CN212905259U - Insulation test fixture for semiconductor power device - Google Patents
Insulation test fixture for semiconductor power device Download PDFInfo
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- CN212905259U CN212905259U CN202021377721.1U CN202021377721U CN212905259U CN 212905259 U CN212905259 U CN 212905259U CN 202021377721 U CN202021377721 U CN 202021377721U CN 212905259 U CN212905259 U CN 212905259U
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- 238000012360 testing method Methods 0.000 title claims abstract description 34
- 238000009413 insulation Methods 0.000 title claims abstract description 23
- 239000004065 semiconductor Substances 0.000 title claims abstract description 17
- 239000000523 sample Substances 0.000 claims abstract description 33
- 230000007246 mechanism Effects 0.000 claims abstract description 23
- 239000004593 Epoxy Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 2
- 238000001514 detection method Methods 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 238000013522 software testing Methods 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 208000027418 Wounds and injury Diseases 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 208000014674 injury Diseases 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000012956 testing procedure Methods 0.000 description 1
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Abstract
The utility model discloses an insulation test fixture for semiconductor power devices, which comprises a shell, wherein a linear driving mechanism with a vertical downward output end is fixedly arranged at the middle part of the inner side of the shell, a probe card is horizontally and fixedly arranged at the output end of the linear driving mechanism, a bearing plate is arranged at the bottom of the shell through a Y-axis slide rail in a sliding manner, and one end of the Y-axis slide rail extends out of the shell; the bearing plate is provided with an adjusting base for arranging the module, the adjusting base is composed of a mother plate arranged on the bearing plate and capable of horizontally moving and adjusting the position along the Y-axis direction and a daughter plate arranged inside a groove on the upper side of the mother plate in a sliding mode along the X-axis and used for adjusting the position, and an inner groove used for arranging the module is formed in the daughter plate. This test fixture, the test of completion semiconductor power device that can convenient and fast, detection efficiency is high to can adjust terminal and probe contact according to actual test semiconductor power device specification, easy operation, the suitability is stronger.
Description
Technical Field
The utility model belongs to the technical field of test fixture, concretely relates to semiconductor power device insulation test fixture.
Background
In recent years, as the market competition of semiconductor components and devices is more and more intense, the product stability is higher and higher. As a parameter testing procedure, in addition to testing some conventional parameters, the customer also proposes some special test items, one of which is the insulation item. According to the existing method, the insulation is tested by manually matching with a graphic instrument, and then the insulation is tested by using a machine. However, the manual test has the problems of low efficiency, unstable test, and easy human electric shock accidents caused by slightly improper treatment of the test insulation item requiring the application of kilovolt voltage. Therefore, professional insulation test fixtures for semiconductor power devices are put into use in the market.
Promote the probe needle and power device's terminal contact through actuating mechanism, the probe is connected the power negative pole and the loading board is connected the power positive pole, all terminal short circuits of module, carry out insulation test, and in the in-service use, because the specification difference of test power device, the position of terminal is different, in order to guarantee the accurate abundant contact of terminal and probe, need change different loading boards in order to guarantee the terminal can with the accurate stable contact of probe, waste time and energy, resource waste and the cost is increased, so need the pertinence to improve the design.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide an insulating test fixture of semiconductor power device comes into operation to solve the problem that proposes in the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: an insulation test fixture for a semiconductor power device comprises a shell, wherein a linear driving mechanism with an output end facing downwards vertically is fixedly installed in the middle of the inner side of the shell, a probe card is horizontally and fixedly installed at the output end of the linear driving mechanism, a bearing plate is arranged at the bottom of the shell in a sliding mode through a Y-axis sliding rail, and one end of the Y-axis sliding rail extends out of the shell;
the bearing plate is provided with an adjusting base for arranging the module, the adjusting base is composed of a mother plate arranged on the bearing plate and capable of horizontally moving and adjusting the position along the Y-axis direction and a daughter plate arranged inside a groove on the upper side of the mother plate in a sliding mode along the X-axis and used for adjusting the position, and an inner groove used for arranging the module is formed in the daughter plate.
Preferably, waist holes with mutually perpendicular center lines are formed in the edges of the mother board and the daughter board, the center line of the waist hole of the mother board is parallel to the Y-axis slide rail, a bolt penetrates through the waist holes to tightly press the daughter board and the mother board or the mother board and the bearing plate, and the width of the waist hole is consistent with that of the bolt.
