CN212752764U

CN212752764U - Circuit board hot air solder leveling die carrier

Info

Publication number: CN212752764U
Application number: CN202021893094.7U
Authority: CN
Inventors: 不公告发明人
Original assignee: Jiangsu Success Circuits Co ltd
Current assignee: Jiangsu Success Circuits Co ltd
Priority date: 2020-09-03
Filing date: 2020-09-03
Publication date: 2021-03-19
Anticipated expiration: 2030-09-03

Abstract

The utility model discloses a circuit board hot air solder leveling die carrier, including the activity roof, the equal fixed mounting in bottom left and right sides of activity roof has reset spring, reset spring's bottom fixed mounting has first joint frame, the inside movable mounting in the left and right sides of first joint frame has the side horizontal pole, the other end fixed mounting of side horizontal pole has fixed mounting panel, fixed mounting panel's top movable mounting has the rebound piece. This circuit board tin spraying die carrier, activity roof can kick-back from top to bottom, can fasten the circuit board of variation in size when the block circuit board, has increased the application scope of this die carrier, can adjust the pole through pegging graft between first joint frame and the second joint frame and carry out the regulation of height, can further increase the application scope of this die carrier to the bottom inserted bar can be pegged graft each other with other positions such as desktop, has increased the upright steadiness when this die carrier uses.

Description

Circuit board hot air solder leveling die carrier

Technical Field

The utility model relates to a circuit board tin spraying technology field specifically is a circuit board tin spraying die carrier.

Background

The working principle of the tin spraying is that the redundant solder on the surface and in the hole of the printed circuit board is removed by hot air, and the residual solder is uniformly covered on the welding disc, the line of the unimpeded solder and the surface packaging point, so that the circuit board enables the circuit to be miniaturized and visualized, and plays an important role in the mass production of fixed circuits and the optimization of the layout of electrical appliances.

However, when the existing circuit board is subjected to tin spraying, the surface of the existing circuit board cannot be rapidly cooled so as to improve the bonding speed of the tin spraying, and meanwhile, the general circuit board cannot be accurately mounted according to different sizes when being used for tin spraying, so that the tin spraying uniformity of the circuit board is not favorably improved, and meanwhile, the tin spraying range of the circuit board is also reduced.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a circuit board hot air solder leveling die carrier to current circuit board when carrying out the hot air solder leveling among the above-mentioned background art of solution, its surface can not rapid cooling, is used for improving the swift speed of bonding of hot air solder leveling, and general circuit board still can not be according to the size of difference to its accurate installation when the hot air solder leveling uses simultaneously, is unfavorable for improving the hot air solder leveling homogeneity of circuit board, has still reduced the problem of circuit board hot air solder leveling scope simultaneously.

In order to achieve the above object, the utility model provides a following technical scheme: a circuit board tin spraying die carrier comprises a movable top plate, wherein reset springs are fixedly mounted on the left side and the right side of the bottom end of the movable top plate, a first clamping frame is fixedly mounted at the bottom end of each reset spring, side cross rods are movably mounted in the left side and the right side of each first clamping frame, a fixed mounting plate is fixedly mounted at the other end of each side cross rod, a rebound block is movably mounted at the top end of each fixed mounting plate, an inserting and connecting adjusting rod is movably mounted in the bottom end of each first clamping frame, a second clamping frame is movably mounted outside the bottom end of each inserting and connecting adjusting rod, bottom inserting rods are fixedly mounted on the left side and the right side of the bottom end of each second clamping frame, a sleeve block is movably mounted outside each inserting and connecting adjusting rod, an opening and closing rod is movably connected to the top end of each sleeve block, a cleaning head is fixedly mounted at the bottom, and the upper end and the lower end of the inside of the connecting back plate are fixedly provided with rotary fans.

Preferably, the movable top plate is designed in an L shape, the movable top plate is integrally connected with the return springs, and the number of the return springs is two.

Preferably, first joint frame all establishes elastic connection for the cover with the grafting regulation pole with second joint frame, the design of second joint frame for the L font, second joint frame is connected as an organic whole with the bottom inserted bar, the design of bottom inserted bar bottom for coniform.

Preferably, the side horizontal pole is elastic connection with the activity roof, the quantity that the side horizontal pole set up is two, fixed mounting board is elastic connection with the resilience piece.

Preferably, the nest block is established for the cover with the grafting regulation pole and is connected, the nest block is connected for the pivot with the pole that opens and shuts, the quantity that the cleaning head set up is three, and three cleaning head is equidistant design.

Preferably, the connection back plate is integrally connected with the first clamping frame, and the number of the rotary fans is two.

