930.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present invention, and should not be construed as limiting the present invention.
In the description of the present invention, if there are first, second, third, fourth, etc. described, it is only for the purpose of distinguishing technical features, and it is not understood that relative importance is indicated or implied or that the number of indicated technical features is implicitly indicated or that the precedence of the indicated technical features is implicitly indicated.
In the description of the present invention, unless there is an explicit limitation, the words such as setting and connection should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meaning of the above words in the present invention by combining the specific contents of the technical solution.
A high-safety dc power supply according to an embodiment of the present invention is described below with reference to fig. 1 to 4.
According to the utility model discloses high security DC power supply, include casing 100 and set up in casing 100: the cooling system comprises a direct-current power supply main circuit, a main cooling device 200, a semiconductor refrigeration device 300, a temperature sensor 400, a processor unit 500 and a power supply module 600. A main cooling device 200 for discharging heat in the casing 100; a semiconductor cooling device 300 for directly neutralizing heat in the case 100; a temperature sensor 400 for detecting the temperature in the case 100; the processor unit 500 is respectively connected with the main cooling device 200, the semiconductor refrigeration device 300 and the temperature sensor 400; the power module 600 is connected to the dc power main circuit, the main cooling device 200, the semiconductor cooling device 300, the temperature sensor 400, and the processor unit 500, respectively, and is configured to convert the operating power supplied to the main cooling device 200, the semiconductor cooling device 300, the temperature sensor 400, and the processor unit 500 from the dc power main circuit.
Before introducing the safety of the high-safety dc power supply of the embodiment of the present invention, a simple description is first performed on the main circuit of the dc power supply. The main circuit of the dc power supply is a basic circuit for operating the dc power supply, and generally includes: the DC-DC converter comprises a rectifying circuit, a filter circuit, a DC-DC converter, an output rectifying circuit for outputting direct current voltage, an output feedback circuit, a control circuit and a working voltage conversion circuit for providing internal working voltage. The output end of the output rectifying circuit is also connected to the DC-DC converter through an output feedback circuit and a control circuit, and the output end of the filter circuit is also connected to the control circuit through a working voltage conversion circuit. Finally, the direct current power supply main circuit can convert the input alternating current into the required direct current. A main circuit mounting base 130 is generally disposed in the casing 100 to fix the main circuit of the dc power supply.
The safety of the high-safety dc power supply according to the embodiment of the present invention is described below with reference to fig. 1 to 4.
The main cooling device 200 generally employs a fan, which has low operating power and does not generate large heat, and is suitable for long-time operation, so as to provide heat dissipation for the housing 100 for a long time. The fan can adopt direct current motor or inverter motor, can realize the adjustment to the fan rotational speed through the range or the frequency of treater unit 500 regulation fan input voltage to provide different rotational speeds when aiming at different temperatures, reach the effect of energy saving.
The semiconductor refrigeration device 300 can perform refrigeration, and can reduce the temperature of the air around the semiconductor refrigeration device, thereby effectively reducing the temperature of the direct-current power supply main circuit. Meanwhile, the cold air produced by the semiconductor cooling device 300 can be blown into the whole casing 100 through the main cooling device 200, so that the optimal cooling effect is achieved.
The temperature sensor 400 may collect temperature data in the case 100 and transmit the collected temperature data to the processor unit 500. The processor unit 500 can control the start and stop of the main cooling device 200 and the semiconductor refrigeration device 300 according to the received temperature data. Usually, a temperature threshold is set, when the temperature is lower than the temperature threshold, only the main cooling device 200 may be turned on, and when the temperature exceeds the temperature threshold, the main cooling device 200 and the semiconductor cooling device 300 may be simultaneously turned on to achieve the best cooling effect. In some embodiments of the present invention, the temperature sensor 400 may be disposed in a plurality of different positions in the housing 100 to ensure the accuracy of the temperature collection.
The power module 600 can be integrated by directly using the existing power chips on the market, and can output multiple paths of different voltages to meet the requirements of different components. Common power outputs include 3.3V, 5V, 12V, 24V, etc.; the 220V voltage can be directly used by a power supply in a direct current power supply main circuit and used after being isolated and rectified direct current.