Preferably, the end part of the bearing plate is vertically and fixedly provided with a side plate, the side plate is fixedly provided with a handle, and the lower end of the side plate is fixedly provided with a slide rail cover body corresponding to the Y-axis slide rail.
Preferably, the output end of the linear driving mechanism is fixedly installed on the supporting plate, guide rails are symmetrically and fixedly arranged on the lower side of the supporting plate, two ends of the probe plate are arranged on the inner sides of the guide rails in a sliding mode, the guide rails are inserted with positioning pins, and the end portions of the positioning pins penetrate through the side walls of the guide rails and are inserted into the inner sides of the probe plate.
Preferably, the linear driving mechanism is fixedly installed inside the shell through a support, a guide sleeve is fixedly installed on the support, a guide shaft is arranged in the guide sleeve in a sliding mode, and the guide shaft is vertically and fixedly installed on the supporting plate.
Preferably, the bottom of the bearing plate is paved with an insulating plate made of epoxy resin, and the insulating plate is fixedly connected with the movable part of the Y-axis slide rail through an insulating screw.
Preferably, the linear driving mechanism is an air cylinder or an electric push rod.
The utility model discloses a technological effect and advantage: the insulation test fixture for semiconductor power device is provided,
1. through the downthehole bolt of rotatory mother board and daughter board side waist, remove mother board adjustment Y axle direction position, remove daughter board adjustment X axle direction position, convenient and fast's adjustment has adjusted the position of power device on the base, guarantee that the probe can be accurate stable with the terminal contact, labour saving and time saving and practiced thrift the resource, guaranteed detection efficiency.
2. Promote the probe card through sharp actuating mechanism and descend and test with the terminal contact of a plurality of power devices on adjusting the base respectively through many probes for the test process, efficiency of software testing is higher, and the practicality is stronger.
Drawings
Fig. 1 is a schematic structural view of the present invention;
fig. 2 is a schematic structural diagram of the present invention.
In the figure: 1. a housing; 2. a linear drive mechanism; 3. a probe card; 4. a Y-axis slide rail; 5. adjusting the base; 51. a motherboard; 52. a daughter board;
6. a carrier plate; 7. an inner groove; 8. a waist hole; 9. a side plate; 10. a handle; 11. a slide rail cover body; 12. A support plate; 13. a guide rail; 14. positioning pins; 15. a guide shaft; 16. a guide sleeve; 17. an insulating plate.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
The utility model provides an insulation test fixture for semiconductor power devices as shown in figures 1-2, which comprises a shell 1, wherein a linear driving mechanism 2 with a vertical downward output end is fixedly installed in the middle of the inner side of the shell 1, a probe plate 3 is fixedly installed at the output end of the linear driving mechanism 2 horizontally, a bearing plate 6 is arranged at the bottom of the shell 1 through a Y-axis slide rail 4 in a sliding manner, and one end of the Y-axis slide rail 4 extends out of the shell 1;
the bearing plate 6 is provided with an adjusting base 5 for arranging the module, the adjusting base 5 is composed of a mother plate 51 which is arranged on the bearing plate 6 and can be horizontally moved along the Y-axis direction to adjust the position, and a daughter plate 52 which is arranged inside a groove on the upper side of the mother plate 51 in a sliding manner along the X-axis to adjust the position, and an inner groove 7 for arranging the module is formed in the daughter plate 52.
Debugging earlier before the insulation test, pulling out shell 1 along Y axle slide rail 4 with the plummer, in the module that will await measuring was settled daughter board 52's interior ditch groove 7, in pushing into shell 1, drive probe board 3 through linear drive mechanism 2 and drive the probe and descend, observe whether the probe contacts with the terminal accuracy is stable, when not taking place the contact, pull out loading board 6.
