CN212906592U - Wireless data acquisition terminal - Google Patents

Abstract

The utility model relates to an information acquisition and transmission field specifically discloses a wireless data acquisition terminal, include: the device comprises an MCU, a wireless communication module, an SP3485 chip, a current detection chip and a PCB, wherein an SPI (serial peripheral interface) is arranged in the MCU, an FLASH chip is arranged on the PCB, and the SPI is in signal connection with the FLASH chip; the MCU comprises a USART1 for realizing debugging output and configuration command input between the MCU and the PC; the MCU also comprises UART2, UART3, UART4 and UART5, the MCU is in signal connection with the wireless communication module through UART2, the MCU is in signal connection with SP3485 through UART3 and UART4, and the MCU is in signal connection with the current detection chip through UART 5. Adopt the technical scheme of the utility model the integration level that can solve present product exists is low, the poor problem of reliability.

Description

Wireless data acquisition terminal

Technical Field

The utility model relates to an information acquisition and transmission field, in particular to wireless data acquisition terminal.

Background

At present, after field acquisition equipment such as a detection device or a sensor is used for field detection equipment, related data is generally required to be sent to an upper computer. At present, the adopted technical means generally needs a mode of converting TCP into RS232/485/422 for operation, and the mode mainly plays a role in converting the protocol of data acquired by field acquisition equipment, the required equipment is acquisition serial equipment and a transmitter, and in addition, if remote data transmission is required, other equipment needs to be added for conversion.

That is, in popular terms, to realize the function of wireless collection of certain data by using the existing equipment, a collection terminal, a serial server (for example, a TCP/IP-to-4-port RS-232/485/422 serial server), a transmitter and a wireless sending module are required. At least three to four separate products are required to be able to achieve the above functions.

Such an approach has the problem of low integration and even indirectly poor reliability.

SUMMERY OF THE UTILITY MODEL

The utility model provides a wireless data acquisition terminal can solve the low, poor problem of reliability of the integrated level that present product exists.

In order to solve the technical problem, the present application provides the following technical solutions:

wireless data acquisition terminal includes: the device comprises an MCU, a wireless communication module, an SP3485 chip, a current detection chip and a PCB, wherein an SPI (serial peripheral interface) is arranged in the MCU, an FLASH chip is arranged on the PCB, and the SPI is in signal connection with the FLASH chip; the MCU comprises a USART1 for realizing debugging output and configuration command input between the MCU and the PC; the MCU also comprises UART2, UART3, UART4 and UART5, the MCU is in signal connection with the wireless communication module through UART2, the MCU is in signal connection with SP3485 through UART3 and UART4, and the MCU is in signal connection with the current detection chip through UART 5.

The basic scheme principle and the beneficial effects are as follows: the scheme makes full use of the hardware interface of the MCU, realizes debugging output and configuration command input between the MCU and the PC through USART1 of the MCU, and realizes communication with the wireless communication module through UART 2. The UART3 and the UART4 realize the RS485 interface through the SP3485 chip and the UART5 realize the communication with the current detection chip, and the data acquisition function of the transmitter is obtained. The read-write capability of the FLASH chip is realized through an SPI interface arranged in the MCU so as to finish the storage of important data and the power-off storage of configuration information.

In the scheme, the MCU is utilized to integrate related hardware on a PCB by utilizing a hardware interface of the MCU, so that the integration level of a product is improved, and the reliability of the product is ensured.

Further, the wireless communication module is one of a 4G communication module, a WIFI module or a ZigBee module.

Such an approach enables multiple wireless communication approaches.

Further, the wireless communication module is a 4G communication module with an EC200T-CN model.

The module has a problem of relatively large volume, but the overall cost is relatively low and the heat generation is relatively low.

Further, the MCU is an STM32 series single chip microcomputer.

Meets the relevant requirements and has low cost.

And the wireless state display lamp, the running state display lamp, the serial port reading and writing indicator lamp and the transmitter acquisition condition indicator lamp are respectively in signal connection with the MCU.

The user can conveniently know the specific working state.