According to the high-safety direct-current power supply provided by the embodiment of the utility model, the heat generated by the main circuit of the direct-current power supply can be continuously discharged from the shell 100 through the main cooling equipment 200; cold air can be continuously released by the semiconductor refrigeration device 300, and heat in the housing 100 is neutralized by the cold air; can make air conditioning cooling and fan heat dissipation combine through the mode that combines main cooling equipment 200 and semiconductor refrigeration plant 300, very big improvement radiating efficiency, and compare in water-cooled mode, very big improvement the security of using. The temperature sensor 400 can effectively detect the temperature in the casing 100, and the processor unit 500 can conveniently control the start and stop of the main cooling device 200 and the semiconductor refrigeration device 300. The power module 600 can directly obtain the working power supply from the main circuit of the direct-current power supply, and an external power supply does not need to be connected, so that the circuit structure is simplified.
In some embodiments of the present invention, the processor unit 500 may adopt a DSP, a single chip microcomputer or an ARM as a core controller. In some embodiments of the utility model, adopted the singlechip as the core control ware of processor unit 500, selected STM32 series singlechip, specifically can select STM32F 103. In some embodiments of the present invention, the core board of STM32F103 is used directly.
In some embodiments of the present invention, referring to fig. 1, fig. 2 and fig. 4, the high-safety dc power supply further includes a dust removing assembly 700 disposed in the casing 100 and connected to the processor unit 500, wherein the dust removing assembly 700 is configured to detect the dust concentration in the casing 100 and reduce the dust concentration in the casing 100. In actual production, have great dust in some production environment, and when dust concentration was too high, hardly discharge the dust is whole through main cooling device 200, and the dust is deposit in casing 100 easily, and the steam in the air can be adsorbed to sedimentary dust, and then reduces and insulate, forms the potential safety hazard. The dust concentration in the housing 100 can be effectively detected by the dust removing assembly 700, and when the dust concentration reaches a preset dust concentration threshold, strong dust removal is performed to try to reduce the dust concentration in the housing 100 and reduce dust deposition.
In some embodiments of the present invention, referring to fig. 1, 2, and 4, the dust removal assembly 700 includes: a dust sensor 710 disposed in the housing 100 and connected to the processor unit 500 for detecting a dust concentration in the housing 100; a dust suction device 720 disposed in the case 100 and connected to the processor unit 500 and the power module 600, for sucking dust; a detachable mounting plate is provided on the housing 100 at a position corresponding to the dust suction device 720. The dust sensor 710 may accurately detect the dust concentration in the housing 100 and transmit the detected dust concentration value to the processor unit 500, so that the processor unit 500 may start or stop the dust suction device 720 according to the dust concentration. The dust suction device 720 can directly adopt core devices in the existing dust suction products on the market, specifically which kind of dust suction product needs to be selected according to the volume of the direct-current power supply, and the smaller the volume is, the smaller the volume of the selected dust suction product is, so that the installation is convenient. In order to facilitate replacement or cleaning of the dust storage component in the dust suction device 720, the dust suction device 720 is disposed in the casing 100 and located at one side, and then a detachable mounting plate corresponding to the dust suction device 720 is disposed at the corresponding side of the casing 100, and the detachable mounting plate can be fastened through bolts. When the dust storage component needs to be replaced or cleaned, the detachable mounting plate is detached, the dust suction device 720 is taken out, cleaning is completed, and then the dust storage component is recovered. In order to facilitate the installation of the dust suction device 720 in the casing 100, the casing 100 is provided with a chute 120, and the dust suction device 720 is provided with a clamping portion which is slidably connected with the chute 120 through the clamping portion.
In some embodiments of the present invention, referring to fig. 1 and fig. 2, the high-safety dc power supply further includes a control box 810, a first terminal is disposed in the control box 810, and the processor unit 500 is disposed in the control box 810 and connected to the first terminal; a control box mounting groove 110 is formed in one side of the housing 100, a second terminal corresponding to the first terminal is disposed in the control box mounting groove 110, and the main cooling device 200 and the semiconductor cooling device 300 are connected to the second terminal. The casing 100 is provided with a control box mounting groove 110 for fitting and connecting the control box 810, and after the control box 810 is mounted in the control box mounting groove 110, the surface of the casing 100 on the side where the control box is mounted is kept flat. The control box mounting recess 110 is provided with a second terminal, the device in the housing 100 to be connected to the processor unit 500 connects the connection line to the second terminal in advance, the control box 810 fixes a first terminal matched with the second terminal, and the processor unit 500 is connected to the first terminal. In practical use, the processor unit 500 can be detached and installed only by inserting and pulling the control box 810, and meanwhile, the components in the control box can be electrically connected with the components in the housing 100.