The edges of the mother board 51 and the daughter board 52 are provided with the waist holes 8 with the central lines perpendicular to each other, the central line of the waist hole 8 of the mother board 51 is parallel to the Y-axis slide rail 4, the bolt penetrates through the waist hole 8 to press the daughter board 52 and the mother board 51 or press the mother board 51 and the bearing plate 6, and the width of the waist hole 8 is consistent with that of the bolt. Firstly loosening the bolts inserted into the waist holes 8 at two sides of the motherboard 51, the pressing force of the motherboard 51 to the bearing plate 6 disappears, pushing the motherboard 51 to slide and adjust the position on the bearing plate 6 along the Y-axis direction, then loosening the bolts inserted into the waist holes 8 of the daughter board 52, so that the pressing force of the daughter board 52 to the motherboard 51 disappears, pushing the daughter board 52 to slide along the X-axis direction, adjusting the position until the probe can accurately and stably press the terminal to deform the terminal, finally screwing two bolts in sequence, so that the daughter board 52 and the motherboard 51 as well as the motherboard 51 and the bearing plate 6 are pressed tightly, respectively connecting the anode and the cathode of a power supply to the bearing plate 6 and the probe, starting the linear driving mechanism 2 to perform insulation test, and pulling the bearing plate 6 out of the shell 1 along the Y-axis slide rail 4 to adjust the replacement of the power device on the base 5, the test is convenient and rapid, and, the applicability is stronger;
and through the terminal contact of many probes respectively with a plurality of power devices on adjusting the base 5 of drive probe card 3 decline test for the test process, efficiency of software testing is higher, and the practicality is stronger.
The end part of the bearing plate 6 is vertically and fixedly provided with a side plate 9, the side plate 9 is fixedly provided with a handle 10, and the lower end of the side plate 9 is fixedly provided with a slide rail cover body 11 corresponding to the Y-axis slide rail 4. Thereby through pulling handle 10 pulling loading board 6 along the motion of Y axle slide rail 4, more convenient pull out shell 1 with loading board 6 and carry out the change of next group power device to shelter from of test area side through curb plate 9, avoid operating personnel to point to stretch into test area and receive the electric current injury.
The output end of the linear driving mechanism 2 is fixedly arranged on a support plate 12, guide rails 13 are symmetrically and fixedly arranged on the lower side of the support plate 12, two ends of the probe plate 3 are arranged on the inner sides of the guide rails 13 in a sliding mode, positioning pins 14 are inserted into the guide rails 13, the end portions of the positioning pins 14 penetrate through the side walls of the guide rails 13 and are inserted into the inner sides of the probe plate 3, and the positioning pins 14 are pulled out, so that the probe plate 3 is pulled out along the guide rails 13, the probe is convenient to replace, the linear driving mechanism is suitable for power devices of various specifications and models, and the.
The linear driving mechanism 2 is fixedly arranged inside the shell 1 through a support, a guide sleeve 16 is fixedly arranged on the support, a guide shaft 15 is arranged in the guide sleeve 16 in a sliding mode, and the guide shaft 15 is vertically and fixedly arranged on the supporting plate 12. In the process of driving the probe card 3 to descend, the guide shaft 15 slides inside the guide sleeve 16, thereby ensuring the stability of the descending of the probe card 3 and avoiding the situation that the probe card 3 is inclined and deformed after the probe is stressed.
The bottom of loading board 6 is laid the insulation board 17 of one deck epoxy material, and insulation board 17 passes through insulating screw and the movable part fixed connection of Y axle slide rail 4. High insulating nature epoxy and insulating screw have avoided the high pressure risk that brings when loading board 6 circular telegram.
The linear driving mechanism 2 is a cylinder or an electric push rod.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications and variations can be made in the embodiments or in part of the technical features of the embodiments without departing from the spirit and the scope of the invention.
Claims (7)
1. The utility model provides an insulating test fixture of semiconductor power device, includes shell (1), the middle part fixed mounting of shell (1) inboard has vertical sharp actuating mechanism (2) down of output, the horizontal fixed mounting of output of sharp actuating mechanism (2) has probe card (3), its characterized in that: a bearing plate (6) is arranged at the bottom of the shell (1) in a sliding mode through a Y-axis sliding rail (4), and one end of the Y-axis sliding rail (4) extends out of the shell (1);
the bearing plate (6) is provided with an adjusting base (5) for arranging the module, the adjusting base (5) is composed of a mother plate (51) which is arranged on the bearing plate (6) and can be adjusted in a translation mode along the Y-axis direction, and a daughter plate (52) which is arranged inside a groove in the upper side of the mother plate (51) in a sliding mode along the X-axis and is adjusted in a sliding mode, and an inner groove (7) for arranging the module is formed in the daughter plate (52).
