CN212649950U

CN212649950U - Shock absorption and heat dissipation mechanism of monolithic integrated amplifier

Info

Publication number: CN212649950U
Application number: CN202020722866.4U
Authority: CN
Inventors: 吴肖飞
Original assignee: Shijiazhuang Zhenglang Electronic Technology Co ltd
Current assignee: Shijiazhuang Zhenglang Electronic Technology Co ltd
Priority date: 2020-05-06
Filing date: 2020-05-06
Publication date: 2021-03-02
Anticipated expiration: 2030-05-06

Abstract

The utility model discloses a monolithic integrated amplifier's shock attenuation heat dissipation mechanism, including the amplifier main part, the amplifier main part is located the box, the box includes the roof that bottom plate, curb plate and activity articulated set up, roof below and bottom plate top all are connected with the buffer board through the buffer layer, the curb plate of box has the limiting plate to the box inboard through bracing piece parallel connection, first louvre has evenly been seted up on the buffer board, the second louvre has evenly been seted up on the limiting plate. The utility model discloses an inwards connect the buffer board through the buffer layer at roof and bottom plate, and when the box received vibrations, the buffer spring of buffer layer cushioned the shock attenuation to the amplifier main part to reduce the friction and collision of amplifier main part, avoid it to receive the damage, through set up limiting plate and buffer board in the box, evenly set up first louvre and second louvre respectively on limiting plate and the buffer board, bottom plate central authorities install the fan, the heat dissipation of being convenient for.

Description

Shock absorption and heat dissipation mechanism of monolithic integrated amplifier

Technical Field

The utility model relates to an amplifier technical field specifically is a monolithic integrated amplifier's shock attenuation heat dissipation mechanism.

Background

The amplifier is a device capable of amplifying the voltage or power of an input signal and is composed of a tube or a transistor, a power transformer and other electrical components. Amplifiers are used in various devices such as telecommunications, radio, radar, television, automation and the like and are important components for processing signals in automation technology tools. The amplification of the amplifier is realized by controlling the energy source by the input signal, and the power consumption required by the amplification is provided by the energy source.

However, the amplifier is easily damaged due to friction and collision caused by vibration in the transportation process, heat is generated when the amplifier works, and the traditional amplifier is not well subjected to heat dissipation treatment, so that the service life of the amplifier is easily shortened.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a monolithic integrated amplifier's shock attenuation heat dissipation mechanism to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme:

the utility model provides a monolithic integrated amplifier's shock attenuation heat dissipation mechanism, includes the amplifier main part, the amplifier main part is located the box, the box includes bottom plate, curb plate and the articulated roof that sets up of activity, roof below and bottom plate top all are connected with the buffer board through the buffer layer, there is the limiting plate the curb plate of box inboard through bracing piece parallel connection, first louvre has evenly been seted up on the buffer board, the second louvre has evenly been seted up on the limiting plate, the mounting hole has been seted up to the central authorities department of bottom plate, fixed mounting has the fan in the mounting hole.

As a further aspect of the present invention: the bottom of box is provided with the supporting seat, the supporting seat includes four supporting shoes, the bottom of supporting seat is provided with the slipmat.

As a further aspect of the present invention: the buffer layer includes bottom plate, roof and corresponds the buffer spring that evenly sets up between the buffer board, bottom plate, roof and correspond and be connected through the telescopic link pole of evenly setting between the buffer board.

As a further aspect of the present invention: the position and the quantity of the telescopic connecting rods and the buffer springs are matched, and the telescopic connecting rods are located in the corresponding buffer springs.

As a further aspect of the present invention: form the heat dissipation chamber between the inner wall of buffer board, limiting plate and box, the air inlet has all been seted up on the left and right sides curb plate of box, be provided with dustproof filter screen in the air inlet.

As a further aspect of the present invention: the heat-conducting plate is fixedly connected to the lower portion of the bottom plate of the box body, air outlet holes are evenly formed in the positions, corresponding to the fans, of the heat-conducting plate, and radiating fins are arranged below the heat-conducting plate on the outer sides of the air outlet holes.

