CN212657824U - A secondary cooling data center air conditioning system - Google Patents
A secondary cooling data center air conditioning system Download PDFInfo
- Publication number
- CN212657824U CN212657824U CN202021864318.1U CN202021864318U CN212657824U CN 212657824 U CN212657824 U CN 212657824U CN 202021864318 U CN202021864318 U CN 202021864318U CN 212657824 U CN212657824 U CN 212657824U
- Authority
- CN
- China
- Prior art keywords
- direct
- evaporative cooler
- data center
- plate
- air
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 48
- 238000004378 air conditioning Methods 0.000 title claims abstract description 30
- 239000007788 liquid Substances 0.000 claims abstract description 113
- 230000017525 heat dissipation Effects 0.000 claims abstract description 37
- 239000003507 refrigerant Substances 0.000 claims abstract description 34
- 238000005057 refrigeration Methods 0.000 claims abstract description 17
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 131
- 239000002826 coolant Substances 0.000 claims description 77
- 238000009833 condensation Methods 0.000 claims description 32
- 230000005494 condensation Effects 0.000 claims description 31
- 238000001704 evaporation Methods 0.000 claims description 27
- 230000008020 evaporation Effects 0.000 claims description 27
- 238000007654 immersion Methods 0.000 claims description 16
- 239000002131 composite material Substances 0.000 claims description 9
- 239000000945 filler Substances 0.000 claims description 9
- 238000010521 absorption reaction Methods 0.000 claims description 4
- 230000000903 blocking effect Effects 0.000 claims 2
- 238000005265 energy consumption Methods 0.000 abstract description 3
- 239000007921 spray Substances 0.000 description 10
- 238000000034 method Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004134 energy conservation Methods 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 230000001502 supplementing effect Effects 0.000 description 2
- 238000013473 artificial intelligence Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000000110 cooling liquid Substances 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000011946 reduction process Methods 0.000 description 1
Images
Landscapes
- Other Air-Conditioning Systems (AREA)
Abstract
本实用新型公开了一种二次制冷的数据中心用空调系统，包括壳体内并列设置的直接蒸发冷却器和液冷剂蒸发冷凝器，液冷剂蒸发冷凝器通过液冷剂流通管与设置在数据中心的芯片散热系统连接；壳体内、直接蒸发冷却器和液冷剂蒸发冷凝器的上方设置有直接—板管式间接蒸发冷却器，直接—板管式间接蒸发冷却器通过循环风管与数据中心送回风系统相连接。本实用新型的空调系统在对数据中心散热源数据处理芯片浸没于液冷剂中进行源头冷却散热的同时，又经过间接蒸发冷却制冷空调模块进行数据中心内部空气环境进行等湿冷却处理，不仅节能降耗，而且适用性广。
The utility model discloses a secondary refrigeration air conditioning system for a data center, which comprises a direct evaporative cooler and a liquid refrigerant evaporative condenser which are arranged in parallel in a casing. The chip cooling system of the data center is connected; a direct-plate-and-tube indirect evaporative cooler is arranged in the casing, above the direct evaporative cooler and the liquid refrigerant evaporative condenser, and the direct-plate-and-tube indirect evaporative cooler is connected to the The data center is connected to the return air system. The air-conditioning system of the utility model performs the source cooling and heat dissipation by immersing the data processing chip of the heat dissipation source of the data center in the liquid refrigerant, and also performs the equal-humidity cooling treatment of the air environment inside the data center through the indirect evaporative cooling refrigeration air-conditioning module, which not only saves energy Consumption reduction and wide applicability.
Description
Technical Field
The utility model belongs to the technical field of the evaporative cooling air conditioner, concretely relates to secondary refrigeration's air conditioning system for data center.
Background
Nowadays, with the deep development of 5G technology cloud computing, artificial intelligence, big data and Internet of things, data centers are used as important components of new capital construction, and the current state advocates vigorously to promote the creation of green data centers, guide the data centers to go along efficient, clean, intensive and cyclic development roads, realize the continuous and healthy development of the data centers, and further make the efficient operation of data rooms very important. At present, the energy consumption of a data machine room is higher and higher, and the most effective and most potential of reducing the PUE in the data center is to start with the energy conservation of an air conditioning system, so that the selection of a proper air conditioning system is more important. The traditional mechanical refrigeration air-conditioning cooling technology not only has extremely large operation power consumption, but also is not in line with the requirements of a data center on energy conservation and consumption reduction, and has larger noise and higher maintenance cost.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a secondary refrigeration's air conditioning system for data center carries out source cooling heat dissipation to data center heat dissipation source data processing chip submergence in the liquid coolant when, carries out the wet cooling processing such as data center inside air circumstance again through indirect evaporative cooling refrigeration air conditioner module, not only energy saving and consumption reduction, extensive applicability moreover.
