CN212692659U - Composite insulation board and heat storage equipment - Google Patents
Composite insulation board and heat storage equipment Download PDFInfo
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- CN212692659U CN212692659U CN202021771755.9U CN202021771755U CN212692659U CN 212692659 U CN212692659 U CN 212692659U CN 202021771755 U CN202021771755 U CN 202021771755U CN 212692659 U CN212692659 U CN 212692659U
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- insulation board
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- 238000009413 insulation Methods 0.000 title claims abstract description 79
- 239000002131 composite material Substances 0.000 title claims abstract description 36
- 238000005338 heat storage Methods 0.000 title claims abstract description 15
- 239000000835 fiber Substances 0.000 claims abstract description 48
- 229920002379 silicone rubber Polymers 0.000 claims abstract description 14
- 239000012790 adhesive layer Substances 0.000 claims description 19
- 239000010410 layer Substances 0.000 claims description 18
- 239000004945 silicone rubber Substances 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- 239000011888 foil Substances 0.000 claims description 5
- 229920001971 elastomer Polymers 0.000 claims description 4
- 238000003860 storage Methods 0.000 abstract description 7
- 239000012774 insulation material Substances 0.000 abstract description 5
- 238000004321 preservation Methods 0.000 description 15
- 239000011810 insulating material Substances 0.000 description 12
- 238000002156 mixing Methods 0.000 description 5
- 229920000728 polyester Polymers 0.000 description 5
- 239000005030 aluminium foil Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000012528 membrane Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000005096 rolling process Methods 0.000 description 4
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000009998 heat setting Methods 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 238000009736 wetting Methods 0.000 description 3
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004134 energy conservation Methods 0.000 description 2
- 238000005265 energy consumption Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000003063 flame retardant Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- YUWBVKYVJWNVLE-UHFFFAOYSA-N [N].[P] Chemical compound [N].[P] YUWBVKYVJWNVLE-UHFFFAOYSA-N 0.000 description 1
- 239000003377 acid catalyst Substances 0.000 description 1
- 239000004964 aerogel Substances 0.000 description 1
- 238000004378 air conditioning Methods 0.000 description 1
- SNAAJJQQZSMGQD-UHFFFAOYSA-N aluminum magnesium Chemical compound [Mg].[Al] SNAAJJQQZSMGQD-UHFFFAOYSA-N 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 238000009960 carding Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
- 239000010431 corundum Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000002657 fibrous material Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- -1 silicate ester Chemical class 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000002918 waste heat Substances 0.000 description 1
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- Laminated Bodies (AREA)
- Thermal Insulation (AREA)
Abstract
本实用新型实施例涉及保温板技术领域，公开了一种复合保温板及蓄热设备，该复合保温板，包括：依次相连的纳米保温板、纤维保温板以及有机硅橡胶层。本实用新型实施例的复合保温板，结构简单，使用安装方便，主要适用于蓄热设备表面温度达到700℃～1000℃温区的耐高温状态时的高效保温；充分利用纳米保温材料和纤维类保温材料的优势温区，使保温材料高效率地使用，从而达到高效且经济的目的。
The embodiment of the utility model relates to the technical field of thermal insulation boards, and discloses a composite thermal insulation board and a heat storage device. The composite thermal insulation board comprises: a nano thermal insulation board, a fiber thermal insulation board and an organic silicon rubber layer which are connected in sequence. The composite thermal insulation board of the embodiment of the utility model has a simple structure and is convenient to use and install, and is mainly suitable for efficient thermal insulation when the surface temperature of the thermal storage equipment reaches a high temperature resistance state in the temperature range of 700°C to 1000°C; it makes full use of nano thermal insulation materials and fibers. The advantageous temperature area of the thermal insulation material enables the efficient use of the thermal insulation material, so as to achieve the purpose of high efficiency and economy.
Description
Technical Field
The utility model relates to an heated board technical field especially relates to a composite insulation board and thermal storage equipment.
