CN212909184U - Automatic motor heat dissipation equipment that uses of electrical engineering - Google Patents
Automatic motor heat dissipation equipment that uses of electrical engineering Download PDFInfo
- Publication number
- CN212909184U CN212909184U CN202021199428.0U CN202021199428U CN212909184U CN 212909184 U CN212909184 U CN 212909184U CN 202021199428 U CN202021199428 U CN 202021199428U CN 212909184 U CN212909184 U CN 212909184U
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- heat
- motor
- module
- motor body
- heat dissipation
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 35
- 238000004870 electrical engineering Methods 0.000 title claims abstract description 14
- 239000004065 semiconductor Substances 0.000 claims abstract description 42
- 238000010438 heat treatment Methods 0.000 claims abstract description 7
- 239000000463 material Substances 0.000 claims description 5
- 229910000838 Al alloy Inorganic materials 0.000 claims description 4
- SNAAJJQQZSMGQD-UHFFFAOYSA-N aluminum magnesium Chemical compound [Mg].[Al] SNAAJJQQZSMGQD-UHFFFAOYSA-N 0.000 claims description 4
- 230000001105 regulatory effect Effects 0.000 claims 2
- 238000005057 refrigeration Methods 0.000 abstract description 39
- 230000000694 effects Effects 0.000 abstract description 14
- 230000005855 radiation Effects 0.000 abstract description 6
- 238000001816 cooling Methods 0.000 abstract description 5
- 238000000034 method Methods 0.000 description 10
- 238000010586 diagram Methods 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
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Abstract
The utility model discloses a motor heat dissipation device for electrical engineering automation, which relates to the technical field of motor heat dissipation, and the structure of the device comprises a motor body, a semiconductor refrigeration piece module and a heat dissipation module, wherein the semiconductor refrigeration piece module is provided with a heating end and a refrigeration end, and the refrigeration end is attached to the outer surface of the shell of the motor body; the heat radiation module arranges at the motor body afterbody, dispels the heat to the end that generates heat of semiconductor refrigeration piece module, right the utility model discloses, when using cooling system, supply power to semiconductor refrigeration piece module, the cold junction contact motor body casing's of semiconductor refrigeration piece module surface, dispel the heat to motor body, be provided with heat radiation module again, heat radiation module acts on the end that generates heat of semiconductor refrigeration piece module, dispel the heat to semiconductor refrigeration piece module, make the effect of the refrigeration end of semiconductor refrigeration piece module better, can be more abundant accomplish the heat dissipation to motor body.
Description
Technical Field
The utility model relates to a motor heat dissipation technical field especially involves a motor heat dissipation equipment for electrical engineering automation.
Background
The motor is a power machine with wide application, converts electric energy into mechanical energy to drive various mechanical equipment to operate, in the process of converting the energy of the motor, a part of energy can be dissipated in a coil in a heat mode, the part of energy converted into heat can cause the motor to generate heat, and if the heat cannot be dissipated in time, the motor coil can be damaged in an insulation way to cause short circuit or other faults affecting the performance of the motor to cause abnormal operation.
In order to guarantee that the motor can normally operate, radiating blades are installed at the tail parts of some motor shafts, and heat generated in the running process of the motor is dissipated through radiating holes, so that the motor has the following problems in the actual use process:
1. because the rotating speeds of different motors or variable frequency motors are different, when the rotating speed of the motor is not fast, the rotating speed of the radiating blade of the traditional motor is not fast, and a good radiating effect cannot be achieved;
2. the heat of the traditional motor is dissipated through the heat dissipating blades, and the heat dissipating effect is poor.
Therefore, the utility model discloses a motor heat abstractor compares in prior art, and the rotational speed of motor is not right the utility model discloses a radiating effect produces the influence, just the utility model discloses a radiating effect is better.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to overcome prior art not enough, provide a motor heat dissipation equipment for electrical engineering automation, compare in prior art, the rotational speed of motor is not right the utility model discloses a radiating effect produces the influence, just the utility model discloses a radiating effect is better.
The utility model discloses a realize through following technical scheme: a kind of electrical engineering automation uses the heat dissipating double-fuselage of the electrical machinery, mount on body of the electrical machinery, dispel the heat to it, the heat dissipating double-fuselage includes semiconductor refrigeration piece module and heat-dissipating module, wherein, the semiconductor refrigeration piece module has heating terminals and refrigeration ends, the refrigeration end is laminated on the body outer surface of electrical machinery; the heat dissipation module is arranged at the tail of the motor body and dissipates heat of the heating end of the semiconductor refrigeration piece module.
