CN213053337U

CN213053337U - Continuous feeding lifting structure for laser wafer cutting

Info

Publication number: CN213053337U
Application number: CN202021902862.0U
Authority: CN
Inventors: 巩铁建; 陶为银
Original assignee: Henan General Intelligent Equipment Co Ltd
Current assignee: Jiangsu General Semiconductor Co ltd
Priority date: 2020-09-03
Filing date: 2020-09-03
Publication date: 2021-04-27
Anticipated expiration: 2030-09-03

Abstract

The utility model discloses a laser is continuous feed elevation structure for wafer cutting, including telescoping device, telescopic link, frame, connection structure, extending structure and track, the telescoping device is fixed in the bottom plate top, and is connected with connection structure above the telescoping device, and the wafer is placed inside the frame, and the backup pad is fixed in the bottom plate top, and response structrual installation is on the backup pad surface, and the carriage release lever is fixed on the backup pad surface, goes up the roof and fixes in the backup pad top, and revolution mechanic sets up in the telescopic link top. This laser is continuous feed elevation structure for wafer cutting, the structure sets up rationally, once puts into a lot of wafers in the frame, and can adjust the position of wafer through the telescoping device, and the device has added response structure and carriage release lever, comes ejecting wafer through carriage release lever control extending structure telescopic position, has realized the automation, has reduced the use of manpower, has saved manufacturing cost, the fast operation of assurance wafer cutting that can be better promotes the development of wafer cutting trade.

Description

Continuous feeding lifting structure for laser wafer cutting

Technical Field

The utility model relates to a wafer cutting feed technical field specifically is a laser wafer cutting is with continuous feed elevation structure.

Background

The wafer is made by silicon element through special processing process, in the process of making the wafer, firstly, the silicon element is purified, then the pure silicon is made into silicon crystal bars, and a thin wafer is formed after cutting, and the purpose of cutting the wafer is mainly to cut and separate each crystal grain on the wafer. Firstly, a layer of adhesive tape is adhered to the back surface of the wafer, and then the wafer is sent to a wafer cutting machine for cutting. After the cutting, crystalline grain of one granule can be in good order arranges and paste on the sticky tape, simultaneously because the support of frame can avoid the crystalline grain to produce the collision because of the sticky tape fold, and be favorable to handling, at present, at the cutting during operation of wafer, need use the manual work to take away the wafer after the cutting to through artifical wafer of placing again, cause the feed inefficiency, extravagant a large amount of manpowers, increased manufacturing cost.

In order to solve the defects existing in the current market, the technology of improving the wafer cutting material supply is urgently needed, the rapid operation of wafer cutting can be better ensured, and the development of the wafer cutting industry is promoted.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a laser is continuous feed elevation structure for wafer cutting to the cutting during operation at the wafer that proposes in solving above-mentioned background art, need use the manual work to tak away the wafer after the cutting, and through artifical the wafer of placing again, cause the feed inefficiency, extravagant a large amount of manpowers, increased manufacturing cost scheduling problem.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a laser is continuous feed elevation structure for wafer cutting, including telescoping device, the telescopic link, the frame, connection structure, extending structure and track, the telescoping device is fixed in the bottom plate top, and the telescoping device top is connected with connection structure, the wafer is placed inside the frame, and the frame side is provided with the fixed column, the backup pad is fixed in the bottom plate top, and the backup pad internal surface is provided with extending structure, response structrual installation is on the backup pad surface, and the catching groove sets up in response structrual top, the carriage release lever is fixed in the backup pad surface, and the spliced pole sets up in the carriage release lever top, go up the roof and fix in the backup pad top, and go up the roof top and install the motor, the base is fixed in the bottom plate top, and the base top.

Preferably, the telescopic link is provided with three sections, the three sections of the telescopic link sequentially shorten from bottom to top, and the rotating structure is provided with three sections.

Preferably, the frame is a rectangular structure with only three sides, the left side and the right side of the frame are both provided with fixed columns, and a plurality of wafers are arranged between the fixed columns.

Preferably, the connecting structure is fixed on the lower surface of the frame, the connecting structure is a structure with a hole in the center, and the size of the middle hole is as large as that of the telescopic device.

Preferably, the bottom surface of the telescopic structure is fixed on the support plate, and the diameter of the extending part of the telescopic structure is equal to the width of the wafer.

Preferably, the left end and the right end of the track are respectively connected with the moving rod through the induction structure, and the telescopic structure can slide on the track.

Compared with the prior art, the beneficial effects of the utility model are that: this laser is continuous feed elevation structure for wafer cutting, the structure sets up rationally, once puts into a lot of wafers in the frame, and can adjust the position of wafer through the telescoping device, and the device has added response structure and carriage release lever, comes ejecting wafer through carriage release lever control extending structure telescopic position, has realized the automation, has reduced the use of manpower, has saved manufacturing cost, the fast operation of assurance wafer cutting that can be better promotes the development of wafer cutting trade.

Drawings

FIG. 1 is a front view of the structure of the present invention;

FIG. 2 is a right-side view of the structure of the present invention;

fig. 3 is a schematic top view of the structure of the present invention.