Further, still include communication bottom plate, row needle and row seat, 4G communication module fixes on the communication bottom plate, arranges the seat and fixes on the PCB board, arranges the needle and connects communication bottom plate and PCB board.

Through arranging needle and row seat for 4G communication module is gapped with the PCB board, improves the heat dissipation on the one hand, and on the other hand can save space.

Furthermore, the MCU is fixed on the PCB and positioned below the communication bottom plate.

The layout mode is that the 4G communication module is large, the 4G communication module and the MCU are arranged in an overlapping mode, the space can be effectively utilized, and a good heat dissipation effect is achieved.

Furthermore, the number of the row seats is two, and the two row seats are respectively positioned on two sides of the 4G communication module.

The mode can have better fixed and supporting effect to 4G communication module.

Further, still include the shell, the bottom of shell has set firmly the otic placode, is provided with the through-hole on the otic placode.

When the shell is installed, the bolts penetrate through the through holes, and the shell can be vertically fixed on the wall surface or other positions.

Further, the shell comprises a front side plate, a rear side plate, a cover plate, a left side plate and a right side plate, the front side plate, the rear side plate, the cover plate and the ear plates are integrally formed, and the left side plate and the right side plate are fixed on two sides of the front side plate and the rear side plate respectively.

The mode can effectively reduce the processing cost.

Drawings

FIG. 1 is a pin diagram of an MCU in a first embodiment of a wireless data acquisition terminal;

FIG. 2 is a schematic structural diagram of a PCB in a second embodiment of the wireless data acquisition terminal;

fig. 3 is a schematic structural diagram of a housing of a second embodiment of the wireless data acquisition terminal.

Detailed Description

The following is further detailed by way of specific embodiments:

the reference numbers in the drawings of the specification include: 4G communication module 1, PCB board 2, otic placode 3, through-hole 4.

Example one

As shown in fig. 1, the wireless data acquisition terminal of this embodiment includes: the circuit comprises an MCU with the model of STM32f103, a 4G communication module with the model of EC200T-CN, an SP3485 chip, a current detection chip with the model of AD8217 and a PCB 2, wherein an SPI (serial peripheral interface) is arranged in the MCU, a FLASH chip is arranged on the PCB 2, and the SPI is in signal connection with the FLASH chip; the MCU comprises a USART1 for realizing debugging output and configuration command input between the MCU and the PC; the MCU also comprises a UART2, a UART3, a UART4 and a UART5, the MCU is in signal connection with the wireless communication module through the UART2, the MCU is in signal connection with the SP3485 through a UART3 and a UART4, and the MCU is in signal connection with the current detection chip through the UART 5;

in other embodiments, the 4G communication module may be replaced by a WIFI module or a ZigBee module.

When the sensor is used specifically, data acquired by a field sensor (the NF53-NTC temperature sensor selected in the embodiment) is transmitted to the SP3485 chip in a wired transmission mode (according to RS485), the SP3485 chip transmits processed signals to the MCU, the MCU transmits the signals to the 4G communication module, and the 4G communication module transmits the signals to the server or an upper computer. Namely, the MCU and the 4G communication module complete the conversion from the signal in the RS485 communication protocol to the signal in the TCP/IP communication protocol, and simultaneously realize the remote transmission of the information in the RS485 (or other communication protocols, as long as the SP3485 chip can execute) communication protocol.

Example two

Compared with the first embodiment, the device is different in that the device also comprises a wireless state display lamp, an operating state display lamp, a serial port reading and writing indicator lamp and a transmitter acquisition condition indicator lamp which are respectively in signal connection with the MCU;

still include communication bottom plate, row needle and row seat, 4G communication module 1 is fixed on the communication bottom plate, arranges the seat and fixes on PCB board 2, arranges the quantity of seat and is two, and two row seats are located 4G communication module 1's both sides respectively, arrange the needle and connect communication bottom plate and PCB board 2. MCU is located the communication bottom plate below on the fixed PCB board 2 of MCU. (as shown in FIG. 2)

Still include the shell, the shell includes preceding curb plate, posterior lateral plate, apron, left side board and right side board, and preceding curb plate and posterior lateral plate have set firmly otic placode 3 respectively, and preceding curb plate, posterior lateral plate, apron and 3 integrated into one piece of otic placode, left side board and right side board are fixed respectively in the both sides of preceding curb plate and posterior lateral plate, and it has through-hole 4 to bore on the otic placode 3. (as shown in FIG. 3)

When the novel serial port display device is used specifically, the through hole 4 can be penetrated through a bolt, the whole product is fixed on the site, the working condition of each serial port can be displayed through the corresponding indicator lamp, and a user can observe the working state of the whole product conveniently.