The technical scheme adopted by the utility model is that the air conditioning system for the secondary refrigeration data center comprises a direct evaporative cooler and a liquid coolant evaporative condenser which are arranged in parallel in a shell, wherein the liquid coolant evaporative condenser is connected with a chip heat dissipation system arranged in the data center through a liquid coolant circulating pipe; in the shell, direct evaporative cooler and liquid coolant evaporative condenser's top is provided with direct-plate tubular indirect evaporative cooler, direct-plate tubular indirect evaporative cooler is connected with data center air supply return system through the circulating air pipe, data center air supply return system includes in the room of data center, the indoor lower part high temperature cold wind air supply layer of data center that data center rack below set up and the indoor upper portion air return layer of data center that data center rack top set up, on the last lateral wall of the indoor lower part high temperature cold wind air supply layer of data center, open data center lower part supply-air outlet in the position that corresponds the data center rack, it has data center upper portion air return to open on the indoor upper portion air return layer lower lateral wall of data center.
The utility model is also characterized in that,
a water distributor and a circulating water tank are respectively arranged above and below the direct evaporative cooler and the liquid coolant evaporative condenser, the water distributor is connected with the circulating water tank through a circulating water supply pipe, and a circulating water pump is arranged at the joint of the circulating water supply pipe and the circulating water tank; the direct evaporative cooler comprises a direct evaporative cooler air inlet arranged on a shell on one side of the direct evaporative cooler, a direct evaporative cooler air inlet primary filter is arranged on the inner side of the direct evaporative cooler air inlet, and a direct evaporative cooling filler is arranged in the shell on the inner side of the direct evaporative cooler air inlet primary filter; the liquid cooling agent evaporation condenser comprises a liquid cooling agent evaporation and condensation coil pipe, and an evaporation and condensation heat dissipation module centrifugal exhaust fan is arranged above the liquid cooling agent evaporation and condensation coil pipe.
And a circulating water level meter, a water replenishing opening and a water draining opening are arranged on the side wall of the circulating water tank.
The direct-plate-tube indirect evaporative cooler comprises a direct-plate-tube indirect evaporative cooler circulating water storage tank, a direct-plate-tube indirect evaporative cooler fresh air inlet grille, a direct-plate-tube indirect evaporative cooler direct-indirect composite heat exchange core, a direct-plate-tube indirect evaporative cooler water distributor and a direct-plate-tube indirect evaporative cooler secondary side axial flow exhaust fan which are sequentially arranged from bottom to top, wherein a direct-plate-tube indirect evaporative cooler secondary side air outlet is arranged at the corresponding position of an upper shell, the direct-plate-tube indirect evaporative cooler water distributor is connected with the direct-plate-tube indirect evaporative cooler circulating water storage tank through a direct-plate-tube indirect evaporative cooler circulating water supply pipe, and a direct-plate-tube indirect evaporative cooler circulating water pump is arranged at the joint of the direct-plate-tube indirect evaporative cooler circulating water supply pipe and the direct-plate-tube indirect evaporative cooler circulating water storage tank, the inner side of the direct and indirect composite heat exchange core of the direct-plate-tube indirect evaporative cooler is provided with a water baffle, and the inner side of the water baffle is provided with a centrifugal blower.
The side wall of the circulating water storage tank of the direct-plate-tube indirect evaporative cooler is provided with a direct-plate-tube indirect evaporative cooler reservoir level meter, a direct-plate-tube indirect evaporative cooler water outlet and a direct-plate-tube indirect evaporative cooler water replenishing port.
The chip heat dissipation system comprises a heat dissipation chip placed in a liquid coolant immersion pool, the heat dissipation chip is covered by an immersed liquid coolant, and the liquid coolant immersion pool is connected with a cooled liquid coolant supply pipe and an absorption chip heat dissipation liquid coolant return pipe.