Background
The heat storage technology can effectively overcome discontinuity in the energy consumption process, can realize good space-time matching between the energy supply process and the energy consumption process, and has wide application prospect. In particular, the heat storage technology can be applied to the fields of power system peak shaving, aerospace, solar energy utilization, waste heat recovery, heating and air conditioning, household appliance industry and the like.
The heat storage equipment often needs to take heat preservation measures, and the surface of the heat storage equipment is subjected to heat preservation treatment by using a heat preservation material, so that the heat dissipation in the heat storage process is reduced, and the purpose of high-efficiency use of heat is achieved. The current high-temperature heat-insulating materials mainly comprise composite silicate, fiber heat-insulating materials and CAS aluminum magnesium heat-insulating materials. The composite silicate and fiber materials are mostly used for the working condition heat preservation within 500 ℃ due to the reasons of high heat conductivity coefficient, short service life and the like at high temperature.
SUMMERY OF THE UTILITY MODEL
The embodiment of the utility model provides a composite insulation board and thermal storage equipment for solve or the problem that present insulation material can't be applicable to the operating mode more than 500 ℃.
In a first aspect, an embodiment of the present invention provides a composite insulation board, including: the insulation board comprises a nanometer insulation board, a fiber insulation board and an organic silicon rubber layer which are sequentially connected.
On the basis of the technical scheme, the temperature of one side, close to the fiber insulation board, of the nanometer insulation board is less than 500 ℃.
On the basis of the technical scheme, the outer wall of the nanometer heat-insulation plate is wrapped with an aluminum foil film.
On the basis of the technical scheme, a first high-temperature-resistant adhesive layer is arranged between the nanometer heat-insulation plate and the fiber heat-insulation plate.
On the basis of the technical scheme, a second high-temperature-resistant adhesive layer is arranged between the fiber heat-insulation plate and the organic silicon rubber layer.
On the basis of the technical scheme, the thicknesses of the first high-temperature-resistant adhesive layer and the second high-temperature-resistant adhesive layer are both 1-5 mm.
On the basis of the technical scheme, the thickness of the nanometer heat-insulating plate is 10-30 mm.
On the basis of the technical scheme, the thickness of the fiber insulation board is 10-70 mm.
On the basis of the technical scheme, the thickness of the organic silicon rubber layer is 10-30 mm.
In a second aspect, an embodiment of the present invention provides a thermal storage device, including the above-mentioned each technical solution the composite insulation board.
The embodiment of the utility model provides a pair of composite insulation board and thermal storage equipment, nanometer heated board, fibre heated board and organosilicon rubber layer laminate mutually in proper order and arrange, during the use, are close to the heat preservation object with the nanometer heated board and arrange. The composite heat-insulating board of the embodiment of the utility model has simple structure and convenient use and installation, and is mainly suitable for high-efficiency heat insulation when the surface temperature of the heat storage equipment reaches the high-temperature resistant state of a temperature area of 700-1000 ℃; the dominant temperature zones of the nano heat-insulating material and the fiber heat-insulating material are fully utilized, so that the heat-insulating material is efficiently used, and the purposes of high efficiency and economy are achieved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is the utility model discloses composite insulation board's structural schematic.
Reference numerals:
1. a nano insulation board; 2. a fiber insulation board; 3. a silicone rubber layer; 4. an aluminum foil film.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
With the improvement of the requirement on energy conservation, the traditional single heat-insulating material is difficult to meet the requirements of high efficiency, energy conservation and low cost. The nanometer heat-insulating material has extremely low heat conductivity coefficient and excellent fireproof performance, and the heat-insulating performance of the nanometer heat-insulating material is not obviously changed within the temperature range of less than 800 ℃, but the problems of material resource shortage, high manufacturing cost and the like need to be improved.
Therefore, for the high temperature resistant working condition of 700 ℃ -1000 ℃, a more advanced heat preservation device is needed to meet the requirements of high efficiency and economy. Therefore, the embodiment of the utility model provides a composite insulation board.