The utility model discloses, be independent setting between radiating system and the motor body, do not influence each other, when using cooling system, supply power to semiconductor refrigeration piece module, the cold junction contact motor body casing's of semiconductor refrigeration piece module surface, dispel the heat to the motor body, be provided with thermal module again, thermal module acts on the end that generates heat of semiconductor refrigeration piece module, dispel the heat to semiconductor refrigeration piece module, make the effect of the refrigeration end of semiconductor refrigeration piece module better, can be more abundant accomplish the heat dissipation to the motor body.
Preferably, in order to facilitate understanding, the utility model discloses a specific structure of a heat dissipation module, the heat dissipation module comprises a shell and a heat dissipation fan, the shell is provided with a cavity, and the side wall of one end of the shell, which is far away from the motor body, is provided with a heat dissipation hole; the heat radiation fan is arranged inside the cavity of the shell; the shell is connected with the tail of the motor body, a gap is formed between the shell and the motor body to form an air outlet, and the air outlet is opposite to the semiconductor refrigerating sheet module.
Preferably, the heat dissipation fan is electrically connected with the power supply module, and the power supply module is provided with a power switch.
Preferably, in order to adjust radiator fan's rotational speed, the utility model discloses still be provided with speed adjusting mechanism, speed adjusting mechanism adjusts the size of the electric current through radiator fan to radiator fan's work efficiency can be changed.
Preferably, the shell is detachably connected with the tail part of the motor body.
Preferably, the shell is made of magnesium-aluminum alloy.
The utility model discloses an electrical engineering automation is with motor heat dissipation equipment compares with prior art:
the utility model discloses a motor heat abstractor compares in prior art, and the rotational speed of motor is not right the utility model discloses a radiating effect produces the influence, just the utility model discloses a radiating effect is better, to the utility model discloses, be independent setting between radiating system and the motor body, do not influence each other, when using cooling system, supply power to semiconductor refrigeration piece module, the cold junction contact motor body casing's of semiconductor refrigeration piece module surface dispels the heat to motor body, be provided with heat dissipation module again, heat dissipation module acts on the end that generates heat of semiconductor refrigeration piece module, dispels the heat to semiconductor refrigeration piece module for the effect of the refrigeration end of semiconductor refrigeration piece module is better, can be more abundant accomplish the heat dissipation to motor body.
Drawings
Fig. 1 is an external view of an angle of the present invention;
fig. 2 is an appearance schematic diagram of the present invention at another angle different from that of fig. 1;
fig. 3 is a top view of the semiconductor cooling plate module of the present invention;
fig. 4 is a schematic structural diagram of the middle heat dissipation module of the present invention.
Detailed Description
The embodiments of the present invention will be described in detail below, and the present embodiment is implemented on the premise of the technical solution of the present invention, and a detailed implementation manner and a specific operation process are given, but the scope of the present invention is not limited to the following embodiments.
As shown in fig. 1 to 3, the utility model discloses a motor heat dissipation device for electrical engineering automation, which is installed on a motor body 1 to dissipate heat, and comprises a semiconductor refrigeration piece module 3 and a heat dissipation module 2, wherein the semiconductor refrigeration piece module 3 is provided with a heat emitting end and a refrigeration end, and the refrigeration end is attached to the outer surface of the shell of the motor body 1; the heat dissipation module 2 is arranged at the tail part of the motor body 1 and is used for dissipating heat of the heating end of the semiconductor chilling plate module 3.
Based on the structure, to the utility model discloses, be independent setting between radiating system and the motor body 1, do not influence each other, when using cooling system, supply power to semiconductor refrigeration piece module 3, the cold junction of semiconductor refrigeration piece module 3 contacts the surface of motor body 1 casing 1, dispel the heat to motor body 1, be provided with heat radiation module 2 again, heat radiation module 2 acts on the heating end of semiconductor refrigeration piece module 3, dispel the heat to semiconductor refrigeration piece module 3, make the effect of the refrigeration end of semiconductor refrigeration piece module 3 better, can be more abundant accomplish the heat dissipation to motor body 1.
Optionally, in order to facilitate understanding, the utility model discloses a specific structure of a heat dissipation module 2, the heat dissipation module 2 includes a housing 21 and a heat dissipation fan 24, the housing 21 is provided with a cavity, and a heat dissipation hole 25 is formed on a side wall of one end of the housing, which is far away from the motor body 1; a heat dissipation fan 24 is arranged inside the cavity of the housing 21; wherein, shell 21 connects 1 afterbody of motor body is provided with the clearance between shell 21 and the motor body 1 and forms the air outlet, the air outlet with semiconductor refrigeration piece module 3 sets up relatively, radiator fan 24 and power module 22 electric connection, be provided with switch on the power module 22, adjust in order to adjust radiator fan 24's rotational speed, the utility model discloses still be provided with speed adjusting mechanism 23, speed adjusting mechanism 23 adjusts and passes through the size of radiator fan 24's electric current to can change radiator fan 24's work efficiency, shell 21 with the connection can be dismantled to motor body 1 afterbody, the material of shell 21 is magnesium-aluminum alloy, and the shell 21 thermal conductivity of magnesium-aluminum alloy material is stronger, prevents that the temperature of casing 21's cavity is too high.