In the figure: 1. a base plate; 2. a telescoping device; 3. a connecting structure; 4. a frame; 5. fixing a column; 6. a wafer; 7. a support plate; 8. an induction structure; 9. buckling grooves; 10. connecting columns; 11. a travel bar; 12. an upper top plate; 13. a motor; 14. a telescopic structure; 15. a track; 16. a base; 17. a telescopic rod; 18. a rotating structure; 19. and (4) a clamp.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-3, the present invention provides a technical solution: a continuous feeding lifting structure for laser wafer cutting comprises a telescopic device 2, a telescopic rod 17, a frame 4, a connecting structure 3, a telescopic structure 14 and a track 15, wherein the telescopic device 2 is fixed above a bottom plate 1, the connecting structure 3 is connected above the telescopic device 2, the telescopic device 2 is connected, the connecting structure 3 and the frame 4 are integrated, a wafer 6 is placed inside the frame 4, a fixing column 5 is arranged on the side surface of the frame 4 to prevent the wafer 6 from sliding, a supporting plate 7 is fixed above the bottom plate 1, the telescopic structure 14 is arranged on the inner surface of the supporting plate 7, the wafer 6 in the frame 4 is pushed out, a sensing structure 8 is arranged on the surface of the supporting plate 7, a chain between the sensing structure 8 and a moving rod 11 can be wound in the sensing structure 8 through rotation of a rotating wheel, a buckling groove 9 is arranged above the sensing structure 8, the moving rod 11 is fixed, and the connecting column 10 is arranged above the moving rod 11, in order to be inserted into the buckling groove 9, the upper top plate 12 is fixed above the supporting plate 7, a motor 13 is arranged above the upper top plate 12 and drives the rotating wheel to rotate, the base 16 is fixed above the bottom plate 1, a telescopic rod 17 is connected above the base 16, the rotating structure 18 is arranged above the telescopic rod 17, the rotating structure 18 is spherical, the telescopic rod 17 can freely rotate around the sphere, a clamp 19 is arranged at the top end of the telescopic rod 17 and clamps the wafer 6 pushed out by the telescopic structure 14, the telescopic rod 17 is provided with three sections, the three sections of the telescopic rod 17 are sequentially shortened from bottom to top, the rotating structure 18 is provided with three sections, the frame 4 is a rectangular structure with only three surfaces, the wafer 6 is convenient to push out, the left and right surfaces of the frame 4 are provided with the fixing columns 5 respectively, the wafer 6, connecting structure 3 fixes at frame 4 lower surface, and connecting structure 3 is the structure of hole for the center, and middle hole size and telescoping device 2 are equally big for can wholly change frame 4 and inner structure, the 14 bottom surfaces of telescoping structure are fixed in backup pad 7, and the 14 partial diameter size that stretches out of telescoping structure equals the 6 widths of wafer, and both ends are connected by response structure 8 and carriage release lever 11 respectively about track 15, and telescoping structure 14 can slide on track 15.

The working principle is as follows: when the continuous feeding lifting structure for laser wafer cutting is used, when the device is started, the telescopic device 2 extends upwards, the wafer 6 is placed in the frame, after the telescopic device 2 moves to a certain position, the motor 13 starts to work, the movable rod 11 starts to move towards the direction of the induction structure 8 along the rail 15 under the driving of the chain, at the moment, the telescopic structure 14 starts to work, the wafer 6 in front of the telescopic structure 14 extending out of the pushing surface moves forwards, at the moment, the telescopic structure 14 moves along the movable rod 11, the wafer 6 is sequentially pushed out, the clamp 19 works, the wafer 6 pushed out is sequentially clamped, the wafer 6 is conveyed to the cutting device through the telescopic rod 17, and the whole process of the continuous feeding lifting structure for laser wafer cutting is achieved.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a laser wafer cutting is with continuous feed elevation structure, includes telescoping device (2), telescopic link (17), frame (4), connection structure (3), extending structure (14) and track (15), its characterized in that: the telescopic device (2) is fixed above the bottom plate (1), a connecting structure (3) is connected above the telescopic device (2), a wafer (6) is placed inside the frame (4), a fixing column (5) is arranged on the side surface of the frame (4), the supporting plate (7) is fixed above the bottom plate (1), a telescopic structure (14) is arranged on the inner surface of the supporting plate (7), the induction structure (8) is installed on the surface of the supporting plate (7), the fastening groove (9) is arranged above the induction structure (8), the moving rod (11) is fixed on the surface of the supporting plate (7), the connecting column (10) is arranged above the moving rod (11), the upper top plate (12) is fixed above the supporting plate (7), a motor (13) is installed above the upper top plate (12), the base (16) is fixed above the bottom plate (1), and a telescopic rod (17) is connected above the base (16), the rotating structure (18) is arranged above the telescopic rod (17), and the top end of the telescopic rod (17) is provided with a clamp (19).

2. The continuous feed lifting structure for laser wafer dicing as claimed in claim 1, wherein: the telescopic rod (17) is provided with three sections, the three sections of the telescopic rod (17) are sequentially shortened from bottom to top, and the rotating structures (18) are three.

3. The continuous feed lifting structure for laser wafer dicing as claimed in claim 1, wherein: the frame (4) is of a rectangular structure with only three sides, the left side and the right side of the frame (4) are provided with fixing columns (5), and a plurality of wafers (6) placed between the fixing columns (5) are arranged.

4. The continuous feed lifting structure for laser wafer dicing as claimed in claim 1, wherein: the connecting structure (3) is fixed on the lower surface of the frame (4), the connecting structure (3) is a structure with a hole in the center, and the size of the middle hole is as large as that of the telescopic device (2).

5. The continuous feed lifting structure for laser wafer dicing as claimed in claim 1, wherein: the bottom surface of the telescopic structure (14) is fixed on the support plate (7), and the diameter of the extending part of the telescopic structure (14) is equal to the width of the wafer (6).

6. The continuous feed lifting structure for laser wafer dicing as claimed in claim 1, wherein: the left end and the right end of the track (15) are respectively connected with the moving rod (11) through the induction structure (8), and the telescopic structure (14) can slide on the track (15).