CN213123797U - A solid state hard drive that is easy to dissipate heat - Google Patents
A solid state hard drive that is easy to dissipate heat Download PDFInfo
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- CN213123797U CN213123797U CN202022301571.2U CN202022301571U CN213123797U CN 213123797 U CN213123797 U CN 213123797U CN 202022301571 U CN202022301571 U CN 202022301571U CN 213123797 U CN213123797 U CN 213123797U
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- heat dissipation
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Abstract
本实用新型提供一种便于散热的固态硬盘,属于固态硬盘技术领域,该便于散热的固态硬盘包括下壳体,所述下壳体的内壁固定连接有芯片,所述下壳体的下表面固定连接有导热板,所述导热板的下表面固定连接有散热铝板,所述导热板的正面固定连接有安装架,所述安装架的正面固定连接有散热扇。该便于散热的固态硬盘,通过下壳体、芯片、导热板、散热铝板、安装架和散热扇之间的配合设置,当固定硬盘工作时,散热扇会持续对散热铝板进行吹风降温,则芯片通过散热铝板散出的热量会被直接带走,极大提高了散热效率,并且散热扇并未直接对芯片进行吹风散热,则极大降低在散热时粉尘进入芯片内部,避免造成芯片损坏,延长其使用寿命。
The utility model provides a solid-state hard disk that is convenient for heat dissipation, belonging to the technical field of solid-state hard disks. The solid-state hard disk for easy heat dissipation comprises a lower casing, the inner wall of the lower casing is fixedly connected with a chip, and the lower surface of the lower casing is fixed A heat-conducting plate is connected, a heat-dissipating aluminum plate is fixedly connected to the lower surface of the heat-conducting plate, an installation frame is fixedly connected to the front of the heat-conducting plate, and a cooling fan is fixedly connected to the front of the installation frame. The solid-state hard drive that is easy to dissipate heat is set through the cooperation among the lower casing, the chip, the heat-conducting plate, the heat-dissipating aluminum plate, the mounting frame and the heat-dissipating fan. The heat dissipated through the heat dissipation aluminum plate will be directly taken away, which greatly improves the heat dissipation efficiency, and the heat dissipation fan does not directly blow the chip to dissipate heat, which greatly reduces the dust entering the chip during heat dissipation, avoids damage to the chip, and prolongs the its service life.
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022301571.2U CN213123797U (en) | 2020-10-16 | 2020-10-16 | A solid state hard drive that is easy to dissipate heat |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022301571.2U CN213123797U (en) | 2020-10-16 | 2020-10-16 | A solid state hard drive that is easy to dissipate heat |
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| Publication Number | Publication Date |
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| CN213123797U true CN213123797U (en) | 2021-05-04 |
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| CN202022301571.2U Active CN213123797U (en) | 2020-10-16 | 2020-10-16 | A solid state hard drive that is easy to dissipate heat |
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| CN (1) | CN213123797U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113380283A (en) * | 2021-06-09 | 2021-09-10 | 西安交通大学 | M2 solid state disk heat dissipation subsides |
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2020
- 2020-10-16 CN CN202022301571.2U patent/CN213123797U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113380283A (en) * | 2021-06-09 | 2021-09-10 | 西安交通大学 | M2 solid state disk heat dissipation subsides |
| CN113380283B (en) * | 2021-06-09 | 2022-08-02 | 西安交通大学 | M2 solid state disk heat dissipation subsides |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20230525 Address after: 247099 Building 5, Phase 4, Electronic Information Industry Park, Economic and Technological Development Zone, Chizhou City, Anhui Province Patentee after: Anhui Huaxun Technology Co.,Ltd. Address before: 1611, Huatong building, No.8 Ganli 2nd Road, gankeng community, Jihua street, Longgang District, Shenzhen, Guangdong 518000 Patentee before: Shenzhen WuXun Technology Co.,Ltd. |
|
| TR01 | Transfer of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A solid-state drive that is easy to dissipate heat Granted publication date: 20210504 Pledgee: Agricultural Bank of China Limited by Share Ltd. Chizhou branch Pledgor: Anhui Huaxun Technology Co.,Ltd. Registration number: Y2024980045839 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Granted publication date: 20210504 Pledgee: Agricultural Bank of China Limited by Share Ltd. Chizhou branch Pledgor: Anhui Huaxun Technology Co.,Ltd. Registration number: Y2024980045839 |
|
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