The circulating air pipe comprises a data center air return pipe connected with an upper air return layer in the data center chamber, a direct-plate-pipe type indirect evaporative cooler primary air side middle-effect filter is arranged in the data center air return pipe, and the data center air return pipe is connected with one side of a direct-plate-pipe type indirect evaporative cooler on the shell; the data center air supply pipe is connected with one side of the shell close to the centrifugal air supply machine through the primary air supply pipe flexible connection of a direct-plate-pipe type indirect evaporative cooler.
The liquid cooling agent circulation pipe comprises a liquid cooling agent return pipe and a liquid cooling agent delivery pipe, the liquid cooling agent return pipe and the liquid cooling agent delivery pipe are respectively connected with two ports of the liquid cooling agent evaporation and condensation coil, and a liquid cooling agent circulation pump is further arranged at the joint of the liquid cooling agent delivery pipe and the liquid cooling agent evaporation and condensation coil.
The utility model discloses air conditioning system's beneficial effect is:
(1) the refrigeration system adopts evaporative condensation and indirect and direct evaporative cooling technologies, the liquid cooling and air cooling are organically combined to realize combined cooling and radiating technical means, water and a liquid cooling agent are used as a refrigerant or a secondary refrigerant, the liquid cooling agent is cooled and radiated through the evaporative condensation, meanwhile, the return air of the data center is subjected to equal-humidity cooling treatment through indirect evaporative cooling, the problem of Freon leakage or the problem of condensation, dewing and water dripping cannot exist, the IT equipment and the environment of the data center are harmless and pollution-free, and the refrigeration system is safe, green, economic and environment-friendly.
(2) The liquid cooling heat dissipation system comprises an immersion liquid pool, a liquid cooling agent return supply pipeline, a liquid cooling agent circulating pump, a liquid cooling agent condensing coil, a circulating water distributor, an axial flow type exhaust fan, a circulating water pump and the like. When the air conditioning system starts to operate, the liquid coolant starts to flow in the evaporation and condensation coil pipe, the circulating water outside the pipe sprays and starts to spray, the direct evaporation cooling and cooling process of air and water continuously occurs outside the condensation coil pipe, the heat of the high-temperature liquid coolant in the pipe is absorbed through the pipe wall, the cooling liquid coolant is finally radiated, and the liquid coolant circularly passes through the liquid cooling pool of the data center to continuously and efficiently radiate the chip.
(3) The direct evaporative cooler with precooled air inlet side consists of a primary filter, a water distributor, a circulating water collecting tank at the bottom of a circulating water pump and a direct evaporative cooling filler.
(4) The direct-plate tube indirect evaporative cooler in the unit consists of seven parts, namely a bottom direct evaporative cooler, a plate tube indirect evaporative cooler, a circulating water pump, a water distributor, a secondary side exhaust fan, a primary side centrifugal air feeder and a indirect-direct shared circulating water collecting tank, wherein outdoor fresh air serving as secondary air enters the direct evaporative cooler from the bottom for cooling, then passes through a wet channel of the plate tube indirect evaporative cooler for carrying out heat insulation and moisture exchange with spray water in the wet channel, and further passes through a plate tube heat exchange wall for carrying out equal moisture cooling on the primary side air (namely return air of a large environment of a data center), and then is sent into a high-temperature cold air supply channel at the lower part of the data center through the primary side centrifugal fan, and finally is sent into the data center through an air supply opening at the lower part of the data center for cooling and radiating the air environment.
(5) The direct evaporative cooler for precooling the inlet air of the refrigeration air-conditioning unit, the evaporative condensation heat dissipation module for condensing and dissipating the liquid refrigerant, the direct-plate-tube indirect evaporative cooler, the centrifugal blower and the like are combined into a whole in one unit, so that the unit is high in integration level, efficient, energy-saving, compact in structure and convenient to install and construct; the cooling device is suitable for cooling and cooling places such as server workstations of general large, medium and small data centers or data rooms or edge data centers, and medium and small data rooms of (large, medium and small) type internet companies and certain medium and small data rooms of enterprises and public institutions.
Drawings
Fig. 1 is a schematic structural diagram of an air conditioning system of the present invention;
fig. 2 is a working schematic diagram of the chip-level immersion cooling heat-dissipating liquid refrigerant in the air conditioning system of the present invention.