Fig. 1 is the utility model discloses composite insulation board's structural schematic, as shown in fig. 1, the utility model discloses composite insulation board, include: the nanometer heat-insulation board 1, the fiber heat-insulation board 2 and the organic silicon rubber layer 3 are sequentially connected; namely, the bottom surface and the top surface of the fiber heat-insulation plate 2 are respectively connected with the nanometer heat-insulation plate 1 and the organic silicon rubber layer 3; the temperature of one side of the nano heat-insulation board 1 close to the fiber heat-insulation board 2 is less than 500 ℃.
The nano heat insulation board 1 is used as a hot surface of the composite heat insulation board, and the fiber heat insulation board 2 is used as a cold surface of the composite heat insulation board. The cold surface refers to one side of the composite insulation board, which is far away from an insulation object when in use; the hot surface refers to the side of the composite insulation board close to an insulation object when in use.
It can be understood that the thickness of the nano heat-insulation board 1 depends on the temperature of the heat storage device, and the temperature of one side, close to the fiber heat-insulation board 2, of the nano heat-insulation board 1 is lower than 500 ℃. Wherein, the organic silicon rubber layer 3 mainly plays the role of protection and moisture protection.
The embodiment of the utility model provides an in, nanometer heated board 1, fibre heated board 2 and organosilicon rubber layer 3 laminate mutually in proper order and arrange, during the use, are close to the heat preservation object with nanometer heated board 1 and arrange. The composite heat-insulating board of the embodiment of the utility model has simple structure and convenient use and installation, and is mainly suitable for high-efficiency heat insulation when the surface temperature of the heat storage equipment reaches the high-temperature resistant state of a temperature area of 700-1000 ℃; the dominant temperature zones of the nano heat-insulating material and the fiber heat-insulating material are fully utilized, so that the heat-insulating material is efficiently used, and the purposes of high efficiency and economy are achieved.
The preparation method of the nano heat-insulating board 1 includes the following steps:
mixing: uniformly mixing the silicon dioxide aerogel powder with an infrared shielding agent and chopped fibers according to the mass ratio of 1 (0.1-0.5) to (0.01-0.1) to form a mixture;
the preparation method of the orthosilicic acid solution comprises the following steps: in the presence of an acid catalyst, mixing silicate ester and water according to a molar ratio of 1 (18-36), reacting while stirring, controlling the pH value of a reaction system to be less than 3, and standing to obtain an orthosilicic acid solution;
a wetting step: spraying the silicic acid solution onto the mixture under stirring to obtain a wetting material; the adding amount of the orthosilicic acid solution is not more than 20% of the mass of the mixture;
a forming step: forming the wetting material into a plate;
and (3) maintenance: curing the plate in an ammonia atmosphere to obtain a curing guard plate;
and (3) drying: and drying the curing plate to obtain the nano heat-insulating plate.
The preparation method of the fiber insulation board 2 includes the following steps:
uniformly mixing the first polyester staple fibers and the fibers A; the first polyester staple fiber accounts for 50-70% of the total mass of the fiber; the fiber A is selected from one of second polyester staple fiber, polyamide fiber or carbon fiber; the melting point of the first polyester short fiber is 180-200 ℃; the melting point of the second polyester short fiber is 250-260 ℃;
opening and carding the mixed fibers to form a fiber web;
uniformly spraying a phosphorus-nitrogen flame retardant or a phosphorus flame retardant accounting for 2-10% of the total mass of the fibers onto the surface of the fiber web;
obtaining the insulation board by needling, rolling and heat setting the treated fiber net; the needling density of the needling is 1.0-1.5 needles/square centimeter; the rolling pressure during rolling is 2.5-3.5 Mpa, and the rolling speed is 1.13-1.26 m/min; the heat setting temperature is 180-210 ℃, and the heat setting time is 9-12 min.