It is worth noting that for the semiconductor chilling plate module 3, it is a means of heat transfer. When a current passes through a thermocouple pair formed by connecting an N-type semiconductor material and a P-type semiconductor material, heat transfer can be generated between the two ends, and the heat can be transferred from one end to the other end, so that temperature difference is generated to form a cold end and a hot end. But the semiconductor itself presents a resistance that generates heat when current passes through the semiconductor, thereby affecting heat transfer. But the heat between the two plates is also transferred through the air and the semiconductor material itself in a reverse direction. When the cold end and the hot end reach a certain temperature difference and the heat transfer amounts of the two types are equal, a balance point is reached, and the positive heat transfer and the reverse heat transfer are mutually offset. The temperature of the cold and hot ends will not change continuously. In order to achieve a lower temperature, the temperature of the hot end can be reduced by means of heat dissipation and the like, which is relatively mature, and a person skilled in the art can understand that the structure of the semiconductor chilling plate module 3 is not described in detail.
To sum up, compare in prior art, the rotational speed of motor is not right the utility model discloses a radiating effect produces the influence, just the utility model discloses a radiating effect is better.
Above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the design of the present invention, equivalent replacement or change should be covered within the protection scope of the present invention.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
Claims (6)
1. The utility model provides an automatic motor heat dissipation equipment for electrical engineering installs on motor body (1), dispels the heat to it, its characterized in that, heat dissipation equipment includes:
the semiconductor refrigerating sheet module (3) is provided with a heating end and a refrigerating end, and the refrigerating end is attached to the outer surface of the shell of the motor body (1);
and the heat dissipation module (2) is arranged at the tail part of the motor body (1) and is used for dissipating heat of the heating end of the semiconductor chilling plate module (3).
2. The electrical engineering automation motor heat sink according to claim 1, characterized in that the heat sink module (2) comprises:
the motor comprises a shell (21), a cavity is arranged, and a heat dissipation hole (25) is formed in the side wall of one end, far away from the motor body (1), of the shell;
-a heat dissipating fan (24) arranged inside the cavity of the casing (21);
the shell (21) is connected with the tail of the motor body (1), a gap is formed between the shell (21) and the motor body (1) to form an air outlet, and the air outlet and the semiconductor refrigerating sheet module (3) are arranged oppositely.
3. The motor heat sink for automation of electrical engineering as claimed in claim 2, characterized in that the heat sink fan (24) is electrically connected to the power supply module (22), and the power supply module (22) is provided with a power switch.
4. A motor heat sink for automation of electrical engineering according to claim 3, characterised in that a speed regulating mechanism (23) is further provided, and the speed regulating mechanism (23) regulates the magnitude of the current passing through the heat sink fan (24).
5. The motor heat sink for automation of electrical engineering as set forth in claim 2, characterized in that the housing (21) is detachably connected to the rear portion of the motor body (1).
6. The motor heat sink for automation of electrical engineering as set forth in claim 5, characterized in that the material of the housing (21) is magnesium aluminum alloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021199428.0U CN212909184U (en) | 2020-06-24 | 2020-06-24 | Automatic motor heat dissipation equipment that uses of electrical engineering |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021199428.0U CN212909184U (en) | 2020-06-24 | 2020-06-24 | Automatic motor heat dissipation equipment that uses of electrical engineering |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212909184U true CN212909184U (en) | 2021-04-06 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021199428.0U Expired - Fee Related CN212909184U (en) | 2020-06-24 | 2020-06-24 | Automatic motor heat dissipation equipment that uses of electrical engineering |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212909184U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114614623A (en) * | 2022-03-23 | 2022-06-10 | 阿波罗智联(北京)科技有限公司 | Motor device and vehicle |
| CN114928191A (en) * | 2022-06-17 | 2022-08-19 | 江苏澳洋顺昌科技材料有限公司 | Moisture-resistant rust-proof galvanized aluminum-magnesium motor steel shell structure and processing method thereof |
-
2020
- 2020-06-24 CN CN202021199428.0U patent/CN212909184U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114614623A (en) * | 2022-03-23 | 2022-06-10 | 阿波罗智联(北京)科技有限公司 | Motor device and vehicle |
| CN114928191A (en) * | 2022-06-17 | 2022-08-19 | 江苏澳洋顺昌科技材料有限公司 | Moisture-resistant rust-proof galvanized aluminum-magnesium motor steel shell structure and processing method thereof |
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210406 |
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| CF01 | Termination of patent right due to non-payment of annual fee |