CN213184271U - 一种芯片键合布线连接结构 - Google Patents
一种芯片键合布线连接结构 Download PDFInfo
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- CN213184271U CN213184271U CN202022507755.4U CN202022507755U CN213184271U CN 213184271 U CN213184271 U CN 213184271U CN 202022507755 U CN202022507755 U CN 202022507755U CN 213184271 U CN213184271 U CN 213184271U
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- 239000011888 foil Substances 0.000 claims abstract description 17
- 238000003466 welding Methods 0.000 claims abstract description 17
- 229910001339 C alloy Inorganic materials 0.000 claims abstract description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 5
- AHADSRNLHOHMQK-UHFFFAOYSA-N methylidenecopper Chemical compound [Cu].[C] AHADSRNLHOHMQK-UHFFFAOYSA-N 0.000 claims abstract description 5
- 229910001182 Mo alloy Inorganic materials 0.000 claims abstract 2
- ZLVDRPIZTVABIW-UHFFFAOYSA-N [Cu].[C].[Mo] Chemical compound [Cu].[C].[Mo] ZLVDRPIZTVABIW-UHFFFAOYSA-N 0.000 claims abstract 2
- 239000000758 substrate Substances 0.000 claims description 4
- 229910021389 graphene Inorganic materials 0.000 claims description 3
- 239000011810 insulating material Substances 0.000 claims description 2
- 230000003064 anti-oxidating effect Effects 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
- 150000001336 alkenes Chemical class 0.000 abstract description 2
- 229910002804 graphite Inorganic materials 0.000 abstract description 2
- 239000010439 graphite Substances 0.000 abstract description 2
- 239000000463 material Substances 0.000 abstract 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 230000018109 developmental process Effects 0.000 description 2
- 208000008454 Hyperhidrosis Diseases 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 208000013460 sweaty Diseases 0.000 description 1
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CN202022507755.4U CN213184271U (zh) | 2020-11-03 | 2020-11-03 | 一种芯片键合布线连接结构 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112234042A (zh) * | 2020-11-03 | 2021-01-15 | 张承平 | 一种芯片键合布线连接结构 |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112234042A (zh) * | 2020-11-03 | 2021-01-15 | 张承平 | 一种芯片键合布线连接结构 |
CN112234042B (zh) * | 2020-11-03 | 2024-07-12 | 苏州志敬半导体材料有限公司 | 一种芯片键合布线连接结构 |
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Effective date of registration: 20240411 Address after: 3rd Floor, Standard Factory Building 1 #, Zhigu Science and Technology Innovation Park, No. 188 Zixu Road, Xukou Town, Wuzhong District, Suzhou City, Jiangsu Province, 215000 Patentee after: Suzhou Zhijing Semiconductor Materials Co.,Ltd. Country or region after: China Address before: 201104 Room 102, No.2, Lane 1398, Jinmei Road, Minhang District, Shanghai Patentee before: Zhang Chengping Country or region before: China Patentee before: Shanghai Zhijing trading firm Patentee before: Changzhou Zhijing graphene Technology Co.,Ltd. |