Compared with the prior art, the beneficial effects of the utility model are that: the circuit board tin spraying die carrier has the advantages that the movable top plate can rebound up and down, circuit boards with different sizes can be fastened when the circuit boards are clamped, the application range of the die carrier is enlarged, the height of the first clamping frame and the second clamping frame can be adjusted through the inserting adjusting rod, the application range of the die carrier can be further enlarged, the bottom inserting rod can be inserted into other positions such as a desktop, the vertical stability of the die carrier during use is improved, the side cross rods are symmetrical to each other on the left side and the right side, the mounting of clamping connecting wires is facilitated, the rebound blocks can rebound, the stabilizing effect of the circuit boards during tin spraying can be further guaranteed, the sleeve blocks can move up and down, after tin spraying is completed, the opening and closing rods can rotate to utilize the cleaning heads to clean the surfaces of the circuit boards, the improvement of the finished product rate after tin spraying is guaranteed, and the connecting back plates can be fixedly mounted, and the rotary fan can blow air at the back of the circuit board, so that the temperature of the circuit board after tin spraying is reduced, and the practicability of the die carrier is increased.

Drawings

FIG. 1 is an overall structure diagram of the present invention;

FIG. 2 is a front view of the present invention;

FIG. 3 is a side view of the present invention;

fig. 4 is a top view structural diagram of the present invention.

In the figure: 1. a movable top plate; 2. a return spring; 3. a first clamping frame; 4. a lateral cross bar; 5. fixing the mounting plate; 6. a rebound block; 7. inserting and connecting an adjusting rod; 8. a second clamping frame; 9. a bottom end inserted rod; 10. sleeving blocks; 11. an opening and closing lever; 12. cleaning the head; 13. connecting the back plate; 14. the fan is rotated.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-4, the present invention provides a technical solution: a circuit board tin spraying die carrier comprises a movable top plate 1, wherein reset springs 2 are fixedly arranged on the left side and the right side of the bottom end of the movable top plate 1, a first clamping frame 3 is fixedly arranged at the bottom end of each reset spring 2, side cross rods 4 are movably arranged in the left side and the right side of the first clamping frame 3, a fixed mounting plate 5 is fixedly arranged at the other end of each side cross rod 4, a rebound block 6 is movably arranged at the top end of each fixed mounting plate 5, an inserting and adjusting rod 7 is movably arranged in the bottom end of the first clamping frame 3, a second clamping frame 8 is movably arranged on the outer side of the bottom end of each inserting and adjusting rod 7, bottom inserting rods 9 are fixedly arranged on the left side and the right side of the bottom end of each second clamping frame 8, a sleeve block 10 is movably arranged on the outer side of each inserting and adjusting rod 7, an opening and closing rod 11 is movably connected to the top end of each, the upper end and the lower end of the inside of the connecting back plate 13 are both fixedly provided with a rotary fan 14.

The utility model discloses in: the movable top plate 1 is designed in an L shape, the movable top plate 1 is integrally connected with the return springs 2, and the number of the return springs 2 is two; the movable top plate 1 can rebound up and down, circuit boards with different sizes can be fastened when the circuit boards are clamped, and the application range of the die carrier is enlarged.

The utility model discloses in: the first clamping frame 3 and the second clamping frame 8 are elastically connected with the inserting adjusting rod 7 in a sleeved mode, the second clamping frame 8 is in an L-shaped design, the second clamping frame 8 is integrally connected with the bottom end inserting rod 9, and the bottom end of the bottom end inserting rod 9 is in a conical design; the height of the first clamping frame 3 and the height of the second clamping frame 8 can be adjusted through the inserting adjusting rod 7, the application range of the die carrier can be further enlarged, the bottom inserting rod 9 can be inserted into other positions such as a table top, and the vertical stability of the die carrier during use is improved.

The utility model discloses in: the side cross rods 4 are elastically connected with the movable top plate 1, the number of the side cross rods 4 is two, and the fixed mounting plate 5 is elastically connected with the rebound block 6; the side horizontal pole 4 is in the mutual symmetry of left and right sides, is favorable to the installation of block connecting wire to the rebound piece 6 can kick-back, can further guarantee the stable effect of circuit board when the tin spraying.

The utility model discloses in: the sleeve block 10 is connected with the inserting adjusting rod 7 in a sleeved mode, the sleeve block 10 is connected with the opening and closing rod 11 through a rotating shaft, the number of the cleaning heads 12 is three, and the three cleaning heads 12 are designed to be equidistant; the sleeve block 10 can move up and down, after tin spraying is completed, the opening and closing rod 11 can rotate to clean the surface of the circuit board by using the cleaning head 12, and the improvement of the finished product rate of the circuit board after tin spraying is guaranteed.