In the figure, 1, a data center cabinet, 2, a liquid refrigerant return pipe, 3, a liquid refrigerant feeding pipe, 4, an upper air return layer in a data center chamber, 5, a high-temperature cold air feeding layer at the lower part in the data center chamber, 6, a data center air return pipe, 7, a data center air feeding pipe, 8, a liquid refrigerant evaporation and condensation coil pipe, 9, a liquid refrigerant circulating pump, 10, a direct-plate pipe type indirect evaporation cooler fresh air inlet grille, 11, a direct-plate pipe type indirect evaporation cooler water storage tank liquid level meter, 12, an evaporation and condensation heat dissipation module centrifugal exhaust fan, 13, a water replenishing port, 14, a water draining port, 15, a circulating water pump, 16, a circulating water feeding pipe, 17, a direct evaporation and cooling filler, 18, a circulating water tank, 19, a circulating water level meter, 20, a direct evaporation and cooler air inlet primary filter, 21, a direct evaporation and cooler air inlet, 22, a water distributor, 23, a direct-plate type indirect evaporation and cooling water outlet, 24. a water replenishing port of a direct-plate-tube indirect evaporative cooler, 25 a circulating water pump of a direct-plate-tube indirect evaporative cooler, 26 a circulating water supply pipe of the direct-plate-tube indirect evaporative cooler, 27 a primary air side middle-effect filter of the direct-plate-tube indirect evaporative cooler, 28 a secondary side axial flow exhaust fan of the direct-plate-tube indirect evaporative cooler, 29 a secondary side exhaust port of the direct-plate-tube indirect evaporative cooler, 30 a water distributor of the direct-plate-tube indirect evaporative cooler, 31 a direct-plate-tube indirect evaporative cooler directly adding an indirect composite heat exchange core, 32 a water baffle, 33 a centrifugal blower, 34 a primary air supply pipe of the direct-plate-tube indirect evaporative cooler, 35 a circulating water storage tank of the direct-plate-tube indirect evaporative cooler, 36 a cooled liquid coolant supply pipe, 37 a radiating liquid coolant return pipe of an absorption chip, 38. the system comprises an immersion type liquid refrigerant 39, a heat dissipation chip 40, a liquid refrigerant immersion tank 41, an upper air return opening of a data center and a lower air supply opening of the data center, wherein the liquid refrigerant immersion tank is provided with a liquid refrigerant immersion inlet 42.
Detailed Description
The present invention will be described in detail with reference to the accompanying drawings and specific embodiments.
The utility model relates to an air conditioning system for a secondary refrigeration data center, as shown in figure 1, which comprises a direct evaporative cooler and a liquid coolant evaporative condenser which are arranged in parallel in a shell, wherein the liquid coolant evaporative condenser is connected with a chip heat dissipation system arranged in the data center through a liquid coolant circulating pipe; a direct-plate-tube indirect evaporative cooler is arranged in the shell and above the direct evaporative cooler and the liquid coolant evaporative condenser, and the direct-plate-tube indirect evaporative cooler is connected with a data center air return system through a circulating air pipe.
A water distributor 22 and a circulating water tank 18 are respectively arranged above and below the direct evaporative cooler and the liquid coolant evaporative condenser, the water distributor 22 is connected with the circulating water tank 18 through a circulating water supply pipe 16, and a circulating water pump 15 is arranged at the joint of the circulating water supply pipe 16 and the circulating water tank 18; the direct evaporative cooler comprises a direct evaporative cooler air inlet 21 arranged on a shell on one side of the direct evaporative cooler, a direct evaporative cooler air inlet primary filter 20 is arranged on the inner side of the direct evaporative cooler air inlet 21, and a direct evaporative cooling filler 17 is arranged in a shell on the inner side of the direct evaporative cooler air inlet primary filter 20; the liquid cooling agent evaporative condenser comprises a liquid cooling agent evaporative condensing coil 8, and an evaporative condensation heat dissipation module centrifugal exhaust fan 12 is arranged above the liquid cooling agent evaporative condensing coil 8. The side wall of the circulating water tank 18 is provided with a circulating water level meter 19, a water replenishing port 13 and a water draining port 14. Air in the device enters the air conditioning unit and firstly passes through an air inlet 21 of the evaporative cooler and then further enters a direct evaporative cooling filler 17 through a primary air inlet filter 20 of the direct evaporative cooler, the air is directly subjected to evaporative cooling on the surface of the filler and then is sprayed to the water on the surface of the filler through a circulating water pump 15 and a circulating water supply pipe 16 and a water distributor 22, and further is subjected to isenthalpic cooling for the inlet air, so that the air entering the evaporative condensation module is precooled, the heat exchange efficiency of the liquid coolant evaporative condensation module is improved, if the spray water is insufficient, the spray water can be supplemented through a water supplementing port 13, and the spray water can be discharged through a water draining port 14 when the unit is not used.