Compared with the prior art, the beneficial effects of the utility model are that:

1. the utility model discloses an inwards connect the buffer board through the buffer layer at roof and bottom plate, when the box received vibrations, the buffer spring of buffer layer cushions the shock attenuation to the amplifier main part to reduce the friction and collision of amplifier main part, avoid it to receive the damage.

2. The utility model discloses a set up limiting plate and buffer board in the box, evenly set up first louvre and second louvre on limiting plate and the buffer board respectively, bottom plate central authorities install the fan, and the heat dissipation of being convenient for avoids the heat gathering in the box, influences the life of amplifier main part.

3. The utility model discloses a set up heat-conducting plate and radiating fin at the bottom half, further help the heat dissipation.

Drawings

Fig. 1 is a schematic cross-sectional view of a shock-absorbing and heat-dissipating mechanism of a monolithic integrated amplifier.

Fig. 2 is an enlarged schematic view of the structure of the region a in fig. 1.

Fig. 3 is a schematic structural diagram of a shock-absorbing and heat-dissipating mechanism of a monolithic integrated amplifier.

In the figure: the novel air-conditioning box comprises a box body 1, a supporting seat 2, a non-slip mat 3, a bottom plate 4, a side plate 5, a top plate 6, a buffer plate 7, a buffer spring 8, a telescopic connecting rod 9, a first heat dissipation hole 10, a limiting plate 11, a supporting rod 12, a second heat dissipation hole 13, a heat conduction plate 14, a heat dissipation fin 15, a heat dissipation cavity 16, an air inlet 17, a dustproof filter screen 18, a fan 19 and an air outlet 20.

Detailed Description

The technical solution of the present patent will be described in further detail with reference to the following embodiments.

Please refer to fig. 1-3, a shock absorption and heat dissipation mechanism of monolithic integrated amplifier, which comprises an amplifier main body, the amplifier main body is located in a box 1, the box 1 comprises a bottom plate 4, a side plate 5 and a top plate 6 movably hinged to the side plate, the lower part of the top plate 6 and the upper part of the bottom plate 4 are both connected with a buffer plate 7 through buffer layers, the side plate 5 of the box 1 is connected with a limiting plate 11 through a support rod 12 in parallel to the inner side of the box 1, a sponge layer (not shown) is arranged on the buffer plate 7 and the limiting plate 11, the surface of the amplifier main body is protected, a first heat dissipation hole 10 is uniformly arranged on the buffer plate 7, a second heat dissipation hole 13 is uniformly arranged on the limiting plate 11, a mounting hole is arranged at the center of the bottom plate 4, a fan 19 is fixedly.

The bottom of box 1 is provided with supporting seat 2, carries out the outrigger to box 1, and supporting seat 2 includes four supporting shoes, and the bottom of supporting seat 2 is provided with slipmat 3, improves box 1's stability.

The buffer layer includes bottom plate 4, roof 6 and the buffer spring 8 that corresponds even setting between the buffer board 7, bottom plate 4, roof 6 and the telescopic link 9 that corresponds through even setting between the buffer board 7 are connected, telescopic link 9 carries on spacingly to buffer board 7, avoid taking place the skew, be connected with buffer board 7 through buffer spring 8, when box 1 receives vibrations, buffer spring 8 cushions the shock attenuation to the amplifier main part, thereby reduce the friction and collision of amplifier main part, avoid it to receive the damage.

The positions and the number of the telescopic connecting rods 9 and the buffer springs 8 are matched, and the telescopic connecting rods 9 are located inside the corresponding buffer springs 8.

Form heat dissipation chamber 16 between the inner wall of buffer board 7, limiting plate 11 and box 1, in the heat entering heat dissipation chamber 16 that the amplifier main part during operation produced, the surface of avoiding the amplifier main part is sealed, influences its heat dissipation, has all seted up air inlet 17 on the left and right sides curb plate 5 of box 1, is provided with dustproof filter screen 18 in the air inlet 17, prevents that the dust from getting into in the box 1, piles up amplifier main part on the surface, influences its life.