In some embodiments of the present invention, referring to fig. 2, a plurality of bolt holes can be disposed on the control box 810, and corresponding bolt holes can be disposed around the control box mounting groove 110. In this way, after the control box 810 is inserted into place, it can be further fastened by bolts.
In some embodiments of the present invention, referring to fig. 1 and fig. 2, the temperature sensor 400 and the power module 600 are both disposed in the control box 810, and the control box 810 is provided with at least one through hole communicated with the inside of the casing 100. The temperature sensor 400 and the power module 600 are both arranged in the control box 810, so that a modular structure can be further realized, and subsequent maintenance and replacement are facilitated. In some embodiments of the present invention, the humidity sensor 910, the wireless communication module 920, and the dust sensor 710 are also disposed in the control box 810, so as to achieve centralization and modularization to the maximum extent. In addition, in order to facilitate detection of temperature, humidity, and dust concentration in the casing 100 and also facilitate heat dissipation in the control box 810, a plurality of through holes communicating with the inside of the casing 100 are provided in the control box 810, or one surface is directly leaked out to maintain communication with the inside of the casing 100 to the maximum extent. In some embodiments of the present invention, the through hole on the control box 810 can be disposed on the lower panel of the box body, so as to effectively avoid dust deposition.
In some embodiments of the present invention, referring to fig. 4, the high-safety dc power supply further includes a humidity sensor 910 disposed in the control box 810. The humidity sensor 910 can detect the humidity in the casing 100, and when the humidity is too high, the use of the dc power supply needs to be stopped to avoid an accident due to low insulation. When the humidity is low, the alarm can be given through the display controller 930 or the wireless communication module 920.
In some embodiments of the present invention, referring to fig. 4, the high-safety dc power supply further includes a wireless communication module 920 disposed in the control box 810. The processor unit 500 can carry out data communication with an external monitoring terminal through the wireless communication module 920, for example, can look over through a mobile phone or a tablet computer the utility model discloses the operating condition of high security dc power supply of the embodiment. In some industrial control sites, special centralized control equipment is arranged, such as: and a computer, a server and the like perform centralized monitoring.
In some embodiments of the utility model, refer to fig. 1, fig. 3, fig. 4, can set up on the front panel of casing 100 and show accuse ware 930, show accuse ware 930 and be connected with processor unit 500, can look over locally through showing accuse ware 930 the utility model discloses a high security DC power supply's running state, the manual control dust extraction 720 of also being convenient for simultaneously, main cooling equipment 200, opening of equipment such as semiconductor refrigeration plant 300 stop, avoid when temperature sensor 400, humidity transducer 910, dust sensor 710 go wrong, unable manual start.
In some embodiments of the present invention, referring to fig. 1 and fig. 2, the high-safety dc power supply further includes an air-cooling coil 820 disposed in the casing 100, and an air inlet and an air outlet of the air-cooling coil 820 are both disposed on the casing 100. The air-cooled coil 820 can be externally connected with air-cooled equipment, and cold air output by the air-cooled equipment can cool the air-cooled coil 820 after entering the air-cooled coil 820, so as to cool air in the shell 100. The air-cooled security that compares in water-cooling is higher, though the cooling effect is less than the water-cooling, but as auxiliary cooling equipment, but can make the utility model discloses a high security DC power supply's cooling performance is more.
In some embodiments of the present invention, referring to fig. 1, the main cooling device 200 includes a plurality of fans all disposed on the casing 100, a plurality of ventilation openings corresponding to the fans are disposed on the casing 100, and the ventilation openings are of a louver structure. The arrangement of the plurality of fans can form an air duct in the whole housing 100, and the air duct can better cool the components in the housing 100. The ventilation opening can be when guaranteeing ventilation effect with the shutter structure, the effectual injury that prevents to drip. Furthermore, a dust screen is usually provided at the ventilation opening to block dust as much as possible.
In some embodiments of the present invention, referring to fig. 1, the semiconductor cooling device 300 is disposed in the housing 100 and close to the air inlet side of the main cooling device 200. The semiconductor cooling device 300 is usually disposed at an air inlet of the main cooling device 200 on the housing 100, so that the cold air generated by the semiconductor cooling device 300 can take away as much heat as possible.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
Although the embodiments of the present invention have been described in detail with reference to the accompanying drawings, the present invention is not limited to the above embodiments, and those skilled in the art can understand that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims (10)