Through arranging needle and row seat, realized PCB board 2's bilayer structure for there is the clearance between 4G communication module 1 and the MCU. In the production process, the PCB 2 can be partially produced, and then the 4G communication module 1 is installed, so that the production cost can be reduced, and the possibility of damage to the 4G communication module 1 in the production process can be reduced.

The above are only embodiments of the present invention, and the present invention is not limited to the field related to this embodiment, and the common general knowledge of the known specific structures and characteristics in the scheme is not described too much, and those skilled in the art know the common technical knowledge in the technical field of the present invention before the application date or the priority date, can know all the prior art in this field, and have the ability to apply the conventional experimental means before this date, and those skilled in the art can combine their own ability to perfect and implement the scheme, and some typical known structures or known methods should not become the obstacles for those skilled in the art to implement the present application. It should be noted that, for those skilled in the art, without departing from the structure of the present invention, several modifications and improvements can be made, which should also be regarded as the protection scope of the present invention, and these will not affect the effect of the implementation of the present invention and the practicability of the patent. The scope of the claims of the present application shall be determined by the contents of the claims, and the description of the embodiments and the like in the specification shall be used to explain the contents of the claims.

Claims (10)

1. Wireless data acquisition terminal includes: the intelligent power supply comprises an MCU, a wireless communication module, an SP3485 chip, a current detection chip and a PCB, and is characterized in that the MCU is internally provided with an SPI (serial peripheral interface), the PCB is provided with an FLASH chip, and the SPI is in signal connection with the FLASH chip; the MCU comprises a USART1 for realizing debugging output and configuration command input between the MCU and the PC; the MCU also comprises UART2, UART3, UART4 and UART5, the MCU is in signal connection with the wireless communication module through UART2, the MCU is in signal connection with SP3485 through UART3 and UART4, and the MCU is in signal connection with the current detection chip through UART 5.

2. The wireless data acquisition terminal of claim 1, wherein: the wireless communication module is one of a 4G communication module, a WIFI module or a ZigBee module.

3. The wireless data acquisition terminal according to claim 1 or 2, wherein: the wireless communication module is a 4G communication module with an EC200T-CN model.

4. The wireless data acquisition terminal of claim 3, wherein: the MCU is an STM32 series single chip microcomputer.

5. The wireless data acquisition terminal of claim 4, wherein: the wireless state display lamp, the running state display lamp, the serial port reading and writing indicator lamp and the transmitter acquisition condition indicator lamp are respectively in signal connection with the MCU.

6. The wireless data acquisition terminal of claim 5, wherein: still include communication bottom plate, row needle and row seat, 4G communication module fixes on the communication bottom plate, arranges the seat and fixes on the PCB board, arranges the needle and connects communication bottom plate and PCB board.

7. The wireless data acquisition terminal of claim 6, wherein: the MCU is fixed on the PCB and located below the communication bottom plate.

8. The wireless data acquisition terminal of claim 7, wherein: the number of the row seats is two, and the two row seats are respectively positioned on two sides of the 4G communication module.

9. The wireless data acquisition terminal of claim 8, wherein: still include the shell, the bottom of shell has set firmly the otic placode, is provided with the through-hole on the otic placode.

10. The wireless data acquisition terminal of claim 9, wherein: the shell comprises a front side plate, a rear side plate, a cover plate, a left side plate and a right side plate, wherein the front side plate, the rear side plate, the cover plate and an ear plate are integrally formed, and the left side plate and the right side plate are respectively fixed on two sides of the front side plate and the rear side plate.

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