On the basis of the embodiment, the outer wall of the nanometer heat-insulation board 1 is wrapped with the aluminum foil film 4.
It should be noted that, the aluminum foil film 4 is used to wrap the exterior of the nano heat-insulating board 1, so that the strength of the nano heat-insulating board 1 is increased, the heat radiation can be reflected, and the effects of water resistance and water vapor can be achieved.
In addition to the above embodiments, a first high temperature adhesive layer is provided between the nano heat insulating board 1 and the fiber heat insulating board 2.
The nano heat insulating board 1 and the fiber heat insulating board 2 are bonded together by the first high temperature-resistant adhesive layer.
In addition to the above embodiment, a second high-temperature-resistant adhesive layer is provided between the fiber heat-insulating board 2 and the silicone rubber layer 3.
The fiber heat-insulating board 2 and the silicone rubber layer 3 are bonded together by the second high-temperature-resistant adhesive layer.
In addition to the above embodiments, the thickness of the first high temperature-resistant adhesive layer and the second high temperature-resistant adhesive layer is 1 to 5 mm.
The first high-temperature-resistant adhesive layer and the second high-temperature-resistant adhesive layer are both 2mm thick, and the first high-temperature-resistant adhesive layer and the second high-temperature-resistant adhesive layer are provided to improve the structural strength of the composite heat-insulating board.
It is understood that the high temperature-resistant adhesive layer comprises, by mass, 100 parts of bisphenol A type EP01441-310 epoxy resin, 10 parts of liquid nitrile rubber, 50 parts of corundum powder, and 10 parts of 2-ethyl-4-methylimidazole, and no other solvent is added. The high-temperature resistant adhesive is prepared by stirring and mixing the components.
On the basis of the embodiment, the thickness of the nanometer heat-insulation board 1 is 10-30 mm, the thickness of the fiber heat-insulation board 2 is 10-70 mm, and the thickness of the organic silicon rubber layer 3 is 10-30 mm.
The thickness of the nano heat insulation board 1 is 20mm, the thickness of the fiber heat insulation board 2 is 50mm, and the thickness of the silicone rubber layer 3 is 20 mm. The composite insulation board has a light structure, and can be suitable for the working condition of a 700-1000 ℃ temperature zone.
On the other hand, the embodiment of the utility model provides a heat storage equipment, including above-mentioned each embodiment the composite insulation board.
The embodiment of the utility model provides an in, at nano heat preservation board 1's surface coating aluminium foil membrane 4, at the surface coating high temperature resistant adhesive of the aluminium foil membrane 4 on upper strata, bond fibre heat preservation board 2's bottom surface and the surface of the aluminium foil membrane 4 on upper strata mutually, at fibre heat preservation board 2's top surface coating high temperature resistant adhesive, bond organosilicon rubber layer 3's bottom surface and fibre heat preservation board 2's top surface mutually, contact nano heat preservation board 1 and heat storage equipment at last, nano heat preservation board 1 contacts with heat storage equipment through the aluminium foil membrane 4 of lower floor promptly.
The embodiment of the utility model provides a thermal storage equipment through installation composite insulation board, can solve current thermal storage equipment poor at the heat preservation effect of 700 ℃ -1000 ℃ warm area, the short-lived problem with the insulation material is with high costs of heat preservation layer.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention in its corresponding aspects.
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021771755.9U CN212692659U (en) | 2020-08-21 | 2020-08-21 | Composite insulation board and heat storage equipment |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202021771755.9U CN212692659U (en) | 2020-08-21 | 2020-08-21 | Composite insulation board and heat storage equipment |
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| CN212692659U true CN212692659U (en) | 2021-03-12 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114076542A (en) * | 2020-08-21 | 2022-02-22 | 中国科学院理化技术研究所 | Composite heat insulation board and heat storage equipment |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114076542A (en) * | 2020-08-21 | 2022-02-22 | 中国科学院理化技术研究所 | Composite heat insulation board and heat storage equipment |
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