CN212932344U - Bonding strength detection device for organosilicon heat-conducting bonding sealant - Google Patents
Bonding strength detection device for organosilicon heat-conducting bonding sealant Download PDFInfo
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- CN212932344U CN212932344U CN202021045144.6U CN202021045144U CN212932344U CN 212932344 U CN212932344 U CN 212932344U CN 202021045144 U CN202021045144 U CN 202021045144U CN 212932344 U CN212932344 U CN 212932344U
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Abstract
The utility model discloses an organosilicon heat conduction bonding strength detection device for sealant, comprising a base plate, the upper surface symmetry fixedly connected with backup pad of bottom plate, two the same roof of the equal fixedly connected with in upper surface of backup pad, two be equipped with the base between the backup pad, logical groove has been seted up to the upper surface of base, the last fixed surface of roof is connected with driving motor, driving motor's output rotates and is connected with the pivot, the bottom fixedly connected with screw rod of pivot, the bottom fixedly connected with disc of screw rod, the movable plate has been cup jointed to the outer wall screw thread of screw rod. The utility model relates to a simply, convenient operation, two sucking discs can be more firm to organosilicon body centre gripping, can conveniently detect the bonding strength of organosilicon body like this, can play the effect to the bonding board buffering, are difficult for making to take place great collision between bonding board and the baffle.
Description
Technical Field
The utility model relates to a bonding strength detection device technical field especially relates to a bonding strength detection device for organosilicon heat conduction bonding sealant.
Background
Organosilicon, i.e., organosilicon compounds, are compounds containing Si — C bonds and having at least one organic group directly bonded to a silicon atom, and conventionally, compounds in which an organic group is bonded to a silicon atom via oxygen, sulfur, nitrogen, or the like are also commonly used as organosilicon compounds, and among these, polysiloxanes having a siloxane bond as a skeleton are the most numerous of organosilicon compounds, the most deeply studied and widely used ones, and account for about 90% or more of the total amount.
The existing bonding strength detection device has the defects of complex structure, large volume, insufficient firmness in clamping of a detected object, easy failure of detection, low working efficiency and small application range.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving the defects existing in the prior art and providing a bonding strength detection device for an organic silicon heat conduction bonding sealant.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
a bonding strength detection device for an organic silicon heat-conducting bonding sealant comprises a bottom plate, wherein the upper surface of the bottom plate is symmetrically and fixedly connected with supporting plates, the upper surfaces of the two supporting plates are fixedly connected with a same top plate, a base is arranged between the two supporting plates, the upper surface of the base is provided with a through groove, the upper surface of the top plate is fixedly connected with a driving motor, the output end of the driving motor is rotatably connected with a rotating shaft, the bottom end of the rotating shaft is fixedly connected with a screw rod, the bottom end of the screw rod is fixedly connected with a disc, the outer wall of the screw rod is sleeved with a movable plate, the upper surface of the movable plate is symmetrically and fixedly connected with a guide rod, the lower surface of the movable plate is symmetrically and fixedly connected with a vertical plate, the inner surface of the bottom of the through groove, divide equally other fixedly connected with baffle, two to lead to the both sides inner wall of groove other sliding connection is equallyd divide to the inside of riser, the one end fixedly connected with mounting panel of spliced pole, one side outer wall fixedly connected with sucking disc that the mounting panel is close to the organosilicon body, the mutual contact between sucking disc and the bonding plate, the other end fixedly connected with connecting plate of spliced pole, one side outer wall fixedly connected with arc of riser is kept away from to the connecting plate, fixedly connected with spring between riser and the connecting plate, sliding connection between spring and the spliced pole.
Preferably, the base is located on the upper surface of the bottom plate, and the base is fixedly connected with the bottom plate.
Preferably, the top end of the guide rod is fixedly connected with a limiting plate, the limiting plate is located above the top plate, and the guide rod is connected with the top plate in a sliding mode.
Preferably, the front side outer wall of the vertical plate is provided with a fixing bolt, and the vertical plate is fixedly connected with the connecting column through the fixing bolt.
Preferably, a buffer pad is fixedly connected to the lower surface of the baffle plate, and the buffer pad and the bonding plate are in contact with each other.
Compared with the prior art, the beneficial effects of the utility model are that:
1. in the utility model, the two suckers can clamp the organic silicon body more stably by arranging the suckers, the mounting plate, the connecting column and the spring, so that the bonding strength of the organic silicon body can be conveniently detected;
2. in the utility model, the cushion pad is arranged, so that the function of buffering the bonding plate can be achieved, and the bonding plate is not easy to collide with the baffle plate greatly;
to sum up, the utility model relates to a simply, convenient operation, two sucking discs can be more firm to organosilicon body centre gripping, can conveniently detect the bonding strength of organosilicon body like this, can play the effect to the bonding plate buffering, are difficult for making to take place great collision between bonding plate and the baffle.
