CN212860595U - Precision forming die convenient to location - Google Patents
Precision forming die convenient to location Download PDFInfo
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- CN212860595U CN212860595U CN202020890980.8U CN202020890980U CN212860595U CN 212860595 U CN212860595 U CN 212860595U CN 202020890980 U CN202020890980 U CN 202020890980U CN 212860595 U CN212860595 U CN 212860595U
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Abstract
The application provides a precision forming die convenient to position, which comprises an upper die base, a lower die base, a buffer mechanism and a guide mechanism; the top end of the lower die base is provided with a lower die plate, the top end of the lower die plate is provided with a die body, and a cavity is formed in the die body; an upper die plate is arranged at the bottom end of the upper die base, and a pressing plate is fixedly arranged at the bottom end of the upper die plate corresponding to the die cavity; the buffer body is arranged at the top end of the lower die base and positioned at two sides of the lower die plate, the upper end part of the buffer body is provided with a buffer slot, and the connecting plate is connected with the bottom of the buffer slot through a buffer spring; the buffer plates are arranged on two sides of the bottom of the upper die base corresponding to the buffer grooves; the guide bodies are arranged at four corners of the top of the lower die base, and guide grooves are formed in the guide bodies; the guide device is arranged at four corners of the top of the bottom of the upper die base corresponding to the guide grooves, so that the guide device can extend into the bottom of the guide grooves. The application provides a pair of precision moulding mould convenient to location, the compound die, the die sinking process of being convenient for, the location and the location buffering of being convenient for have very big popularization nature.
Description
Technical Field
The present disclosure relates generally to precision forming dies, and more particularly to a precision forming die with easy positioning.
Background
The forming die is a die which is manufactured according to the shape and the structure of an object in proportion, and the material is formed into a tool with a certain shape by a pressing or pouring method.
The guide structure is used for the location between upper die base and the die holder in actual production process, therefore guide structure often also influences forming die's precision, simultaneously in actual production process, often through set up buffer structure in forming die, avoids the suppression process to damage the mould body.
However, in the prior art, the guide structure realizes the positioning function through the guide posts and the guide grooves, so that the phenomenon that the guide posts of the upper die holder are clamped at the edges of the guide grooves of the lower die holder occurs in use, and certain damage is easily caused to the die; meanwhile, the buffer structure in the traditional mode realizes the buffer effect through the buffer spring between the upper die base and the lower die base, and the buffer spring is exposed outside and does not have foreign object support, so that the buffer structure is poor in buffer effect and easy to cause dislocation damage.
Disclosure of Invention
In view of the above-mentioned defects or shortcomings in the prior art, it is desirable to provide a precision forming die convenient for positioning, which has good guidance quality, is not easy to damage and has a good buffering effect.
The utility model provides a precision forming die convenient to location, include: comprises an upper die holder, a lower die holder, a buffer mechanism and a guide mechanism;
the top end of the lower die base is fixedly provided with a lower die plate, the top end of the lower die plate is fixedly provided with a die body, and a cavity is formed in the die body; an upper die plate is fixedly installed at the bottom end of the upper die base, and a pressing plate is fixedly installed at the bottom end of the upper die plate corresponding to the die cavity;
the buffer mechanism includes: the connecting plate, the buffer body and the buffer plate; the buffer body is arranged at the top end of the lower die base and positioned at two sides of the lower die plate, a buffer groove is formed in the upper end of the buffer body, and the connecting plate is fixedly connected with the bottom of the buffer groove through a buffer spring; the buffer plates are arranged on two sides of the bottom of the upper die base corresponding to the buffer grooves, so that the buffer plates can enter the buffer grooves to be in contact with the connecting plate;
the guide mechanism includes: a guide device and a guide body; the guide bodies are arranged at four corners of the top of the lower die base, and guide grooves are formed in the guide bodies; the guide device is arranged at four corners of the top of the bottom of the upper die base corresponding to the guide groove, so that the guide device can extend into the bottom of the guide groove.
According to the technical scheme provided by the embodiment of the application, the guide device comprises a first guide column and a second guide column; the first guide columns are arranged at four corners of the upper die holder, and the second guide columns are arranged at the bottoms of the first guide columns; the second guide post and the second guide post are both in a truncated cone structure; the inner diameter of the first guide post is larger than that of the second guide post; the guide groove is provided with a first groove and a second groove corresponding to the guide device.