1. A high-safety dc power supply, comprising a housing (100) and, disposed in the housing (100):
a direct current power supply main circuit;
a main temperature reducing device (200) for discharging heat in the casing (100);
a semiconductor refrigeration device (300) for directly neutralizing heat in the housing (100);
a temperature sensor (400) for detecting a temperature in the housing (100);
the processor unit (500) is respectively connected with the main cooling equipment (200), the semiconductor refrigeration equipment (300) and the temperature sensor (400);
and the power supply module (600) is respectively connected with the direct-current power supply main circuit, the main cooling equipment (200), the semiconductor refrigeration equipment (300), the temperature sensor (400) and the processor unit (500) and is used for converting working power supply supplied to the main cooling equipment (200), the semiconductor refrigeration equipment (300), the temperature sensor (400) and the processor unit (500) from the direct-current power supply main circuit.
2. The high safety dc power supply according to claim 1, further comprising a dust removing assembly (700) disposed in the housing (100) and connected to the processor unit (500), wherein the dust removing assembly (700) is configured to detect a dust concentration in the housing (100) and to reduce the dust concentration in the housing (100).
3. The high safety dc power supply according to claim 2, wherein the dust removing assembly (700) comprises:
a dust sensor (710) disposed within the housing (100) and connected to the processor unit (500) for detecting a dust concentration within the housing (100);
a dust suction device (720) disposed in the housing (100) and connected to the processor unit (500) and the power module (600) for sucking dust; the shell (100) is provided with a detachable mounting plate corresponding to the dust suction device (720).
4. The high-safety direct-current power supply according to claim 1, further comprising a control box (810), wherein a first terminal is arranged in the control box (810), and the processor unit (500) is arranged in the control box (810) and connected with the first terminal; casing (100) one side is provided with control box mounting groove (110), be provided with in control box mounting groove (110) with the second terminal that first terminal corresponds, main cooling equipment (200), semiconductor refrigeration plant (300) all with the second terminal is connected.
5. The high-safety direct-current power supply according to claim 4, wherein the temperature sensor (400) and the power supply module (600) are both arranged in the control box (810), and at least one through hole communicated with the inside of the shell (100) is arranged on the control box (810).
6. The high safety DC power supply according to claim 4, further comprising a humidity sensor (910) disposed in the control box (810).
7. The high-safety direct-current power supply according to claim 4, further comprising a wireless communication module (920) disposed in the control box (810).
8. The high-safety direct-current power supply according to claim 1, further comprising an air-cooled coil (820) disposed in the housing (100), wherein an air inlet and an air outlet of the air-cooled coil (820) are disposed on the housing (100).
9. The high-safety direct-current power supply according to claim 1, wherein the main cooling device (200) comprises a plurality of fans which are all arranged on the housing (100), a plurality of ventilation openings corresponding to the fans are arranged on the housing (100), and the ventilation openings are of a shutter structure.
10. The high-safety direct-current power supply according to claim 1 or 9, wherein the semiconductor refrigeration device (300) is arranged in the housing (100) and is abutted against the side of the air inlet of the main temperature reduction device (200).
CN202022227823.1U 2020-10-09 2020-10-09 High-safety direct-current power supply Active CN213368423U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202022227823.1U CN213368423U (en) 2020-10-09 2020-10-09 High-safety direct-current power supply

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202022227823.1U CN213368423U (en) 2020-10-09 2020-10-09 High-safety direct-current power supply

Publications (1)

Publication Number Publication Date
CN213368423U true CN213368423U (en) 2021-06-04

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202022227823.1U Active CN213368423U (en) 2020-10-09 2020-10-09 High-safety direct-current power supply

Country Status (1)

Country Link
CN (1) CN213368423U (en)

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