CN213239248U - Electronic device - Google Patents
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- CN213239248U CN213239248U CN202021821734.3U CN202021821734U CN213239248U CN 213239248 U CN213239248 U CN 213239248U CN 202021821734 U CN202021821734 U CN 202021821734U CN 213239248 U CN213239248 U CN 213239248U
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Abstract
The utility model belongs to the technical field of the electron device, concretely relates to electron device. The utility model provides an electronic device includes sensing element, pin and lead wire, sensing element with the one end of pin is connected, the pin has wavy structure, the other end of pin with the lead wire is connected. Through using the electron device among this technical scheme, when the temperature sharply descends, because the overall structure of pin is wavy structure, can compensate the axial deformation that different materials expend with heat and contract with cold of pin lead wire caused, reduced the risk of failure, avoided the cracked problem of pin axial.
Description
Technical Field
The utility model belongs to the technical field of the electron device, concretely relates to electron device.
Background
When the measurement temperature continuously changes, the reciprocating cycle is continuously increased and reduced, the sensitive element in the temperature sensor deforms due to the temperature change, the platinum resistance pin and the lead are different in material and different in thermal expansion coefficient, the risk of axial fracture exists when the temperature rapidly decreases, and in addition, after the temperature rapidly increases, the fractured pin and the lead have the possibility of being overlapped again, so that the measurement deviation is large.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving the problem that the pin has axial fracture when the temperature sharply drops at least. The purpose is realized by the following technical scheme:
a first aspect of the present invention provides an electronic device, including:
a sensing element;
the sensitive element is connected with one end of the pin, and the pin has a wavy structure;
and the other end of the pin is connected with the lead.
Through using the electron device among this technical scheme, when the temperature sharply descends, because the overall structure of pin is wavy structure, can compensate the axial deformation that different materials expend with heat and contract with cold of pin lead wire caused, reduced the risk of failure, avoided the cracked problem of pin axial.
In addition, according to the present invention, the electronic device may further have the following additional technical features:
in some embodiments of the present invention, the pin includes a first transition portion, a compensation portion and a second transition portion, the compensation portion is in a wavy structure and is located between the first transition portion and the second transition portion.
In some embodiments of the present invention, the compensation portion includes a peak section and a trough section, and the peak section and the trough section are sequentially and alternately arranged.
In some embodiments of the present invention, the first transition portion is connected to the sensing element by welding.
In some embodiments of the present invention, the second transition portion and the lead are connected by welding.
In some embodiments of the invention, the material of the pin is copper.
In some embodiments of the present invention, the number of the pins and the leads is two.
In some embodiments of the present invention, the electronic device is a resistance type temperature sensor.
Drawings
Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are only for purposes of illustrating the preferred embodiments and are not to be construed as limiting the invention. Also, like parts are designated by like reference numerals throughout the drawings. In the drawings:
fig. 1 schematically shows a schematic structural diagram of an electronic device according to an embodiment of the present invention.
10: a sensing element;
21: first transition, 22: pin, 221: peak band, 222: valley section, 23: a second transition portion;
30: and (7) leading wires.
Detailed Description
Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.
It is to be understood that the terminology used herein is for the purpose of describing particular example embodiments only, and is not intended to be limiting. As used herein, the singular forms "a", "an" and "the" may be intended to include the plural forms as well, unless the context clearly indicates otherwise. The terms "comprises," "comprising," "including," and "having" are inclusive and therefore specify the presence of stated features, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, steps, operations, elements, components, and/or groups thereof. The method steps, processes, and operations described herein are not to be construed as necessarily requiring their performance in the particular order described or illustrated, unless specifically identified as an order of performance. It should also be understood that additional or alternative steps may be used.
Although the terms first, second, third, etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms. These terms may be only used to distinguish one element, component, region, layer or section from another region, layer or section. Terms such as "first," "second," and other numerical terms when used herein do not imply a sequence or order unless clearly indicated by the context. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the example embodiments.