According to the technical scheme provided by the embodiment of the application, two second guide posts are installed at the bottom of each first guide post; two second grooves are correspondingly arranged at the bottom of each first groove.
According to the technical scheme provided by the embodiment of the application, the guide device and the upper die base are integrally cast.
According to the technical scheme provided by the embodiment of the application, the anti-abrasion pad is installed on the connecting plate.
According to the technical scheme provided by the embodiment of the application, the anti-abrasion pad is installed on the connecting plate.
The utility model discloses the advantage:
in the process of compound die, owing to be provided with buffer gear, when the upper die base pushed down, the buffer board of upper die base bottom installation entered into the buffering body through the dashpot, because the dashpot bottom is connected with the connecting plate through buffer spring for the buffer board pushes down the connecting plate, realizes the effect of location buffering. This buffer gear passes through the cooperation of buffer board, buffer spring, connecting plate, and the difficult spring dislocation that appears leads to the damage of bolster.
Meanwhile, as the four corners of the upper die base are provided with the guide devices and the four corners of the lower die base are correspondingly provided with the guide grooves, the guide devices can enter the guide grooves to be positioned in the process of pressing the upper die base, and the positioning precision is ensured.
Further, the guide device comprises a first guide post and a second guide post which are in a truncated cone structure, the inner diameter of the first guide post is larger than that of the second guide post, and the guide groove is provided with a first groove and a second groove corresponding to the guide device; therefore, in the positioning process, the first guide column and the second guide column are in the truncated cone structures, so that the guide device can easily enter the guide groove for positioning, and the guide device is prevented from being clamped on the edge of the guide groove; simultaneously, through the second guide post that sets up in first guide post bottom for fix a position more accurately at the location in-process, positioning error is less.
Drawings
Other features, objects and advantages of the present application will become more apparent upon reading of the following detailed description of non-limiting embodiments thereof, made with reference to the accompanying drawings in which:
fig. 1 is a schematic front view of a precision forming mold for facilitating positioning according to the present application;
FIG. 2 is a schematic side view of the precision forming mold shown in FIG. 1;
FIG. 3 is a schematic structural view of the upper die holder shown in FIG. 1;
FIG. 4 is a schematic structural view of the lower die holder shown in FIG. 1;
reference numbers in the figures:
1. an upper die holder; 2. a lower die holder; 3. mounting a template; 4. a lower template; 5. a mold body; 6. a cavity; 7. an anti-wear pad; 8. pressing a plate; 9. a connecting plate; 10. a buffer body; 11. a buffer plate; 12. a buffer tank; 13. a buffer spring; 14. a guide device; 15. a guide body; 16. a guide groove; 17. a first guide post; 18. a second guide body; 19. a first groove; 20. a second groove;
Detailed Description
The present application will be described in further detail with reference to the following drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the relevant invention and not restrictive of the invention. It should be noted that, for convenience of description, only the portions related to the present invention are shown in the drawings.
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present application will be described in detail below with reference to the embodiments with reference to the attached drawings.
Example 1
Please refer to fig. 1, which is a schematic view of a front view structure of a precision forming mold convenient for positioning, including an upper mold base 1, a lower mold base 2, a buffering mechanism, and a guiding mechanism;
a lower template 4 is fixedly installed at the top end of the lower die holder 2, as shown in fig. 2, a die body 5 is fixedly installed at the top end of the lower template 4, and a cavity 6 is formed in the die body 5; an upper template 3 is fixedly installed at the bottom end of the upper die holder 1, and a pressing plate 8 is fixedly installed at the bottom end of the upper template 3 corresponding to the cavity 6;
the buffer mechanism includes: a connecting plate 9, a buffer body 10 and a buffer plate 11; the buffer body 10 is mounted at the top end of the lower die holder 2 and located on two sides of the lower die plate 4, a buffer groove 12 is formed in the upper end of the buffer body 10, and the connecting plate 9 is fixedly connected with the bottom of the buffer groove 12 through a buffer spring 13; the buffer plates 11 are arranged at two sides of the bottom of the upper die holder 1 corresponding to the buffer grooves 12, so that the buffer plates 11 can enter the buffer grooves 12 to be in contact with the connecting plate 9;
as shown in fig. 3 and 4, the guide mechanism includes: a guide 14 and a guide body 15; the guide bodies 15 are arranged at four corners of the top of the lower die base 2, and guide grooves 16 are formed in the guide bodies 15; the guide devices 14 are mounted at four corners of the top of the bottom of the upper die holder 1 corresponding to the guide grooves 16, so that the guide devices 14 can extend into the bottoms of the guide grooves 16.
