CN212682737U

CN212682737U - Tin dispensing device for semiconductor element production

Info

Publication number: CN212682737U
Application number: CN202020616717.XU
Authority: CN
Inventors: 李建立
Original assignee: Shanghai Wangde Industrial Co ltd
Current assignee: Shanghai Wangde Industrial Co ltd
Priority date: 2020-04-22
Filing date: 2020-04-22
Publication date: 2021-03-12
Anticipated expiration: 2030-04-22

Abstract

The utility model discloses a point tin device is used in semiconductor element production, comprises an operation bench, the front end on operation panel surface and the equal fixedly connected with fixing base in rear end, the surperficial threaded connection of fixing base has the threaded rod, the one end of threaded rod has the clamp splice through bearing swing joint, the spacing groove has all been seted up to the both sides on operation panel surface, the spacing slide bar of inner chamber fixedly connected with of spacing groove, the equal sliding connection in both ends on spacing slide bar surface has spacing sliding sleeve. The utility model discloses a rotatory threaded rod, threaded rod drive clamp splice motion, and two clamp splices are to the component motion to fasten the component, wherein the clamp splice drives the fixed block motion, and the fixed block drives spacing sliding sleeve at the surface slip of spacing slide bar, thereby carry on spacingly to the clamp splice, when having solved semiconductor element production point tin, owing to lack the fixed to it, thereby reduced semiconductor's production efficiency and product quality's problem.

Description

Tin dispensing device for semiconductor element production

Technical Field

The utility model relates to a semiconductor processing technology field specifically is a semiconductor element production is with some tin device.

Background

The semiconductor is a material with electric conductivity between a conductor and an insulator at normal temperature, and has wide application in radio, television and temperature measurement, for example, a diode is a device made of the semiconductor, the semiconductor is a material with controllable electric conductivity ranging from the insulator to the conductor, the importance of the semiconductor is very great from the viewpoint of technology or economic development, most of electronic products such as computers, displays, mobile phones or digital recorders in the present day are closely related to the semiconductor, and the production efficiency and the product quality of the semiconductor are reduced because the semiconductor element is not fixed during the production process.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a semiconductor element production is with some tin device possesses fixed advantage, when having solved semiconductor element production point tin, owing to lack the fixed to it to the production efficiency and the product quality's of semiconductor problem have been reduced.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a semiconductor component production is with some tin device, includes the operation panel, the equal fixedly connected with fixing base in front end and the rear end on operation panel surface, the surperficial threaded connection of fixing base has the threaded rod, the one end of threaded rod has the clamp splice through bearing swing joint.

Preferably, both sides of the surface of the operating platform are provided with limit grooves, and inner cavities of the limit grooves are fixedly connected with limit slide rods.

Preferably, both ends on the surface of the limiting slide rod are connected with a limiting slide sleeve in a sliding mode, the top of the limiting slide sleeve is fixedly connected with a fixed block, and the fixed block is fixedly connected with the clamping block.

Preferably, the inner cavity of the clamping block is fixedly connected with a rubber pad, and one side of the rubber pad is arc-shaped.

Preferably, the two sides of the surface of the limiting sliding rod are both provided with limiting sliding grooves, the two sides of the inner cavity of the limiting sliding sleeve are both fixedly connected with limiting sliding blocks, and one ends of the limiting sliding blocks extend to the inner cavities of the limiting sliding grooves.

Compared with the prior art, the beneficial effects of the utility model are as follows:

1. the utility model discloses a rotatory threaded rod, threaded rod drive clamp splice motion, and two clamp splices are to the component motion to fasten the component, wherein the clamp splice drives the fixed block motion, and the fixed block drives spacing sliding sleeve at the surface slip of spacing slide bar, thereby carry on spacingly to the clamp splice, when having solved semiconductor element production point tin, owing to lack the fixed to it, thereby reduced semiconductor's production efficiency and product quality's problem.

2. The utility model discloses a set up the rubber pad, played the effect to the component protection, through setting up spacing spout and spacing slider, played spacing effect to spacing sliding sleeve.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic top view of the operation table of the present invention;

fig. 3 is a schematic view of the overlooking section structure of the limiting sliding sleeve of the present invention.