Drawings
Fig. 1 is a schematic structural view of an adhesion strength detecting device for an organosilicon heat-conducting adhesive sealant according to the present invention;
FIG. 2 is an enlarged view of the structure at the position A of the bonding strength detection device for the organosilicon heat-conducting bonding sealant provided by the utility model;
fig. 3 is a schematic structural diagram of a second embodiment of the bonding strength detection device for the organosilicon heat-conducting bonding sealant.
In the figure: 1. a base plate; 2. a support plate; 3. a top plate; 4. a base; 5. a through groove; 6. a drive motor; 7. a rotating shaft; 8. a screw; 9. a disc; 10. moving the plate; 11. a guide bar; 12. a vertical plate; 13. a bonding plate; 14. an organosilicon body; 15. a baffle plate; 16. connecting columns; 17. mounting a plate; 18. a suction cup; 19. a connecting plate; 20. an arc-shaped plate; 21. a spring; 22. a fixing bolt; 23. a cushion pad.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.
Referring to fig. 1-2, an embodiment of a bonding strength detecting device for an organosilicon heat-conducting bonding sealant comprises a bottom plate 1, wherein support plates 2 are symmetrically and fixedly connected to the upper surface of the bottom plate 1, a same top plate 3 is fixedly connected to the upper surfaces of the two support plates 2, a base 4 is arranged between the two support plates 2, a through groove 5 is formed in the upper surface of the base 4, a driving motor 6 is fixedly connected to the upper surface of the top plate 3, a rotating shaft 7 is rotatably connected to the output end of the driving motor 6, a screw 8 is fixedly connected to the bottom end of the rotating shaft 7, a disc 9 is fixedly connected to the bottom end of the screw 8, a movable plate 10 is sleeved on the outer wall of the screw 8 in a threaded manner, a guide rod 11 is symmetrically and fixedly connected to the upper surface of the movable plate 10, a vertical plate 12 is symmetrically and fixedly connected to the lower surface of the movable plate 10, a bonding, divide equally no fixedly connected with baffle 15 to lead to groove 5's both sides inner wall, No. respectively sliding connection has spliced pole 16 is equallyd divide to the inside of two risers 12, spliced pole 16's one end fixedly connected with mounting panel 17, mounting panel 17 is close to one side outer wall fixedly connected with sucking disc 18 of organosilicon body 14, the intercommunicating contact between sucking disc 18 and the bonding plate 13, spliced pole 16's other end fixedly connected with connecting plate 19, riser 12's one side outer wall fixedly connected with arc 20 is kept away from to connecting plate 19, fixedly connected with spring 21 between riser 12 and the connecting plate 19, sliding connection between spring 21 and the spliced.
At first place the bonding board 13 in the logical groove 5 at base 4, then give the gim peg 22 on the riser 12 and dismantle, spliced pole 16 is under the effect of spring 21 elasticity, spliced pole 16 is promoting sucking disc 18 on the mounting panel 17 and is removing, make sucking disc 18 can suck tightly on organosilicon body 14, at this moment, on screwing up gim peg 22 on riser 12 again, fix between spliced pole 16 and riser 12, then start driving motor 6, driving motor 6 drives pivot 7 and rotates, pivot 7 drives screw rod 8 and rotates, screw rod 8 drives movable plate 10 and upwards moves, movable plate 10 drives two riser 12 rebound, two sucking discs 18 can be more firm to organosilicon body centre gripping, can conveniently detect the bonding strength to organosilicon body 14 like this.
Compared with the first embodiment, the second embodiment adopts a more convenient structure as the cushion pad 23, which can play a role of buffering the bonding plate 13, and is not easy to cause large collision between the bonding plate 13 and the baffle 15.