The direct-plate-tube indirect evaporative cooler comprises a direct-plate-tube indirect evaporative cooler circulating water storage tank 35, a direct-plate-tube indirect evaporative cooler fresh air inlet grille 10, a direct-plate-tube indirect evaporative cooler direct and indirect composite heat exchange core 31, a direct-plate-tube indirect evaporative cooler water distributor 30 and a direct-plate-tube indirect evaporative cooler secondary side axial flow exhaust fan 28 which are sequentially arranged from bottom to top, wherein a direct-plate-tube indirect evaporative cooler secondary side air outlet 29 is arranged at a position corresponding to a shell above the direct-plate-tube indirect evaporative cooler secondary side axial flow exhaust fan 28, the direct-plate-tube indirect evaporative cooler water distributor 30 is connected with the direct-plate-tube indirect evaporative cooler circulating water storage tank 35 through a direct-plate-tube indirect evaporative cooler circulating water supply pipe 26, the direct-plate-tube indirect evaporative cooler circulating water 26 and the direct-plate-tube indirect evaporative cooler circulating water storage tank The joint of the water circulation pump 35 and the water circulation pump 25 of the direct-plate-tube indirect evaporative cooler is provided, the inner side of the direct-plate-tube indirect evaporative cooler and the indirect composite heat exchange core 31 is provided with a water baffle 32, and the inner side of the water baffle 32 is provided with a centrifugal blower 33. The side wall of the circulating water storage tank 35 of the direct-plate-tube indirect evaporative cooler is provided with a direct-plate-tube indirect evaporative cooler reservoir level meter 11, a direct-plate-tube indirect evaporative cooler water outlet 23 and a direct-plate-tube indirect evaporative cooler water replenishing port 24. The chip heat dissipation system, as shown in fig. 2, includes a heat dissipation chip 39 disposed in a liquid coolant immersion tank 40, the heat dissipation chip 39 is covered by an immersion liquid coolant 38, and the liquid coolant immersion tank 40 is connected to a cooled liquid coolant supply pipe 36 and an absorption chip heat dissipation liquid coolant return pipe 37. The liquid cooling agent circulation pipe comprises a liquid cooling agent return pipe 2 and a liquid cooling agent delivery pipe 3, the liquid cooling agent return pipe 2 and the liquid cooling agent delivery pipe 3 are respectively connected with two ports of the liquid cooling agent evaporation and condensation coil pipe 8, and a liquid cooling agent circulation pump 9 is further arranged at the joint of the liquid cooling agent delivery pipe 3 and the liquid cooling agent evaporation and condensation coil pipe 8.
The process of liquid cooling and heat dissipation of the chip by the direct plate-tube indirect evaporative cooler, the liquid coolant circulating tube and the chip heat dissipation system is as follows: the immersed liquid coolant 38 which absorbs the heat dissipation capacity of the chip and heats up enters the liquid coolant evaporation and condensation coil 8 from the liquid coolant return pipe 37 of the absorbed chip heat dissipation capacity to the liquid coolant return pipe 2, then enters the circulating water pump 15 from the circulating water tank 18 through the circulating water supply pipe 16 and is further supplied to the water distributor 22, and sprays water on the outer surface of the liquid coolant evaporation and condensation coil through the nozzle, at this time, the water and the air which is directly evaporated and cooled through the previous part are further directly evaporated and cooled outside the unit, and absorbs the heat of the liquid coolant dissipated from the wall surface of the coil, so as to realize the evaporation, condensation and heat dissipation of the liquid coolant, and the air which is directly evaporated and cooled outside the unit and heated up is discharged outside the unit through the evaporation, condensation and heat dissipation module centrifugal fan 12, and the liquid coolant after heat dissipation and cooling is pressurized through the liquid coolant circulating pump 9 and then passes through the liquid coolant supply pipe 3 to the cooled liquid coolant supply pipe, And returning to the liquid coolant immersion liquid pool 40, and performing immersion liquid type heat dissipation on the chip in a circulating and reciprocating manner.