In the figure: 1. an operation table; 2. a fixed seat; 3. a threaded rod; 4. a clamping block; 5. a limiting groove; 6. a limiting slide bar; 7. a limiting sliding sleeve; 8. a fixed block; 9. a rubber pad; 10. a limiting chute; 11. and a limiting sliding block.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

The utility model discloses an operation panel 1, fixing base 2, threaded rod 3, clamp splice 4, spacing groove 5, spacing slide bar 6, spacing sliding sleeve 7, fixed block 8, rubber pad 9, spacing spout 10 and spacing slider 11 part are the parts that universal standard spare or technical staff in the field know, and its structure and principle all are that this technical staff all can learn through the technical manual or learn through conventional experimental method.

Referring to fig. 1-3, a tin dropping device for semiconductor element production comprises an operation table 1, wherein both sides of the surface of the operation table 1 are provided with limiting grooves 5, the inner cavity of the limiting grooves 5 is fixedly connected with limiting slide bars 6, both the front end and the rear end of the surface of the operation table 1 are fixedly connected with fixing seats 2, the surface of the fixing seats 2 is in threaded connection with threaded rods 3, one end of the threaded rods 3 is movably connected with clamping blocks 4 through bearings, both ends of the surface of the limiting slide bars 6 are in sliding connection with limiting slide sleeves 7, the tops of the limiting slide sleeves 7 are fixedly connected with fixing blocks 8, the fixing blocks 8 are fixedly connected with the clamping blocks 4, the inner cavity of the clamping blocks 4 is fixedly connected with rubber pads 9, one side of the rubber pads 9 is arc-shaped, both sides of the surface of the limiting slide bars 6 are provided with limiting slide grooves 10, both sides of the inner cavity of the limiting slide, through rotatory threaded rod 3, threaded rod 3 drives clamp splice 4 motion, and two clamp splices 4 are to the component motion to fasten the component, wherein clamp splice 4 drives the motion of fixed block 8, and fixed block 8 drives spacing sliding sleeve 7 at spacing slide bar 6's surface slip, thereby spacing clamp splice 4, when having solved semiconductor component production point tin, owing to lack fixed to it, thereby reduced the production efficiency of semiconductor and product quality's problem.

During the use, through rotatory threaded rod 3, threaded rod 3 drives clamp splice 4 motion, and two clamp splices 4 are to the component motion to fasten the component, wherein clamp splice 4 drives the motion of fixed block 8, and fixed block 8 drives spacing sliding sleeve 7 and slides at spacing slide bar 6's surface, thereby carry on spacingly to clamp splice 4, when having solved semiconductor component production point tin, owing to lack fixed to it, thereby reduced the production efficiency of semiconductor and product quality's problem.

The standard parts used in the application document can be purchased from the market, and can be customized according to the description of the specification and the description of the attached drawings, the specific connection mode of each part adopts conventional means such as mature bolts, rivets, welding and the like in the prior art, and machines, parts and equipment adopt conventional models in the prior art.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A tin dotting device for semiconductor element production comprises an operation table (1), and is characterized in that: the utility model discloses an operation panel, including operation panel (1), the equal fixedly connected with fixing base (2) in front end and the rear end on operation panel (1) surface, the surperficial threaded connection of fixing base (2) has threaded rod (3), the one end of threaded rod (3) has clamp splice (4) through bearing swing joint.

2. The tin spot welding device for producing the semiconductor element according to claim 1, wherein: limiting grooves (5) are formed in two sides of the surface of the operating platform (1), and limiting sliding rods (6) are fixedly connected to inner cavities of the limiting grooves (5).

3. The tin spot welding device for producing the semiconductor element according to claim 2, wherein: the two ends of the surface of the limiting slide rod (6) are connected with limiting sliding sleeves (7) in a sliding mode, the top of each limiting sliding sleeve (7) is fixedly connected with a fixing block (8), and the fixing blocks (8) are fixedly connected with the clamping blocks (4).

4. The tin spot welding device for producing the semiconductor element according to claim 1, wherein: the inner cavity of the clamping block (4) is fixedly connected with a rubber pad (9), and one side of the rubber pad (9) is arc-shaped.

5. The tin spot welding device for producing the semiconductor element according to claim 3, wherein: spacing spout (10) have all been seted up to the both sides on spacing slide bar (6) surface, the equal fixedly connected with spacing slider (11) in both sides of spacing sliding sleeve (7) inner chamber, the one end of spacing slider (11) extends to the inner chamber of spacing spout (10).