The utility model discloses in: the connecting back plate 13 is integrally connected with the first clamping frame 3, and the number of the rotary fans 14 is two; the connection back plate 13 can be fixedly installed, the rotary fan 14 can blow air at the back of the circuit board, the temperature of the circuit board after tin spraying is reduced, and the practicability of the die carrier is increased.

The working principle is as follows: when the die carrier is used, the bottom inserting rod 9 is inserted and installed in a position where tin spraying is convenient in advance, the vertical stability of the whole die carrier is guaranteed, firstly, a circuit board to be installed needs to be clamped and installed inside the whole die carrier, the movable top plate 1 on the top end and the bottom end of the second clamping frame 8 can be clamped and installed on the upper end and the lower end of the circuit board, the installation stability of the circuit board is guaranteed, meanwhile, the rebounding blocks 6 on the two sides of the device can be clamped and installed on the circuit board, the stable installation effect of the circuit board is further guaranteed, tin spraying can be normally conducted on the surface of the circuit board, the in-process is completed, the rotary fan 14 on the back can blow the circuit board, normal cooling of the circuit board is facilitated, the cleaning head 12 can be rotated.

In summary, the following steps: the circuit board tin spraying die carrier has the advantages that the movable top plate 1 can rebound up and down, circuit boards with different sizes can be fastened when the circuit boards are clamped, the application range of the die carrier is enlarged, the height between the first clamping frame 3 and the second clamping frame 8 can be adjusted through the inserting adjusting rod 7, the application range of the die carrier can be further enlarged, the bottom inserting rod 9 can be inserted with other parts such as a table top, the vertical stability of the die carrier when in use is increased, the side cross rods 4 are symmetrical on the left side and the right side, the clamping connecting wires can be favorably installed, the rebound blocks 6 can rebound, the stabilizing effect of the circuit boards during tin spraying can be further guaranteed, the sleeve blocks 10 can move up and down, after the tin spraying is finished, the opening and closing rods 11 can rotate to clean the surfaces of the circuit boards by using the cleaning heads 12, and the yield of the circuit boards after the tin spraying is guaranteed, the connection back plate 13 can be fixedly installed, the rotary fan 14 can blow air at the back of the circuit board, the temperature of the circuit board after tin spraying is reduced, and the practicability of the die carrier is increased.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a circuit board hot air solder leveling die carrier, includes movable top plate (1), its characterized in that: the bottom left and right sides of the movable top plate (1) are fixedly provided with reset springs (2), the bottom of the reset springs (2) is fixedly provided with a first clamping frame (3), the inside of the left and right sides of the first clamping frame (3) is movably provided with side cross rods (4), the other end of each side cross rod (4) is fixedly provided with a fixed mounting plate (5), the top end of each fixed mounting plate (5) is movably provided with a rebound block (6), the bottom inside of the first clamping frame (3) is movably provided with an inserting and adjusting rod (7), the bottom outer side of each inserting and adjusting rod (7) is movably provided with a second clamping frame (8), the bottom left and right sides of each second clamping frame (8) are fixedly provided with bottom inserting rods (9), the outer side of each inserting and adjusting rod (7) is movably provided with a sleeve block (10), and the top end of each sleeve block (10) is movably connected with an opening and, the bottom fixed mounting that opens and shuts pole (11) has cleaning head (12), the inner wall department fixed mounting of first joint frame (3) has connection backplate (13), the equal fixed mounting in both ends has rotatory fan (14) about the inside of connection backplate (13).

2. The circuit board tin spraying mold frame of claim 1, wherein: the movable top plate (1) is in an L-shaped design, the movable top plate (1) is integrally connected with the reset springs (2), and the number of the reset springs (2) is two.

3. The circuit board tin spraying mold frame of claim 1, wherein: elastic connection is established for the cover to first joint frame (3) and second joint frame (8) all with grafting regulation pole (7), second joint frame (8) are the design of L font, second joint frame (8) are connected with bottom inserted bar (9) as an organic whole, bottom inserted bar (9) bottom is coniform design.

4. The circuit board tin spraying mold frame of claim 1, wherein: the side cross rods (4) are elastically connected with the movable top plate (1), the number of the side cross rods (4) is two, and the fixed mounting plate (5) is elastically connected with the rebound block (6).

5. The circuit board tin spraying mold frame of claim 1, wherein: the cleaning machine is characterized in that the sleeve block (10) is connected with the inserting adjusting rod (7) in a sleeved mode, the sleeve block (10) is connected with the opening and closing rod (11) in a rotating mode, the number of the cleaning heads (12) is three, and the three cleaning heads (12) are designed equidistantly.

6. The circuit board tin spraying mold frame of claim 1, wherein: connect backplate (13) and first joint frame (3) as an organic whole and be connected, the quantity that rotatory fan (14) set up is two.