The data center air supply and return system comprises a data center indoor lower high-temperature cold air supply layer 5 arranged in a data center room and below a data center cabinet 1 and a data center indoor upper air return layer 4 arranged above the data center cabinet 1, a data center lower air supply opening 42 is formed in the position, corresponding to the data center cabinet 1, of the upper side wall of the data center indoor lower high-temperature cold air supply layer 5, and a data center upper air return opening 41 is formed in the side wall of the data center indoor upper air return layer 4. The circulating air pipe comprises a data center return air pipe 6 connected with an upper return air layer 4 in the data center chamber, a primary air side middle effect filter 27 of the direct-plate-tube type indirect evaporative cooler is arranged in the data center return air pipe 6, and the data center return air pipe 6 is connected with one side of the direct-plate-tube type indirect evaporative cooler on the shell; the data center indoor lower part high temperature cold air blast layer 5 is connected with the data center blast pipe 7, and the data center blast pipe 7 is connected with one side of the shell close to the centrifugal blower 33 through the direct-plate tube type indirect evaporative cooler primary blast pipe flexible connection 34. Outdoor air as secondary air enters from a fresh air inlet grille 10 of a direct-plate-tube type indirect evaporative cooler to directly add an indirect composite heat exchange core 31 through the direct-plate-tube type indirect evaporative cooler, firstly, the secondary air is pre-cooled through direct evaporative cooling, then the secondary air enters a plate-tube type indirect evaporative cooling wet channel, and is pressurized through a circulating water supply pipe 26 of the direct-plate-tube type indirect evaporative cooler and a circulating water pump 25 of the direct-plate-tube type indirect evaporative cooler and then sent to a water distributor 30 of the direct-plate-tube type indirect evaporative cooler, and spray circulating water sequentially generates direct evaporative cooling processes in a direct evaporative cooling filler and a plate-tube type indirect evaporative cooling wet channel (namely the secondary air side) respectively to provide cooling power for a primary side, and the primary side air is hot return air from absorbing internal air heat of a data center, passes through a return air inlet 41 at the upper part of the data center and then passes through a return air layer 4 at the upper part of The data center return air pipe 6 is further purified by the primary air side middle effect filter 27 of the direct-plate-tube type indirect evaporative cooler, the data center indoor return air which is sent to the primary side of the plate-tube type indirect evaporative cooling heat exchange core and cooled in the indirect equal-humidity temperature reduction process passes through the water baffle 32, then passes through the centrifugal blower 33, is connected with the data center air supply pipe 7 through the primary air supply pipe flexible connection 34 of the direct-plate-tube type indirect evaporative cooler, then is sent into the upper return air layer 4 in the data center room, finally passes through the lower air supply outlet 42 of the data center and is sent back to the inside of the data center again, and the temperature reduction and cooling are carried out on the environment in the data. If the spray water is insufficient, the water can be supplemented through the water supplementing opening 24 of the direct-plate-tube indirect evaporative cooler, and the spray water can be discharged through the water discharging opening 23 of the direct-plate-tube indirect evaporative cooler when the unit is not used.
Furthermore, the utility model relates to an air conditioning system for secondary refrigeration's data center will carry out the precooling direct evaporative cooler of the air inlet of refrigeration air conditioning unit, the evaporative condensation heat dissipation module of the condensation heat dissipation of liquid refrigerant, direct-plate tubular indirect evaporative cooler, centrifugal blower etc. combine to form a whole in a unit, make the unit integrated level high, compact structure, easy to process, practicality are strong; meanwhile, the direct evaporative cooler and the indirect-direct composite core in the unit are respectively used for leading the inlet air or the secondary air to be properly cooled, so that the heat exchange working efficiency of the whole unit is correspondingly improved.
To sum up, the utility model provides an air conditioning system for a secondary refrigeration data center, which comprehensively utilizes a direct evaporative cooler for precooling the inlet air of a refrigeration air conditioning unit, an evaporative condensation heat dissipation module for condensation heat dissipation of liquid refrigerant, a direct-plate tube type indirect evaporative cooler, a centrifugal blower and the like to be combined into a unit to form a whole, so that the unit has high integration level and compact structure; meanwhile, the air inside the data center is controlled and adjusted by temperature and humidity, and the most main source Chip (CPU) radiating the data center is subjected to direct contact type immersion liquid cooling heat dissipation treatment, the liquid coolant evaporation and condensation module and the direct-plate tube type indirect evaporation cooler are precooled by working air, so that the heat exchange efficiency is improved, meanwhile, the lower module of the unit is also used by a circulating water pump and a circulating water supply pipe, so that the energy is saved, the efficiency is high, the structure is simpler, more convenient and more convenient to maintain and manage, and the working efficiency of the whole unit is correspondingly improved.