2. The insulation test fixture for semiconductor power devices according to claim 1, wherein: waist holes (8) with mutually vertical center lines are formed in the edges of the mother board (51) and the daughter board (52), the center line of each waist hole (8) of the mother board (51) is parallel to the Y-axis slide rail (4), a bolt penetrates through each waist hole (8) to press the daughter board (52) and the mother board (51) or press the mother board (51) and the bearing plate (6), and the width of each waist hole (8) is consistent with that of the bolt.
3. The insulation test fixture for semiconductor power devices according to claim 2, wherein: the end part of the bearing plate (6) is vertically and fixedly provided with a side plate (9), the side plate (9) is fixedly provided with a handle (10), and the lower end of the side plate (9) is fixedly provided with a slide rail cover body (11) corresponding to the Y-axis slide rail (4).
4. The insulation test fixture for semiconductor power devices according to claim 1, wherein: the probe board fixing device is characterized in that the output end of the linear driving mechanism (2) is fixedly arranged on a supporting plate (12), guide rails (13) are symmetrically and fixedly arranged on the lower side of the supporting plate (12), two ends of the probe board (3) are arranged on the inner sides of the guide rails (13) in a sliding mode, positioning pins (14) are inserted into the guide rails (13), and the end portions of the positioning pins (14) penetrate through the side walls of the guide rails (13) and are inserted into the inner sides of the probe board (3).
5. The insulation test fixture for semiconductor power devices according to claim 4, wherein: the linear driving mechanism (2) is fixedly arranged inside the shell (1) through a support, a guide sleeve (16) is fixedly arranged on the support, a guide shaft (15) is arranged in the guide sleeve (16) in a sliding mode, and the guide shaft (15) is vertically and fixedly arranged on the supporting plate (12).
6. The tool of any one of claims 1-5, wherein: the bottom of loading board (6) is laid insulation board (17) of one deck epoxy material, and insulation board (17) are through insulating screw and the movable part fixed connection of Y axle slide rail (4).
7. The tool of any one of claims 1-5, wherein: the linear driving mechanism (2) is a cylinder or an electric push rod.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021377721.1U CN212905259U (en) | 2020-07-14 | 2020-07-14 | Insulation test fixture for semiconductor power device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021377721.1U CN212905259U (en) | 2020-07-14 | 2020-07-14 | Insulation test fixture for semiconductor power device |
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| Publication Number | Publication Date |
|---|---|
| CN212905259U true CN212905259U (en) | 2021-04-06 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021377721.1U Active CN212905259U (en) | 2020-07-14 | 2020-07-14 | Insulation test fixture for semiconductor power device |
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| Country | Link |
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| CN (1) | CN212905259U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113109357A (en) * | 2021-04-09 | 2021-07-13 | 徐州盛科半导体科技有限公司 | Detachable semiconductor analysis device |
-
2020
- 2020-07-14 CN CN202021377721.1U patent/CN212905259U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113109357A (en) * | 2021-04-09 | 2021-07-13 | 徐州盛科半导体科技有限公司 | Detachable semiconductor analysis device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Anhui Xingtai Financial Leasing Co.,Ltd. Assignor: Hefei Zhongheng Micro Semiconductor Co.,Ltd. Contract record no.: X2022980017557 Denomination of utility model: Insulation test fixture for semiconductor power devices Granted publication date: 20210406 License type: Exclusive License Record date: 20221009 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Insulation test fixture for semiconductor power devices Effective date of registration: 20221010 Granted publication date: 20210406 Pledgee: Anhui Xingtai Financial Leasing Co.,Ltd. Pledgor: Hefei Zhongheng Micro Semiconductor Co.,Ltd. Registration number: Y2022980017833 |
|
| PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20231115 Granted publication date: 20210406 Pledgee: Anhui Xingtai Financial Leasing Co.,Ltd. Pledgor: Hefei Zhongheng Micro Semiconductor Co.,Ltd. Registration number: Y2022980017833 |
|
| EC01 | Cancellation of recordation of patent licensing contract | ||
| EC01 | Cancellation of recordation of patent licensing contract |
Assignee: Anhui Xingtai Financial Leasing Co.,Ltd. Assignor: Hefei Zhongheng Micro Semiconductor Co.,Ltd. Contract record no.: X2022980017557 Date of cancellation: 20231129 |