The heat-conducting plate 14 is fixedly connected to the lower portion of the bottom plate 4 of the box body 1, air outlet holes 20 are evenly formed in the positions, corresponding to the fans 19, of the heat-conducting plate 14, heat dissipation is facilitated, and radiating fins 15 are arranged below the heat-conducting plate 14 on the outer side of the air outlet holes 20 and further help in heat dissipation.

The utility model discloses a theory of operation is: in the box 1 was arranged in to the amplifier main part, limiting plate 11 in the curb plate 5 was spacing to it, and buffer board 7 in bottom plate 4 and the roof 6 cushions it, and when box 1 received vibrations, the buffer spring 8 of buffer layer cushioned the shock attenuation to the amplifier main part to reduce the friction and collision of amplifier main part, avoid it to receive the damage. The heat that the amplifier during operation produced gets into the heat dissipation chamber through first louvre 10 and second louvre 13, and fan 19 discharges the heat through gas outlet 20, avoids the heat gathering in box 1, influences the life of amplifier main part, and box 1 bottom sets up heat-conducting plate 14 and radiating fin 15 simultaneously, further helps the heat dissipation.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art through specific situations.

Although the preferred embodiments of the present patent have been described in detail, the present patent is not limited to the above embodiments, and various changes can be made without departing from the spirit of the present patent within the knowledge of those skilled in the art.

Claims

1. The utility model provides a shock attenuation heat dissipation mechanism of monolithic integrated amplifier, includes the amplifier main part, its characterized in that, the amplifier main part is located box (1), box (1) is including roof (6) that bottom plate (4), curb plate (5) and activity hinge set up, roof (6) below and bottom plate (4) top all are connected with buffer board (7) through the buffer layer, curb plate (5) of box (1) are inboard to box (1) through bracing piece (12) parallel connection have limiting plate (11), first louvre (10) have evenly been seted up on buffer board (7), second louvre (13) have evenly been seted up on limiting plate (11), the mounting hole has been seted up to the central authorities department of bottom plate (4), fixed mounting has fan (19) in the mounting hole.

2. The damping and heat dissipating mechanism of a monolithic integrated amplifier as recited in claim 1, wherein the bottom of the box (1) is provided with a supporting base (2), the supporting base (2) comprises four supporting blocks, and the bottom of the supporting base (2) is provided with a non-slip pad (3).

3. The damping and heat dissipating mechanism of the monolithic integrated amplifier according to claim 1, wherein the buffer layer comprises buffer springs (8) uniformly arranged between the bottom plate (4), the top plate (6) and the corresponding buffer plate (7), and the bottom plate (4), the top plate (6) and the corresponding buffer plate (7) are connected through uniformly arranged telescopic connecting rods (9).

4. The vibration-damping and heat-dissipating mechanism of the monolithic integrated amplifier as recited in claim 3, characterized in that the positions and the number of the telescopic connecting rods (9) are matched with those of the buffer springs (8), and the telescopic connecting rods (9) are positioned inside the corresponding buffer springs (8).

5. The shock-absorbing and heat-dissipating mechanism of the monolithic integrated amplifier according to claim 1, wherein a heat-dissipating cavity (16) is formed among the buffer plate (7), the limiting plate (11) and the inner wall of the box body (1), air inlets (17) are formed on the side plates (5) on the left and right sides of the box body (1), and dust-proof filter screens (18) are arranged in the air inlets (17).

6. The damping and heat dissipating mechanism of the monolithic integrated amplifier according to claim 1, wherein a heat conducting plate (14) is fixedly connected below the bottom plate (4) of the box body (1), air outlet holes (20) are uniformly formed in the heat conducting plate (14) at positions corresponding to the fans (19), and heat dissipating fins (15) are arranged below the heat conducting plate (14) outside the air outlet holes (20).