In the process of die assembly, owing to be provided with buffer gear, when upper die base 1 pushed down, buffer board 11 of 1 bottom installation of upper die base entered into buffering body 10 through buffer slot 12, because buffer slot 12 bottom is connected with connecting plate 9 through buffer spring 13 for buffer board 10 pushes down connecting plate 9, realizes the effect of location buffering. This buffer gear passes through the cooperation of buffer plate 11, buffer spring 13, connecting plate 9, and the difficult spring dislocation that appears leads to the damage of bolster.
The bottom end of the upper template 3 is fixedly provided with a pressing plate 8 corresponding to the cavity 6, and after the die assembly is completed, the pressing plate 8 is matched with the cavity 6, so that the material in the cavity can be conveniently molded.
Meanwhile, as the four corners of the upper die base 1 are provided with the guide devices, and the four corners of the lower die base 2 are correspondingly provided with the guide grooves 16, in the process of pressing down the upper die base 1, the guide devices can enter the guide grooves 16 for positioning, so that the positioning precision is ensured.
Preferably, in order to enhance the structural stability and precision of the mold, the buffer plate 11 and the upper mold base 1 may be integrally cast, and the lower mold base 2 and the buffer body 10 may be integrally cast.
Preferably, in order to enhance the buffering effect, a plurality of buffering springs 13 may be used, for example, as shown in fig. 1, two buffering springs 13 may be installed in each buffering body 10.
In a preferred embodiment of the guide device 14, as shown in fig. 3 and 4, the guide device 14 includes a first guide post 17 and a second guide post 18; the first guide columns 17 are arranged at four corners of the upper die holder 1, the second guide columns 18 are arranged at the bottoms of the first guide columns 17, and the second guide columns 18 are in truncated cone structures; the inner diameter of the first guide post 17 is larger than that of the second guide post 18; the guide groove 16 has a first groove 19 and a second groove 20 corresponding to the guide device 14; a second groove 20 is formed at the bottom of the first groove 19; the first groove 19 and the second groove 20 are both in a truncated cone structure.
During the positioning process, the first guide column 17 and the second guide column 18 have the truncated cone structures, so that the guide device 14 can easily enter the guide groove 16 for positioning, and the guide device 14 is prevented from being clamped at the edge of the guide groove 16; meanwhile, the second guide post 18 is arranged at the bottom of the first guide post 17, so that the positioning is more accurate in the positioning process, and the positioning error is smaller.
In the preferred embodiment of the guide device 14, two second guide posts 18 are mounted at the bottom of each first guide post 17; two second grooves 20 are correspondingly arranged at the bottom of each first groove 19.
In a preferred embodiment of the guide device 14, the guide device 14 and the upper die holder 1 are integrally cast.
The guide device 14 and the upper die base 1 are integrally cast, compared with welding or other fixing modes, the integral casting structure is stable, errors can be reduced, when the upper die base 1 is pressed downwards, the guide device 14 can smoothly and more fittingly enter the guide groove, and the problem that a welding part cannot enter the guide groove to influence a production process under the welding mode is avoided.
Wherein, in the preferred embodiment of the connecting plate 9, an anti-wear pad 7 is mounted on the connecting plate 9.
Because in the actual production process, need frequent compound die and die sinking for buffer plate 11 need often contact with connecting plate 9 compression in the buffer 10, install abrasionproof pad 7 on connecting plate 9 can effectively guarantee that wearing and tearing are less, prevents that connecting plate 9 from wearing and tearing seriously, influences the compound die.
In a preferred embodiment of the buffer board 11, the buffer board 11 is a lightweight PVC board.