For convenience of description, spatially relative terms, such as "inner", "outer", "lower", "below", "upper", "above", and the like, may be used herein to describe one element or feature's relationship to another element or feature as illustrated in the figures. Such spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "below" or "beneath" other elements or features would then be oriented "above" or "over" the other elements or features. Thus, the example term "below … …" can include both an orientation of above and below. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
Fig. 1 schematically shows a schematic structural diagram of an electronic device according to an embodiment of the present invention. As shown in fig. 1, the present invention provides an electronic device. The utility model provides an electronic device includes sensing element 10, pin 22 and lead wire 30, and sensing element 10 is connected with pin 22's one end, and pin 22 is wavy structure, and pin 22's the other end is connected with lead wire 30.
Through using the electronic device in this technical scheme, when the temperature sharply descends, because pin 22's overall structure is wavy structure, can compensate the axial deformation that pin 22 lead wire 30 different materials expend with heat and contract with cold and cause, reduced the inefficacy risk, avoided pin 22 axial fracture's problem.
Further, in the present embodiment, the pin 22 includes a first transition portion 21, a compensation portion and a second transition portion 23, and the compensation portion is located between the first transition portion 21 and the second transition portion 23 in a wavy structure. The compensation portion is wavy structure, can compensate the axial deformation that pin 22 lead wire 30 different materials expend with heat and contract with cold caused, reduces the inefficacy risk, avoids pin 22 axial fracture's problem.
Specifically, in the present embodiment, the compensation part includes a peak section 221 and a trough section 222, and the peak section 221 and the trough section 222 are alternately arranged in sequence. The peak sections 221 and the trough sections 222 are in two directions in the longitudinal direction, and can respectively perform compensation deformation in the axial direction when the temperature is sharply reduced, so that the compensation deformation is better.
Further, in the present embodiment, the connection manner of the first transition portion 21 and the sensing element 10 is welding.
Further, in the present embodiment, the connection method of the second transition portion 23 and the lead 30 is welding.
Specifically, in the present embodiment, the material of the pin 22 is copper, and the deformation performance of copper is good, so that the compensation effect is better, and the reliability is improved.
Specifically, in the present embodiment, the number of the pins 22 and the leads 30 is two each.
Further, in the present embodiment, the electronic device is a resistance type temperature sensor.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention should be covered by the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (8)
1. An electronic device, comprising:
a sensing element;
the sensitive element is connected with one end of the pin, and the pin has a wavy structure;
and the other end of the pin is connected with the lead.
2. The electronic device of claim 1, wherein the pin comprises a first transition, a compensation portion, and a second transition, the compensation portion being in a wave-like configuration and located between the first transition and the second transition.
3. The electronic device of claim 2, wherein the compensation portion includes a peak segment and a valley segment, and the peak segment and the valley segment are alternately arranged in sequence.
4. The electronic device of claim 2, wherein the first transition portion is connected to the sensing element by soldering.
5. The electronic device of claim 2, wherein the second transition portion is connected to the lead by soldering.
6. The electronic device of claim 1, wherein the material of the pin is copper.
7. The electronic device of claim 1, wherein the number of pins and leads is two.
8. The electronic device of claim 1, wherein the electronic device is a resistive temperature sensor.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202021821734.3U CN213239248U (en) | 2020-08-26 | 2020-08-26 | Electronic device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202021821734.3U CN213239248U (en) | 2020-08-26 | 2020-08-26 | Electronic device |
Publications (1)
Publication Number | Publication Date |
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CN213239248U true CN213239248U (en) | 2021-05-18 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN202021821734.3U Active CN213239248U (en) | 2020-08-26 | 2020-08-26 | Electronic device |
Country Status (1)
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CN (1) | CN213239248U (en) |
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2020
- 2020-08-26 CN CN202021821734.3U patent/CN213239248U/en active Active
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