Claims (8)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021864318.1U CN212657824U (en) | 2020-08-31 | 2020-08-31 | A secondary cooling data center air conditioning system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021864318.1U CN212657824U (en) | 2020-08-31 | 2020-08-31 | A secondary cooling data center air conditioning system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212657824U true CN212657824U (en) | 2021-03-05 |
Family
ID=74761584
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021864318.1U Expired - Fee Related CN212657824U (en) | 2020-08-31 | 2020-08-31 | A secondary cooling data center air conditioning system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212657824U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111947262A (en) * | 2020-08-31 | 2020-11-17 | 西安工程大学 | Air conditioning system for data center based on the combination of liquid cooling and evaporative cooling technology |
| CN113737209A (en) * | 2021-09-27 | 2021-12-03 | 长江勘测规划设计研究有限责任公司 | Water electrolysis hydrogen production system adopting external circulation evaporation cooling full immersion and use method |
| CN113864932A (en) * | 2021-11-05 | 2021-12-31 | 深圳市英维克科技股份有限公司 | Air conditioner cooling system |
-
2020
- 2020-08-31 CN CN202021864318.1U patent/CN212657824U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111947262A (en) * | 2020-08-31 | 2020-11-17 | 西安工程大学 | Air conditioning system for data center based on the combination of liquid cooling and evaporative cooling technology |
| CN113737209A (en) * | 2021-09-27 | 2021-12-03 | 长江勘测规划设计研究有限责任公司 | Water electrolysis hydrogen production system adopting external circulation evaporation cooling full immersion and use method |
| CN113864932A (en) * | 2021-11-05 | 2021-12-31 | 深圳市英维克科技股份有限公司 | Air conditioner cooling system |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110769646B (en) | An energy-saving and efficient evaporative cooling air conditioning system suitable for data center | |
| CN212657824U (en) | A secondary cooling data center air conditioning system | |
| CN102620363B (en) | Evaporation and electronic double-refrigeration cooling fan | |
| CN211792609U (en) | Indirect evaporative cooling air conditioning unit for data center | |
| CN109769376A (en) | A liquid cooling system based on evaporative cooling technology | |
| CN105517404B (en) | A fluorine pump circulating primary refrigerant loop cooling system for server cabinets | |
| CN201497089U (en) | Evaporative condensing computer room air conditioner | |
| CN105263294A (en) | Cooling system of divided composite heat pipe evaporative condenser for data machine room | |
| CN204047013U (en) | A kind of fluorine pump internal-circulation type secondary refrigerant loop server cabinet cooling system | |
| CN111947262A (en) | Air conditioning system for data center based on the combination of liquid cooling and evaporative cooling technology | |
| CN209165653U (en) | An evaporative cooling air conditioning system for a data center with a closed hot aisle | |
| CN111295084A (en) | Indirect evaporative cooling air conditioning unit using condenser and evaporator | |
| CN105430997A (en) | A heat pipe internal circulation type secondary refrigerant loop server cabinet heat dissipation system | |
| CN210802114U (en) | A double working condition pre-cooling type closed evaporative cooling tower | |
| CN204153902U (en) | A kind of equipment cabinet server water loops heat pipe radiating system | |
| CN104254232B (en) | Heat-pipe circulating type primary refrigerant loop server cabinet heat dissipation system | |
| CN204157200U (en) | A kind of heat pipe cyclic refrigerant loop server cabinet cooling system | |
| CN110636744A (en) | A closed evaporative cooling cold water system for data centers | |
| CN110762896A (en) | Indirect evaporative cooling and lithium bromide absorption refrigeration combined air conditioning unit | |
| CN211854538U (en) | An evaporative condenser with pre-cooling | |
| CN211429866U (en) | A high-efficiency and energy-saving container data center | |
| CN116321916A (en) | Cooling Systems, Cabinets and Data Centers | |
| CN105451508A (en) | Fluorine-pump internal-circulation secondary refrigerant loop server cabinet heat radiation system | |
| CN108901176A (en) | A kind of data center machine room evaporation cooling-condensation module air-conditioner set | |
| CN211345638U (en) | Air conditioning unit based on indirect evaporative cooling and lithium bromide absorption refrigeration combination |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210305 Termination date: 20210831 |