The buffer plate 11 is made of light PCV plate, so that the weight of the device can be reduced, and the device has the advantages of light weight, heat insulation, flame retardance, corrosion resistance and the like.
The above description is only a preferred embodiment of the application and is illustrative of the principles of the technology employed. It will be appreciated by a person skilled in the art that the scope of the invention as referred to in the present application is not limited to the embodiments with a specific combination of the above-mentioned features, but also covers other embodiments with any combination of the above-mentioned features or their equivalents without departing from the inventive concept. For example, the above features may be replaced with (but not limited to) features having similar functions disclosed in the present application.
Claims (6)
1. The utility model provides a precision molding mould convenient to location which characterized in that: comprises an upper die holder (1), a lower die holder (2), a buffer mechanism and a guide mechanism;
a lower template (4) is fixedly installed at the top end of the lower die holder (2), a die body (5) is fixedly installed at the top end of the lower template (4), and a cavity (6) is formed in the die body (5); an upper template (3) is fixedly installed at the bottom end of the upper die holder (1), and a pressing plate (8) is fixedly installed at the bottom end of the upper template (3) corresponding to the cavity (6);
the buffer mechanism includes: a connecting plate (9), a buffer body (10) and a buffer plate (11); the buffer body (10) is mounted at the top end of the lower die holder (2) and positioned at two sides of the lower die plate (4), a buffer groove (12) is formed in the upper end of the buffer body (10), and the connecting plate (9) is fixedly connected with the bottom of the buffer groove (12) through a buffer spring (13); the buffer plates (11) are arranged on two sides of the bottom of the upper die holder (1) corresponding to the buffer grooves (12), so that the buffer plates (11) can enter the buffer grooves (12) to be in contact with the connecting plate (9);
the guide mechanism includes: a guide device (14) and a guide body (15); the guide bodies (15) are arranged at four corners of the top of the lower die base (2), and guide grooves (16) are formed in the guide bodies (15); the guide devices (14) are arranged at four corners of the top of the bottom of the upper die base (1) corresponding to the guide grooves (16), so that the guide devices (14) can extend into the bottoms of the guide grooves (16).
2. A precision forming die convenient for positioning according to claim 1, wherein: the guide device (14) comprises a first guide post (17) and a second guide post (18); the first guide columns (17) are arranged at four corners of the upper die holder (1), and the second guide columns (18) are arranged at the bottoms of the first guide columns (17); the second guide column (18) and the second guide column (18) are in a truncated cone structure; the inner diameter of the first guide column (17) is larger than that of the second guide column (18); the guide groove (16) has a first recess (19) and a second recess (20) corresponding to the guide means (14).
3. A precision forming die convenient for positioning according to claim 2, wherein: two second guide columns (18) are mounted at the bottom of each first guide column (17); two second grooves (20) are correspondingly arranged at the bottom of each first groove (19).
4. A precision forming die convenient for positioning according to claim 1, wherein: the guide device (14) and the upper die holder (1) are integrally cast.
5. A precision forming die convenient for positioning according to claim 1, wherein: and an anti-abrasion pad (7) is arranged on the connecting plate (9).
6. A precision forming die convenient for positioning according to claim 1, wherein: the buffer plate (11) is a light PVC plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020890980.8U CN212860595U (en) | 2020-05-25 | 2020-05-25 | Precision forming die convenient to location |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020890980.8U CN212860595U (en) | 2020-05-25 | 2020-05-25 | Precision forming die convenient to location |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212860595U true CN212860595U (en) | 2021-04-02 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020890980.8U Active CN212860595U (en) | 2020-05-25 | 2020-05-25 | Precision forming die convenient to location |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212860595U (en) |
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2020
- 2020-05-25 CN CN202020890980.8U patent/CN212860595U/en active Active
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| TR01 | Transfer of patent right |
Effective date of registration: 20210825 Address after: 518000 Yuanmabu Community, Xixiang Street, Baoan District, Shenzhen City, Guangdong Province Patentee after: SHENZHEN XIEHEHUI HARDWARE PRODUCTS Co.,Ltd. Address before: 065300 zhaipo Village section, qigezhuang Town, Dachang Hui Autonomous County, Langfang City, Hebei Province Patentee before: Zhengzhong mould precision manufacturing (Langfang) Co.,Ltd. |