Referring to fig. 1-3, a second embodiment of a bonding strength detecting device for an organosilicon heat-conducting bonding sealant comprises a bottom plate 1, wherein support plates 2 are symmetrically and fixedly connected to the upper surface of the bottom plate 1, the upper surfaces of the two support plates 2 are both fixedly connected with a same top plate 3, a base 4 is arranged between the two support plates 2, a through groove 5 is formed in the upper surface of the base 4, a driving motor 6 is fixedly connected to the upper surface of the top plate 3, a rotating shaft 7 is rotatably connected to the output end of the driving motor 6, a screw 8 is fixedly connected to the bottom end of the rotating shaft 7, a disc 9 is fixedly connected to the bottom end of the screw 8, a movable plate 10 is sleeved on the outer wall of the screw 8 in a threaded manner, a guide rod 11 is symmetrically and fixedly connected to the upper surface of the movable plate 10, a vertical plate 12 is symmetrically and fixedly connected to the lower surface of the movable plate 10, a, divide equally no fixedly connected with baffle 15 to lead to groove 5's both sides inner wall, No. respectively sliding connection has spliced pole 16 is equallyd divide to the inside of two risers 12, spliced pole 16's one end fixedly connected with mounting panel 17, mounting panel 17 is close to one side outer wall fixedly connected with sucking disc 18 of organosilicon body 14, the intercommunicating contact between sucking disc 18 and the bonding plate 13, spliced pole 16's other end fixedly connected with connecting plate 19, riser 12's one side outer wall fixedly connected with arc 20 is kept away from to connecting plate 19, fixedly connected with spring 21 between riser 12 and the connecting plate 19, sliding connection between spring 21 and the spliced.
When the bonding strength of the silicone body 14 is detected, the cushion pad 23 is pressed by the bonding plate 13, so that the bonding plate 13 and the baffle 15 are not easy to collide greatly.
The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.
Claims (5)
1. The bonding strength detection device for the organosilicon heat-conducting bonding sealant comprises a bottom plate (1) and is characterized in that supporting plates (2) are symmetrically and fixedly connected to the upper surface of the bottom plate (1), two supporting plates (2) are fixedly connected to the upper surface of the same top plate (3), a base (4) is arranged between the two supporting plates (2), a through groove (5) is formed in the upper surface of the base (4), a driving motor (6) is fixedly connected to the upper surface of the top plate (3), the output end of the driving motor (6) is rotatably connected with a rotating shaft (7), a screw rod (8) is fixedly connected to the bottom end of the rotating shaft (7), a disc (9) is fixedly connected to the bottom end of the screw rod (8), a movable plate (10) is sleeved on the outer wall threads of the screw rod (8), and a guide rod (11) is symmetrically and fixedly connected to the upper surface, the lower surface symmetry fixedly connected with riser (12) of movable plate (10), the bottom internal surface that leads to groove (5) is equipped with bonding pad (13), the upper surface of bonding pad (13) bonds through heat conduction bonding sealant and has organosilicon body (14), the both sides inner wall that leads to groove (5) is equallyd divide respectively fixedly connected with baffle (15), two do not sliding connection have spliced pole (16) are equallyd divide to the inside of riser (12), the one end fixedly connected with mounting panel (17) of spliced pole (16), one side outer wall fixedly connected with sucking disc (18) that mounting panel (17) are close to organosilicon body (14), mutual contact between sucking disc (18) and bonding pad (13), the other end fixedly connected with connecting plate (19) of spliced pole (16), one side outer wall fixedly connected with arc (20) of riser (12) are kept away from to connecting plate (19), fixedly connected with spring (21) between riser (12) and connecting plate (19), sliding connection between spring (21) and spliced pole (16).
2. The bonding strength detection device for the silicone heat-conducting bonding sealant according to claim 1, wherein the base (4) is located on the upper surface of the bottom plate (1), and the base (4) is fixedly connected with the bottom plate (1).
3. The bonding strength detection device for the silicone heat-conducting bonding sealant according to claim 1, wherein a limiting plate is fixedly connected to the top end of the guide rod (11), the limiting plate is located above the top plate (3), and the guide rod (11) is slidably connected with the top plate (3).
4. The bonding strength detection device for the silicone heat-conducting bonding sealant according to claim 1, wherein a fixing bolt (22) is provided on the front outer wall of the vertical plate (12), and the vertical plate (12) is fixedly connected with the connecting column (16) through the fixing bolt (22).
5. The bonding strength detecting device for the silicone heat-conducting bonding sealant as claimed in claim 1, wherein a cushion pad (23) is fixedly connected to the lower surface of the baffle plate (15), and the cushion pad (23) and the bonding plate (13) are in contact with each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021045144.6U CN212932344U (en) | 2020-06-09 | 2020-06-09 | Bonding strength detection device for organosilicon heat-conducting bonding sealant |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021045144.6U CN212932344U (en) | 2020-06-09 | 2020-06-09 | Bonding strength detection device for organosilicon heat-conducting bonding sealant |
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| CN212932344U true CN212932344U (en) | 2021-04-09 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113138161A (en) * | 2021-05-14 | 2021-07-20 | 深圳源明杰科技股份有限公司 | Electronic tags laminating intensity check out test set |
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2020
- 2020-06-09 CN CN202021045144.6U patent/CN212932344U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113138161A (en) * | 2021-05-14 | 2021-07-20 | 深圳源明杰科技股份有限公司 | Electronic tags laminating intensity check out test set |
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